JPH11121661A - Heat sink and heat sing assembling method - Google Patents

Heat sink and heat sing assembling method

Info

Publication number
JPH11121661A
JPH11121661A JP31759697A JP31759697A JPH11121661A JP H11121661 A JPH11121661 A JP H11121661A JP 31759697 A JP31759697 A JP 31759697A JP 31759697 A JP31759697 A JP 31759697A JP H11121661 A JPH11121661 A JP H11121661A
Authority
JP
Japan
Prior art keywords
heat sink
heat
base
heating element
base surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31759697A
Other languages
Japanese (ja)
Inventor
Atsushi Terada
厚 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOUSUI KIKAKU KK
Original Assignee
TOUSUI KIKAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOUSUI KIKAKU KK filed Critical TOUSUI KIKAKU KK
Priority to JP31759697A priority Critical patent/JPH11121661A/en
Publication of JPH11121661A publication Critical patent/JPH11121661A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink of high performance, low cost and light weight, without being limitated by a conventional heat sink manufacturing technology. SOLUTION: Each heat sink part chip which comprises a base part 2 for equipping a heat-generating element thereon and of a fin part 1 for making heat radiation from the base surface and of which convex part 3 formed at the base part 2 is inserted one after another into a concave part 4 formed at another corresponding base part of the heat sink part chip. After that, by successively clamping at the inserted portions through pressure, this device is constituted of wide base areas for equipping a heat-generating elements thereon and of a number of the radiating fins proportional to one of the base areas.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、CPU,トランジスタ
ー類の発熱素子電子部品を冷却するヒートシンに関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for cooling electronic components of a heating element such as a CPU and transistors.

【0002】[0002]

【従来の技術】従来、CPU冷却用ヒートシンク制作
は、押し出し、鍛造、ダイカストなどから作られ、製造
技術の制約上フィンの幅及び高さに制限があり薄くかつ
高いフィンを制作するのは困難で合った。
2. Description of the Related Art Conventionally, a heat sink for cooling a CPU has been manufactured by extrusion, forging, die casting, and the like, and the width and height of the fins are limited due to limitations in manufacturing technology, and it is difficult to manufacture thin and high fins. matched.

【0003】[0003]

【発明が解決しようとする課題】冷却効果の高い薄くか
つ長いフィンを兼ね備えたCPU冷却用ヒートシンク制
作は製造技術上困難であり、そのため、フィンとベース
を別々に制作し接合する方法もあるがこの場合、接合箇
所において熱抵抗が増大し、ヒートシンクの性能が劣化
してしまった。
It is difficult to manufacture a heat sink for cooling a CPU having both thin and long fins having a high cooling effect in terms of manufacturing technology. Therefore, there is a method of separately manufacturing and joining a fin and a base. In this case, the thermal resistance increased at the joint, and the performance of the heat sink deteriorated.

【0004】本発明は、従来の技術の有するこのような
問題点を鑑みてなされたものであり、その目的とすると
ころは、従来の製造技術の制約を受けることなく、高性
能でかつ低価格、軽量なヒートシンクを提供することに
ある。
[0004] The present invention has been made in view of such problems of the conventional technology, and has as its object to provide a high-performance and low-cost device without being restricted by the conventional manufacturing technology. To provide a lightweight heat sink.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

【0006】本発明は、発熱素子を取り付けるベース部
分(2)と前記ベース面からの熱を放熱させるフィン部
分(1)を構成したヒートシンク部分片同志をこのベー
ス部分(2)に構成されている凸状部(3)とこれに対
応するもう一方のヒートシンク部分片のベース部分に構
成された凹状部(4)に次々に挿入後、その挿入箇所を
圧力にて次々にかしめ合わせることにより発熱素子を取
付ける広いベース面とそれに比例した数の放熱フィンを
構成させるヒートシンクの組み立て方法である。
According to the present invention, the base portion (2) includes a base portion (2) to which a heating element is attached and a heat sink portion which constitutes a fin portion (1) for radiating heat from the base surface. After the protrusions (3) and the corresponding recesses (4) formed in the base portion of the other heat sink part corresponding to the protrusions (3) are successively inserted, the inserted portions are successively caulked with pressure to generate the heating element. This is a method of assembling a heat sink for forming a wide base surface on which the radiating fins are mounted and a number of heat dissipating fins proportional to the wide base surface.

