JPH11126967A - Manufacture of supporting spring with wiring pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which a simple, highly reliable, and inexpensive supporting spring with wiring pattern which has a uniform thickness and spring property and can float an MR (magneto-resistive head) mounting section in a uniform attitude and from which the position of the wiring pattern is not deviated. SOLUTION: After a both-sided substrate 1 composed of copper foil 7, polyimide 8, and stainless foil 9 is cleaned, dry films 3 are respectively laminated upon both surfaces of the substrate 1 (202a). Then a copper wiring pattern 4 and an SUS pattern 2 are formed by simultaneously exposing, developing, and etching the dry films 3 on both surfaces of the substrate 1 and the films 3 are stripped off from the substrate 1 (202b). Thereafter, the polyimide 8 is stripped off from the other part than that under the pattern 4 (203). Finally, a supporting spring with wiring pattern is manufactured by performing Ni/Au plating 10 on the pattern 4 (204) and applying a polyimide-based resin 11 to a prescribed wiring section (205). The supporting spring with wiring pattern thus manufactured becomes a product after appearance inspections and characteristic evaluation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a support spring with a wiring pattern, and more particularly to a method for manufacturing a support spring with a wiring pattern by etching a copper foil and a stainless steel foil to form a wiring pattern and a support spring, respectively. About the method.

[0002]

2. Description of the Related Art Conventionally, an MR head (Magnetoresistiv) has been used.
The support spring with a wiring board for the e-head is an important component that is incorporated in a hard disk drive (HDD) and has an MR head mounted at the tip to write and read stored data and the like to and from the hard disk. For this reason, the support spring with the wiring pattern for the MR head is required to have high reliability, and a more inexpensive manufacturing method has been required.

[0003] A conventional support spring with a wiring pattern for an MR head is manufactured by attaching a gold stranded wire covered with vinyl as a wiring pattern with an adhesive to a stainless steel support spring material having a thickness of 20 to 50 µm. I was In another method, a flexible substrate (FP) is used as a wiring pattern.
C) was prepared in a separate step and, similarly to the above, was produced by sticking it to a stainless steel supporting spring material with an adhesive.

[0004]

However, according to the above-described conventional method of manufacturing a support spring with a wiring pattern, a support spring made of stainless steel (SUS) foil is manufactured and then coated with vinyl as a wiring pattern. Because the stranded wire or flexible substrate is attached with an adhesive,
There is a problem in that the manufacturing process is long, the yield is reduced, and the manufactured supporting spring with a wiring pattern is expensive.

[0005] Further, since the stranded wire or the flexible substrate is attached to the support spring of the SUS foil manufactured in a separate process with an adhesive, the thickness becomes uneven or uniform spring property cannot be obtained. In addition, there has been a problem that the flying attitude of the slider portion on which the MR head is mounted is not uniform.

Further, since the wiring pattern is attached to the support spring of the SUS foil with an adhesive, there is a problem in that the position of the wiring pattern is displaced with respect to the support spring of the SUS foil, and high reliability cannot be obtained. Was.

Therefore, an object of the present invention is to provide a uniform manufacturing process, uniform thickness and resilience, no misalignment between a support spring and a wiring pattern, a uniform floating attitude of an MR mounting portion, and a high reliability. It is an object of the present invention to provide a method for manufacturing a highly reliable and inexpensive supporting spring with a wiring pattern.

[0008]

According to the present invention, in order to achieve the above-mentioned object, a conductive material foil such as a copper foil is formed on a support spring formed by a spring material foil such as a stainless steel foil. In a method of manufacturing a support spring with a wiring pattern having a predetermined wiring pattern, a spring material foil and a conductive material foil are attached to the opposite surface of the base film, and the spring material foil is etched to form a support spring. And forming a predetermined wiring pattern by etching the support spring.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a support spring with a wiring pattern according to the present invention will be described in detail.

FIG. 1 shows an embodiment of a support spring with a wiring pattern manufactured by the method for manufacturing a support spring with a wiring pattern of the present invention. The support spring with a wiring pattern includes a SUS304 spring plate 2 having a predetermined shape made of stainless steel (SUS304) foil, and a copper wiring pattern 4 provided on the SUS304 spring plate 2 and made of copper foil having a predetermined pattern. ing. In addition, copper wiring pattern 4
Has an MR head mounting section 5 on which Ni / Au plating is applied and on which an MR head is mounted, and an electrode pad 6 for extracting an electric signal. The MR head mounting section 5 and the electrode pad 6
The other wiring parts are coated with a polyimide resin.

