JPH11135845A - Thermoionic module - Google Patents
Thermoionic moduleInfo
- Publication number
- JPH11135845A JPH11135845A JP9299733A JP29973397A JPH11135845A JP H11135845 A JPH11135845 A JP H11135845A JP 9299733 A JP9299733 A JP 9299733A JP 29973397 A JP29973397 A JP 29973397A JP H11135845 A JPH11135845 A JP H11135845A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric
- thermoionic
- lead wire
- type thermoelectric
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005219 brazing Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は熱電モジュールに関
する。[0001] The present invention relates to a thermoelectric module.
【0002】[0002]
【従来の技術】熱電モジュールは、p型熱電素子とn型
熱電素子が電極板を介して電気的に直列となるように接
合されたもので、pn素子対の接合部間に温度差を与え
ると電位差が発生し、また接合部間に電流を流すと、そ
の電流の向きにより吸熱又は発熱する性質を有する。前
者の性質はゼーベック効果と呼ばれ、例えばごみ焼却炉
の廃熱による発電の如き熱電発電用に開発されており、
後者の性質はペルチェ効果と呼ばれ、例えば半導体製造
プロセスにおける恒温装置、エレクトロデバイスの冷却
等の熱電冷却に幅広く利用されている。2. Description of the Related Art A thermoelectric module is formed by joining a p-type thermoelectric element and an n-type thermoelectric element via an electrode plate so as to be electrically connected in series. When a current flows between the junctions, heat is absorbed or heat is generated depending on the direction of the current. The former property is called the Seebeck effect, and has been developed for thermoelectric power generation, such as power generation by waste heat from refuse incinerators,
The latter property is called a Peltier effect, and is widely used for thermoelectric cooling such as cooling of a thermostat or an electronic device in a semiconductor manufacturing process.
【0003】この熱電モジュールの典型例として、図3
に示すように、対向するセラミック基板(96)(96)の間に
て、p型熱電材料(90)とn型熱電材料(91)が電極板(98)
を介して電気的に直列に接続された構造のものがある。
この熱電モジュールの作製法について説明すると、図4
に示すように、p型熱電材料(90)とn型熱電材料(91)の
両面に、接合性を高めるためのNiメッキ層(92)(92)が
施され、Niメッキ層の上には半田メッキ層(94)(94)が
さらに施される。次に、電極(98)は、電気絶縁性のセラ
ミック基板(96)の上にCuのパターニングを直接施して
形成される。セラミック基板(96)のCu電極(98)の上
に、そのパターニング位置に対応してp型熱電材料(90)
とn型熱電材料(91)が交互に配置された後、これら熱電
材料(90)(91)の上に、Cu電極(98)のパターニングが施
されたセラミック基板(96)が載せられる。これを加熱装
置の中に入れて加熱すると、半田(94)(94)が溶融し、熱
電材料(90)(91)のNiメッキ層(92)(92)と、セラミック
基板(96)(96)のCu電極(98)(98)とが接合される。FIG. 3 shows a typical example of this thermoelectric module.
As shown in the figure, a p-type thermoelectric material (90) and an n-type thermoelectric material (91) are provided between the facing ceramic substrates (96) and (96).
Are electrically connected in series via a.
The method of manufacturing the thermoelectric module will be described with reference to FIG.
As shown in the figure, Ni plating layers (92) and (92) for improving the bonding property are applied to both sides of the p-type thermoelectric material (90) and the n-type thermoelectric material (91), and A solder plating layer (94) (94) is further applied. Next, the electrode (98) is formed by directly patterning Cu on the electrically insulating ceramic substrate (96). On the Cu electrode (98) of the ceramic substrate (96), p-type thermoelectric material (90) corresponding to the patterning position
After the n-type thermoelectric material (91) and the n-type thermoelectric material (91) are alternately arranged, a ceramic substrate (96) on which a Cu electrode (98) is patterned is placed on the thermoelectric material (90) (91). When this is put in a heating device and heated, the solder (94) (94) melts, and the Ni plating layers (92) (92) of the thermoelectric materials (90) (91) and the ceramic substrates (96) (96) ) Are joined to the Cu electrodes (98) and (98).
