JPH11135993A - Parts mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve attaching accuracy of the upper surface of a first work when the surface is further attached to the reference plane of a second work after parts are mounted on the first work. SOLUTION: A reference plate 45a having a reference plane 45 at the position corresponding to the reference plane of the main body of an optical pickup is provided above a mounting stage, and a work pushing-up mechanism 50 which presses a resin package 14 against the reference plate 45a by pushing up the package 14 is provided below the mounting stage. The mechanism 50 has an upper block 51 and a lower block 52, and a contact probe 53 the upper end of which can be brought into contact with a lead frame 13 when the package 14 is pushed up is provided in the upper block 51. The contact probe 53 is constituted so that the probe 53 may be bent when the package 14 is pushed up and the probe 53 comes into contact with the lead frame 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a leadless chip component at a predetermined position on a workpiece such as a substrate.

[0002]

2. Description of the Related Art FIGS. 27 and 28 show a conventional component mounting apparatus, in which a supply station 1 and a mounting station 3 are arranged horizontally. The supply station 1 has an xy stage on which components are set in advance, and the mounting station 3 has an xy stage on which a workpiece such as a substrate on which components are mounted at predetermined positions is set in advance. A head 6 movable horizontally between the stations 1 and 3 and up and down is disposed above the stations 1 and 3, and a tip of the head 6 sucks a component in the supply station 1 as shown in FIG. Then, a suction collet 4 for transporting to the mounting station 3 is attached. The suction collet 4 is rotatable in the θ direction. A TV camera 5-1 is fixed above the supply station 1,
Above the mounting station 3 and below the head 6, a TV camera 5-2 for imaging the head 6 and a TV camera 5-3 for imaging the mounting station 3 are integrally movably arranged in the horizontal direction. Have been.

In such a configuration, when a component is transported from the supply station 1 to the mounting station 3 and the position of the component is aligned with the work on the mounting station 3 side, first, the supply image picked up by the TV camera 5-1 is supplied. Based on the image in the station 1, the stage of the supply station 1 is moved in the xy directions so that the supply component comes to the suction position of the head 6, and then the head 6 descends in this state to suction the supply component, and then suction. In this state, it moves upward, then moves horizontally and waits at a position above the mounting station 3.

When the head 6 has been moved above the mounting station 3, the TV cameras 5-2 and 5-3
In this state, the TV cameras 5-2 and 5-5 are moved in order to align the parts supported by the suction collet 4 with the work on the mounting station 3. The suction collet 4 is rotated in the θ direction on the basis of the image captured by 3. Next, after retreating the TV cameras 5-2 and 5-3 from between the head 6 and the mounting station 3, the head 6 is lowered to mount the component at a predetermined position on the work.

FIG. 5 shows a light emitting / receiving assembly mounted on the optical pickup body 18 as an example of components mounted on the component mounting apparatus according to the present invention. The light emitting / receiving assembly includes a resin package 14 in which a lead frame 13 is sealed, a photodiode chip 12 mounted on the lead frame 13, a submount member 11 mounted on the photodiode chip 12, and a micro mirror. 15, a semiconductor laser chip 17 mounted on the submount member 11, and a resin package 14.
It is composed of a hologram element 16 mounted thereon.

[0006] Then, the assembly on which the component mounting is completed is further mounted on a reference surface 18a below the optical pickup main body 18 as shown in FIG. 29, and the optical pickup main body 18 is mounted on an optical disk drive. Attached to. In the completed state of the optical disk drive, the laser light emitted by the semiconductor laser chip 17 is reflected by the 45 ° reflecting surface of the micromirror 15 and the reflected light is transmitted by the objective lens 19 on the main body 18 side via the hologram element 16. Focused disk D
And the reflected light is received by the light receiving surface of the photodiode chip 12 via the hologram element 16.

[0007]

However, in the above-described conventional component mounting apparatus, when the hologram element 16 as the last mounted component is mounted, the hologram element 16 is simply mounted on the resin package 14.
Since the hologram element 16 is mounted with the resin package 14 tilted, there is a problem that the hologram element 16 is mounted with the optical axis tilted with respect to the reference surface 18 a of the optical pickup body 18.

In the above-mentioned conventional component mounting apparatus, the head 6 temporarily stops at a position above the mounting station 3, and the cameras 5-2 and 5-3 are moved to the positions of the head 6 and the mounting station 3. Since the positioning is performed by taking an image, and then the cameras 5-2 and 5-3 are retracted and mounted, there is a problem that the component mounting time becomes long.
Further, since the cameras 5-2 and 5-3 are not fixed and are interrupted between the head 6 and the mounting station 3, the head 6
However, there is a problem that the vertical stroke becomes longer, so that the positioning accuracy is deteriorated.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, the present invention can improve the mounting accuracy when the upper surface of the first work on which the mounting of components is completed is further mounted on the reference surface of the second work. It is intended to provide a device.

[0010]

According to the present invention, in order to achieve the above object, a reference plate is provided above a stage at a position corresponding to a reference surface of a second work.
When the components are mounted on the first work, the first work is pushed up from below the stage. That is, according to the present invention, when the upper surface of the first work on which the component mounting is completed is further attached to the reference surface of the second work, the upper surface of the first work is located above the stage at a position corresponding to the reference surface of the second work. A component mounting apparatus is provided, comprising: a reference plate provided; and a workpiece push-up unit that pushes up the first work from below the stage and presses the reference work against the reference plate when mounting a component on the first work. You. Further, according to the present invention, a first stage on which a component to be supplied is mounted, a second stage movable in x, y, and θ directions, and a second stage on which a workpiece on which the component is mounted is mounted. Stage 3 and the components are transported from the first stage to the second stage and placed on the second stage, and the components are transported from the second stage to the third stage and Component conveying means to be placed on the workpiece,
The position of the component on the second stage and the position of the component on the first work on the third stage are aligned when the component is mounted on the second stage. Positioning means for moving the second stage in the x, y, and θ directions; and when the upper surface of the first work on which the component mounting is completed is further attached to the reference surface of the second work, A reference plate provided at a position corresponding to the reference surface of the second work, and a work for pushing up the first work from below the stage and pressing the first work against the reference plate when a component is mounted on the first work. A component mounting apparatus having push-up means is provided.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 is an external view showing a main part of an embodiment of the component mounting apparatus according to the present invention, FIG. 2 is a plan view showing the component mounting apparatus of FIG. 1, FIG. 3 is a front view showing the component mounting apparatus of FIG. FIG. 4 is an explanatory diagram showing the operation of positioning by the correction stage shown in FIGS.

As shown in FIGS. 1 to 3, a supply station 1, a correction station 2, and a mounting station 3 are arranged horizontally from left to right, and at regular intervals in this order. The supply station 1 and the mounting station 3 each include a supply stage 1a movable in the xy directions.
And the correction stage 2 have x,
It has a correction stage 2a movable in the y and θ directions. TVs are located above these stations 1, 2, and 3, respectively.
The cameras 5-1, 5-2, and 5-3 are fixed, and the TV cameras 5-1 to 5-3 image components on the stages 1a to 3a, respectively.

A support member 20 is fixed above the stations 1 to 3 so as to extend in the horizontal direction. A head base 21 is attached to the support member 20 so as to be movable in the horizontal direction. Two suction collets 4a and 4b are attached to the head base 21 so as to be vertically movable,
The distance between the suction collets 4a and 4b corresponds to the distance between the supply station 1 and the correction station 2 and the distance between the correction station 2 and the mounting station 3.

In such a configuration, the suction collet 4
a reciprocates between the supply station 1 and the correction station 2, and the suction collet 4b
The parts are conveyed from the supply station 1 to the correction station 2 and from the correction station 2 to the mounting station 3 by reciprocating between the and the mounting station 3.

At this time, first, the suction collets 4a, 4b
Are located between the supply station 1 and the correction station 2 and between the correction station 2 and the mounting station 3, respectively, so as not to hinder the imaging of the TV cameras 5-1 to 5-3 as shown in FIGS. Waiting in the upper position.
Then, the operation of the suction collet 4a will be described.
First, the components on the supply stage 1a are imaged by the TV camera 5-1 and the supply stage 1
The supply component is positioned at the suction position by moving a in the xy directions. Next, after the suction collet 4a moves to the position of the supply station 1 in the horizontal direction and then descends to suck the supply components on the supply stage 1a, and then moves upward to move to the position of the correction station 2 in the horizontal direction, respectively, As shown in FIG. 3, it is lowered and mounted on the correction stage 2a.

In parallel with the operations of the TV camera 5-1 and the suction collet 4a, the components on the correction stage 2a and the mounting positions on the mounting stage 3a are imaged by the TV cameras 5-2 and 5-3, respectively. First, based on the image signal, the work is positioned by moving the mounting stage 3a in the xy directions, and then the x, y, and θ directions of the component are set in the mounting position on the work by moving the correction stage 2a. Is aligned with Next, after the suction collet 4b moves to the position of the correction station 2 in the horizontal direction, it descends to suck the components on the correction stage 2a, and then moves upward to move to the position of the mounting station 3 in the horizontal direction. As shown, it is lowered and mounted on a predetermined position of the work on the mounting stage 3a.

FIG. 4 (a) shows an image before the positioning taken by the TV cameras 5-2 and 5-3, and the position of the component on the correction stage 2a and the mounting on the work on the mounting stage 3a. The position is different. Therefore, the characteristics of the component on the correction stage 2a are extracted, and the components are extracted by the correction stage 2a as shown in FIG. 4B so that the characteristic matches the position to be mounted on the work on the mounting stage 3a. Position in the x, y, and θ directions.

Therefore, according to such a configuration, although the component goes through the correction stage 2a, the TV camera 5
Since -2 and 5-3 do not move, the component mounting time can be greatly reduced as compared with the conventional example, and the alignment accuracy can be improved. In addition, according to the above configuration, the suction collets 4a and 4b move simultaneously to simultaneously move the components from the supply station 1 to the correction station 2 and the components from the correction station 2 to the mounting station 3, respectively. Can be shortened. Although the component mounting time will be somewhat longer,
The number of the suction collets 4a and 4b may be one.

According to the above configuration, parts having various characteristics can be mounted on the work. FIG. 5 shows a light-emitting / light-receiving assembly mounted on an optical pickup main body as an example of components mounted on the component mounting apparatus according to the present invention. The light emitting / receiving assembly includes a resin package 14 in which a lead frame 13 is sealed, and a photodiode chip 1 mounted on the lead frame 13.
2, a submount member 11 and a micromirror 15 mounted on the photodiode chip 12, and a semiconductor laser chip 17 mounted on the submount member 11.
And a hologram element 16 mounted on the resin package 14. When such an assembly is mounted on the optical pickup main body 18 as shown in FIG. 29, the laser light emitted from the semiconductor laser chip 17 is reflected by the 45 ° reflecting surface of the micro mirror 15, and the reflected light Is condensed by the objective lens 19 via the hologram element 16 and is irradiated on the surface of the disk D, and the reflected light is received by the light receiving surface of the photodiode chip 12 via the hologram element 16.

When assembling such a light emitting / receiving assembly, first, a submount member (hereinafter, also referred to as SM) 11 is mounted on a photodiode chip (hereinafter, also referred to as PD) 12 by a first component mounting apparatus. The semiconductor laser chip (hereinafter, also referred to as LD) 17 is mounted on the sub-mount member 11 by the second component mounting device, and then mounted by the third component mounting device. Micro mirror (hereinafter M
Also called M. ) 15 is mounted on the PD chip 12. Next, the photodiode wafer is diced for each PD chip 12, and the PD component is then diced by a fourth component mounting apparatus.
The chip 12 is mounted on the resin package 14, and then the hologram element 16 is mounted on the resin package 14 by a fifth component mounting device.

