JPH1111059A - Ic module and ic card with the module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To satisfactorily protect an IC chip contained in an IC card by forming a resin package to enclose the chip by mounting the chip on a board, and providing a fragile part on the board and/or the package. SOLUTION: The module 1 comprises a circular board 2, an IC chip 3 mounted on the board 2, an antenna coil 20 formed on a surface of the board 2, and a resin package 4 for enclosing the board 2 and the chip 3. The chip 3 mounts an electrode 30 to make a continuity with a land 21 formed on the board 2. The chip is mounted in a structure in which an anisotropically conductive film 6 is formed to disperse conductive particles 50 in a resin film 61. The board 2 and the chip 3 are enclosed in the resin package 4. A through hole 40 is formed at the package 4 as a fragile part. Thus, a stress concentration at the chip 3 is avoided to maintain characteristics satisfactory.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card having a built-in IC chip such as a so-called ID card and provided with an information storage function, and an IC module incorporated in the IC card and provided with the IC chip.

[0002]

2. Description of the Related Art As is well known, some cards have an information storage function. Among them, there is a so-called IC card having an IC memory in addition to a magnetic stripe for storing information. .

[0003] Such an IC card has an advantage suitable for being constituted as a so-called non-contact type information storage card. Further, as compared with a magnetic stripe type card, the information storage capacity can be easily increased. In addition, there is an advantage that the forgery prevention effect is high. For this reason, it is expected that an IC card having a more advanced information processing function and communication function will appear by incorporating a memory chip, a CPU, and the like having a further increased storage capacity into the card. Are expected to be used as information carrying tools related to telephone cards and electronic money.

[0004]

By the way, not only the above-mentioned IC card but also a card formed by incorporating an IC chip for giving a special function is required to be further thinned in the future. In this case, the thin card must be bent to some extent due to the force received by the user during handling or the force received from the transport system of the machine reading device. The problem in this case is
This is the effect on the built-in IC chip when the IC card is bent. As described above, since the IC chip is incorporated in the plastic card, when the IC card is bent, stress tends to concentrate on the built-in position of the IC chip. In such a case, it is possible that the IC chip is peeled off from the predetermined wiring pattern or the IC chip itself is damaged. That is, for example, the power supply path to the above-mentioned IC chip is disconnected, and the power supply is cut off.
IC stored in the chip is lost
A situation in which the inherent characteristics of the chip may be lost may occur. Therefore, as the thickness of the IC card is reduced, the IC built in the IC card is
The need to effectively protect the chip is further increased.

Therefore, in order to protect the IC chip, it is conceivable to package the IC chip with a resin material or the like. However, simply by packaging the IC chip with a resin, bending stress acts on the resin package. In this case, the bending stress acts on the IC chip as it is. Therefore, although the above means can protect the IC chip to some extent,
When the card is bent relatively large, it is difficult to sufficiently protect the IC chip.

The present invention was conceived in view of the above circumstances, and aims to satisfactorily protect an IC chip built in an IC card and solve various problems that occur during a manufacturing process. Make it an issue.

[0007]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

That is, an IC module provided by the first aspect of the present invention is an IC module in which an IC chip is mounted on a substrate and a resin package is formed so as to surround the IC chip. A fragile portion is provided on the substrate and / or the resin package.

In a preferred embodiment, the fragile portion is a recess formed on the surface of the resin package, for example, as a slit or a pinhole, and is a through hole vertically penetrating the resin package. There may be.

[0010] In a preferred embodiment, the fragile portion is a slit formed in the substrate.

Usually, the module is used as an IC card by being fitted into a thin flat plate made of plastic or the like.
Alternatively, such an IC card bends to some extent due to the force received from the transport system of the machine reading device, and the module may naturally bend. However, when the module bends, since the IC chip is wrapped in the resin package, stress concentrates on the IC chip, the IC chip peels off from the resin package, and the IC chip itself Is likely to be damaged as described above.