【0004】しかし、この熱電モジュールでは、所望の
機械的強度を確保するためにセラミック基板(96)を厚く
作らねばならず、このセラミック基板が熱伝導を妨げる
結果、熱電効率に劣る問題があった。そこで、出願人は
以前に、図5に示す如く、対向する一対の電極板(18)(1
8)の間にp型熱電材料(16)が接合されたp型熱電素子(2
1)と、対向する一対の電極板(18)(18)の間にn型熱電材
料(17)が接合されたn型熱電素子(22)とが、電気的に絶
縁性の材料から作られた平板状の基体(11)の中に格子状
に配置され、熱電素子(21)(22)が全体として電気的に直
列となるように、隣り合う電極板(18)(18)どうしが接続
されたものを提案した。この熱電モジュールは、密着さ
せるべき熱交換用部材との間に、アルミナ等の薄い電気
絶縁膜を介在させるだけでよいから、熱伝導性は著しく
改善される。However, in this thermoelectric module, the ceramic substrate (96) must be made thick in order to secure a desired mechanical strength, and this ceramic substrate interferes with heat conduction, resulting in poor thermoelectric efficiency. . Then, the applicant previously made a pair of opposed electrode plates (18) (1) as shown in FIG.
8) a p-type thermoelectric element (2) with a p-type thermoelectric material (16)
1) and an n-type thermoelectric element (22) in which an n-type thermoelectric material (17) is joined between a pair of opposed electrode plates (18) and (18) are made of an electrically insulating material. The adjacent electrode plates (18) (18) are connected so that the thermoelectric elements (21) and (22) are electrically connected in series as a whole in a flat plate-shaped base (11). Suggested what was. In this thermoelectric module, it is only necessary to interpose a thin electric insulating film such as alumina between the heat exchange member to be brought into close contact with the heat exchange member, so that the thermal conductivity is significantly improved.
【0005】ところで、この熱電モジュールの作製は、
図6で示すように、p型熱電素子(21)とn型熱電素子(2
2)を、所定の間隔をあけて交互に並べて格子状に配置
し、電気的に直列となるように、隙間を挟んで隣り合う
上側電極板(18)(18)どうし、下側電極板(18)(18)どうし
を半田等のロー材(25)でロー付けした後、熱電素子の電
気的直列の基端及び終端となる電極板にそれぞれリード
線(32)(32)を取り付けたものを、底付き型枠(図示せず)
の中に入れ、半液状にしたセメント材料を流し込んで凝
固させて、熱電モジュールの基体を形成し、その後で電
極板が露出するまで平面研削することにより行なわれ
る。By the way, the production of this thermoelectric module is as follows.
As shown in FIG. 6, the p-type thermoelectric element (21) and the n-type thermoelectric element (2
2), are arranged alternately at a predetermined interval in a grid pattern, and are electrically connected in series so that the upper electrode plates (18) and (18) adjacent to each other with a gap therebetween, the lower electrode plate ( 18) (18) After soldering each other with a brazing material (25) such as solder, the lead wires (32) and (32) are attached to the electrode plates serving as the base and end of the thermoelectric element in electrical series. A bottomed formwork (not shown)
And a semi-liquid cement material is poured and solidified to form a base of the thermoelectric module, and thereafter, surface grinding is performed until the electrode plate is exposed.
【0006】[0006]
【発明が解決しようとする課題】しかし、この方法で
は、熱電素子を電気的に直列接続した後に、半液状のセ
メント材料を流し込むから、リード線(32)の一部は基体
(11)の中に埋め込まれて基体(11)からはみ出すため、作
業性が悪く、リード線の長さを後で変えることが困難で
ある。例えば、接続しようとする他の熱電モジュール又
は機器との距離が変わると、その距離に合わせてリード
線(32)を切断したり、或いは追加のリード線を用いて延
長せねばならなかった。However, in this method, since the semi-liquid cement material is poured after the thermoelectric elements are electrically connected in series, a part of the lead wire (32) is partially
Since it is embedded in (11) and protrudes from the base (11), workability is poor, and it is difficult to change the length of the lead wire later. For example, when the distance to another thermoelectric module or device to be connected changes, the lead wire (32) has to be cut or extended with an additional lead wire according to the distance.
