JPH11126792A - Electrode position of face-down type multi-output driver, electrode position of face-down type ic, wiring board and display module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrode layout enabling one side wiring by making a chip size smaller so as to use a low-cost flexible board wherein mass production effects can be expected, in a face-down type multi-output driver for display drive. SOLUTION: In a strip type multi-output driver, signal electrodes commonly connected to a plurality of chips are gathered at one of long sides to be configured. Electrodes of driver power wirings 41 and 42 with large width are configured at both the short sides. The vertical distance between the input electrodes at the long side and the electrodes at the short sides is more than the number of electrodes at the short side through which common wiring 45 between wiring pitch x pitch on a flexible board passes. Thus, the power electrodes are configured at the short sides to enable a chip size to be smaller, which enables the wiring on the flexible board to be formed on a single layer, enabling cost reduction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode position of a face-down IC. More specifically, the present invention relates to an electrode position of a multi-output driver used for a display module and a wiring board for connecting the IC.

[0002]

2. Description of the Related Art In a liquid crystal display module, a driver IC for driving a display is shifted from a flat package to a tape chip carrier type package (hereinafter referred to as TCP). In recent years, a driver IC is provided on a glass substrate as disclosed in JP-A-3-211838. A so-called chip-on-glass (hereinafter referred to as COG) mounting for fixing the wiring using a resin in a face-down state is also performed. On the other hand, in the conventional plasma display module, the driver IC for driving the display is mainly a flat package. The reason that the plasma display module cannot shift from the flat package to the TCP is that the driving voltage and the driving current of the driver are large and the heat generation is large. Is out of the allowable power range. Also, considering the price, TCP is expensive and has little merit.

In recent years, a flexible substrate (hereinafter referred to as FRP) having several holes slightly larger than the IC shape is laid on an aluminum substrate for heat radiation, and the IC is directly placed on the aluminum substrate in the hole portion of the FRP and a wire is formed. I by bonding
An IC module that connects the C electrode and the wiring on the FRP. An IC module in which bumps are attached to the electrodes of the IC, several ICs are fixed face-down to the wiring on the FRP, and an aluminum substrate for heat dissipation is brought into contact with the back surface of the IC. These I
A mounting method of connecting the C module to a plurality of display panels has been adopted. As a driver IC used in a conventional IC module, an IC contained in a flat package as disclosed in JP-A-3-225949 is used as it is, so it is not suitable for face-down mounting, and input electrodes of each IC are not provided. In the case of passing a wiring commonly used in the FPC, a cross is formed in the wiring, so that the FPC has to use an expensive double-sided wiring board.

[0004]

However, even if the IC module is connected to the display panel by this mounting method, if the IC module itself is expensive, the price of the plasma display module as a whole becomes expensive, and the spread of the plasma display is improved. You will not be able to make it. Display size of plasma display is 1280
When the color display is set to * 1024, the number of pixels on the data side is 1280 * 3 = 3840 dots, and when the number of outputs of the driver is 96, 3840/96 = 40, and when driving two screens, 80 drivers are required. Become. When the above IC module is composed of four ICs, the IC module is 20
Required. Therefore, it is necessary to reduce the price of the IC module itself. Therefore, the present invention provides a single-sided FPC instead of an expensive double-sided FPC when connecting a face-down mounting IC to an FPC.
The purpose is to realize the connection with.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a strip-shaped multi-output driver for driving a display device mounted by a method of fixing a semiconductor element on a circuit board in a face-down state. An electrode position of a face-down multi-output driver, wherein commonly connected signal electrodes are arranged along one long side, and the electrode positions on the long side are collected and arranged on one side on the long side. .

At the electrode position of the multi-output driver,
An electrode position of a face-down multi-output driver, wherein a plurality of multi-output drivers are used side by side, and electrodes for transferring data connected between adjacent drivers are arranged at left and right ends on a long side.

At the electrode position of the multi-output driver,
When the power supply terminals to be supplied to the driver are arranged along the short side and the long side is arranged in parallel in the horizontal direction, the vertical position of the power supply electrode arranged on the short side and the input line arranged on the long side The distance between the electrode and the vertical position is larger than the product of the number of input terminals of signals commonly connected to a plurality of multi-output drivers excluding the data transfer electrode and the wiring pitch of the wiring board. Electrode position of face-down multi-output driver.

Further, at an electrode position of an IC mounted by a method of fixing the IC on a circuit board in a face-down state, an electrode arranged adjacent to a test electrode used for testing the IC has a test function inactive. An electrode position of the face-down IC, which is an electrode at a level to be brought into a state.

[0009] At an electrode position of an IC mounted by a method of fixing the IC on a circuit board in a face-down state, I
The electrodes arranged adjacent to the input electrodes for which the input level needs to be preset to a high level or a low level depending on the use condition of C are a high level electrode and a low level electrode. IC
Electrode position.

In a wiring board on which a plurality of multi-output drivers are mounted, a signal wiring, a power supply wiring, and a wiring between data transfer electrodes commonly connected to each driver are connected by a single-layer wiring.

[0011] A display module for displaying a display, wherein a plurality of the wiring boards are mounted.

[0012]

When the face-down multi-output driver of the present invention is used, the wiring on the FPC on which a plurality of ICs are mounted can be wired on one side.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram of one embodiment showing electrode positions arranged in the multiple output driver of the present invention. 1 is a chip outer shape, 2 is a driver output electrode, 3 is a power supply electrode, 4 is an input electrode, 5 is an input / output electrode for transferring data between adjacent ICs, and 6 is a dummy having no electrical connection.
The electrodes are all bumped. Since the IC module is arranged outside the glass substrate of the plasma display body, it leads to an increase in the frame area. The chip outer shape is a strip shape which is advantageous for reducing the frame area. Output electrodes are arranged along the long sides of the chip, and input / output electrodes and dummy for transferring data between the input electrodes and adjacent ICs are arranged along the other long side. A point to be noted here is that all input electrodes 4 except for input / output electrodes for transferring data between adjacent ICs are arranged on one side of the long side. In addition, power supply electrodes to be supplied to the driver are arranged on both sides of the short side. In a multi-output driver for driving a plasma display, the current flowing per output is several tens mA or more, and the thickness of a power line commonly connected to all outputs of the driver must be several hundred μm or more in consideration of electromigration. No. When this thick electrode is arranged on the long side of the input side of the IC, it is necessary to route the thick wiring, and the dimension in the chip lateral direction becomes extremely large. Therefore, by making the power supply wiring straight and arranging the power supply electrodes on the short sides, the chip size of the IC can be extremely reduced.

For example, as shown in FIG. 2, 21 output electrodes and 22 driver blocks are formed at a pitch of 94 μm.
When 6 outputs are arranged, the horizontal length indicated by 23 is 9024 μm
When two 24 power supply lines with a width of 500 μm are drawn out on the long side on the input side, the lateral spread must be at least 1 mm as shown at 25, and a total of 2 mm must be spread when placed at both ends of the IC. become. When the distance to the end chip edge of the wiring is 100 μm, the chip size is 9024 + 2000 + 200 = 111224 μm (about 11.2 mm).

FIG. 3 shows a case where the power supply electrodes are arranged on the short sides. The 34 power supply lines can be extended straight to the electrodes. Therefore, the lateral spread of 35 is 150μ.
Even if it is arranged on both sides at about m, the spread becomes about 300 μm. 9024 + 300 + chip size as above
200 = 9524 μm (about 9.6 mm). Therefore, by arranging the power supply electrodes on the short side, the chip size can be extremely reduced.
Although the chip cost is reduced by reducing the chip size, there are other significant advantages. It depends on the size of the IC module. The plasma display has a big impact on the color flat large screen and is in the spotlight, but it is quite expensive at about 1.2 million yen for 42 inches. Therefore, not only the large screen but also the medium screen of about 21 inches is expected to spread . When considering the size of the IC module with respect to the screen size of the plasma display, if the IC module is developed according to the screen size, the development cost increases, and the mass production effect of the FPC board price is reduced by half.
The module size must be compact enough to fit all screen sizes. 21 inch size (53
Considering high-definition image quality (1280 * 1024) at 3.4 mm), the length in the horizontal direction is about 426.7 mm, and 10 IC modules containing 4 driver ICs with 96 outputs in this length I have to enter. Therefore, the size of one IC module is 426.7 / 10 = 42.
It must be about 5 mm in size. If an IC having a width of 11.2 mm is to be inserted, even if the ICs are arranged without gaps, they will be 44.8 mm and will protrude from the FPC. For a 9.6mm IC, 42.5mm F
The clearance (about 1.0 mm) between the ICs can be secured and inserted into the PC. By arranging the power supply electrode on the short side of the strip-shaped IC in this manner, a compact IC module can be obtained, and one IC module can be used for a plasma display module of any screen size.

FIG. 4 shows a graph of F when the IC of the present invention is used.
An example of PC wiring is shown. Reference numerals 41 and 42 denote driver supply power supplies, which are thick wirings. 43 and 44 are logic power supplies. 45 is a wiring for common signals between ICs. Wirings 46 and 47 connect electrodes for transferring data between ICs. When FIG. 4 is viewed from the right, the common wiring 45 between the ICs passes between the electrode on the short side and the electrode on the long side, passes through the dummy electrode on the long side, and is once drawn out of the IC. Next, it is connected to the input electrode facing the inside of the IC, and is wired so as to pass between the electrode on the left short side and the electrode on the long side. Since the vertical position of the wiring position of the right short side is the same as the vertical position of the wiring position of the left short side, it is possible to use a single-sided wiring FPC by arranging this configuration continuously. The dummy electrodes on the long sides are electrically floating, and there is no fear of short-circuiting between the wirings.

To put it simply, it can be considered that all input electrodes are arranged on the short side and the common wiring is drawn straight out.
An electrostatic protection diode is required, and a large area is required. If the input terminal is disposed on the short side, the width in the lateral direction becomes large, or the length of the short side becomes large, which leads to an increase in chip size. In the case of a face-down IC, the area of the electrode on the long side of the input side is preferably closer to the area of the electrode on the output side, and the input side However, even if is arranged, it does not mean that there is no need for an electrode on the lower side, and it is not advisable to arrange an input terminal on the short side. As can be seen from FIG. 4, when the input electrodes are arranged on the long side, the clearance between the electrodes can be kept large, so that the connection on the input side becomes easy.

FIG. 5 shows one embodiment of a schematic diagram of the configuration of a multi-output driver according to the present invention. 51 is a driver output, 52 is a level shift for converting a logic signal into a driver drive voltage,
53 is a latch circuit, and 54 is a bidirectional shift register. 55 LDIO1, 56 LDIO2, 57 LD
IO3, 58RDIO1, 59 RDIO2, 60 R
DIO3 is a signal for transferring data between ICs,
61 CK, 62 LH, 63 BK, 64 XIN
SHFR of V, 65 and XHIMP of 66 are signals commonly used between ICs. VDDH of 67, VDD of 68
The VSS of DL and 69 (terminals are separated on the high voltage side and the logic side) indicates a power supply. TEST of 70 is IC
This terminal is used only for testing and is fixed to high level during normal use.

When the SHFR of 65, which briefly explains the operation, is set to the high level, the bidirectional shift register of 54 can shift data from left to right. 55-57 L
DIO1-3 are for data input, 58-60 RDIO1 are
3 becomes the data output. The data input to the LDIOs 1 to 3 is taken in at 61 clocks, the data in the shift register is shifted, and the data is output to the RDIOs 1 to 3. When the predetermined data is transferred, the data is stored in the 53 latch circuits by the 62 LH signal. The data stored in the latch circuit is output to the driver via the level shift circuit. The BK signal 63 is a signal for forcibly setting the output to a low level regardless of the latch data. 6
XINV of 4 is a signal for inverting data in the latch. 66
XHIMP is a signal for forcibly setting the driver output to a high impedance state. Normally, the 70 test terminals and the like are set in a state where the terminals can be opened by inserting a pull-up resistor or the like. However, a driver used in a plasma display generates a large amount of noise due to a large voltage and current to be handled, and a pull-up resistor (approximately 5
0KΩ), there is a high possibility that an output abnormality will occur due to noise when the terminals are open, so it is necessary to apply a stable potential to the test electrodes. When a high level is applied to the test electrode in the face-down state, wiring from a power supply is required. However, it is meaningless to use a double-sided FPC board for this wiring.

In the present invention, as shown in FIG. 4, the potential of the adjacent electrode 49 of the test electrode 48 is VDDL (high level). The VDDL electrode 49 is not an electrode for power supply, but a wiring extending from the VDDL electrode on the short side inside the IC. 48 on FPC
By preparing 50 wiring patterns for connecting the test electrodes of No. and the VDDL electrodes of No. 49, it is possible to supply a stable potential to the test electrodes.

Similarly, by fixing the input such as the SHFR terminal 65 in FIG. 5 to either the high level or the low level, in the case of a terminal in which the operating state of the IC is set in advance, it is arranged adjacent to the input electrode. The input level can be switched between the high level and the low level by preparing the same wiring pattern as described above by using the high level electrode and the low level electrode. The SHFR terminal of the present invention shown in FIG. 4 is drawn out in consideration of the fact that it is used vertically for driving two screens in order to make the IC module common, but this terminal is used if driven on one screen. Can be fixed to either side, so V
DDL electrodes and VSS electrodes may be prepared.

FIG. 6 shows an I-type device having a driver IC of the present invention mounted thereon.
1 shows an embodiment of a C module. 101 is an FPC board,
Reference numeral 102 denotes a driver IC, and four driver ICs are arranged on the FPC. Reference numeral 103 denotes an output electrode, and 384 outputs are arranged at a pitch of 109 μm. Reference numeral 104 denotes an input terminal of the IC module, a hole shown by reference numeral 122 is formed in the FPC, and an electrode portion is subjected to a solder plating process. Reference numerals 105 to 110 denote input signal wirings, 111 to 116 denote data signal wirings, 117 to
Reference numeral 120 denotes a power supply wiring. An aluminum plate indicated by a dotted line 121 for heat dissipation is attached to the back surface of the IC. I
The width of the C module is 42.5 mm, the space between the ICs is 0.7 mm, and the distance from the IC end to the FPC end is about 1.0 mm. One of the six input signal wires is 1
At the position of 05, the other five are wired from the input electrode of the lowermost IC. Power supply lines are wired in pairs from both sides. A pass capacitor for noise cancellation may be arranged on this power supply line.

FIG. 7 shows an embodiment of a plasma display module equipped with the IC module of the present invention. 2
01 is a plasma display panel, 202 is a data side IC module, and 203 is a scan side IC module. The output of the IC module is directly connected to the glass substrate by pressure bonding via an anisotropic conductive adhesive tape. In the case of a large-screen plasma display panel, a heat seal is once connected to the output of the IC module, the wiring is fan-shaped, and then connected to the glass substrate, instead of directly connecting the IC module to the glass substrate by pressure bonding. The input side of the IC module is connected to the printed circuit board 204 by soldering.

Note that the above embodiment is one embodiment, and even if some input electrodes are arranged on the short side, the other input electrodes are on the long side, and the input electrodes that are commonly wired are on the long side. The present invention does not fall out at all if it is arranged so as to be close to one side. The present invention does not depart from the present invention even if input terminals that do not require wiring, such as test input electrodes and fixed signal input electrodes, are aligned with the side opposite to the side where the input electrodes are commonly wired. In the IC module, four ICs are mounted for each module. However, the present invention is not limited to two or more ICs. In the embodiment, the input terminal of the IC module is located on the left side of the IC module. However, even if the input terminal is located on the upper and lower sides, if the driver IC is used in the present invention and the single-sided wiring FPC is used, the present invention is not limited to the present invention. Do not escape. Further, although the aluminum plate is mounted on the IC module, the present invention is not excluded even if the connection is made not on the IC module but on the display module. In the display module, even if the scan side is not an IC module but a flat package, the present invention does not depart from the present invention if the data side is the IC module of the present invention.