In the IC module according to this aspect, a fragile portion such as a slit or a through hole is formed in the resin package, and a fragile portion such as a slit is formed in the substrate. When the module is bent, stress is concentrated on the fragile portion and external force such as bending stress is absorbed.
That is, even if the module is bent, the IC
The configuration is such that stress is not concentrated on the chip, and the IC chip can be effectively protected by the resin package while avoiding a problem caused by resin packaging of the IC chip.

The antenna coil may be one formed by patterning the substrate with copper or the like, or may be a wound coil formed by a metal wire.

The I provided by the second aspect of the present invention
In the C module, an IC chip is mounted in the center, a substrate having an antenna coil conductively connected to the IC chip formed on the surface thereof, and a hole having a diameter larger than the diameter of the IC chip is formed in the center. And a film material on the surface of which a pattern symmetric or substantially symmetric with the pattern of the antenna coil is provided, and the substrate and the film material are arranged such that the patterns formed on the respective surfaces overlap with each other. And are bonded so as to conduct.

Usually, the pattern formed on the substrate is formed by sputtering, vapor deposition or CVD on the substrate surface.
After forming a film such as copper by such means as above, it is formed by performing an etching process. There is a limit to the thickness of the pattern formed in this way, no matter which film forming means is employed. In particular, the finer and denser the pattern, the larger the thickness. become unable. However, when the thickness of the pattern cannot be set large, the antenna coil cannot sufficiently serve as an antenna or a coil.

In the IC module according to the present aspect, the substrate and a film material having a pattern symmetrical or substantially symmetrical to the antenna coil pattern formed on the surface thereof are formed such that the patterns formed on the respective surfaces overlap each other. And are electrically connected. That is,
By overlapping and bonding the patterns formed on the substrate and the film material in a conductive state, the thickness of the antenna coil is almost doubled, and as a result, the antenna and the coil Can fulfill the role of.

In a preferred embodiment, the substrate and the film material are bonded via an anisotropic conductive film in which conductive particles are dispersed in an adhesive resin film.

According to the above configuration, the pattern formed on the substrate and the pattern formed on the film material can be reliably made conductive and adhered. Moreover,
Since the conductive particles are interposed between the pattern formed on the film material and the pattern formed on the substrate, and the respective patterns are made conductive with each other, the thickness of the antenna coil is reduced by the thickness of the conductive particles. It will be bigger by the minute. Therefore, the characteristics of the antenna coil as the antenna and the coil can be improved by bonding the substrate and the film material using the anisotropic conductive film.

In a preferred embodiment, at least the IC chip on the substrate is sealed with a sealing member.

As the sealing member, a cap-shaped member having a concave portion capable of covering the IC chip, a resin package formed so as to surround the IC chip by resin molding using a mold, and the like are considered. Can be According to the above configuration, at least the IC chip can be protected. In particular, when the substrate and the film material are also wrapped in a resin package, the substrate and the film material can be protected in addition to the IC chip. it can.
When the IC chip, substrate, and film material are resin-packaged, these members can be conveniently handled as one element. A weak portion may be provided on the surface of the resin package as in the case of the above-described first side surface. In this case, needless to say, the effects of the above-described first side surface can be enjoyed.

In a preferred embodiment, a plurality of slits extending radially from the mounting position of the IC chip are formed in the substrate on any of the first and second side surfaces.

By the way, in order to protect an IC chip mounted on a substrate, resin packaging is sometimes performed on the IC chip together with the substrate so that the back surface of the substrate is exposed. The molding is performed by die molding as described above. That is, a resin material in a high-temperature molten state is supplied into a mold, and resin packaging is performed by solidifying the molten resin.
The resin material contracts as the temperature decreases. As the substrate, for example, an insulating film made of polyimide or the like is used. The heat shrinkage of the resin package is larger than that of the substrate. For this reason, the thermal shrinkage of the substrate is smaller than the thermal shrinkage of the resin package, and the resin package warps in a mortar shape as the temperature drops, and stress concentrates on the IC chip on which the substrate is mounted. Would.