【0007】[0007]
【課題を解決するための手段】本発明の熱電モジュール
は、対向する一対の電極板の間にp型熱電材料が接合さ
れたp型熱電素子と、対向する一対の電極板の間にn型
熱電材料が接合されたn型熱電素子とが、電気的に絶縁
性の材料から作られた平板状の基体の中に格子状に配置
され、熱電素子が全体として電気的に直列となるように
隣り合う電極板どうしが接続されてなる熱電モジュール
において、熱電素子の電気的直列の基端及び終端となる
それぞれの電極板に対し、導電性材料から形成されたリ
ード線取付部材を電気的に接続し、各々のリード線取付
部材の外側端部に、リード線を取り付けるべきネジ部材
と螺合可能なネジ孔を開設したものである。According to the thermoelectric module of the present invention, a p-type thermoelectric element in which a p-type thermoelectric material is joined between a pair of opposed electrode plates and an n-type thermoelectric material are joined between a pair of opposed electrode plates. N-type thermoelectric elements are arranged in a grid in a flat substrate made of an electrically insulating material, and adjacent electrode plates such that the thermoelectric elements as a whole are electrically in series. In a thermoelectric module in which the thermoelectric elements are connected to each other, a lead wire mounting member made of a conductive material is electrically connected to each of the electrode plates serving as a base end and an end of an electric series of the thermoelectric element. At the outer end of the lead wire mounting member, a screw hole is formed which can be screwed with a screw member to which the lead wire is to be mounted.
【0008】[0008]
【作用及び効果】ネジ部材とリード線取付部材の間にリ
ード線を挟んで、ネジ部材をネジ孔へ螺入することによ
り、リード線と熱電モジュールは電気的に接続される。
本発明の構成では、接続すべき他の熱電モジュール又は
機器との距離に合わせてリード線を準備できるので、他
の熱電モジュール又は機器との接続作業が簡素化され
る。The lead wire and the thermoelectric module are electrically connected to each other by inserting the lead wire between the screw member and the lead wire mounting member and screwing the screw member into the screw hole.
According to the configuration of the present invention, since the lead wire can be prepared according to the distance to another thermoelectric module or device to be connected, the connection operation with another thermoelectric module or device is simplified.
【0009】[0009]
【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。図1は、本発明の熱電モジュールの斜視
図、図2(a)は熱電モジュールの平面図、図2(b)は図
2(a)のA−A'線に沿う断面図である。図1及び図2
を参照すると、矩形平板状の基体(11)の中に、p型熱電
素子(21)とn型熱電素子(22)の2種類の熱電素子が、仕
切部(13)を介して交互に配置され、格子状の配列となっ
ている。p型熱電素子(21)とn型熱電素子(22)は、全体
として電気的に直列となるように、隣り合う上側電極板
(18)(18)どうし、下側電極板(18)(18)どうしが、半田等
のロー材(25)を介して上下交互に接続される。この接続
状態は、図2(b)に最もわかり易く示されている。な
お、熱電素子の個数は所望される発電容量に応じて適宜
選択されるべきものであって、図示の実施例の個数に限
定されるものでないことは理解されるべきである。基体
(11)は、セラミックス又はセメント等の電気的絶縁性材
料から作られており、望ましい材料として、例えばコー
ジェライト(2MgO・2Al2O3・5SiO2)を挙げ
ることができる。Embodiments of the present invention will be described below. FIG. 1 is a perspective view of a thermoelectric module of the present invention, FIG. 2A is a plan view of the thermoelectric module, and FIG. 2B is a cross-sectional view taken along line AA ′ of FIG. 1 and 2
Referring to, two types of thermoelectric elements, a p-type thermoelectric element (21) and an n-type thermoelectric element (22), are alternately arranged via a partition (13) in a rectangular plate-shaped base (11). Are arranged in a lattice. The p-type thermoelectric element (21) and the n-type thermoelectric element (22) are adjacent to each other so that they are electrically connected in series.
