JPH11125647A - Method for inspecting probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply, quickly and highly accurately inspect a short circuit and a leak by reading, storing card data of a probe card and pressing an insulating flat plate to a measuring stylus with a predetermined overdrive amount. SOLUTION: A lift unit 31 can move a composite inspection substrate 32 up and down in a Z direction with carrying a stylus end observation apparatus thereinside. The lift unit can press the composite inspection substrate 32 to a measuring stylus 37 of a probe card 36 or retreat the composite inspection substrate from the measuring stylus 37, and also measure a height of each measuring stylus 37 while sequentially changing a contact amount thereof to the measuring stylus 37. A height and a contact resistance of a leading end of the stylus can be measured when an electrode flat plate 33 is pressed and moved to the measuring stylus 37. On the other hand, a coordinate pattern of the leading end of the stylus can be observed by the observation apparatus in a state while a transparent glass flat plate 34 is pressed to the measuring stylus 37 by a predetermined amount. When the coordinate pattern is observed, an optical microscope 38 held by the lift unit 31 is moved to a predetermined position by XY stages 41, 42, thereby enabling sequential tracking and observation of a plurality of measuring styluses 37.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card inspection method, and more particularly to an improved probe card inspection method capable of quickly and accurately detecting shorts and leaks of a plurality of conductive measurement needles provided on a probe card. About.

[0002]

2. Description of the Related Art A large number of semiconductor ICs formed on a wafer
A prober tester system is used to perform an electrical characteristic test of the above, and a probe card having a plurality of conductor measuring needles arranged according to the electrode pattern of each semiconductor IC is mounted on the prober. This probe card usually has a structure in which a plurality of conductor measuring needles such as tungsten are fixedly mounted on a substrate such as an epoxy resin, and the tip of the measuring needle is brought into contact with each electrode pad of a semiconductor IC as a measured object. The desired electrical test is then performed. The tip of such a measuring needle is usually bent into an L-shaped hook shape, and each measuring needle is brought into contact with, for example, a bonding pad which is an electrode of a semiconductor IC chip, and the IC is tested by a tester.
Electrical inspection is performed.

Therefore, the tip of the measuring needle of such a probe card must be arranged in a pattern that exactly corresponds to the electrode pattern of the IC chip to be measured, and its height accuracy must be strictly controlled. Similarly,
In order to ensure good electrical continuity with each bonding pad, the contact resistance at the tip must also be properly managed.

As described above, a probe card inspection apparatus has been put to practical use in order to correctly position a measurement needle of a probe card and to repair deformation or the like of the measurement needle that occurs during long-time use.

Conventionally, as a device for measuring the probe tip of the probe card, a measuring optical system having an optical lens and a CCD camera are provided in a part of a prober tester system as shown in Japanese Patent Application Laid-Open No. 3-89102. Accordingly, there has been proposed an apparatus for measuring a probe tip position of a probe card at the time of alignment during wafer measurement.

However, in such a measuring device, only the approximate position of the stylus tip is known, and there is a problem that it is not possible to carry out a height variation, short-circuit or leak test. Since the measurement is performed in a floating state, there is a problem that the needle point pattern when the actual contact with the bonding pad of the wafer cannot be inspected.

FIG. 18 shows a schematic structure of a conventional probe card inspection device, and according to this device, the height of the measurement needle of the probe card and the contact resistance of the needle tip can be inspected.

In FIG. 18, an elevating unit 11 is supported on a base 10 so as to be vertically movable, and an electrode plate 12 is fixed to an upper end of the elevating unit 11. And
A probe card 13 is fixed and held on the electrode plate 12 in parallel with the electrode plate 12. Actually, the probe card 13 is fixed to a holder (not shown), and an arbitrary probe card 13 is detachably attached to the electrode plate 12.
Are positioned opposite to each other. A tester 15 is provided between the electrode plate 12 and each group of measuring needles 14 of the probe card 13.
Is connected, and the contact state and contact resistance in the state where the measuring needle 14 and the electrode plate 12 are in contact with each other are accurately measured.

In such a conventional apparatus, after the probe card 13 is fixed at a predetermined position, the electrode plate 12 is fixed.
Is moved to the probe card 13 side by the elevating unit 11, and the position where the first measuring needle 14 contacts the electrode plate 12 is recorded. The elevating unit 11 further moves the electrode flat plate 12 upward and records the contact position with each measuring needle 14, so that the height variation of each measuring needle 14 can be inspected. At the same time, the contact resistance between each measuring needle 14 and the electrode plate 12 can be inspected.