[0025]

As described above, if the face-down multi-output driver of the present invention is used, a single-sided wiring FPC can be used.
The signal electrodes between the ICs can be connected by the substrate, and there is an effect that an inexpensive FPC substrate can be used. In addition, since the chip size can be reduced by using the multi-output driver of the present invention, a compact IC module can be created, and a common IC module can be used for all displays from a small screen display to a large screen display. It has the effect of reducing costs. In addition, since the used quantity is increased, there is a cost reduction effect by mass production. The cost reduction of the IC module has a great effect on the cost reduction of the display module using many IC modules.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment of a multiple output driver electrode arrangement according to the present invention.

FIG. 2 is a diagram illustrating an embodiment when a power supply electrode is arranged on a long side.

FIG. 3 is a diagram illustrating an embodiment of a multi-output driver power electrode arrangement according to the present invention.

FIG. 4 is a diagram illustrating an embodiment of an FPC wiring for a multi-output driver according to the present invention.

FIG. 5 is a diagram illustrating an embodiment of a configuration of a multi-output driver according to the present invention.

FIG. 6 is a diagram showing an embodiment of the IC module of the present invention.

FIG. 7 is a diagram showing an embodiment of the display module of the present invention.

[Explanation of symbols]

 1 Chip outline 2 Driver output electrode 3 Power supply electrode 4 Input electrode 5 Data input / output electrode 6 Dummy electrode 22 Driver block 23 Length of 96 driver blocks 24, 34 Power supply wiring 25, 35 Length of power supply wiring routing area 41 Driver VSS power supply wiring 42 Driver VDDH power supply wiring 43 Logic VSS power supply wiring 44 Logic VDDL power supply wiring 45 Input signal wiring 46, 47 Data input / output wiring 48 Test electrode 49 VDDL electrode 50 Wiring pattern 51 High voltage driver 52 Level shift circuit 53 Latch circuit 54 Shift register circuit 55-60 Data input / output signal 61-66 Input signal 67 Driver VDDH power supply 68 Logic VDDL power supply 69 Common ground power supply 101 FPC board 102 IC outline 103 Output electrode 104 Input Pole 105 to 110 the input signal lines 111 to 116 the data signal lines 117 to 120 display the power supply wiring 121 radiating aluminum plate 122 FPC opening 201 panel 202 data-side IC module 203 scans side IC module 204 a flexible substrate

Claims (7)

[Claims] In a strip-shaped multi-output driver for driving a display device mounted by a method in which a semiconductor element is fixed on a circuit board in a face-down state, a signal electrode commonly connected to a plurality of multi-output drivers is provided. An electrode position of a face-down multi-output driver, wherein the electrode position is arranged along one long side, and the electrode positions on the long side are collected and arranged on one side on the long side. 2. A multi-output driver according to claim 1, wherein a plurality of multi-output drivers are used side by side, and data transfer electrodes connected between adjacent drivers are arranged at left and right ends on a long side. The electrode position of the face-down multi-output driver, which is disposed at 3. A multi-output driver according to claim 1, wherein the power supply terminals to be supplied to the driver are arranged along the short sides and the long sides are arranged in parallel in the horizontal direction. The distance between the vertical position of the power supply electrode arranged on the short side and the vertical position of the input electrode arranged on the long side is defined in claim 2.
The electrode position of the face-down multi-output driver, which is larger than the product of the number of input terminals of signals commonly connected to a plurality of multi-output drivers excluding the data transfer electrodes described above and the wiring pitch of the wiring board . 4. The method according to claim 1, further comprising the steps of: fixing the IC on a circuit board in a face-down state;
C. An electrode arranged adjacent to a test electrode used in the test of C is an electrode at a level that renders a test function inactive.
C electrode position. 5. The method according to claim 1, wherein the IC is mounted on a circuit board in a face-down state by fixing the IC at an electrode position.
The electrodes arranged adjacent to the input electrodes for which the input level needs to be preset to a high level or a low level depending on the use condition of C are a high level electrode and a low level electrode. IC
Electrode position. 6. A wiring board on which a plurality of multi-output drivers according to claim 1 are mounted, wherein signal wiring, power supply wiring and wiring between data transfer electrodes commonly connected to each driver are connected by a single-layer wiring. Characteristic wiring board. 7. A display module for performing display display, wherein a plurality of the wiring boards according to claim 6 are mounted.