FIG. 2 shows an embodiment of a method of manufacturing a support spring with a wiring pattern according to the present invention. FIG. 2 (a)
FIG. 2B shows a manufacturing process, and FIG. 2B shows a cross section of the member in the manufacturing process. The substrate material of the support spring with the wiring pattern is a copper (Cu) foil 7 having a thickness of 0.018 mm and a thickness of 0.1 mm.
010 mm polyimide (PI) 8 and a thickness of 0.020
A double-sided substrate 1 made of a stainless steel (SUS304) foil 9 mm is used (201). After removing the grease and rust on the surface of the double-sided substrate 1 by alkali degreasing and acid cleaning,
A photosensitive dry film 3 having a thickness of 13 μm is laminated on both sides (202a). Next, the photosensitive dry film 3 on both sides is exposed by a double-sided exposure machine, developed with alkali, and a predetermined pattern is drawn on both surfaces of the copper foil 7 and the SUS foil 9, respectively. The substrate on which the pattern is drawn on both sides is etched by a double-sided etching machine to form a copper wiring pattern 4 for an electric signal on the copper foil 7 side, and a SUS pattern on the SUS foil 9 side for modeling the outer shape of the support spring. After forming 2, the photosensitive dry film 3 on both sides is peeled off (202b).

Then, the SUs other than those under the copper wiring pattern 4
The polyimide 8 on the surface of the S pattern 2 is degraded by laser light and plasma light, and is immersed in an aqueous hydrazine solution and peeled off.
(203). The copper wiring pattern 4 was plated with nickel on the base and gold plating (Ni / Au plating 10) on the finish (20).
4) Later, in order to prevent short-circuiting of the wiring due to adhesion of foreign matter from the outside, heat-resistant organic substances are used for wiring parts other than the MR head mounting part 5 (FIG. 1) and the electrode pad part 6 (FIG. 1) for extracting signals. The photosensitive polyimide resin 11 is applied using a screen mask (205) to manufacture a support spring with a wiring pattern. The support spring with the wiring pattern manufactured in this way is subjected to appearance inspection and characteristic evaluation to become a product (206).

The method of manufacturing the supporting spring with a wiring pattern according to the present invention has been described above. In the above method, after the copper wiring pattern 4 is formed, the polyimide 8 other than under the copper wiring pattern 4 is dissolved and peeled off. However, it is not always necessary to peel off the polyimide 8 in this portion.

[0014]

As described above, according to the method of manufacturing a support spring with a wiring pattern of the present invention, the support spring and the wiring pattern are simultaneously formed by etching. With this configuration, there is no misalignment between the support spring and the wiring pattern, the floating posture of the MR mounting portion is uniform, and a highly reliable and inexpensive support spring with a wiring pattern can be provided. Was.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a support spring with a wiring pattern according to the present invention.

FIG. 2 is a schematic view illustrating a method of manufacturing a support spring with a wiring pattern according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Double-sided board 2 SUS pattern 3 Dry film 4 Copper wiring pattern 5 MR head mounting part 6 Electrode pad 7 Copper foil 8 Polyimide 9 SUS foil 10 Ni / Au plating 11 Polyimide resin 12 SUS304 spring plate

Claims (3)

[Claims] 1. A method of manufacturing a support spring with a wiring pattern having a predetermined wiring pattern formed by a conductive material foil such as a copper foil on a support spring formed by a spring material foil such as a stainless steel foil. Affixing the spring material foil and the conductive material foil on the opposite surface of the substrate, etching the spring material foil to form the support spring, and etching the conductive material foil to form the predetermined wiring pattern A method for manufacturing a support spring with a wiring pattern, comprising: 2. The method according to claim 1, wherein the etching of the spring material foil and the etching of the conductive material foil are performed simultaneously. 3. The predetermined wiring pattern of the conductive material foil has an electrode pad for extracting an electric signal, and a wiring portion other than the electrode pad of the predetermined wiring pattern is covered with a heat-resistant organic material. The method for manufacturing a support spring with a wiring pattern according to claim 1, wherein: