JPH11138425A - Polishing method and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for polishing a work with a good yield and high precision. SOLUTION: A plural carriers 18 each of which has a fixed lower plate 11 provided with a lower-side grinding stone 12 and a fixed upper plate 13 provided with an upper-side grinding stone 14 to hold a work W, are engaged with sun gears 15 and internal gears 16. After polishing with both grinding stones 14, 12 is completed, before the fixed upper and lower plates 13, 11 are stopped, the sun gears 15 are stopped, thus to form a drawn-line on the surface of the work W. On the other hand, after the polishing is completed, the upper and lower fixed plates 13, 11 and the sun gears 15 are stopped at almost the same time, thus not to form the drawn-line. A drawn-line mode to form the drawn-line and a non-drawn-line mode not to form the drawn-line can be selected by an operator. When drawn-line work is done, the working amount can be randomly set.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polishing technique for polishing a disk-shaped work such as an aluminum substrate for a magnetic disk.

[0002]

2. Description of the Related Art A polishing apparatus for simultaneously polishing both surfaces of a plurality of aluminum substrates for magnetic disks comprises a lower platen having an annular lower grinding wheel provided on an upper surface and an annular upper grinding wheel provided on a lower surface as a lower grinding wheel. A plurality of carriers having a plurality of circular holding holes for accommodating a magnetic disk aluminum substrate serving as a work are arranged on the lower grindstone. It is supposed to be. Each carrier meshes with a sun gear rotatably provided at the center of rotation of the lower surface plate, and meshes with an internal gear provided outside the lower surface plate.

[0003] The work held by the carrier is rotated by the upper and lower whetstones by rotating the upper and lower platens in a state where the work is rotated while rotating the sun gear and rotating the work around the sun gear. Both sides will be polished simultaneously. An example of such an aluminum substrate polishing apparatus is disclosed in Japanese Patent No. 2556605.

Polishing is a general term for grinding and polishing. Grinding is a process of cutting a workpiece with a grinding wheel. Polishing involves adjusting the dimensional error of the workpiece or adjusting the surface finish. There are lapping performed to improve the quality and polishing for forming a high mirror surface on the work surface.

[0005]

When a workpiece is polished using a polishing apparatus having a grinding wheel, the user must consciously check the polishing condition to see whether the workpiece has been polished uniformly or not. In some cases, an operation of making a fine scratch called a catch is performed. The operation of providing the catch is performed by rotating the upper and lower platens for a certain period of time in a state where the rotation of the sun gear is stopped and the rotation and the revolution of the work are stopped.

[0006] However, when the greasing operation is performed, if the abrasive grains are sharp as in the case of a new grindstone, the depth of the crease may be formed to be deeper than a desired value. , Even after polishing,
The fold may not be removed. If the fold remains, a gentle scratch called a shallow mark will remain on the surface of the disk, making it difficult to obtain a high-quality disk.

An object of the present invention is to provide a technique capable of polishing a work with high accuracy.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the polishing method of the present invention comprises a carrier arranged on a lower platen having a lower polishing tool and loaded with a plurality of works, and a sun gear and an internal gear meshing with each of the carriers. A polishing method for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate in opposition to the lower polishing tool in a state where the gears are relatively rotated, After the polishing of the work is completed, the relative rotation between the sun gear and the internal gear is stopped to fix the work, and the work is fixed by the lower polishing tool and the upper polishing tool while the work is fixed. Draw marks were formed on both surfaces of the base plate, and the amount of fold processing was adjusted by the time from the stop of the relative rotation of the sun gear and the internal gear to the stop of the rotation of the lower platen and the upper platen. Specially To.

Further, the polishing method of the present invention has a carrier disposed on a lower platen having a lower polishing tool and loaded with a plurality of works, and a sun gear and an internal gear meshing with each of the carriers. A polishing method for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate in opposition to the lower polishing tool in a state where the gears are relatively rotated, When the eye catching mode is selected, after the end of the predetermined polishing step, first, the relative rotation between the sun gear and the internal gear is stopped, and after a predetermined time has elapsed, the lower surface plate and the upper surface plate And stop,
When the uninterrupted mode is selected, the sun gear, the internal gear, the lower platen, and the upper platen are stopped almost simultaneously after a predetermined polishing process is completed.