(18) The lower electrode plates (18) and (18) are alternately connected to each other via a brazing material (25) such as solder. This connection state is shown most clearly in FIG. It should be understood that the number of thermoelectric elements should be appropriately selected according to the desired power generation capacity, and is not limited to the number of the illustrated embodiment. Substrate
(11) is made of an electrically insulating material such as ceramic or cement, can be cited as a preferred material, for example cordierite the (2MgO · 2Al 2 O 3 · 5SiO 2).
【0010】p型熱電素子(21)は、対向する一対の電極
板(18)(18)の間にp型熱電材料(16)が予め接合されてお
り、n型熱電素子(22)は、対向する一対の電極板(18)(1
8)の間にn型熱電材料(17)が予め接合されている。これ
ら熱電素子は、金型の中に、電極板を入れ、その上に熱
電材料粉末を充填した後、電極板を載せて、ホットプレ
スすることにより作製される。p型熱電材料の例とし
て、(Bi2Te3)1-x(Sb2Te3)xであってxが0.7
0〜0.85のもの、n型熱電材料の例として、(Bi2
Te3)1-x(Bi2Se3)xであってxが0.05〜0.15
のものを挙げることができるが、これらに限定されるも
のでない。なお、組成比は原子数比である。電極板(18)
はCu板が使用されるが、熱電材料との接合性を向上さ
せるために、熱電材料と接触する側の面に、Niメッキ
を施したり、又はMo若しくはTiを蒸着したものを使
用することがより望ましい。The p-type thermoelectric element (21) has a p-type thermoelectric material (16) previously bonded between a pair of opposing electrode plates (18), (18), and the n-type thermoelectric element (22) has A pair of opposing electrode plates (18) (1
An n-type thermoelectric material (17) is previously bonded between 8). These thermoelectric elements are manufactured by placing an electrode plate in a mold, filling a thermoelectric material powder thereon, placing the electrode plate, and hot pressing. As an example of a p-type thermoelectric material, (Bi 2 Te 3 ) 1 -x (Sb 2 Te 3 ) x where x is 0.7
(Bi 2)
Te 3 ) 1-x (Bi 2 Se 3 ) x where x is 0.05 to 0.15
However, the present invention is not limited to these. The composition ratio is a ratio of the number of atoms. Electrode plate (18)
Although a Cu plate is used, in order to improve the bondability with the thermoelectric material, a surface that is in contact with the thermoelectric material may be plated with Ni or vapor-deposited with Mo or Ti. More desirable.
【0011】図示の実施例では、図2(a)中、符号で
示す位置のp型熱電素子(21)が電気的直列の基端であ
り、電気的に直列となるようにジグザグ状に接続され、
符号で示す位置のn型熱電素子(22)が電気的直列の終
端となっている。In the illustrated embodiment, the p-type thermoelectric element (21) at the position indicated by the reference numeral in FIG. 2 (a) is the base end of the electric series, and is connected in a zigzag manner so as to be electrically connected in series. And
The n-type thermoelectric element (22) at the position indicated by the reference numeral is the end of the electrical series.