[0010]

However, in such a conventional apparatus, although the height and the contact resistance of the needle of the measuring needle can be inspected, each measuring needle 14 actually comes into contact with the object to be measured. There is a problem that a short-circuit or leak test of each measuring needle cannot be performed in a state where the needle is deformed, that is, a state where the needle tip is deformed.

In particular, when the probe card has a large number of measuring needles, all such measuring needles can be quickly and continuously inspected for short and leak with high precision to easily determine the quality of the probe card. There was a problem that was difficult.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide an improved probe card capable of easily performing a short and leak test on each measuring needle of a probe card to be inspected. An object of the present invention is to provide an inspection method.

[0013]

In order to achieve the above object, the present invention first reads and stores card data of a probe card to be inspected, and then places an insulating flat plate on a measuring needle of the probe card by a predetermined amount. Press with the drive amount,
A short circuit and leak test are performed according to the card data.

[0014]

Therefore, according to the present invention, it is possible to carry out a short-circuit and leak test by placing the measuring needle of the probe card to be tested in the same penetrate state as in the actual measurement.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a preferred embodiment of an apparatus to which a probe card inspection method according to the present invention is applied, showing a main mechanism inside the apparatus, and a side view seen from that direction. 2 is shown. According to this embodiment, not only the short leak test characteristic of the present invention but also the height variation of the measuring needle and the inspection of the tip sliding can be performed.

The elevating unit 31 is placed on the inspection device base 30.
Is provided for moving the composite inspection board up and down in the Z direction with respect to the probe card to be measured, as will be described later, and the lifting unit 31 for moving the needle tip observation device in the horizontal direction. The moving mechanism is housed.

As is apparent from the figure, a composite inspection board 32 is slidably mounted on the upper surface of the elevating unit 31. The slide mechanism will be described in detail later. The substrate 32 is an electrode plate 33
In the embodiment, the transparent glass flat plate 34 has a structure in which the transparent glass flat plates 34 are juxtaposed on the same plane. The electrode flat plate 33 is formed of a low-resistance conductive plate having a conductor plated with gold, while the transparent glass flat plate 34 is formed of a glass plate having excellent light transmittance such as lead glass.

In the present embodiment, as is clear from the inspection procedure described later, the two flat plates 33 and 34 must be at the same height in a slid state.
The upper surfaces of the flat plates 33 and 34 are fixed in a state where they are precisely adjusted.

In FIG. 2, a probe card holder 35 is supported on the inspection apparatus base 30, and a probe card 36 to be measured is detachably mounted on the probe card holder 35. In the embodiment, the probe card holder 35 can be turned around a rotation axis fixed to the inspection apparatus base 30 so that the probe card 36 can be rotated at the inspection position 200.
The measurement needle 37 faces downward toward the composite inspection board 32 side. On the other hand, when the probe card holder 35 is turned over, the measuring needle 37 of the probe card 36 is exposed upward, and for example, the position of the measuring needle 37 can be corrected during an inspection.

Although not shown in detail in FIGS.
Each of the measurement needles 37 and the electrode plate 33 is electrically connected to a tester that measures a contact resistance between the measurement needle 37 and the electrode plate 33.

In this embodiment, the lifting unit 3
A needle tip observation device for observing the measurement needle 37 of the probe card 36 is mounted in 1.
Thereby, it can move in the Z direction, that is, in the vertical direction, together with the composite inspection board 32. The needle tip observation apparatus includes an optical microscope 38 and a CCD camera 39 in the embodiment, and can recognize an image of a desired tip of the measurement needle 37 through the transparent glass plate 34 at an inspection position 200.

The elevating unit 31 includes a Z stage 40, which can be moved up and down in the Z direction in FIG. 1 by a Z direction moving mechanism described later. Can be pressed against the measurement needle 37 of the probe card 36. An X stage 41 and a Y stage 42 are provided in the elevating unit 31.
8 and the CCD camera 39 can be moved in the X and Y directions to obtain a desired plane coordinate position.

As described above, the lifting unit 31
Can move the composite inspection board 32 up and down in the Z direction while supporting the needle tip observation device therein.
2 can be pressed against the measuring needle 37 of the probe card 36 or retracted from the measuring needle 37, and the height of each measuring needle 37 can be measured while changing the contact amount with the measuring needle 37 sequentially. Becomes Therefore, the electrode plate 33
When the transparent glass plate 34 is pressed against the measuring needle 37 by a predetermined amount, the coordinate of the tip of the transparent glass plate 34 is measured by the observation device. The pattern can be observed. When observing the needle tip coordinate pattern, the optical microscope 38 carried by the elevating unit 31 is moved to a predetermined position by the XY stages 41 and 42, so that the plurality of measurement needles 37 can be sequentially observed.