In the IC module, since the substrate is provided with a slit extending radially and reaching the peripheral edge, when the resin package shrinks due to a temperature drop, the slit width is reduced to reduce the width. Can be. That is, by reducing the slit width in accordance with the amount of shrinkage of the resin package, the same effect can be obtained as when the substrate is shrunk as a whole. For this reason, it is possible to follow the shrinkage of the resin package without stress being concentrated on the substrate, especially the IC chip. Therefore, by forming a slit in the substrate, it is possible to avoid stress concentration on the IC chip due to shrinkage of the resin package and to maintain good characteristics of the IC chip.

The I provided by the third aspect of the present invention
The C module is an IC module including an IC chip mounted on a substrate, an antenna coil that conducts with the IC chip, and a resin package that wraps the IC chip. The IC chip is located at the center of the substrate. The substrate is mounted, and the substrate is formed in a gear shape or a star shape having a plurality of hairpin portions extending radially from a mounting position of the IC chip.

As described above, when resin packaging of an IC chip is performed together with a substrate so that the back surface of the substrate is exposed, the resin package may be damaged due to a difference in thermal shrinkage between the substrate and the resin package. May warp like a mortar. That is, according to the configuration, as in the case where the substrate is formed in a slit shape in the substrate by forming the substrate in the form of a gear or a starfish, the distance between the adjacent hairpin portions is reduced, thereby coping with the shrinkage of the resin package. Resin warpage can be reduced.

In a preferred embodiment, the antenna coil is formed in a pattern on the substrate and is formed in a starfish shape as a whole according to the shape of the substrate.

If the pattern is formed in a starfish shape like the substrate, the pattern formed on the hairpin portion is formed so as to extend in the radial direction of the substrate. It is expected that the substrate is prevented from being bent unnecessarily due to the formed pattern being stretched.

In a preferred embodiment, the resin package is formed in a starfish shape in plan view substantially similar to the substrate.

If the shape of the resin package in a plan view is a starfish shape, the resin shrinkage in the radial direction can be reduced, and the resin shrinkage can be performed mainly in the circumferential direction. That is,
If the shape of the resin package in a plan view is starfish-shaped, the resin shrinks in a direction in which the distance between the hairpin portions of the resin package is shortened, whereby resin warpage due to a temperature drop during molding can be avoided.

When the IC module is used as an IC card by being fitted into a thin flat plate made of plastic or the like, even if the IC card is flexed,
This can be dealt with by bending the hairpin portion corresponding to the bending direction. That is, even if the IC card is bent, stress is prevented from being concentrated on the portion where the IC chip is mounted, so that the path for supplying power to the IC chip is disconnected or the IC chip itself is disconnected. It is possible to avoid troubles such as receiving damage.

The I provided by the fourth aspect of the present invention
The C card is an IC described in any of the above aspects.
And a card body having a flat plate shape and having a through hole or a recessed portion into which the IC module is fitted.

According to a preferred embodiment, a cover sheet is attached to at least one surface of the card body.

According to the above configuration, the above-described first to third embodiments
Needless to say, the effects of the IC module described in any of the aspects can be enjoyed. The IC card, especially the module, can be protected by attaching a cover sheet having excellent elasticity to the surface of the card body.

[0034] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is an overall perspective view showing a first embodiment of an IC module according to the present invention, and FIG. 2 is a cross-sectional view showing a state where an IC chip constituting the module is mounted on a substrate. FIG. 3 is a plan view of the substrate.

As shown in FIG. 1, the module 1 includes:
A circular substrate 2, an IC chip 3 mounted on the substrate 2, and an antenna coil 2 formed on the surface of the substrate 2;
0, and a resin package 4 enclosing the substrate 2 and the IC chip 3, and has a columnar shape as a whole.