The basic structure of the above-described first to fifth component mounting apparatuses is the same as that of FIGS. 1 to 3, but the configuration is slightly different depending on the mounted components as described later. FIG. 6 shows a first component mounting apparatus, and as shown in detail in FIG.
An SM sheet 31 in which a number of SM chips 11 are supported by an adhesive tape in advance is set on a, and a PD wafer 32 is set on the mounting stage 3a. The PD wafer 32 is supported by a PD pallet 33 as shown in FIG.
3 is positioned with respect to the positioning pins 34 on the mounting stage 3a side. Then, as shown in FIG. 8, each SM chip 11 is mounted at a mounting position on the PD chip 12 constituting the PD wafer 32 where an adhesive is applied in advance.

Here, as shown in FIG. 9, when a large number of SM chips 11 (chip components) adsorb one SM chip 11 from the SM sheet 31 supported by the adhesive tape 31a by the suction collet 4a, the adhesive is used. Tape 31a
A method is known in which the SM chip 11 is raised from the adhesive tape 31a by abutting a pin 36 from the back surface of the SM chip 11 and sucked. In such a method, it is necessary to take an image of the tip of the pin 36 with the TV camera 5-1 and adjust the position of the pin 36 and the suction position of the suction collet 4a in advance. TV camera 5
No image can be obtained even if the image is taken with -1. Therefore, in the first component mounting apparatus that handles components supported by the adhesive tape 31a, the tip of the pin 36 can be imaged by ring illumination (shown in FIG. 37) on the supply stage 1a as shown in FIG. it can. Note that the TV camera 5-1 may capture an image obliquely.

FIG. 10 shows a second component mounting apparatus, and FIG.
As shown in FIG. 1A, an LD sheet 37 on which a large number of LD chips 17 are supported in advance by an adhesive tape is set on the supply stage 1a. In addition, mounting stage 3
As shown in FIG. 11B, a PD wafer 32 supported by a PD pallet 33 is set on a as shown in FIG. 11B. Then, as shown in FIG. 12, the LD chip 17 is mounted on the mounting position of the SM chip 11 mounted on the PD wafer 32 where the adhesive is applied in advance. Similarly, in the second (and later described) component mounting apparatus, since the LD chip 17 is supported by the adhesive tape, the supply stage 1a is configured to be ring-illuminated.

Here, since the parts are conveyed between the stations while being sucked by the suction collets 4a and 4b,
Although there is a possibility that the positioning accuracy may be degraded during the conveyance in the suction state, depending on the components, very high positioning accuracy may be required in one direction and may not be required in the other direction. The LD chip 17 is one example, and as shown in FIG. 13, high accuracy is required in the emission direction (Y direction) of the laser beam, but high accuracy is not required in the X direction. Therefore, in the second component mounting apparatus, conveyance is performed in the X direction, in which extremely high positioning accuracy is not required, in a suction state.

The feature of a component serving as a reference for positioning is usually the outer shape of the imageable component or the pattern of the upper surface. Such a feature is located on the surface opposite to the suction surface. There are also parts. In the case of such a part, a method of temporarily stopping while moving between stations and taking an image of the opposite side of the part with another fourth camera to extract the feature can be considered. And costly. Therefore, for example, the LD chip 1 as a mounting component
In the case where 7 is such a component, the correction stage 2a is replaced with a transparent glass as shown in FIG.
The TV camera 5-2 captures an image of the part from below through the glass to extract the feature.

When a part is sucked and conveyed by the suction collets 4a and 4b, it is necessary to take an image with a camera to check whether the part is actually sucked. However, since the LD chip 17 is generally much smaller than other components, as shown in FIG.
When the suction collet 4 sucks 7 from directly above, an image must be obliquely picked up by another fourth TV camera. Therefore, in this second component mounting apparatus, FIG.
As shown in (b), the suction collet 4 sucks the LD chip 17 obliquely from above and forms a vertical opening 21a in the head 21 above the suction collet 4 without providing another TV camera. Camera 5-1 to 5
-3.