【0012】電気的直列の基端及び終端となる各熱電素
子の側部に、後記するリード線取付部材(44)を収容する
ための溝(34)が開設される。溝(34)は、望ましくは断面
矩形の細長い形状であり、溝(34)の深さは、リード線取
付部材(44)が、最終形状の熱電モジュールの中に納まる
程度の寸法とするのが望ましい。なお、熱電モジュール
の作製に際しては、熱電素子を収容すべき孔を予め格子
状に開設した基体を使用して、該孔の中へ熱電素子を配
置し、隣り合う熱電素子どうしを電気的に直列接続する
こともできる。この場合には、基体の中に溝(34)を予め
形成しておくことができるので、作製工程を簡素化する
ことができる。A groove (34) for accommodating a lead wire mounting member (44), which will be described later, is formed on a side portion of each of the thermoelectric elements serving as the base end and the end of the electrical series. The groove (34) is desirably an elongated shape having a rectangular cross section, and the depth of the groove (34) should be such that the lead wire mounting member (44) fits in the thermoelectric module in the final shape. desirable. When manufacturing the thermoelectric module, a thermoelectric element is arranged in the hole by using a base in which holes for accommodating the thermoelectric element are previously opened in a lattice shape, and adjacent thermoelectric elements are electrically connected in series. You can also connect. In this case, since the groove (34) can be formed in the base in advance, the manufacturing process can be simplified.
【0013】溝(34)の中へは、Cuなどの導電性材料か
らなるリード線取付部材(44)が配備される。望ましいリ
ード線取付部材(44)は細長い角棒状であり、その大きさ
は、溝(34)の大きさにほぼ等しく、電極板(18)と半田付
けする際に必要な隙間の分だけ、離して配置されてい
る。リード線取付部材(44)(44)と、符号で示される
位置の熱電素子(21)(22)とは、半田等のロー材(46)(46)
を用いてロー付けし、それぞれ電気的に接続される。A lead wire mounting member (44) made of a conductive material such as Cu is provided in the groove (34). Desirable lead wire attaching member (44) is in the shape of an elongated rectangular bar, and its size is almost equal to the size of groove (34), and is separated by the gap required for soldering with electrode plate (18). It is arranged. The lead wire mounting members (44) (44) and the thermoelectric elements (21) (22) at the positions indicated by the reference numerals are solder materials (46) (46) such as solder.
And are electrically connected.
【0014】リード線取付部材(44)の外端部側にはネジ
孔(45)が開設されており、該ネジ孔は、リード線(32)を
取り付けるべきネジ部材(42)と螺合可能である。A screw hole (45) is formed at the outer end of the lead wire mounting member (44), and the screw hole can be screwed with a screw member (42) to which the lead wire (32) is to be mounted. It is.
【0015】然して、ネジ部材(42)とリード線取付部材
(44)の間にリード線(32)を挟んで、ネジ部材(42)をネジ
孔(45)へ螺入することにより、リード線(32)は熱電モジ
ュールと電気的に接続される。なお、リード線(32)の先
端に圧着端子を取り付けておくと、ネジ部材(42)による
熱電モジュールへの電気的接続作業をより容易に行なえ
る。However, the screw member (42) and the lead wire attaching member
By screwing the screw member (42) into the screw hole (45) with the lead wire (32) interposed therebetween (44), the lead wire (32) is electrically connected to the thermoelectric module. If a crimp terminal is attached to the end of the lead wire (32), electrical connection to the thermoelectric module by the screw member (42) can be performed more easily.
【0016】本発明は、上記実施例の構成に限定される
ものでなく、特許請求の範囲の記載の範囲内で種々の変
形が可能であることは理解されるべきである。It should be understood that the present invention is not limited to the configuration of the above-described embodiment, and various modifications can be made within the scope of the claims.
【図1】本発明の熱電モジュールの斜視図である。FIG. 1 is a perspective view of a thermoelectric module of the present invention.
【図2】(a)は本発明の熱電モジュールの平面図、(b)
は(a)のA−A'線に沿う断面図である。FIG. 2A is a plan view of the thermoelectric module of the present invention, and FIG.
FIG. 3A is a cross-sectional view taken along line AA ′ of FIG.
【図3】従来の熱電モジュールの分解斜視図である。FIG. 3 is an exploded perspective view of a conventional thermoelectric module.
【図4】従来の熱電モジュールの作製方法を説明する図
である。FIG. 4 is a diagram illustrating a method for manufacturing a conventional thermoelectric module.
【図5】リード線が基体に埋め込まれた熱電モジュール
の斜視図である。FIG. 5 is a perspective view of a thermoelectric module in which a lead wire is embedded in a base.