The IC chip 3 is, for example, an EEPRO
A memory chip such as M and other capacitors are integrally formed, and are mainly used as a memory having an information storage function. Antenna connection electrodes 30, 30 are formed on the main surface 3a of the IC chip 3, and the electrodes 30, 30 project from the main surface 3a by applying gold plating to electrode pads (not shown). It is formed as described above.

The substrate 2 is formed in a circular shape from a resin having flexibility and insulating properties such as a polyimide film, for example. The shape of the substrate 2 is not limited to a circle, but may be an ellipse, an ellipse, a rectangle, or the like, and the shape may be appropriately selected. As shown in FIG. 3, a predetermined pattern is formed on the surface of the substrate 2 to form an antenna coil 20, and the pattern is formed by a conductor wire bundle 2 forming the antenna coil 20.
The predetermined portion 2 is bent and extended concavely inward in the radial direction of the substrate 2 and has a spiral shape as a whole. The start and end of the conductor wire 20a are:
At the mounting position of the IC chip 3 at the center, the conductor wire bundle 22
And are electrically connected to lands 21 and 21 protrudingly formed at the center of the substrate 2. The pattern 20 is formed, for example, by forming a film of copper or the like on the surface of the substrate 2 by sputtering, vapor deposition, CVD, or the like and then performing an etching process. The lands 21 and 21 are also formed in the same step. can do. Although not shown, the substrate 2 is covered with, for example, a polyimide resin so that the lands 21 and 21 are exposed and the pattern is protected. Further, the antenna coil 20 may be a wound coil formed of a metal wire.

As shown in FIG. 2, the IC chip 3
The electrodes 30 are connected to the lands 2 formed on the substrate 2.
It is mounted so as to be electrically connected to the first and the second. For mounting the IC chip 3, for example, an anisotropic conductive film 6 is used.
It has a structure in which conductive particles 60 are dispersed. When mounting the IC chip 3 using the anisotropic conductive film 6, the anisotropic conductive film 6 is interposed between the IC chip 3 and the substrate 2, IC
This is performed by applying a predetermined pressure between the chip 3 and the substrate 2.

In the above configuration, the antenna coil 20 functions as a device for transmitting and receiving a radio wave between the outside and the IC chip 3, and a data signal is transmitted and received on a carrier wave of the radio wave. On the other hand, the antenna coil 20 functions as a coil that generates an induced electromotive force by an electromagnetic induction effect because the conductor wire 20a is formed into a spiral shape in which the conductor wire 20a rotates in one direction, and supplies the electromotive force to the IC chip 3. It has been made like that. Then, the electromotive force supplied to the IC chip 3 is stored in the capacitor.

As clearly shown in FIG. 1, the substrate 2 and the IC chip 3 are used to protect the IC chip 3.
For example, the resin package 4 is formed by packaging with an epoxy resin or the like. The resin package 4 is formed with a through-hole 40 that penetrates vertically and has a cross-sectional shape of an arc shape, and is a fragile portion. The resin package 4 can be easily realized by mold molding such as injection molding or transfer molding.

In the IC module 1 according to the present embodiment, the resin package 4 is formed with a fragile portion having a through hole 40, and when the module 1 is bent,
The stress is concentrated on the fragile portion and an external force such as a bending stress is absorbed. That is, even if the module 1 is bent, the through holes 40 corresponding to the bending direction are provided.
The stress is not concentrated on the IC card 7 by increasing or decreasing the diameter of the through hole at a predetermined portion of the IC chip 3. The IC chip 3 is protected by the resin package 4 and the IC chip 3 is protected.
Can be avoided also due to resin packaging.