It is desirable that the suction hole of the suction collet 4 be as small as possible in order to stably suck the parts. However, make the suction hole as small as possible,
Further, when an image of the component sucked by the suction hole is to be taken from above, there is a limit to making the outer shape of the suction collet 4 smaller than the outer shape of the component as shown in FIG. Due to the vertical wall of the suction collet 4, the components are blurred and components are difficult to catch. Also, as the size of the component becomes smaller, the image needs to be enlarged. In this case, since the depth of field becomes shallow, this phenomenon becomes remarkable. Therefore, as shown in FIG. 16B, by forming the wall surface of the suction collet 4 near the component 17 being sucked by the suction hole at an angle, blurring due to the wall surface of the suction collet 4 is prevented, and the component is lifted. Can be reliably captured.

FIG. 17 shows a third component mounting apparatus, and FIG.
As shown in FIG. 8A, an MM sheet 38 on which a large number of MM chips 15 are supported in advance by an adhesive tape is set on the supply stage 1a. In addition, mounting stage 3
As shown in FIG. 18 (b), the P supported by the PD pallet 33 is similar to the first and second component mounting devices.
The D wafer 32 is set. Then, as shown in FIG. 19, the MM chip 15 is mounted on the PD chip 12 mounted on the PD wafer 32 at a predetermined position where an adhesive is applied in advance. Similarly, in the third component mounting apparatus, since the MM chip 15 is supported by an adhesive tape, the supply stage 1a is configured to be ring-illuminated.

Here, the MM chip 15 is formed with a 45 ° reflecting surface for reflecting the laser light emitted from the LD chip 17 in parallel with the mounting surface, directly above, and the optical axis of the reflected light. Must match the objective lens on the optical pickup body side. When the distance between the MM chip 15 and the LD chip 17 is shifted, the optical axes do not match, but FIG.
As shown in (1), when the position of the tip of the MM chip 15 is imaged as a feature and alignment is performed, the optical axes do not coincide due to the variation in the chamfering of the tip of the MM chip 15.

Therefore, on the correction stage 2a of the third component mounting apparatus, a dummy component 39 having a horizontal ridge line at a position corresponding to the LD chip 17 is arranged as shown in FIG. At the same time, the light source 40 is arranged behind the dummy component 39, and the TV camera 5-2 captures an image of the silhouette 39a of the horizontal ridge line of the dummy component 39 reflected by the MM chip 15. At this time,
If the distance of the MM chip 15 from the horizontal ridge line of the dummy component 39 is shifted, the silhouette 39a imaged by the TV camera 5-2 is shifted by that amount. 39a is also rotated by that amount, so that the position adjustment in the x, y, and θ directions is performed so that the silhouette 39a is at a predetermined position and a predetermined angle.

As described above, the PD wafer 32 on which the SM chip 11, the LD chip 17, and the MM chip 15 are mounted by the first to third component mounting apparatuses is sent to the adhesive curing step, and the respective chips 11, 17 , 15 are fixed,
Next, the wafer is sent to a dicing process,
It is cut for each D chip 12 and then sent to a fourth component mounting apparatus.

FIG. 21 shows a fourth component mounting apparatus, and FIG.
As shown in FIG. 2A, a dicing plate 41 on which a PD wafer 32 cut in advance for each PD chip 12 is set on the supply stage 1a. An LF pallet 42 is set on the mounting stage 3a as shown in FIG.
2 supports a large number of resin packages 14 each having a lead frame (LF) 13 sealed therein. Then, as shown in FIG. 23, an Ag paste is previously applied to a mounting position in the resin package 14, and then the PD chip 12 is mounted at this applying position. When the mounting of the LF pallet 42 on all the resin packages 14 is completed, the LF pallet 42 is sent to an Ag paste curing process to fix the PD chip 12 and then the LD chip 17.
Then, wire bonding of each lead of the PD chip 12 and the lead frame 13 is performed, and then the lead is sent to the fifth component mounting apparatus.

FIG. 24 shows a fifth component mounting apparatus, and FIG.
As shown in FIG. 5A, a dicing plate 44 is set on the supply stage 1a.
Supports an HOE sheet 43 on which a number of hologram elements (HOE) 16 are supported in advance. Also,
As shown in FIG. 25B, an LF pallet 42 supporting the resin package 14 is set on the mounting stage 3a. Then, an adhesive is applied in advance to the mounting position in the resin package 14, and then the hologram element 16 is mounted in this application position.

By the way, the assembly having the components mounted thereon is further mounted on a reference surface 18a below the optical pickup main body 18, as shown in FIG. 29, and the optical pickup main body 18 is mounted on an optical disk drive. Attached to. In the completed state of the optical disk drive, the laser light emitted by the semiconductor laser chip 17 is reflected by the 45 ° reflecting surface of the micromirror 15 and the reflected light is transmitted by the objective lens 19 on the main body 18 side via the hologram element 16. Focused disk D
And the reflected light is received by the light receiving surface of the photodiode chip 12 via the hologram element 16. Therefore, if the hologram element 16 is mounted in a state where the resin package 14 is tilted, the hologram element 16 is mounted in a state where the optical axis is tilted with respect to the reference surface 18 a of the optical pickup main body 18, so that it does not operate normally.

The mounting stage 3a in the fifth component mounting apparatus is configured as shown in FIG. First, a reference surface 45a is provided above the mounting stage 3a at a position corresponding to the reference surface 18a of the optical pickup body 18.
Is attached. A work push-up mechanism 5 that pushes up the resin package 14 and presses it against the reference plate 45 below the mounting stage 3a.
0 is arranged.

The work lifting mechanism 50 includes the upper block 5
1 and a lower block 52, and a contact probe 53 whose upper end can contact the lead frame 13 when the resin package 14 is pushed up is provided in the upper block 51. The contact probe 53 is a resin package 14
When the hologram element 16 is mounted, the LD chip 17, the PD chip 12, and the lead frame 13 are inspected when the hologram element 16 is mounted.

A printed circuit board 54 is mounted below the upper block 51. The lower end of the contact probe 53 is soldered to the upper surface of the printed circuit board 54, and a conductive pattern (not shown) is formed on the lower surface. The lower block 52 corresponding to the position of the conductive pattern holds a contact pin 55, and the contact pin 55 is connected to an inspection circuit (not shown). The upper block 51 and the lower block 52 are each provided with a recess 5 in the horizontal direction.
1a and 52a are formed, and the concave portion 51 of the upper block 51 is formed.
a is formed slightly above the concave portion 52a of the lower block 52 (as viewed in a direction perpendicular to the paper surface). And
When the two concave portions 51a and 52a are stopped by the screws 56, the conductive pattern of the printed circuit board 54 and the contact pins 55 are pressed.

[0038]

As described above, according to the present invention, the reference plate is provided above the stage at a position corresponding to the reference surface of the second work, and the stage is mounted when the component is mounted on the first work. The first work is pushed up from below, so the first
When the upper surface of the work is further mounted on the reference surface of the second work, the mounting accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is an external view showing a main part of an embodiment of a component mounting apparatus according to the present invention.

FIG. 2 is a plan view showing the component mounting apparatus of FIG. 1;

FIG. 3 is a front view showing the component mounting apparatus of FIG. 1;

FIG. 4 is an explanatory diagram showing an operation of positioning by the correction stage of FIGS. 1 to 3;

FIG. 5 is an external view showing a specific example of a mounted component.

6 is a plan view showing a component mounting apparatus when the submount of FIG. 5 is mounted.

FIG. 7 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 6;

FIG. 8 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 6 in detail.

FIG. 9 is an explanatory view showing a ring light source in the component mounting apparatus of FIG. 6 in detail.

FIG. 10 is a plan view showing a component mounting apparatus when the LD chip of FIG. 5 is mounted.

FIG. 11 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 10;

FIG. 12 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 10 in detail.

FIG. 13 is an explanatory diagram showing in detail a transport direction of an LD chip by the component mounting apparatus of FIG. 10;

FIG. 14 is an explanatory diagram showing a correction stage in the component mounting apparatus of FIG. 10 in detail.

