JPH11135597A - Semiconductor wafer manufacturing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor wafer manufacturing equipment which enables carriage with manual operation without exerting influence on automatic carriage. SOLUTION: When selection signals SEL1, SEL2 are set to be 'automatic', and a selection signal SEL3 is set to be 'treatment 1' in an interrupt processing designation part 18, a semiconductor wafer 1A carried with an automatic carrying vehicle 2 is transferred from an automatic carrying-in port 11 to a wafer process part 14. Treatment conditions of treatment 1 which are stored in a storage device 19a in a process condition designation part 19 are successively outputted to the wafer process part 14, and the semiconductor wafer 1A which is subjected to wafer process by the 'treatment 1' is carried to an automatic carrying-out part 16. On the contrary, e.g. a semiconductor wafer 1B for manufacture trial is set in a manual carrying-in port 12, the selection signals SEL1, SEL2 are set to be 'manual', and the selection signal SEL3 is set to be 'treatment 2'. Then the semiconductor wafer 1B is subjected to wafer process by the 'treatemnt 2' and carried to a manual carrying-out port 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor wafer, and more particularly to an apparatus for manufacturing a semiconductor wafer capable of interrupting a different process during a normal process.

[0002]

2. Description of the Related Art In a semiconductor wafer process in a semiconductor device manufacturing process, an unmanned transfer device is used in order to prevent difficulties in carrying by hand and to prevent quality deterioration due to dust due to enlargement and miniaturization of semiconductor wafers. Automatic conveyance is the mainstream. In such a semiconductor wafer manufacturing apparatus by automatic transfer, a carry-in / out port for receiving a semiconductor wafer transferred by an unmanned transfer device is provided. The semiconductor wafer set in the loading / unloading port is transferred to various processing devices in the semiconductor wafer manufacturing apparatus, subjected to a predetermined wafer process, and returned to the loading / unloading port. Then, the processed semiconductor wafer is transported again by the unmanned transport device to the device for the next manufacturing process. As described above, in a semiconductor wafer device using automatic transfer, a predetermined wafer process can be performed accurately and promptly without manual intervention, and the yield is improved. In addition, since the manufacturing process is recorded, accurate process management can be performed.

[0003]

However, for example, when the delivery time of a product is limited and the delivery process cannot be completed in the same process as a normal product, the delivery condition is determined by a prototype or the like. In the case where the technical evaluation is performed while performing the process, the semiconductor wafer cannot be taken in and out of the semiconductor wafer manufacturing apparatus by automatic transfer. For this reason, it has become necessary to take express products and prototypes into and out of the semiconductor wafer manufacturing apparatus manually. However,
The conventional semiconductor wafer manufacturing apparatus has a configuration on the premise of automatic transfer. Therefore, when the transfer is performed manually, there are the following problems (1) to (3). (1) In the case of automatic transfer, the progress of the wafer process is automatically managed. However, in the case of manual transfer, the automatic processing function is stopped.
The worker himself / herself must manage the progress status, which may be troublesome and may lead to omission of management. In particular, in the case of management omission, since the actual processing has been performed, the management data is in an unprocessed state, and thus the same processing may be performed repeatedly. (2) When a semiconductor wafer, such as an express product, is manually interrupted and set in a loading / unloading port of a semiconductor wafer manufacturing apparatus during automatic transfer, the semiconductor wafer is transferred to the semiconductor wafer by the automatic transfer. Conflicts occurred at the loading / unloading port, which hindered the automatic transport operation. (3) In the case of a prototype, it is necessary for the operator to sequentially set the conditions of the processing contents in each processing step from an operation panel or the like, and there is no means for checking even if the setting is incorrect, so that the wafer process gets stuck halfway. There was a fear. The present invention provides the above (1) to (10) which the prior art has.
An object of the present invention is to provide a semiconductor wafer manufacturing apparatus capable of solving the problem (3) and performing manual transfer without affecting automatic transfer.

[0004]

According to a first aspect of the present invention, there is provided a semiconductor wafer manufacturing apparatus for receiving a first semiconductor wafer to be subjected to a wafer process. A first loading port, a second loading port for receiving a second semiconductor wafer to be subjected to a wafer process, and the first or second loading port in accordance with a first selection signal. Loading means for loading the first or second semiconductor wafer accepted by the mouth, process specifying means for outputting the first or second processing condition as a specified processing condition based on a processing selection signal, A wafer processing means, first and second unloading ports, unloading means, and selection signal setting means.
The wafer processing means performs a wafer process on the first or second semiconductor wafer loaded by the loading means based on the designated processing conditions. First
And a second unloading port for unloading the first or second semiconductor wafer subjected to the wafer process by the wafer processing means. The unloading means transfers the first or second semiconductor wafer subjected to the wafer process by the wafer processing means to the first or second unloading port in accordance with a second selection signal. The selection signal setting means is for setting the first and second selection signals and the processing selection signal.

According to a second aspect of the present invention, there is provided a semiconductor wafer manufacturing apparatus for receiving a first semiconductor wafer to be subjected to a wafer process and unloading the processed first or second semiconductor wafer. A first loading / unloading port and a second loading / unloading port for receiving the second semiconductor wafer to be subjected to a wafer process and unloading the second or first semiconductor wafer subjected to the wafer process; An outlet and the first or second carry-in / out port are selected in accordance with a first selection signal, and the first or second semiconductor wafer received at the selected carry-in / out port is carried in; Transport means for transporting the applied first or second semiconductor wafer to the first or second loading / unloading port in accordance with a second selection signal; It has the same, and process specifying means, and the wafer processing unit, and a selection signal setting section.

In a third aspect, the process designating means according to the first and second inventions is characterized in that the process designating means comprises a plurality of processing steps sequentially performed according to the first processing condition, and processing contents in each processing step. And a second storage unit in which a difference between processing contents of each processing step of the first processing condition and the second processing condition is stored in advance. When the first processing condition is selected by the processing selection signal, the first storage unit is read out and sequentially output as the specified processing condition,
When the second processing condition is specified, the contents of the first storage unit are changed according to the contents of the second storage unit, and are sequentially output as the specified processing conditions.

According to the first aspect of the present invention, since the semiconductor wafer manufacturing apparatus is configured as described above, the following operation is performed. The semiconductor wafer received at the first or second loading port according to the first selection signal given from the selection signal setting means is loaded by the loading means and transferred to the wafer processing means. Further, the first or second processing condition is output from the process specifying means to the wafer processing means as the specified processing condition based on the processing selection signal given from the selection signal setting means. By wafer processing means
The semiconductor wafer is subjected to a wafer process under the designated processing conditions, and the semiconductor wafer subjected to the wafer process is transferred to the first or second unloading port via unloading means controlled by the second selection signal. Is done.

According to the second aspect, the following operation is performed. The semiconductor wafer received at the first or second loading / unloading port in accordance with the first selection signal given from the selection signal setting means is loaded by the transfer means and transferred to the wafer processing means. Further, the first or second processing condition is output from the process specifying means to the wafer processing means as the specified processing condition based on the processing selection signal given from the selection signal setting means. The semiconductor wafer is subjected to a wafer process by the designated processing conditions by the wafer processing means, and the semiconductor wafer subjected to the wafer process is transferred to the first or second semiconductor wafer via the transfer means controlled by the second selection signal. To the loading / unloading port.

According to the third invention, the following operation is performed by the process designating means in the first and second inventions. When the first processing condition is selected by the processing selection signal, the conditions of the processing contents in the plurality of processing steps stored in advance in the first storage unit are read out, and sequentially sent to the wafer processing means as designated processing conditions. Is output. On the other hand, when the second processing condition is selected by the processing selection signal, the conditions of the processing contents in the plurality of processing steps stored in advance in the first storage unit are read, and the read processing contents are further read. Are changed according to the different portions stored in the second storage unit in advance, and are sequentially output to the wafer processing means as designated processing conditions.

[0010]

FIG. 1 is a schematic configuration diagram of a semiconductor wafer manufacturing apparatus showing an embodiment of the present invention. This semiconductor wafer manufacturing apparatus has a first wafer processing object.
A first loading port (for example, an automatic loading port) 11 for receiving the first semiconductor wafer 1A and a second loading port for receiving the second semiconductor wafer 1B to be subjected to the wafer process.
(For example, a manual carry-in port) 12. The automatic carry-in entrance 11 is, for example, a receiving opening in which a semiconductor wafer 1A for mass production which is carried by the unmanned automatic carrier 2 is set. On the other hand, the manual loading port 12 is a receiving port for manually setting semiconductor wafers 1B such as limited express items with limited delivery dates and prototypes with different processing conditions. A loading means (for example, a loading section) 13 is connected to the automatic loading port 11 and the manual loading port 12. Loading unit 13
Is controlled by a first selection signal SEL1. When the selection signal SEL1 is "automatic", the semiconductor wafer 1A set in the automatic loading port 11 is loaded into the wafer processing means (for example, a wafer processing unit) 14, and Select signal SEL
When "1" is "manual", the semiconductor wafer 1B set in the manual carry-in port 12 is carried into the wafer processing section 14.

The wafer processing unit 14 is adapted to handle the semiconductor wafers 1A and 1B carried in by the carry-in unit 13.
The wafer process is performed based on the designated processing condition PROC. The semiconductor wafers 1A and 1B that have been subjected to the predetermined wafer process in the wafer processing unit 14 are unloaded by a unloading unit (for example, unloading unit) 15 into a first unloading port (for example, an automatic unloading port) 16 or a second unloading port. Exit (for example,
(A manual carry-out port) 17. The automatic carry-out port 16 is for sending out the semiconductor wafers 1A, 1B subjected to the wafer process by the automatic carrier 2 or the like, and the manual carry-out port 17 is for transferring the semiconductor wafers 1A, 1B subjected to the wafer process. It is intended for manual removal. Then, the unloading section 15 outputs the second selection signal S
When EL2 is "automatic", the semiconductor wafers 1A, 1B are transferred to the automatic unloading port 16. When the selection signal SEL2 is "manual", the semiconductor wafers 1A, 1B are transferred to the manual unloading port 1.
7.

The semiconductor wafer manufacturing apparatus further has an interrupt processing designating section 18. Interrupt processing designator 18
Is, for example, selected signal SEL by manual operation.
1 and SEL2 are individually set to "automatic" or "manual", and the processing selection signal (for example, selection signal) SEL3 is set to "processing 1" or "processing 2". The selection signals SEL1 and SEL2 are
These are provided to the carry-in section 13 and the carry-out section 15, respectively. Further, the selection signal SEL3 is given to the process condition specifying unit 19. The process condition specifying unit 19 outputs the selection signal S
First storage unit (for example, memory) 1 based on EL3
The first processing condition (for example, process 1) stored in advance in 9a or the second processing condition (for example, process 2) stored in advance in the second storage unit (for example, memory) 19b is selected. Has a function of giving the specified processing condition PROC to the wafer processing unit 14. FIG. 2 (a), (b)
FIG. 4 is an explanatory diagram showing the operation of the process condition specifying unit 19 in FIG. 1, and FIG.
Showing an example of the contents stored in the memories 19a and 19b, and FIG. 2B is a flowchart showing the processing procedure. Next, with reference to FIGS. 2A and 2B, the operation of the semiconductor wafer manufacturing apparatus of FIG. 1 will be described with respect to (I) a manufacturing process by automatic conveyance and (II) a manufacturing process of a prototype. .

(I) Manufacturing Process by Automatic Transport In the manufacturing process by automatic transport, the selection signals SEL1 and SEL2 output from the interrupt processing control unit 18 are both set to "automatic", and the selection signal SEL3 is set to "process". 1 "
Is set to The semiconductor wafer 1 </ b> A transferred by the automatic transfer vehicle 2 is set in the automatic transfer port 11,
The wafer is loaded into the wafer processing unit 14 by the loading unit 13. The semiconductor wafer 1A is subjected to the wafer process of the process 1 by the wafer processing unit 14 as follows based on the designated processing condition PROC given from the process condition designating unit 19. The processing conditions of the process 1 are stored in the memory 19a in the process condition specifying unit 19, and, for example, as shown in FIG. 2A, a plurality of processes from a process 1 to a process n are sequentially performed. ing. And each process 1
n, processing conditions a, b, c,..., x
Are set in advance as the storage contents of the memory 19a.

In the process condition designating section 19, FIG.
In step S1, i = 1 as an initial value of the process i
Is set, and the process proceeds to the determination processing in step S2. In step S2, if the content of the selection signal SEL3 is "process 1", the process proceeds to step S3, and if it is "process 2", the process proceeds to step S8. In this case, since the selection signal SEL3 is set to "process 1", the process proceeds to step S3. In step S3, the contents of step i (that is, step 1) of the memory 19a are read, and the process proceeds to step S4. In step S4, the read content of the process i, that is, “processing condition a” is output to the wafer processing unit 14 as the designated processing condition PROC, and the process proceeds to step S5. As a result, in the wafer processing unit 14, the semiconductor wafer 1A is subjected to the wafer process of the “processing condition a” of the process 1. In step S5, the elapse of the required time until the completion of the wafer process under the “processing condition a” is measured by the wafer processing unit 14, and after the elapse of the required time, the process proceeds to step S6. In step S6, it is determined whether or not all the processes have been completed. If any unprocessed processes remain, the process proceeds to step S7, the process i + 1 next to the process i is designated, and the process returns to step S2. If all steps have been completed, the wafer processing in the wafer processing unit 14 ends. In the wafer processing unit 14, the semiconductor wafer 1 </ b> A that has been subjected to the wafer processes of all the steps 1 to n is transferred to the automatic unloading port 16 by the unloading unit 15.

(II) Prototype Manufacturing Process In the case of a prototype, the operator operates the prototype semiconductor wafer 1B.
Is set in the manual carry-in port 12, and the selection signals SEL1 and SEL2 are set to "manual" and the selection signal SEL3 is set to "process 2" by the interrupt processing designating section 18. Thereby, the semiconductor wafer 1B set in the manual carry-in port 12
Is carried into the wafer processing unit 14 by the carry-in unit 13. The semiconductor wafer 1B is subjected to the wafer process of the process 2 by the wafer processing unit 14 as follows based on the designated processing condition PROC given from the process condition designating unit 19. The processing condition of the process 2 is such that only the difference from the process 1 is stored in the memory 19 b in the process condition specifying unit 19. For example, when only the step 3 is different among the steps 1 to n, FIG.
As shown in (a), the processing condition of step 3 is set to “processing condition y”. In the process condition specifying unit 19,
In step S1 of FIG. 2B, i = 1 is set as the initial value of the process i, and the process proceeds to the determination process of step S2.

In step S2, since the selection signal SEL3 is set to "process 2", the process proceeds to step S8. In step S8, it is checked whether processing conditions for the process i in the memory 19b are set. If it is not set, it is determined that the processing condition is the same as that of process 1, and the process proceeds to step S3. If it is set, the process proceeds to the next step S9. In step S9, the processing conditions set in step i of the memory 19b are read, and the process proceeds to step S4. For example, in the case of step 3, since “processing condition y” is set in the memory 19b, this “processing condition y” is read. On the other hand, in Steps 1, 2 and the like, since the processing conditions are not set in the memory 19b, the processing conditions of the processing 1 set in the memory 19a are read. Thus, step S2
By repeating steps S9 to S9, the wafer processes of all the steps 1 to n are completed.

In the wafer processing section 14, the semiconductor wafer 1 B which has been subjected to the wafer processing of all the processes of the processing 2 is transferred by the unloading section 15 to the manual unloading port 17. As described above, the semiconductor wafer manufacturing apparatus according to the present embodiment includes the automatic carrying-in port 11 and the automatic carrying-out port 16 for automatic carrying.
And the manual carry-in port 12 and the manual carry-out port 17 for manual transfer, the semiconductor wafer 1A for mass production and the semiconductor wafer 1B for trial operation can be transferred to the wafer processing section 14 separately. Further, the process condition specifying unit 19
The type of processing condition is stored, and as the designated processing condition PROC based on the selection signal SEL3, the wafer processing unit 1
4, the semiconductor wafers 1A, 1A
There is an advantage that the wafer process corresponding to B can be performed without fail. Further, the carry-in section 13, the carry-out section 15,
And the process condition designating section 19 is controlled by different selection signals SEL1, SEL2, and SEL3, respectively, so that the carry-in port, the wafer process, and the carry-out port can be arbitrarily combined according to the manufacturing process. There is an advantage. For example, in the case of an express product, after the semiconductor wafer 1B is manually set in the manual carry-in port 12, the same wafer process as that of the mass-produced product can be performed, and the semiconductor wafer 1B can be unloaded from the same automatic outlet 16 as the mass-produced product.

The present invention is not limited to the above embodiment, but can be variously modified. For example, there are the following modifications (a) to (f). (A) Although the carry-in ports 11 and 12 are distinguished from the carry-out ports 16 and 17, the semiconductor wafers 1A and 1B subjected to the wafer process may be sent out from these carry-in ports 11 and 12. . Accordingly, the carrying-out ports 16 and 17 become unnecessary, and the carrying-in section 13 and the carrying-out section 15 can be integrated into a carrying section, so that the apparatus can be downsized. (B) Although the semiconductor wafer 1B is set in the manual carry-in port 12 manually, the semiconductor wafer 1B may be set using the automatic carrier 2 or the like instead of the manual work. Thereby, two types of semiconductor wafers 1A and 1B
Can be automatically switched to perform a wafer process. (C) Two carry-in ports 11 and 12 and two carry-out ports 1
Although 6, 17 are provided, it is also possible to provide a larger number of carry-in and carry-out ports.

(D) The process condition designating section 19 stores two types of processing conditions, but stores three or more types of processing conditions so that any of the processing conditions can be selected. Can be. (E) Although the process condition designating section 19 has been described as having only the sequencer function of outputting the processing conditions of each process in a predetermined procedure, for example, a host computer or the like that performs overall manufacturing process management may be used. It may be used to control the production process of the product in addition to the sequencer function. (F) From the manual loading port 12, the prototype semiconductor wafer 1
Although B is carried in, for example, a semiconductor wafer for inspection for inspecting the function of the semiconductor wafer manufacturing apparatus can be carried in. In this case, a specific processing condition for inspection is given from the process condition specifying unit 19 to the wafer processing unit 14 as a specified processing process PROC. The function of the semiconductor wafer manufacturing apparatus can be inspected by checking the semiconductor wafer that has been subjected to the wafer process under the processing conditions for inspection.

[0020]

As described in detail above, according to the first aspect, since the first and second entrances are provided,
For example, semiconductor wafers requiring unusual processing such as prototypes can be received from the second loading port,
Two types of semiconductor wafers do not compete at one loading port. Further, since there is provided a process designating means for selecting and outputting the first and second two types of processing conditions based on the condition selection signal, it is possible to perform a wafer process corresponding to each of the two types of semiconductor wafers. There is an effect that can be. According to the second aspect of the present invention, since there are two loading / unloading ports that share the loading / unloading port and the loading / unloading port, the size of the apparatus can be reduced in addition to the effect of the first aspect. According to the third aspect, the process designating means stores the first processing condition in the first storage unit, and stores the first processing condition in the first processing condition.
Since there is a second storage unit that stores only the conditions of the process different from the processing conditions described above, even if there are a plurality of processing conditions, only the different portions need to be set, and the setting work can be saved.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor wafer manufacturing apparatus showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an operation of a process condition specifying unit 19 in FIG.

[Explanation of symbols]

 1A, 1B Semiconductor wafer 11 Automatic carry-in 12 Manual carry-in 13 Carry-in part 14 Wafer processing part 15 Carry-out part 16 Automatic carry-out 17 Manual carry-out 18 Interrupt processing designation part 19 Process condition designation part 19a, 19b Memory PROC designation processing condition SEL1 ~ SEL3 selection signal

Claims (3)

[Claims] A first loading port for receiving a first semiconductor wafer to be subjected to a wafer process; a second loading port for receiving a second semiconductor wafer to be subjected to a wafer process; Loading means for selecting the first or second loading port according to the first selection signal and loading the first or second semiconductor wafer received at the selected loading port; A process designating means for outputting the first or second processing condition as a designated processing condition; and a wafer for performing a wafer process on the first or second semiconductor wafer carried in by the carrying-in means based on the designated processing condition. Processing means; first and second unloading ports for unloading the first or second semiconductor wafer that has been subjected to a wafer process by the wafer processing means; Unloading means for transferring the first or second semiconductor wafer subjected to the wafer process by the eha processing means to the first or second unloading port in accordance with a second selection signal; and the first and second semiconductor wafers A semiconductor wafer manufacturing apparatus, comprising: a selection signal; and selection signal setting means for setting the processing selection signal. 2. A first loading / unloading port for receiving a first semiconductor wafer to be subjected to a wafer process and unloading the first or second semiconductor wafer subjected to the wafer process, and a wafer process. Receiving the second semiconductor wafer to be processed, and subjecting the second semiconductor wafer to a wafer process.
Alternatively, a second loading / unloading port for unloading the first semiconductor wafer and the first or second loading / unloading port are selected according to a first selection signal, and the selected loading / unloading port is accepted by the selected loading / unloading port. Loading the first or second semiconductor wafer,
Transport means for transporting the first or second semiconductor wafer subjected to the wafer process to the first or second loading / unloading port in accordance with a second selection signal; A process specifying unit that outputs a second processing condition as a specified processing condition; and a wafer processing unit that performs a wafer process on the first or second semiconductor wafer loaded by the loading unit based on the specified processing condition. And a selection signal setting means for setting the first and second selection signals and the processing selection signal. 3. A first storage unit in which a plurality of processing steps sequentially performed in accordance with the first processing condition and a condition of a processing content in each processing step are stored in advance, the first processing unit includes: And a second storage unit in which a difference between processing contents in each processing step of the second processing condition is stored in advance, and the first processing condition is selected by the processing selection signal. Sometimes, the first storage unit is read out and sequentially output as the designated processing condition. When the second processing condition is designated, the contents of the first storage unit are changed according to the contents of the second storage unit. 3. The semiconductor wafer manufacturing apparatus according to claim 1, wherein the designated processing conditions are sequentially output.