FIG. 3 shows an overall external view of the present embodiment. The above-described mechanism shown in FIGS. 1 and 2 is housed in a main body cover 43. The probe card holder 35 can be inverted 180 ° about the axis 44 as shown by an arrow C. At the probe card holder position shown by the solid line in FIG. 3, measurement is performed as shown in FIGS. Measurement needle 37 of probe card 36
Is held downward on the composite inspection board 32 side, while being inverted to the position indicated by the dashed line, the measurement needles 37 of the probe card 36 are opened upward, and in this state, the position of each measurement needle 37 is repaired. Etc. can be performed very easily.

In FIG. 3, a personal computer 45 is built in the main body cover 43, performs predetermined data processing, and uses a well-known tester (not shown in detail) to connect each measuring needle 37 and the electrode plate 33 to each other. Is measured by the four-terminal method, and the measurement result is processed by the personal computer 45.

A monitor 46 and a personal computer display 47 are further mounted on the inspection apparatus according to the present embodiment, and image information output from the observation apparatus by the monitor 46 is displayed after being processed by the image processing apparatus. . On the other hand, a personal computer display 47 displays an output processed by the personal computer 45. These data processing outputs can be printed out by the printer 48 as needed. As described above, according to the present embodiment, the probe card 36 to be measured is mounted on the probe card holder 35, and the composite test board 32 is slid to slide the electrode flat 33 or the transparent glass flat 34.
The height measurement, the contact resistance measurement and the needle tip coordinate pattern measurement of the measuring needle 37 can be sequentially and continuously performed using any one of the above. These series of measurement procedures are performed automatically or manually according to an instruction from the control panel 49. In the embodiment, the slide movement of the composite inspection board 32 is performed by pneumatic driving, while the lifting and lowering unit 31 The vertical movement in the Z direction and the horizontal movement of the XY stages 41 and 42 are performed by driving a pulse motor. The control panel 49 includes a joystick in the embodiment, and can manually move the XY stages 41 and 42 at any time.

Hereinafter, the more detailed structures of the lifting unit 31 and the composite inspection board 32 and the probe card holder 3 will be described.
5 preferred embodiments will be described in detail.

FIG. 4 shows a Z-direction moving mechanism of the elevating unit 31 in the present embodiment. Inspection device base 3
0 has two Z receiving plates 50 and 51 fixed upright.
The Z receiving plates 50 and 51 are guided by Z slide plates 52 and 53 so as to be vertically movable.
It can be understood that the Z stage 40 is supported on the inspection device base 30 so as to be movable in the vertical direction by firmly fixing the Z slide plates 52 and 53.

As is clear from the above description, this Z
Posts 54 and 55 are fixed to the stage 40, the composite inspection board 32 is supported via the posts 54 and 55, and the optical microscope 38 and the CCD camera 39 described above.
In order to smoothly move the Z stage 40 in the vertical direction under the weight of these devices, the observation device including the XY stage is placed between the inspection device base 30 and the Z stage 40 in detail. Although not shown, a pressurizing mechanism including a compression spring is provided.

In order to drive the Z stage 40 in the vertical direction, a Z pulse motor 56 is mounted on the inspection device base 30.
Is fixed, and a pulley 5 fixed to the motor shaft is provided.
7 and a pulley 59 fixed to the lower end of the Z drive screw 58
A drive belt 60 is hung between the two and the Z drive screw 58 can be driven to rotate by the rotation of the Z pulse motor 56. The Z drive screw 58 is rotatably supported on the inspection device base 30 by a bearing 61, while a Z nut 62 is fixed to the Z stage 40,
By connecting the Z drive screw 58 to the Z nut 62 by screwing, the Z stage 4 is rotated by the rotation of the Z drive screw 58.
0 can be moved up and down to any height. Therefore, according to this embodiment, the composite test board 32 is pushed up toward the measuring needle 37 of the probe card 36 by the Z drive device shown in FIG. The pulse can be known, and in the embodiment, one feed pulse of the Z pulse motor 56 is set to correspond to 1 μm in the Z direction. Therefore, according to the elevating unit 31, it is possible to measure the contact height between the composite inspection substrate 32 and the measuring needle 37 with an accuracy of 1 μm. By moving the Z pulse motor 56 at high speed, the composite inspection board 32 is
Can be quickly withdrawn from the measuring needle 37 or moved at a high speed to a predetermined position.

FIG. 5 shows an XY drive mechanism of the needle point observation apparatus in the present embodiment. The X receiving plate 63 of the X stage 41 is fixed on the Z stage 40 shown in FIG. An X slide plate 64 is supported on the X receiving plate 63 so as to be slidable in the X direction.