FIG. 15 is a configuration diagram showing a conventional example and a head in the component mounting apparatus of FIG. 10;

FIG. 16 is a configuration diagram showing a suction collet in the conventional example and the component mounting apparatus of FIG. 10;

FIG. 17 is a plan view showing a component mounting apparatus when the micromirror chip of FIG. 5 is mounted.

18 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 17;

FIG. 19 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 17 in detail.

20 is an explanatory diagram showing in detail a positioning method in the component mounting apparatus of FIG. 17;

FIG. 21 is a plan view showing a component mounting apparatus when the PD chip of FIG. 5 is mounted.

FIG. 22 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 21;

FIG. 23 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 21 in detail.

24 is a plan view showing a component mounting device when the hologram element of FIG. 5 is mounted.

FIG. 25 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 24;

26 is a configuration diagram illustrating a reference plate and a push-up mechanism in the component mounting apparatus of FIG. 24.

FIG. 27 is an external view showing a conventional component mounting apparatus.

FIG. 28 is an explanatory diagram showing a mounting process by the component mounting apparatus of FIG. 27;

FIG. 29 is an explanatory view showing a state where the assembly of FIG. 5 is attached to the optical pickup main body.

[Explanation of symbols]

1a Supply stage (first stage) 2a Correction stage (second stage) 3a Mounting stage (third stage) 4a, 4b Suction collet (component transfer means) 5-1 5-2-5 TV camera (Positioning means) 45 Reference plate 45a Reference surface 50 Push-up mechanism 51 Upper block 52 Lower block 53 Contact probe 54 Printed circuit board 55 Contact pin 56 Screw

Claims (6)

[Claims] When the upper surface of a first work on which components are mounted is further attached to a reference surface of a second work,
A reference plate provided at a position corresponding to a reference surface of the second work above the stage; and when the component is mounted on the first work, the first work is pushed up from below the stage to make the reference work. A component mounting device, comprising: a workpiece push-up means for pressing against a plate. 2. A first stage on which a component to be supplied is mounted, a second stage movable in x, y, and θ directions, and a third stage on which a workpiece on which the component is mounted is mounted. A stage, a part is conveyed from the first stage to the second stage and is placed on the second stage, and a part is conveyed from the second stage to the third stage and the first workpiece is A component transfer unit mounted on the first stage, a component position on the second stage when the component is mounted on the second stage, and a mounting on a first workpiece on the third stage. Positioning means for moving the second stage in the x, y, and θ directions so that the mounting positions are aligned; and the upper surface of the first work on which the components are mounted is further positioned on the reference surface of the second work. When mounted, the second wire above the stage A reference plate provided at a position corresponding to a reference surface of a workpiece; and a workpiece push-up means for pushing up the first workpiece from below the stage and pressing the first workpiece against the reference plate when a component is mounted on the first workpiece. And a component mounting device. 3. A contact probe for contacting a conductive pattern of a first work to which a lead of a component is conducted is provided on the work push-up means, and the first work is inspected via the contact probe when the work push-up means is pushed up. 3. The component mounting apparatus according to claim 1, wherein the component mounting is performed. 4. The component mounting apparatus according to claim 3, wherein said contact probe is configured to contact and bend with a conductive pattern of said first workpiece when said workpiece push-up means moves upward. 5. A printed circuit board comprising: an upper block for holding the contact probe; a work board pushing-up means mounted below the upper block, the contact probe being soldered to an upper surface, and a conductive pattern formed on a lower surface. The component mounting apparatus according to claim 3, further comprising: a lower block attached below the printed board and holding a contact pin that contacts a conductive pattern of the printed board. 6. A concave portion is formed in both the upper block and the lower block in a horizontal direction, a concave portion of the upper block is formed slightly above the concave portion of the lower block, and the two concave portions are screwed. The component mounting apparatus according to claim 5, wherein the conductive pattern and the contact pin of the printed board are pressed.