【0007】本発明は、発熱素子を取り付けるベース部
分(2)と前記ベース面からの熱を放熱させるフィン部
分(1)を構成したヒートシンク部分片同志をこのベー
ス部分(2)に構成されている凸状部(3)とこれに対
応するもう一方のヒートシンク部分片のベース部分に構
成された凹状部(4)に次々に挿入後、その挿入箇所を
圧力にて次々にかしめ合わせることにより発熱素子を取
付ける広いベース面とそれに比例した数の放熱フィンを
構成させるヒートシンクである。
According to the present invention, the base portion (2) comprises a base portion (2) on which a heating element is mounted and a fin portion (1) for radiating heat from the base surface. After the protrusions (3) and the corresponding recesses (4) formed in the base portion of the other heat sink part corresponding to the protrusions (3) are successively inserted, the inserted portions are successively caulked with pressure to generate the heating element. This is a heat sink that constitutes a wide base surface on which the radiating fins are mounted and a number of radiating fins in proportion to the wide base surface.

【0008】[0008]

【作用】本ヒートシンクはベース面に取り付けられたC
PU,トランジスター類の発熱素子からの熱をフィンに
移動させファンからの風などをフィンにあてることによ
りこれらの熱をフィンから空気中に移動させ、これら発
熱素子の熱による破壊を防ぐ。
[Function] This heat sink has C attached to the base surface.
The heat from the heat generating elements such as PUs and transistors is transferred to the fins, and the wind from the fan is applied to the fins to transfer the heat from the fins to the air, thereby preventing the heat generating elements from being destroyed by the heat.

【0009】[0009]

【実施例】実施例について図面を参照して説明する。図
1は、本発明におけるヒートシンクを形成する部分片挿
入図である。(1)は発熱素子からの熱を放熱させるフ
ィン部分であり(2)は発熱素子が取り付けられるベー
ス面である(3)部はもう一方のヒートシンク部分
(1)を挿入する際の結合用凸状部であり(4)はこれ
に対応する凹状部である。
An embodiment will be described with reference to the drawings. FIG. 1 is a partially inserted view showing a heat sink according to the present invention. (1) is a fin portion for dissipating heat from the heating element, (2) is a base surface to which the heating element is attached, and (3) is a projection for coupling when the other heat sink portion (1) is inserted. (4) is a corresponding concave portion.

【0010】図2は、図1におけるヒートシンク部分片
のベース部分に形成されたそれぞれの凹凸状部を次々に
挿入し、その挿入部分を圧力にてかしめた時のかしめ前
と後の図である。
FIG. 2 is a view before and after caulking when the respective concave and convex portions formed on the base portion of the heat sink portion piece in FIG. 1 are successively inserted and the inserted portion is caulked by pressure. .

【0011】図3は、完成したヒートシンクの斜視図と
同ヒートシンクに発熱素子を取り付けた図である。
FIG. 3 is a perspective view of the completed heat sink and a view in which a heating element is attached to the heat sink.

【0012】[0012]

【発明の効果】従来の製造技術に制限を受けることなく
高性能、低価格なヒートシンクを提供できた。
As described above, a high-performance, low-cost heat sink can be provided without being restricted by the conventional manufacturing techniques.

【図面の簡単な説明】[Brief description of the drawings]

【図1】ヒートシンク部分片同志の挿入図であるFIG. 1 is an insertion view of a heat sink part piece.