Further, the polishing apparatus of the present invention has a carrier disposed on a lower platen having a lower polishing tool and loaded with a plurality of works, and a sun gear and an internal gear meshing with each of the carriers. With the gear and the gear relatively rotated,
A polishing apparatus for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate opposite thereto, wherein the sun gear is Sun gear rotating means for relatively rotating the upper platen, upper platen rotating means for rotating the upper platen, lower platen rotating means for rotating the lower platen, and the sun gear and the internal gear after polishing is completed. A stitch amount input means for inputting a time from when the relative rotation of the workpiece is stopped until when the lower surface plate and the upper surface plate are stopped, and the lower polishing tool for moving the workpiece while being moved by the carrier. After performing predetermined polishing by the upper polishing tool and the upper polishing tool, the sun gear rotating means is stopped based on a signal from the stitch amount input means, and then the upper platen rotating means and the lower platen rotating are stopped. Time to stop means And having a drive control means for controlling the kerf machining amount by us.

Further, the polishing apparatus of the present invention has a carrier arranged on a lower platen having a lower polishing tool and loaded with a plurality of works, and a sun gear and an internal gear meshing with each of the carriers. With the gear and the gear relatively rotated,
A polishing apparatus for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate opposite thereto, wherein the sun gear is Sun gear rotating means for relatively rotating the upper platen, upper platen rotating means for rotating the upper platen, lower platen rotating means for rotating the lower platen, and a catching mode for forming a mark on the work, A mode input means for inputting a non-drawing mode in which no work is formed on the work, and when the pulling mode is input by the mode input means, after the end of a predetermined polishing step, first, the sun gear rotating means. Stop, stop the lower platen rotating means and the upper platen rotating means after a predetermined time has elapsed,
A drive control unit for stopping the sun gear rotating unit, the lower platen rotating unit, and the upper platen rotating unit almost simultaneously after a predetermined polishing process is completed when the seamless mode is selected. And

According to the present invention, the amount of nicking after the polishing of the workpiece is completed can be set arbitrarily. In addition, polishing can be performed in any of the draw-marking mode and the draw-free mode. In this manner, optimal polishing can be performed according to various conditions such as the condition of the polishing tool and the type of work.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a cross-sectional view showing a polishing apparatus according to an embodiment of the present invention. This polishing apparatus 10 has a lower surface plate 11 which rotates in a horizontal plane. A lower grindstone 12 as a lower polishing tool is attached, and the lower stool 11 is also adjustable in the vertical direction. Therefore, the illustrated polishing apparatus performs a process of polishing a work with a grindstone.

Above the lower platen 11 is disposed an upper platen 13 which rotates in opposition to the upper platen 13. The upper platen 13 has an annular upper grinding wheel 14 corresponding to the lower grinding wheel 12. Are attached as upper polishing tools. This upper platen 13
Is adapted to rotate in a direction opposite to the direction of rotation of the lower surface plate 11, and is further movable in the vertical direction so as to approach and move away from the lower surface plate 11.

A sun gear 15 having an outer diameter slightly smaller than the inner diameter of the lower grindstone 12 is rotatably provided at the center of rotation of the lower stool 11. It rotates in the same direction as the lower surface plate 11. Outside the lower grindstone 12, an annular internal gear 16 having a diameter slightly larger than the outer diameter is fixed to a support 17 so as to surround the lower surface plate 11.

On the upper surface of the lower grindstone 12 provided on the lower platen 11, for example, about ten carriers 18 are arranged, and external teeth formed on the outer peripheral portion of each carrier 18 are provided. The gear portion meshes with the sun gear 15 and the internal gear 16. Each carrier 18 has a work W which is an aluminum substrate for a magnetic disk.
A plurality of, for example, about five, circular holding holes 19 for accommodating the workpiece W are formed, and the thickness of the carrier 18 is formed smaller than the thickness of the work W.

The lower platen 11 is connected to a hollow drive shaft 11a rotatably supported by a base 20, and a drive shaft 15a rotatably provided in this hollow hole is connected to a sun gear 15. .