Therefore, in the present invention, as described later, the needle point observation device automatically follows the needle points in accordance with the card data of the probe card 36 to be measured and automatically recognizes the images of all the needle points. Becomes possible.

An X step motor 65 is provided on the X receiving plate 63.
Is fixed, and X (not shown) fixed to its main shaft
The drive screw has an X fixed to the X slide plate 64.
The nut is screw-connected, and as a result, the X slide plate 64 can be moved to an arbitrary position by the rotation of the X step motor 65. In the embodiment, the movement in the X direction can be known by the number of pulses applied to the X step motor 65, but in this embodiment, the accurate X direction position can be determined by the linear encoder 66 fixed to the X slide plate 64. Can be detected.

Similarly, a Y receiving plate 67 of the Y stage 42 is fixed to the X slide plate 64.
7, a Y slide plate 68 is slidably supported in the Y direction. Then, by rotating a Y step motor 69 fixed to the Y receiving plate 67, the Y drive screw 70 is screw-coupled to a Y nut 71 fixed to the Y slide plate 68, and the Y slide plate 68 It can be moved to a predetermined position in the direction. As with the X stage 41, Y
The stage 42 also has a linear encoder 73 fixed to the Y slide plate 68 so that the position in the Y direction can be accurately detected.

As shown in FIGS. 1 and 2, an optical microscope 38 and a CCD camera 39 are fixed to the Y slide plate 68, so that the observation position of the optical microscope 38 can be adjusted with respect to each measuring needle 37 of the probe card 36. It is possible to adjust to the needle point, and in the automatic measurement, while continuously moving the optical microscope 38 to each needle point position of the plurality of measurement needles 37,
The shape of the tip of the needle tip at this time can be displayed on the monitor 46 and the personal computer display 47.

The feature of this embodiment is that the composite inspection substrate 3 having the electrode plate 33 and the transparent glass plate 34
2 is slid to one of the inspection position 200 and the retracted position, and the height and contact resistance of the measuring needle 37 are measured by the electrode flat plate 33, while the transparent glass flat plate 34 is used for short-circuit and leak testing of the measuring needle 37 and the needle tip The ability to measure coordinate patterns. FIG. 6 shows a preferred embodiment of the slide mechanism for the composite inspection board 32.

A column 5 provided on the Z stage 40
A slider receiving plate 74 is fixed to each of the slider receiving plates 74, and a slide plate 76 on which the composite inspection board 32 is mounted is slidably supported on a slide guide 75 provided on the slider receiving plate 74. For this purpose, the slide plate 76 is provided with guide pieces 77 and 78 that slide on the slide guide 75. In the embodiment, a pneumatic actuator 79 is provided to move the slide plate 76 by a stroke indicated by S, and the pneumatic actuator 79 includes a cylinder 80 and a piston rod 81, and the cylinder 80 is a slide receiving plate. The piston rod 81 is fixed to a bracket 82 fixed to the slide plate 76. Therefore, by operating the pneumatic actuator 79, the slide plate 76 carrying the composite inspection board 32 can be quickly moved to the left and right by the stroke S shown in the drawing, thereby moving either the electrode plate 33 or the transparent glass plate 34. It is possible to face the inspection position 200.

FIG. 7 shows a preferred embodiment of the probe card holder according to the present embodiment in detail.

In the present embodiment, the composite inspection board 32 and the needle tip observation device are mounted in the elevating unit 31. As a result, the probe card 36, which is the object to be measured, has its measuring needle 37 attached to the composite inspection board 32. It must be positioned at the inspection position 200 so as to face the upper surface.

Accordingly, in the present embodiment, the probe card 36 is mounted so that the measuring needle 37 faces downward, and the present embodiment uses the probe card holder 35 for this purpose.
Has a holder frame 83, a motherboard 84 is positioned and fixed to the holder frame 83 by clamps 85 and 86, the probe card 36 is mounted on the motherboard 84, and the measurement needles 37 are arranged downward at the measurement position.

One end of the holder frame 83 is rotatably supported by a rotating shaft 87 provided on the inspection apparatus base 30, and the holder frame 83 can be turned around the rotating shaft 87 as a center. Therefore, when the holder frame 83 is positioned as shown by the solid line in FIG. 7, the probe card 36 is automatically positioned at the inspection position, and the probe card 36 is inverted in the state of the dashed line, exposing the measuring needle 37 upward. Repair of the measuring needle during the inspection and the like can be easily performed. In the inspection position indicated by the solid line in FIG. 7, the holder frame 83 is firmly positioned by the lock 88, and the lock 88 in the embodiment holds the holder frame 83 during the inspection by the holding force from the pneumatic pump (not shown). Do.