【図2】ヒートシンク部分片のかしめ前(a)及び後図
(b)である。
FIGS. 2A and 2B are before (a) and after (b) a caulking of a heat sink part;

【図3】本ヒートシンク斜視図(c)と本ヒートシンク
と発熱素子取り付け図(d)である。
FIG. 3 is a perspective view of the present heat sink (c), and a view of mounting the present heat sink and a heating element (d).

【符号の説明】[Explanation of symbols]

(図1) 1、フィン部分 2、ベース部分 3、凸条部 4、凹状部 (図2) 1、フィン部分 2、ベース部分 3、凸条部 4、凹状部 (図3) 1、フィン部分 2、ベース部分 (FIG. 1) 1, fin portion 2, base portion 3, convex ridge portion 4, concave portion (FIG. 2) 1, fin portion 2, base portion 3, convex ridge portion 4, concave portion (FIG. 3) 1, fin portion 2. Base part

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 発熱素子を取り付けるベース部分(2)
と前記ベース面からの熱を放熱させるフィン部分(1)
を構成したヒートシンク部分片同志をこのベース部分
(2)に構成されている凸状部(3)とこれに対応する
もう一方のヒートシンク部分片のベース部分に構成され
た凹状部(4)に次々に挿入後、その挿入箇所を圧力に
て次々にかしめ合わせることにより発熱素子を取付ける
広いベース面とそれに比例した数の放熱フィンを構成さ
せるヒートシンクの組み立て方法。
1. A base part (2) for mounting a heating element.
And a fin portion for dissipating heat from the base surface (1)
Of the heat sink portions constituting the base portion (2) and the corresponding concave portion (4) formed on the base portion of the other heat sink portion corresponding to the convex portion (3). A method of assembling a heat sink, which forms a wide base surface on which a heating element is to be mounted and a proportional number of heat dissipating fins by successively caulking the insertion locations with pressure after insertion.
【請求項2】 発熱素子を取り付けるベース部分(2)
と前記ベース面からの熱を放熱させるフィン部分(1)
を構成したヒートシンク部分片同志をこのベース部分
(2)に構成されている凸状部(3)とこれに対応する
もう一方のヒートシンク部分片のベース部分に構成され
た凹状部(4)に次々に挿入後、その挿入箇所を圧力に
て次々にかしめ合わせることにより発熱素子を取付ける
広いベース面とそれに比例した数の放熱フィンを構成さ
せるヒートシンク。
2. A base part for mounting a heating element.
And a fin portion for dissipating heat from the base surface (1)
The heat sink part pieces that constitute the above are successively formed on the convex part (3) formed on the base part (2) and the corresponding concave part (4) formed on the base part of the other heat sink part piece. A heat sink that forms a wide base surface on which a heating element is mounted and a proportional number of heat dissipating fins by successively caulking the insertion points with pressure after insertion.
JP31759697A 1997-10-14 1997-10-14 Heat sink and heat sing assembling method Pending JPH11121661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31759697A JPH11121661A (en) 1997-10-14 1997-10-14 Heat sink and heat sing assembling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31759697A JPH11121661A (en) 1997-10-14 1997-10-14 Heat sink and heat sing assembling method

Publications (1)

Publication Number Publication Date
JPH11121661A true JPH11121661A (en) 1999-04-30

Family

ID=18089989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31759697A Pending JPH11121661A (en) 1997-10-14 1997-10-14 Heat sink and heat sing assembling method

Country Status (1)

Country Link
JP (1) JPH11121661A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010105508A (en) * 2000-05-12 2001-11-29 윤형균 Heat Sink and Manufacturing Method
KR101883679B1 (en) * 2018-02-09 2018-07-31 주식회사 제이케이테크원 Aluminum stack pin integrated graphite heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010105508A (en) * 2000-05-12 2001-11-29 윤형균 Heat Sink and Manufacturing Method
KR101883679B1 (en) * 2018-02-09 2018-07-31 주식회사 제이케이테크원 Aluminum stack pin integrated graphite heat sink

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