JPH11111903A - Bridge-type semiconductor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To widen distance between terminals and thereby radiate heat from a semiconductor chip efficiently by bending a first and a second terminal for AC input nearly at right angles. SOLUTION: In a semiconductor device 1, for example, semiconductor chips 14 are located on lead frames, having a die pad section 11 and a terminal section 17 and those lead frames are connected by soldering or other method using connectors 16 to form a bridge circuit. After forming a resin section 15 by transfer molding or other methods, unwanted parts of the lead frames are cut off to form a bridge-type semiconductor device. Then, L-shaped sections A, B formed beforehand in parts of the terminal sections located on both sides are bent from inside nearly at right angles to make them terminal sections 17a, 17b. Bent sections 11a, 11b are parts of the die pads bent nearly at right angles. Through this method, distance can be secured between terminals, and thereby heat radiating property of the device can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a structure of a bridge type semiconductor device used for electronic equipment and the like, and a method of manufacturing the same.

[0002]

[Prior art]

(2) Conventionally, the bridge semiconductor device has already been registered as 18955
As described in No. 18 Bridge type semiconductor device,
After assembling a semiconductor chip on a lead frame, it is manufactured by resin molding by transfer molding method, etc.In recent years, interest in miniaturization and high reliability of electronic equipment has increased, and semiconductor devices that meet safety standards are required. Have been. In particular, the bridge type semiconductor device used on the primary side (AC input) in terms of the circuit configuration requires a creeping surface and a space distance with respect to the insulation distance of a certain distance or more.

FIG. 4 shows a conventional example in which terminals are secondarily processed in order to secure an insulation distance of a bridge type semiconductor device (a).
Is a front view, (b) is a side view, and in the figure, 15 is a mold resin portion, and 12, 12a and 12b are terminal portions and intermediate terminals 12
a and 12b are bent upward. With this structure, the insulation distance can be ensured, but the workability is poor and the terminal shape becomes unstable. Also, when the terminal is mounted on a printed circuit board or the like, the terminal ends or the terminals 12 and 12a or 12b are not aligned. To the terminals 12a and 12b
Must be formed a little longer in advance.

Further, if a lead frame having a large terminal interval is formed in advance, there is a disadvantage that the bridge type semiconductor device becomes large in use. Also, in order to efficiently radiate the heat generated from the semiconductor chip, the area of the die pad portion is increased or a material with good heat conductivity is used, but the disadvantages are that the bridge type semiconductor device becomes large and expensive. was there.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to increase the distance between terminals by devising the structure of a semiconductor device. It is an object of the present invention to provide a semiconductor device capable of efficiently dissipating heat from a semiconductor chip and having high productivity.

[0006]

According to a first aspect of the present invention, there is provided a bridge-type semiconductor device according to the first aspect of the present invention, wherein first and second terminals for AC input of a lead frame are connected to first and second terminals. After forming a bridge circuit with a structure having the second bent portion (3), resin sealing is performed by a transfer molding method or the like, and unnecessary portions are cut and bent in a substantially right angle direction near the bent portion. It is characterized by processing. By bending the first and second terminals for AC input in a substantially perpendicular direction in this manner, it is possible to secure a distance between the terminals of the bridge-type semiconductor device. In the invention of claim 2, a part of the terminal is formed in an L-shape in advance so that the terminal at both ends can be easily bent in a right angle direction by machining. or,
The die pad portion of the bridge type semiconductor device according to the third aspect is configured so that a part of the die pad portion is bent in a direction substantially perpendicular to a surface on which the semiconductor chip is mounted, in order to effectively radiate heat generated from the semiconductor element. It is characterized in that it is bent so as to increase the area of the die pad portion. By thus increasing the area of the die pad portion, a semiconductor device having good heat dissipation can be easily realized.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the accompanying drawings. In the description of the drawings, the same members will be denoted by the same reference symbols, without redundant description. FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a front view (a), (b) is a side view and FIG. FIG. . This semiconductor device 1 has a die pad 1 shown in FIG.
The semiconductor chip 14 is arranged on a lead frame having the terminal 1 and the terminal portion 17 and connected by soldering or the like so as to form a bridge circuit using the connector 16. Then, after forming the resin portion 15 by a transfer molding method or the like, an unnecessary portion of the lead frame is removed by cutting to obtain a bridge type semiconductor device. Then, the terminal portions 17 arranged at both ends
The L-shaped parts A and B formed in advance on a part of the a and 17b are bent at substantially right angles (in the direction of the arrow) from the inside. The resin portion of this bridge type semiconductor device is about 20 mm in width and about 20 mm in height.
mm, thickness about 4mm, terminal part about 5m thick
m, the spacing is approximately 5.5 mm. In FIG. 2, reference numerals 11a and 11b denote bent portions obtained by bending a part of the die pad portion in a substantially right angle direction. (4)

FIG. 3 is a front view showing an embodiment of the present invention for simultaneously forming a plurality of devices. A bridge circuit unit is simultaneously resin-molded in advance on a lead frame 13 to form units 1a to 1d and 2a to 2d. Then, unnecessary portions are cut and separated individually, and individually transferred by a transfer means (not shown), and the L-shaped portions of the units are bent at substantially right angles.

[0009]

Since the terminal interval can be widened, it is possible to provide a small and highly productive bridge type semiconductor device satisfying various safety standards. Heat generated from the semiconductor chip can be efficiently dissipated.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an explanatory view of an embodiment of the present invention.

FIG. 3 is a front view showing the embodiment of the present invention.

FIG. 4 shows a conventional example.

[Explanation of symbols]

 1, semiconductor device 1a-1d, 2a-2d, unit unit 11, die pad parts 11a, 11b, bent parts 12, 12a, 12b, terminal part 13, lead frame 14, semiconductor chip 15, resin part 16, connector 17 , 17a, 17b, terminal

Claims (4)

[Claims] A first terminal and a second terminal for AC input (or DC output) are disposed at both ends by using a lead frame having a die pad portion on which a semiconductor chip is disposed and a terminal portion used at the time of mounting. In the bridge type semiconductor device, a third terminal and a fourth terminal for DC output (or AC input) are arranged, and a die pad portion is provided on an extension of each terminal, and a semiconductor chip is connected to a bridge circuit at the die pad portion. In
A bridge-type semiconductor device, wherein a part of the first and second terminals is bent in a substantially right-angle direction. 2. One end of each of the first and second terminals or the third and fourth terminals disposed at both ends is formed in an L-shape, and the L-shaped portion is bent in a substantially right angle direction. Claim 1.
The bridge type semiconductor device as described in the above. 3. A die pad provided on an extension of the first and second terminals for AC input (or DC output) on which a semiconductor chip is disposed has a bent portion in a substantially right angle direction. 3. The bridge-type semiconductor device according to claim 1, wherein: 4. A step of forming a plurality of bridge circuit units on a lead frame to manufacture a plurality of bridge type semiconductor devices, a step of simultaneously resin-molding each of the bridge circuit units, and separately forming the mold units. A method of manufacturing a bridge-type semiconductor device, comprising: a step of cutting an unnecessary frame of a lead frame for separation, and a step of bending terminals at both ends of an individual unit at right angles.