In this embodiment, there is a problem that the weight of the holder frame 83 containing the motherboard 84 and the probe card 36 is increased, and the operability is deteriorated when performing the reversing operation. In order to reduce the operation amount, a tension spring 90 is hung on a spring hook 89 provided on the tail portion 83a of the holder frame 83, and the inversion operation force of the holder frame 83 is reduced by the tension force of the tension spring 90.

The structure of the preferred embodiment of the probe card inspection apparatus used in the present embodiment is clear from the above description. The inspection procedure is described below with reference to FIGS.
This will be described with reference to FIGS. 11, 12, 13, and 14.

FIG. 8 shows an outline of the measurement procedure.
In step S1, card data of a probe card to be measured is input. This data includes a probe card name, a serial number, the number of measurement channels, a measurement needle coordinate pattern, and the like. These data are read into the inspection device from the keyboard of the control panel 49 or a floppy disk reader.

Step S2 is an initial setting of the inspection apparatus, and includes an overdrive amount, an escape amount, and a measurement pitch.

The overdrive is the amount of movement penetrate of the elevating unit 31 by which the composite inspection board 32 is pressed against the measuring needle 37. In measuring the height of the measuring needle and the contact resistance, the maximum overdrive amount from the first contact is set in advance. In addition, at the time of measuring the needle tip coordinate pattern, the overdrive amount from the first contact at the time of measurement is set in advance. For example, about 100 μm or less is selected as such an overdrive amount.

The escape amount is an amount by which the composite inspection board 32 is retracted from the measurement needle 37 in the present embodiment.
3. The amount of retreat in each direction when one of the transparent glass flat plates 34 is selectively moved to the measurement position 200 is determined, and for example, about 500 μm is appropriate. Further, the measurement pitch is a setting of the ascending pitch when measuring the height variation,
For example, by setting it to about 1 μm, observation measurement with high accuracy becomes possible. When the initial setting is completed as described above, the probe card 36 to be measured is correctly mounted on the probe card holder 35, and the measuring needles 37 and the tester are electrically connected. According to the display, a predetermined inspection mode is selected in step S3. In the present embodiment, the following six types of inspections can be selected.

1. Pin-to-pin short measurement 2. 2. Pin-to-pin leak measurement 3. Pin height variation measurement 4. Pin tip contact resistance measurement 5. Pin tip position measurement Pin tip diameter measurement In this embodiment, mode selection S3 can select each of these measurements individually or can also select continuous measurement. When an individual inspection is selected, each mode corresponds to each of the measurements. Steps S4, S5, S6, S7, S
The measurements in steps 8 and 9 are performed individually. After the completion of each measurement, the measured values are recorded in steps S10 to S15, and the process returns to step S3 again to wait for the selection of the next inspection mode.

On the other hand, when the continuous inspection mode is selected, the individual inspections of each of the steps S4 to S9 arbitrarily selected are sequentially and sequentially performed in accordance with the continuous program shown in step S16, and the predetermined order is determined. Is completed.

The characteristic of the present invention is that the pin-to-pin (measurement needle) short measurement and the pin-to-pin leak measurement are performed in the penetrate state similar to the state in which each measurement needle 37 of the probe card 36 is in contact with the object to be measured. Is what can be done. That is, the pneumatic actuator causes the transparent glass flat plate 34 of the composite inspection substrate 32 to face the inspection position 200 in order to perform the inter-pin short measurement and the inter-pin leak measurement. Then, the elevating unit 31 is raised from the first contact position with the measuring needle 37 by a predetermined overdrive amount, and the transparent glass flat plate 34 is pressed against all the measuring needles 37. The predetermined amount of overdrive at this time is preferably, for example, a state in which the transparent glass flat plate 34 is pressed against the 50 μm measuring needle 37.

FIG. 9 shows a measurement state of short candidate pins. Each measurement needle 37 is connected to a tester 302 via a motherboard 84 and a cable 301. FIG.
In the first, the measuring needle 3 which may be short-circuited
7 is performed, and a constant current is supplied from the constant current source 303 to any one of the measurement needles 37. Each measuring needle 37 is 2
Signal lines A and B, and the constant current source 30
3 is connected to one signal line A. Then, the other signal line B is supplied to one input of the operational amplifier 304,
The other input of the operational amplifier 304 is the other measuring needle 3
It is commonly connected to one of the signal lines C ₁ -C _n 7. The other signal lines D _{1 to} D _n of the other measuring needles 37 are commonly connected and connected to the other terminal of the constant current source 303. The output of the operational amplifier 304 is a 16-bit AD
It is connected to the converter 305, and as a result, the voltage generated between the terminals BC can be measured as a digital output.