【図6】図5の熱電モジュールについて、基体を形成す
る前の熱電素子の配列状態を示す斜視図である。FIG. 6 is a perspective view showing an arrangement state of thermoelectric elements before forming a base in the thermoelectric module of FIG. 5;
(11) 基体 (21) p型熱電素子 (22) n型熱電素子 (25)(46) ロー材 (32) リード線 (34) 溝 (42) ネジ部材 (44) リード線取付部材 (45) ネジ孔 (11) Base (21) p-type thermoelectric element (22) n-type thermoelectric element (25) (46) brazing material (32) lead wire (34) groove (42) screw member (44) lead wire mounting member (45) Screw hole
Claims (1)
型熱電材料(16)が接合されたp型熱電素子(21)と、対向
する一対の電極板(18)(18)の間にn型熱電材料(17)が接
合されたn型熱電素子(22)とが、電気的に絶縁性の材料
から作られた平板状の基体(11)の中に格子状に配置さ
れ、熱電素子(21)(22)が全体として電気的に直列となる
ように隣り合う電極板(18)(18)どうしが接続された熱電
モジュールであって、熱電素子の電気的直列の基端及び
終端となる各々の電極板(18)に対し、導電性材料から形
成されたリード線取付部材(44)を電気的に接続し、各々
のリード線取付部材の外側端部に、リード線(32)を取り
付けるべきネジ部材(42)と螺合可能なネジ孔(45)が開設
されていることを特徴とする熱電モジュール。1. A p-electrode between a pair of opposed electrode plates (18) (18).
P-type thermoelectric element (21) to which the type-type thermoelectric material (16) is joined, and an n-type thermoelectric element (to which an n-type thermoelectric material (17) is joined between a pair of opposed electrode plates (18) and (18)) 22) are arranged in a grid in a flat substrate (11) made of an electrically insulating material so that the thermoelectric elements (21) and (22) are electrically in series as a whole. A thermoelectric module in which electrode plates (18) and (18) adjacent to each other are connected to each other, and each of the electrode plates (18) serving as a base end and an end of an electric series of the thermoelectric element is formed of a conductive material. The lead wire mounting member (44) is electrically connected, and a screw hole (45) that can be screwed with a screw member (42) to which the lead wire (32) is to be mounted is provided at the outer end of each lead wire mounting member. ) Has been established.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9299733A JPH11135845A (en) | 1997-10-31 | 1997-10-31 | Thermoionic module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9299733A JPH11135845A (en) | 1997-10-31 | 1997-10-31 | Thermoionic module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11135845A true JPH11135845A (en) | 1999-05-21 |
Family
ID=17876313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9299733A Withdrawn JPH11135845A (en) | 1997-10-31 | 1997-10-31 | Thermoionic module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11135845A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100697166B1 (en) * | 2004-08-31 | 2007-03-22 | 가부시끼가이샤 도시바 | Thermoelectric device and method of manufacturing the same |
JP2011228708A (en) * | 2010-04-17 | 2011-11-10 | J Eberspaecher Gmbh & Co Kg | Heat transfer device and method for manufacturing same |
CN112599654A (en) * | 2020-12-22 | 2021-04-02 | 杭州大和热磁电子有限公司 | Thermoelectric module with conductive through hole |
-
1997
- 1997-10-31 JP JP9299733A patent/JPH11135845A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100697166B1 (en) * | 2004-08-31 | 2007-03-22 | 가부시끼가이샤 도시바 | Thermoelectric device and method of manufacturing the same |
JP2011228708A (en) * | 2010-04-17 | 2011-11-10 | J Eberspaecher Gmbh & Co Kg | Heat transfer device and method for manufacturing same |
CN112599654A (en) * | 2020-12-22 | 2021-04-02 | 杭州大和热磁电子有限公司 | Thermoelectric module with conductive through hole |
CN112599654B (en) * | 2020-12-22 | 2022-10-25 | 杭州大和热磁电子有限公司 | Thermoelectric module with conductive through hole |
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