JPH11126966A - Manufacture of supporting spring with wiring pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which a highly reliable, inexpensive, and simple supporting spring with wiring pattern which has a uniform thickness and spring property and can float an MR (magneto-resistive head) mounting section in a uniform attitude and from which the position of the wiring pattern is not deviated. SOLUTION: After an SUS (stainless steel) pattern 2 is formed by punching a double-sided substrate composed of copper foil 7, polyimide 8, and SUS foil 9 (201), dry films 3 are respectively laminated upon both surfaces of the pattern 7 (203). Then, after a copper wiring pattern 4 is formed by exposing, developing, and etching the dry films 3, the dry films 3 are stripped off and the polyimide 8 is removed from prescribed parts (204). After removing the polyimide 8, dry films 3 are again laminated upon the pattern 2 (205) and Ni/Au plating 10 is performed on the copper wiring pattern 4 (206). Then a polyimide-based resin 11 is applied to the pattern 4. Finally, a supporting spring with wiring pattern is manufactured by removing the dry films 3 (208) and the supporting spring thus manufactured becomes a product after appearance inspections and characteristic evaluation (209).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a support spring with a wiring pattern, and more particularly, to forming a wiring pattern by etching a copper foil using a photofabrication technique and stamping and supporting a stainless steel foil. The present invention relates to a method for manufacturing a support spring with a wiring pattern that forms a spring.

[0002]

2. Description of the Related Art Conventionally, an MR head (Magnetoresistiv) has been used.
The support spring with a wiring board for the e-head is an important component that is incorporated in a hard disk drive (HDD) and has an MR head mounted at the tip to write and read stored data and the like to and from the hard disk. For this reason, the support spring with the wiring pattern for the MR head is required to have high reliability, and a more inexpensive manufacturing method has been required.

[0003] A conventional support spring with a wiring pattern for an MR head is manufactured by attaching a gold stranded wire covered with vinyl as a wiring pattern with an adhesive to a stainless steel support spring material having a thickness of 20 to 50 µm. I was In another method, a flexible substrate (FP) is used as a wiring pattern.
C) was prepared in a separate step and, similarly to the above, was produced by sticking it to a stainless steel supporting spring material with an adhesive.

[0004]

However, according to the above-described conventional method of manufacturing a support spring with a wiring pattern, a support spring made of stainless steel (SUS) foil is manufactured and then coated with vinyl as a wiring pattern. Because the stranded wire or flexible substrate is attached with an adhesive,
There is a problem in that the manufacturing process is long, the yield is reduced, and the manufactured supporting spring with a wiring pattern is expensive.

[0005] Further, since the stranded wire or the flexible substrate is attached to the support spring of the SUS foil manufactured in a separate process with an adhesive, the thickness becomes uneven or uniform spring property cannot be obtained. In addition, there has been a problem that the flying attitude of the slider portion on which the MR head is mounted is not uniform.

Further, since the wiring pattern is attached to the support spring of the SUS foil with an adhesive, there is a problem in that the position of the wiring pattern is displaced with respect to the support spring of the SUS foil, and high reliability cannot be obtained. Was.

Therefore, an object of the present invention is to provide a uniform manufacturing process, uniform thickness and resilience, no misalignment between a support spring and a wiring pattern, a uniform floating attitude of an MR mounting portion, and a high reliability. It is an object of the present invention to provide a method for manufacturing a highly reliable and inexpensive supporting spring with a wiring pattern.

[0008]

According to the present invention, in order to achieve the above-mentioned object, a conductive material foil such as a copper foil is formed on a support spring formed by a spring material foil such as a stainless steel foil. In a method of manufacturing a support spring with a wiring pattern having a predetermined wiring pattern, a spring material foil and a conductive material foil are attached to the opposite surface of the base film, and the spring material foil is stamped to form a support spring. Is etched to form a predetermined wiring pattern,
A method for manufacturing a support spring with a wiring pattern is provided.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a support spring with a wiring pattern according to the present invention will be described in detail.

FIG. 1 shows an embodiment of a support spring with a wiring pattern manufactured by the method for manufacturing a support spring with a wiring pattern of the present invention. The support spring with a wiring pattern includes a SUS304 spring plate 2 having a predetermined shape made of stainless steel (SUS304) foil, and a copper wiring pattern 4 provided on the SUS304 spring plate 2 and made of copper foil having a predetermined pattern. ing. In addition, copper wiring pattern 4
Has an MR head mounting section 5 on which Ni / Au plating is applied and on which an MR head is mounted, and an electrode pad 6 for extracting an electric signal. The MR head mounting section 5 and the electrode pad 6
The other wiring parts are coated with a polyimide resin.

FIG. 2 shows an embodiment of a method of manufacturing a support spring with a wiring pattern according to the present invention. FIG. 2 (a)
FIG. 2B shows a manufacturing process, and FIG. 2B shows a cross section of the member in the manufacturing process. The substrate material of the support spring with the wiring pattern is a copper (Cu) foil 7 having a thickness of 0.018 mm and a thickness of 0.1 mm.
010 mm polyimide (PI) 8 and a thickness of 0.020
A double-sided substrate 1 made of a stainless steel (SUS304) foil 9 mm is used (201). The substrate 1 is stamped by a stamping technique to form a SUS pattern 2 serving as a support spring, and then immersed in a 10% nitric acid (HNO3) aqueous solution to dissolve fine burrs on the punched end surface (202). Then, after removing fats and oils and rust on the surface by alkali degreasing and acid washing, a photosensitive dry film 3 having a thickness of 13 μm was formed on both surfaces.
Is laminated (203). Then, the photosensitive dry film 3 on the side of the copper foil 7 is exposed by an exposing machine and developed with an alkali to draw a predetermined pattern on the copper foil 7. The substrate 1 having the pattern drawn on the copper foil 7 is etched by an etching machine,
After forming the copper foil electrical signal wiring pattern 4, the photosensitive dry films 3 on both sides are peeled off. Thereafter, the polyimide 8 on the surface of the SUS pattern 2 other than under the copper wiring pattern 4 is degraded by the laser light and the plasma light, penetrates into the hydrazine aqueous solution, and is stripped (204).