Therefore, in a state where all the measuring needles 37 of the probe card 36 are in contact with the transparent glass plate 34 and penetrate by a predetermined overdrive amount, each measuring needle 37
Is automatically determined in sequence whether or not the other measuring needles are short-circuited.

When a short-circuit candidate measuring needle is found by the pin-to-pin short measurement of FIG. 9, the resistance between the candidate pins is measured as shown in FIG. FIG. 10 shows this inter-pin measurement state. After a candidate pin is found in FIG. 9, the pin-to-pin resistance between the candidate pins connects the constant current source 303 between the terminals A and D of both measurement needles. , Both terminals BC at this time
Measure the voltage between them. In this embodiment, when the resistance value between both pins is 250Ω or less, it is determined that a short circuit occurs.

Next, a leak test is performed with each measuring needle 37 of the probe card 36 being anesthetized by a predetermined amount of overdrive on the transparent glass plate 34. FIG.
Numeral 1 indicates the state of the leak test, and one of the measuring needles 3
7 is checked for all the measuring needles 37. At this time, the constant voltage of the constant voltage generating source 310 is common to any one of the measuring needles and the other measuring needles as in the short-circuit test of FIG. Applied between terminals. If a leak occurs between the measuring needle to be measured and any other measuring needle, a current flows through the operational amplifier 311 and this is detected by the sensing circuit 312, and an ammeter having a shunt resistor is provided. 313 measures the current at this time, and the presence or absence of leakage is detected from the 16-bit AD converter 314.

After the leak candidate pin is found, the current value between the candidate pins is measured as shown in FIG. 12, and the quality of the leak current is determined for each measuring needle based on the current value at this time. Is done.

As described above, according to the present invention, the short-circuit test and the leak test are performed in the same state as when all the measuring needles 37 of the probe card 36 are in contact with the actual measurement object. Even when the interval is narrow, the probe card can be inspected in almost the same state as the actual measurement.

FIG. 13 shows the detailed procedure of the height variation measurement described above. First, in step S20, the electrode plate 33 of the composite inspection substrate 32 is moved to the inspection position 200. This movement is quickly performed by the pneumatic actuator as described above.
Is lowered, and the composite inspection board 32 and the measurement needle 37 are not in contact with each other.

In step S21, the lifting unit 3
1 rises to the first contact with the measuring needle 37,
At each contact with each measuring needle 37 (S22), the Z coordinate data at this time is read (S23), and this rising measurement is repeated until a predetermined overdrive amount is reached (S24).

When the predetermined overdrive amount in the Z direction is completed, the contact position of each measuring needle 37 is read during this period, and the lifting unit 31 stops moving up (S25).

When all data has been captured, the elevating unit 31 descends again, and retracts the electrode plate 33 from the measuring needle 37 (S26).

As described above, the height variation of the measuring needle 37 is inspected.
The contact between the measuring needle 37 and each measuring needle 37 is performed by measuring the contact resistance with a tester. Therefore, the contact resistance value of each measuring needle itself can be measured by the same procedure as shown in FIG.

FIG. 14 shows the procedure for measuring the first and second tip positions in the present invention. In step S30, the transparent glass plate 34 of the composite inspection substrate 32 is brought to the inspection position 200 by the pneumatic actuator. Then, the elevating unit 31 is raised from the first contact position with the measuring needle 37 by a predetermined overdrive amount, and the transparent glass substrate 34 is pressed against all the measuring needles 37 (S31, S31).
32). At this time, in the first stylus position measurement, the subsequent measurement is performed with a small overdrive amount or in the first contact state where only one of the styluses is in contact, while the second stylus position measurement is performed with a predetermined amount. The measurement is performed with the transparent glass flat plate 34 pressed against the overdrive amount, for example, the 50 μm measuring needle 37. Therefore, if both measurement results are displayed on the same screen for each measurement needle 37, it is possible to know the slip amount of each measurement needle 37. Hereinafter, the procedure of image recognition in the double-needle position measurement will be described.

In step S33, the optical microscope 38 is adjusted to a predetermined measuring needle tip using a joystick or the like.
In this state, when the measurement start is instructed, the needle point image at the start position is image-recognized (S34), and this needle point image is displayed together with the determination reference frame (S35).

FIG. 15 shows a display example of a stylus image according to the present invention.

In the embodiment, the monitor 46 displays the image information output from the observation device as it is, that is, the image of the CCD camera 39 as it is, while the display 47 displays the recognition image shown in FIG.
5 indicates the result of the data processing.

As is apparent from FIG. 15, according to the present invention, the screen of the display 47 has a display 130 showing the arrangement of all pins in the X and Y directions and a detailed display frame 100 for displaying the measurement results of each pin in detail. It is composed of

In the detailed display frame 100 in the embodiment,
A needle point display frame 102 on which the data-processed needle point image 101 is displayed, and a height relation display frame 110 on which a height relationship between the display pin and another pin and a contact resistance determination are displayed are included.

In the needle tip display frame 102, a circle is formed with a radius corresponding to the contact center deviation allowable value corresponding to the displayed measurement needle 37 obtained from the card data of the probe card 36 to be inspected which has been input in advance. 103, and a circle display 104 of a warning level frame when the contact center deviation allowable value is set to 100%. The needle point image 101 is shown as a virtual tip circle display having an average diameter obtained from the image-recognized data.

In the height relation display frame 110, a bar graph 111 indicating the height relation between the pin being displayed and the other pins is displayed as described above. When the value is less than the value, the color of the bar graph changes.

Accordingly, the detailed display frame 100 shown in FIG.
Based on the position and size of the top image 101 and the length and color of the bar graph 111, the quality of the test needle 37 being inspected can be easily determined on the screen.

Further, according to the present embodiment, the following additional display is performed in the detailed display frame. Display 10
Reference numeral 2 denotes a pin number for which the details of the measurement result are being displayed, and it is understood that this is the display of the pin 1 selected at the start position in the figure. The display 121 indicates the tip diameter of the pin being displayed. The display 122 shows the shift amount from the reference coordinate position as the shift amount on the X and Y axes. The display 123 shows the distance from the reference coordinate position to the center of the needle tip. The display 124 indicates the amount of overdrive in which the display pin and the transparent glass plate 34 are pressed against each other when the needle point position is measured. The display 125 indicates the color change position of the bar graph in the height-related display frame. Further, the following additional display is performed on the screen of the display 47.

The above-described display 130 showing the arrangement of all pins in the X and Y directions is displayed in different colors according to the results determined based on the respective measurement data, and the pin position currently displayed is further shown as a display 131. In the figure, the display of the measurement result of the first pin can be quickly read from the surrounding pin pattern. In the embodiment,
It is displayed with a frame as the displayed pin position display 131. The display 132 indicates the number of defective pins with respect to the total number of pins. In the figure, the first pin is defective, which means that one out of 32 pins is defective.

Therefore, such a display 47 allows the inspector to visually judge the acceptability of the measuring needle 37 as numerical data.

Next, in step S36, the XY stages 41 and 42 are sequentially moved stepwise by the distance between the pins determined in advance by the card data.
7 is subjected to image recognition.

When the measurement of all the needles is completed (S3
7) The apparatus is stopped (S38), and after the measurement is completed, the composite inspection board 32 is retracted from the probe card 36 (S39).

The position of the needle tip is measured as described above, and the inspection as to whether the measurement needle 37 of the probe card 36 is assembled in a predetermined coordinate pattern is completed.

As described above, according to the present embodiment, there is an advantage that the measurement of the needle point coordinate pattern can be continuously performed, and the accurate measurement can be performed in an extremely short time.

Further, according to the present invention, step S3
The image recognition performed by 4 is stored in an appropriate memory, for example, a floppy disk, and the measurement result is read arbitrarily and can be observed for each measuring needle on the display 47 shown in FIG.

As described above, according to the present invention, the needle point image of each measuring needle 37 is captured at a predetermined overdrive amount.

In the present invention, the measurement needle 37 is pressed against the transparent glass plate 34 with a small amount of overdrive including the non-contact state and a predetermined large amount of overdrive, respectively, in the first and second states. Is performed as described above, and a change (slip) in the needle tip position due to a change in the overdrive amount of each measuring needle 37 can be inspected from the two detected needle tip position data.

FIG. 16 shows the procedure of a slip test according to the present invention.

Step S40 shows a Z-stage positioning step of pressing the transparent glass plate 34 against the measuring needle 37 with a small amount of overdrive, and this small amount of overdrive gives a slight pressing to all the measuring needles 37. This includes a case where only a predetermined, for example, only the first contact measurement needle is pressed against the flat plate 34.

Thus, a small overdrive amount,
That is, in a state where the penetrate is hardly performed on the measurement needle 37, the first needle point position measurement is performed in step S41. This first needle point position measurement is performed in the manner shown in FIG.
Since the procedure is performed in step 4, detailed description thereof is omitted.

As described above, when the tip positions of all the measuring needles 37 are measured with a small overdrive amount,
These first data are stored in a memory or the like (S42),
This first data becomes readable at an arbitrary position.

Next, as shown in step S43,
The transparent glass plate 34 is further raised by a predetermined amount, for example, 50 μm, to obtain a state of a large overdrive amount that gives a penetrate amount to all of the measurement needles 37. This large overdrive amount is assumed to be a state of being pressed against the electrode pad when the IC card is inspected by the probe card 36 to be measured.

When the pressing of the large overdrive amount is completed as described above, the second needle point position measurement is performed (S44). This measurement is the same as the procedure shown in FIG. 14 described above, and thus detailed description is omitted.

The second needle tip position measurement result is stored as second data (S45), and both the first data and the second data are read out for each necessary measuring needle 37 to obtain a desired judgment reference. The slide is displayed together with the frame (S46).

FIG. 17 shows an example of such a slip display, which is almost the same as the judgment reference frame and the other displays in FIG. 15 described above. Description is omitted.

However, in the sliding display of FIG. 17, the first and second data obtained by the first and second needle tip position measurements are simultaneously displayed. The display 101b shows the measurement results with a large overdrive amount.

The needle point display frame 102 in this case indicates the contact area allowable value corresponding to the displayed measurement needle 37, and a warning level frame when the contact area allowable value is set to 100% is a frame display 105. Is displayed as

Therefore, according to the display of the inspection result as shown in FIG. 17, it is possible to clearly know the sliding of each measuring needle 37 when the measuring needle 37 is pressed against the transparent glass plate 34. In particular, from FIG. 17, the direction and amount of slip at the time of sliding of the measuring needle are visually and very clearly understood, thereby accurately determining the quality of the probe card 36 when actually used for IC pad measurement. be able to.

The display 126 in FIG. 17 shows the tip displacement with a small overdrive amount, and the display 127 shows the tip displacement with a large overdrive amount as the X and Y axis displacements. The actual amount of slip is displayed on the display 128 and can be grasped numerically.

Further, according to the present invention, if the assembly of the measuring needle is not appropriate during the measurement, the defective measuring needle can be arbitrarily repaired, and the repair state can be inspected at the same time.

[0095]

As described above, according to the present invention,
Short and leak inspection of a plurality of measurement needles of the probe card can be quickly and accurately performed in a needle deformation state similar to an actual measurement state.

[Brief description of the drawings]

FIG. 1 is a schematic structural view showing a preferred embodiment of an apparatus to which a probe card inspection method according to the present invention is applied.

FIG. 2 is a side view seen from the direction in FIG.

FIG. 3 is an overall external view when the present embodiment is assembled as an inspection device.

FIG. 4 is a sectional view of a main part showing a detailed structure of a Z-direction moving mechanism of the lifting unit according to the embodiment.

FIG. 5 is a cross-sectional view of a main part of the XY moving device of the needle point observation device carried by the lifting unit according to the embodiment.

FIG. 6 is a front view of a main part showing a slide mechanism of the composite inspection board in the embodiment.

FIG. 7 is a main part front view showing a preferred embodiment of the probe card holder in the present embodiment.

FIG. 8 is an explanatory diagram showing an outline of an inspection procedure in the present embodiment.

FIG. 9 is a test connection circuit diagram showing an extraction state of short candidate pins in the present embodiment.

10 is an inspection connection circuit diagram for measuring a resistance value between each needle of a short candidate pin found in FIG. 9;

FIG. 11 is an inspection connection circuit diagram when performing a leak inspection in the present embodiment.

12 is a test connection circuit diagram showing a current measurement state of a leak candidate pin determined in FIG. 11;

FIG. 13 is a flowchart illustrating a height variation measurement procedure according to the present embodiment.

FIG. 14 is a flowchart showing first and second needle tip position measurement procedures in the present invention.

FIG. 15 is an explanatory diagram showing a display example of a needle point image in the present invention.

FIG. 16 is a flowchart showing a procedure for measuring and displaying data on the state of the needle tip slip according to the present invention.

FIG. 17 is an explanatory diagram of a sliding display according to the present invention.

FIG. 18 is an explanatory view showing a schematic structure of a conventional probe card inspection device.

[Explanation of symbols]

30 inspection device base, 31 elevating unit, 32 composite inspection board, 33 electrode flat plate, 34 transparent glass flat plate, 3
5 probe card holder, 36 probe card, 3
7 Measurement needle, 200 inspection position, 303 constant current source, 310 constant voltage source.

Claims (2)

[Claims] A step of storing card data of a probe card to be inspected; pressing an insulating flat plate against a measuring needle of the probe card by a predetermined overdrive amount; flowing a constant current between the predetermined measuring needles; A short-circuit inspection step of inspecting a short-circuit of the measurement needle by measuring a voltage between the probe cards. 2. A step of storing card data of a probe card to be inspected, pressing an insulating flat plate against a measuring needle of the probe card by a predetermined overdrive amount, and applying a constant voltage between predetermined measuring needles for measurement. A leakage inspection step of inspecting leakage of the measurement needle by measuring a current between the needles.