When the sun gear 15 is rotated by the drive shaft 15a in a state where each carrier 18 is engaged with the sun gear 15 and the internal gear 16, the internal gear 16 is fixed. Is revolving around the sun gear 15 while rotating, and the workpiece W is moved by the carrier 18 into the upper and lower whetstones 1 in a horizontal plane.
While touching these between 4 and 12, it moves in the horizontal direction while drawing a cycloid curve or trochoid curve. At that time, the lower surface plate 11 is driven to rotate via a drive shaft 11a, and the upper surface plate 13 is driven to rotate by a drive shaft not shown.

FIG. 2 is a block diagram showing a control circuit for controlling the driving of the polishing apparatus shown in FIG. 1. The sun gear 15 is driven by a sun gear motor 21 as sun gear rotating means. The motor 21 is connected to the drive shaft 15a shown in FIG. The upper platen 13 is driven by an upper platen motor 22 as upper platen rotating means. The lower stool 11 is driven by a lower stool motor 23 as a lower stool rotating means, and the motor 23 is connected to the drive shaft 11a.
The operation of each of the motors 21 to 23 is controlled by a control signal from the drive control unit 24.

An operation board or operation panel 25 as a stitch amount input means and a mode input means is connected to the drive control unit 24. When the operation panel 25 is operated by an operator, both sides of the work W are provided. The amount of folds to be formed can be set, and the polishing apparatus 10 can be selected between a foldable mode and a non-folded mode.

[0024] The pulling mode is a mode in which the upper and lower grinding wheels 14,
After a predetermined polishing operation has been completed on each work W by 12, the carrier 18 is fixed, and only the upper and lower platens 13, 11 are rotated in this state, so that the surface of the work W is finely ground. This is a mode in which the polishing apparatus 10 is operated so as to make a so-called scratch, in which the work W is fixed by the upper and lower platens 13 and 11 while the carrier 18 is fixed and the work W is fixed. By changing the time for processing both surfaces, the amount of the crease formed by the upper and lower whetstones 14 and 12 can be adjusted. On the other hand, the no-marking mode is a mode in which the polishing apparatus 10 is operated so that no notching is formed on the surface of the workpiece W.

In order to input the stitch amount, the rotation of the sun gear motor 21 is stopped by a switch (not shown) provided on the operation panel 25, and then the rotation of the upper surface plate motor 22 and the lower surface plate motor 23 is stopped. This is done by an operator who enters the time until. Similarly, in order to set either the eye-catching mode or the eye-catching mode, the operation panel 2
5 is provided with a mode setting key and the like.

FIG. 3 is a characteristic diagram showing an operating state of each of the motors 21 to 23 operated by a control signal sent from the drive control unit 24.

In the polishing operation, after the work W is loaded into all the holding holes 19 of all the carriers 18, the upper platen 13 is moved toward the lower platen 11 to move the work W.
Is carried out by driving the respective motors 21 to 23 in a state of being sandwiched between the upper and lower grinding wheels 14 and 12. In the case shown, the upper platen 13 is the lower platen 1
The polishing speed is set lower than 1 and the sun gear 1
The polishing rotation speed of No. 5 is set to a lower rotation speed than the polishing rotation speed of the lower platen.

The polishing time T ₁ during which each of the motors 21 to 23 is driven at a predetermined polishing speed is arbitrarily set according to the type of the work W and the like, and is an acceleration time from the stop state to the predetermined polishing speed. T ₂ can also be set arbitrarily.

After a predetermined polishing time T ₁ has elapsed and the polishing process for the workpiece W has been completed, the polishing apparatus 10 passes through a deceleration process of time T ₃ to form the sun gear 15, the upper platen 13, and the lower platen 11. It will be completely stopped. In the deceleration step of the polishing apparatus 10, one of the draw-marking mode and the draw-less mode is selected.

[0030] When the pull basis weight mode is selected by the operator by operating the operation panel 25, after the polishing step of polishing time T ₁ is completed, as shown by the solid line in FIG. 3, the sun gear 15 by decelerating after rotating for a predetermined time at the same rotational speed and rotational speed of the polishing time T _1, the sun gear 15 after a lapse of a time T ₄ is stopped. On the other hand, upper platen 13 and lower platen 1
1 while decelerating after the polishing process is finished, stops after a lapse of a long time T ₃ than the time T _4. Thus, when the pull basis weight mode is selected, the upper and lower surface plates 13, 11 is in a stopped state after the sun gear 15 has passed a predetermined time T ₅ after stopping. Thus, in a state where the movement is stopped by the workpiece W is fixed in the carrier 18 is located between the predetermined time T _5, the upper and lower grinding wheel 14,
Since the surface of the work W is polished by 12, a crease is formed on the surface of the work W.

The draw processing time T ₅ can be set to an arbitrary time by operating a key or the like provided on the operation panel 25 as a draw amount input means. Thus, it is possible to form an optimal fold according to the situation.

On the other hand, when the uninterrupted mode is selected, the sun gear 15 stops almost simultaneously with the upper and lower bases 13, 11 as shown by a broken line or a dashed line in FIG. In the deceleration step until the sun gear 15 is stopped after the polishing step, the sun gear 15 may be decelerated almost simultaneously with the upper and lower platens 13 and 11 as shown by a broken line, as shown by a dashed line. Alternatively, the rotation may be performed at a polishing speed for a predetermined time and then reduced. By stopping the upper and lower bases 13 and 11 and the sun gear 15 almost at the same time in this manner, no catch is formed on the surface of the work W.

FIG. 4 is a characteristic diagram showing another operation state of each of the motors 21 to 23 operated by the control signal sent from the drive control unit 24. In this case, the sun gear 15 and the upper and lower bases 13 and 11 have substantially the same acceleration time T.
₂ , the polishing rotation speed is set to a regular rotation. When the eye catching mode is selected, the sun gear 15 starts decelerating after the end of the polishing process, and
It will be stopped as soon as the time T ₅ than 3,11.
On the other hand, when the uninterrupted mode is selected, the sun gear 15 and the upper and lower stools 13 and 11 stop almost simultaneously.

FIG. 5 is a characteristic diagram showing still another operation state of each of the motors 21 to 23 operated by the control signal sent from the drive control unit 24. In this case,
And so as to differ for a plurality of steps with the sun gear 15 of each of the polishing rotational speed of the upper and lower surface plates 13, 11 at time T ₁ of the polishing process. In this case, the sun gear 15 is decelerated almost simultaneously with the bases 13 and 11 and is stopped almost simultaneously, as in the case shown in FIG. When the pull basis weight mode is selected, as shown by the solid line, the surface plate 13, 11 is controlled so as to stop after the sun gear 15 has passed time T ₅ after stopping. Also shown in FIG. 5 also shown in FIG. 4, pull machining time T ₅ is the same manner as described above, can be operator to arbitrarily set time, thereby,
The amount of nicks can be adjusted according to the type of the grindstones 12, 14 and the work W.

As described above, in the illustrated polishing apparatus 10, the operator can adjust the amount of the stitch in consideration of various conditions such as the state of the grindstone and the type of the work W.
In addition, any of the eye-catching mode and the eye-catching mode can be arbitrarily selected, and the polishing apparatus 10 can be controlled in accordance with the selection. You can get a disc.

The polishing apparatus 10 may be configured to perform only the drawing process after the polishing process on both surfaces of the work W is completed, so that the amount of the drawing process can be adjusted. It may be possible to perform any of the processing without the nick. Further, in the case where both the crease processing and the crease-free processing can be performed, the crease processing amount may be adjusted.

In the illustrated polishing apparatus, whetstones 14 and 12 are attached to the respective surface plates 13 and 11, but instead of the whetstones, polishing tools for performing polishing such as buffs are mounted. You may do it.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist of the invention. Needless to say, there is.

For example, in the case shown, the sun gear 1
5, the internal gear 16 is prevented from rotating. However, if the internal gear 16 is rotated relative to each other, at least one of the sun gear 15 and the internal gear 16 can be rotated. Further, the number of carriers 18 placed on the lower grindstone 12 can be any number, and the number of holding holes 19 formed in each carrier 18 can also be any number.

[0040]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) After the predetermined polishing of the work is completed, depending on the condition of the polishing tool and the type of the work,
It is possible to arbitrarily set the amount of the crease to be formed on both surfaces of the work.

(2) Either polishing with or without scoring can be performed on the work.

(3). The operator can arbitrarily set the polishing apparatus between the draw-on mode and the draw-off mode according to the type of the work, the condition of the grinding wheel, and the like.