The photosensitive dry film 3 is again laminated on the back (lower) side of the SUS pattern 2 (205). After the copper wiring pattern 4 is nickel-plated on the base and gold-plated (Ni / Au plating 10) on the finish (206), the MR is used to prevent short-circuiting of the wiring due to the attachment of foreign matter from the outside.
Photosensitive polyimide resin 1 is applied to wiring parts other than the head mounting part 5 (FIG. 1) and the electrode pad part 6 (FIG. 1) for extracting signals.
1 is applied using a screen mask (207). Finally, the dry film 3 on the back side of the SUS pattern 2 is peeled off to manufacture a support spring with a wiring pattern for the MR head (208). The support spring with the wiring pattern manufactured in this way is subjected to appearance inspection and characteristic evaluation, and becomes a product (20
9).

FIG. 3 shows another embodiment of a method of manufacturing a support spring with a wiring pattern according to the present invention. FIG. 3 (a)
Shows a manufacturing process, and FIG. 3B shows a cross section of a member in the manufacturing process. The substrate material has a thickness of 0.0, as in FIG.
A double-sided board 1 comprising a copper (Cu) foil 7 of 18 mm, a polyimide (PI) 8 of 0.010 mm thickness, and a stainless (SUS304) foil 9 of 0.020 mm thickness is used (301). This double-sided substrate 1 is alkali-degreased and acid-washed to remove fats and oils and rust on the surface.
Is laminated (302a).
Next, the photosensitive dry film 3 on the copper foil 7 side is exposed by an exposure machine, developed with an alkali, and a predetermined pattern is drawn on the copper foil 7 surface. After the substrate having the pattern drawn on the surface of the copper foil 7 is etched by an etching machine to form the wiring pattern 4 for a copper foil electric signal, the photosensitive dry film 3 on both sides is peeled off (302b).

Then, the SUs other than those under the copper wiring pattern 4
The polyimide 8 on the surface of the S foil 9 is degraded by laser light and plasma light, immersed in an aqueous hydrazine solution, and peeled off.
After stamping the foil 9 to form the SUS pattern 2 serving as a support spring, the photosensitive dry film 3 is laminated again on the back surface (lower surface) of the SUS pattern 2 (303). After the copper wiring pattern 4 has been subjected to nickel plating on the base and gold plating (Ni / Au plating 10) for the finish (304), the MR head mounting portion 5 is provided to prevent short-circuiting of the wiring due to the attachment of foreign matter from the outside. A photosensitive polyimide resin 11 is applied using a screen mask to wiring portions other than the electrode pad portion 6 (FIG. 1) for extracting signals (FIG. 1) and a signal (305). Finally, the dry film 3 on the back side of the SUS pattern 2 is peeled off to manufacture a support spring with a wiring pattern for the MR head (306). The support spring with the wiring pattern manufactured in this manner is subjected to appearance inspection and characteristic evaluation, and becomes a product (307).

Although several embodiments of the method of manufacturing a support spring with a wiring pattern according to the present invention have been described above, in the above-described embodiment, after the copper wiring pattern 4 is formed, the polyimide 8 other than under the copper wiring pattern 4 is formed. Is dissolved and peeled off, but the polyimide 8 in this portion does not necessarily need to be peeled off.

[0016]

As described above, according to the method of manufacturing a support spring with a wiring pattern of the present invention, the support spring and the wiring pattern are formed in the same manufacturing process. It has a uniform thickness and spring properties, does not cause displacement between the support spring and the wiring pattern, makes the floating posture of the MR mounting unit uniform, and can provide a reliable and inexpensive support spring with a wiring pattern. It became so.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a support spring with a wiring pattern according to the present invention.

FIG. 2 is a schematic view showing one embodiment of a method for manufacturing a support spring with a wiring pattern according to the present invention.

FIG. 3 is a schematic view showing one embodiment of a method of manufacturing a support spring with a wiring pattern according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Double-sided board 2 SUS pattern 3 Dry film 4 Copper wiring pattern 5 MR head mounting part 6 Electrode pad 7 Copper foil 8 Polyimide 9 SUS foil 10 Ni / Au plating 11 Polyimide resin 12 SUS304 spring plate

Claims (3)

[Claims] 1. A method of manufacturing a support spring with a wiring pattern having a predetermined wiring pattern formed of a conductive material foil such as a copper foil on a support spring formed of a spring material foil such as a stainless steel foil. Affixing the spring material foil and the conductive material foil on the opposite side of the above, stamping the spring material foil to form the support spring, and etching the conductive material foil to form the predetermined wiring pattern A method for manufacturing a support spring with a wiring pattern, comprising: 2. The method according to claim 1, wherein the supporting spring is formed before the predetermined wiring pattern is formed from the conductive material foil or after the predetermined wiring pattern is formed. A method for manufacturing a support spring with a wiring pattern. 3. The method according to claim 1, wherein the spring material foil is chemically treated after the stamping.