JPH0456243A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor manufacturing device capable of preventing a defective element in the preceding process from being mounted on a burn-in board by a method wherein the device is constituted into one having functions that an inspecting device is mounted on a burn-in loader, semiconductor elements are inspected, then, the elements are mounted on the burn-in board. CONSTITUTION:A semiconductor manufacturing device is constituted into one having functions that in a semiconductor manufacturing process, an inspecting device is mounted on a burn-in loader, semiconductor elements are inspected, then, the elements are mounted in a burn-in board. For example, semiconductor elements are set from the preceding process into a putting-in part 3. Then, the elements are taken out in order from the part 3 to a transfer part 2 and are first transferred to a simple inspecting device 5. After being inspected there, the elements are again sent to the part 2, are selected according to the inspected result and are respectively divided and sent to a taking-out part 4 or a defective storage part 6. The elements sent to the part 4 are mounted on a previously set burn-in board. The control of all the elements is conducted by a control part 1.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor manufacturing apparatus for mounting semiconductor elements on a burn-in board (hereinafter abbreviated as BIB) in a semiconductor element manufacturing process.

Conventional technology A conventional semiconductor manufacturing apparatus will be described below.

FIG. 2 is a block diagram of a conventional semiconductor manufacturing apparatus, and the reference numerals in the figure are: 1 is a control section, 2 is a transport section, 3 is an input section, and 4 is a block diagram of a conventional semiconductor manufacturing apparatus.
represents the take-out part.

Regarding the semiconductor mortuary device configured as described above, the following is as follows.
Let's explain its operation.

First, a semiconductor element is set in the input section 3 from the previous process. Next, the semiconductor devices are sequentially taken out from the input section 3 to the transport section 2 and transported to the take-out section 4. Finally, the semiconductor elements transported to the BIB that had been set in advance in the take-out section 4 are sequentially mounted (the control section 1 controls this series of operations).

Problems to be Solved by the Invention However, in the conventional configuration described above, all defective elements from the previous process are mounted on the BIB, which reduces the production capacity of the burn-in device. Furthermore, there is a problem that the BIB or burn-in device itself may be destroyed due to the mounting of defective elements.

The present invention solves the above-mentioned conventional problems.
It is an object of the present invention to provide a semiconductor manufacturing apparatus that can prevent a defective element from being mounted on a semiconductor device in a previous process.

Means for Solving the Problems To achieve this object, the semiconductor manufacturing apparatus of the present invention is equipped with an inspection device.

Effect: With this configuration, semiconductor elements are inspected and sorted before being mounted on the BIB, so it is possible to prevent defective elements from the previous process from being mounted on the BIB.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a block diagram of a semiconductor manufacturing apparatus in an embodiment of the present invention. The reference numerals in this figure include a control section 1, a conveyance section 2, a loading section 3, and an unloading section 4, which are the same as those of the conventional example. 5 represents a simple inspection device, and 6 represents a defective element storage section.

The operation of the semiconductor manufacturing apparatus of this embodiment will be explained.

First, a semiconductor element is set in the input section 3 from the previous process. Next, the semiconductor devices are sequentially taken out from the input section 3 to the transport section 2, and first transported to the simple inspection device 5. After the inspection is carried out there, the pieces are sent to the conveying section 2 again, sorted according to the inspection results, and sorted and sent to the take-out section 4 or the defect accumulation section 6, respectively. The semiconductor elements sent to the extraction section 4 are
It is implemented in a preset BIB. All these controls are performed by the control section 1.

Effects of the Invention According to the present invention, it is possible to realize a semiconductor manufacturing apparatus that can perform inspection and selection before BIB mounting by being equipped with a simple inspection device.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional semiconductor manufacturing apparatus. 1...Control unit, 2...Transportation unit, 3...
...Input part, 4...Take out part, 5...
... Simple inspection device, 6... Defect accumulation section.

Claims (1)

[Claims] Semiconductor manufacturing equipment that has the function of mounting an inspection device on a burn-in rotor to inspect semiconductor elements and then mounting them on a burn-in board during the semiconductor manufacturing process.