(4) As a result, the workpiece can be polished with high accuracy and high yield.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a structure of a polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a drive control circuit for controlling the drive of the polishing apparatus of FIG.

FIG. 3 is a characteristic diagram showing operating states of a sun gear driven by a motor and upper and lower stools.

FIG. 4 is another characteristic diagram showing operating states of the sun gear and upper and lower stools.

FIG. 5 is still another characteristic diagram showing the operating states of the sun gear and the upper and lower platens.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Polishing apparatus 11 Lower surface plate 12 Lower grindstone 13 Upper surface plate 14 Upper grindstone 15 Sun gear 16 Internal gear 17 Support base 18 Carrier 19 Holding hole 21 Sun gear motor 22 Upper surface plate motor 23 Lower surface plate motor 24 Drive Control unit 25 Operation panel W Work

Claims (4)

[Claims] 1. A carrier arranged on a lower surface plate having a lower polishing tool and loaded with a plurality of workpieces, wherein a sun gear and an internal gear that mesh with the respective carriers are relatively rotated. A polishing method for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate in opposition to the lower polishing tool. The relative rotation between the sun gear and the internal gear is stopped to fix the work, and the lower polishing tool and the upper polishing tool form a crease on both surfaces of the work in a state where the work is fixed. A polishing method, wherein the amount of crease processing is adjusted by the time from the stop of relative rotation between the sun gear and the internal gear to the stop of rotation of the lower platen and the upper platen. . 2. A sun gear and an internal gear which are arranged on a lower surface plate having a lower polishing tool and on which a plurality of workpieces are loaded, and which mesh with the respective carriers, are relatively rotated. A polishing method for polishing the surface of the work by rotating the lower polishing tool and the upper polishing tool provided on the upper surface plate in opposition to the lower polishing tool, wherein a pulling mode is selected. Sometimes, after completion of the predetermined polishing step, first, the relative rotation between the sun gear and the internal gear is stopped, and after a predetermined time has elapsed, the lower platen and the upper platen are stopped. The polishing method according to claim 1, wherein when the no mode is selected, the sun gear, the internal gear, the lower platen, and the upper platen are stopped almost simultaneously after a predetermined polishing step is completed. 3. A sun gear and an internal gear, which are arranged on a lower platen having a lower polishing tool and on which a plurality of works are loaded, and which mesh with the respective carriers, are relatively rotated. A polishing apparatus for polishing the surface of the work by rotating the lower polishing tool and an upper polishing tool provided on an upper surface plate in opposition to the lower polishing tool, wherein the sun gear includes the internal gear; A sun gear rotating means for rotating the gear relative to the gear; an upper stool rotating means for rotating the upper stool; a lower stool rotating means for rotating the lower stool; Draw eye length input means for inputting the time from when the relative rotation with the internal gear is stopped until when the lower surface plate and the upper surface plate are stopped; and Side polishing tool and said After performing a predetermined polishing by the side polishing tool, based on a signal from the pull stitch amount input means, after stopping the sun gear rotating means, the upper platen rotating means and the lower platen rotating means, And a drive control means for controlling a time for stopping the grinding and controlling an amount of the crease processing. 4. A sun gear and an internal gear that are arranged on a lower surface plate having a lower polishing tool and are loaded with a plurality of workpieces and mesh with each of the carriers are relatively rotated. A polishing apparatus for polishing the surface of the work by rotating the lower polishing tool and an upper polishing tool provided on an upper surface plate in opposition to the lower polishing tool, wherein the sun gear includes the internal gear; Sun gear rotating means for rotating the gear relative to the gear; upper stool rotating means for rotating the upper stool; lower stool rotating means for rotating the lower stool; And a mode input means for inputting a no-drawing mode in which no marks are formed on the work. When the drawing input mode is input by the mode input means, after a predetermined polishing step, Stopping the sun gear rotating means, stopping the lower platen rotating means and the upper platen rotating means after a predetermined time has elapsed, and terminating the predetermined polishing step when the drawless mode is selected. A polishing apparatus, comprising: a driving control unit that stops the sun gear rotating unit, the lower platen rotating unit, and the upper platen rotating unit almost simultaneously.