Of course, the design of the fragile portion can be variously changed. For example, as shown in FIG. 4, a plurality of cylindrical through-holes 41 penetrating the resin package 4 up and down so as to surround the IC chip 3 are formed in the above-described embodiment also as fragile portions. Through hole 4
Needless to say, 0 gives the same effect. Further, a recessed portion such as a slit or a pinhole may be provided on the surface of the resin package 4 to be a fragile portion.

In addition, the fragile portion may be formed on the substrate 2. For example, as shown in FIG.
A plurality of holes 24 are formed around the portion where the IC chip 3 is mounted.
By forming a hole, a weak portion may be formed.
And the above-described through holes 40 and 41 may be combined to form a fragile portion. The holes 24 formed in the substrate 2 may be formed by performing an etching process after forming a pattern. Alternatively, the holes 24 may be formed in the substrate 2 in advance by performing a pressing process or the like. A pattern may be formed on this, and the method of forming the holes 24 may be appropriately designed and changed.

FIG. 6 is a plan view showing a substrate constituting a module according to a second embodiment of the present invention. In addition,
The basic configuration of the module 1 in this embodiment is substantially the same as that of the first embodiment described above, and the configuration of the substrate 2a is slightly different from the configuration of the substrate 2 described above.

As shown in FIG. 6, the substrate 2a is made of, for example, a polyimide film or the like which is flexible, and is formed in a circular shape by using an insulating resin or the like. The antenna coil 20 has a predetermined pattern. The substrate 2a
Are formed with a plurality of slits 25 extending radially from the mounting position of the IC chip 3 at the center and reaching the peripheral edge. The slit 25 is formed, for example, on the substrate 2a
After the pattern is formed thereon, it is formed by performing etching using a predetermined chemical or the like.

Of course, the substrate 2a thus configured
The IC chip 3 is packaged with a resin using an epoxy resin or the like. Although this resin packaging is performed at a high temperature, as described above, a problem in this case is a temperature drop of the resin caused by a difference in thermal shrinkage between the resin package 4 and the substrate 2a. The resulting resin warpage.

In this embodiment, the substrate 2a has slits 25 extending radially and reaching the peripheral edge.
Is formed, it is possible to cope with a case where the resin package 4 shrinks due to a temperature drop by reducing the width of the slit 25. That is, by reducing the width of the slit 25 in accordance with the amount of contraction of the resin package 4, the same effect as that of the substrate 2a contracting as a whole can be obtained. For this reason, it is possible to follow the shrinkage of the resin package 4 without stress being concentrated on the substrate 2a, especially the IC chip 3. Therefore, by forming the slits 25 in the substrate 2a, stress concentration on the IC chip 3 due to shrinkage of the resin package 4 can be avoided, and the characteristics of the IC chip 3 can be maintained well.

The substrate 2a may have a shape as shown in FIG. The substrate 2a is formed in a gear shape having a plurality of hairpin portions 26 extending radially from the mounting position of the IC chip 3. Also in this case, similarly to the above-described embodiment, it is possible to avoid resin warpage generated during resin molding. That is, in the substrate 2a, when the resin package 4 shrinks due to a temperature drop, the distance between the hairpin portions 26 adjacent to each other can be reduced.

As shown in FIG. 7, the pattern formed on the substrate 2a may be entirely gear-shaped in accordance with the shape of the substrate 2a. In this case, the pattern formed on the hairpin portion 26 corresponds to the substrate 2
Since it is formed so as to extend in the radial direction of a,
It is expected that when the resin package 4 contracts, the pattern formed on the hairpin portion 26 will be stretched and the substrate 2a will not be bent unnecessarily.

Further, the shape of the resin package 4 enclosing the substrate 2a and the IC chip 3 in plan view may be a gear shape. In this case, the resin shrinkage in the radial direction can be reduced and the resin shrinkage mainly in the circumferential direction can be achieved.
That is, if the shape of the resin package 4 in a plan view is a gear shape, the resin shrinks in a direction in which the distance between the hairpin portions of the resin package 4 decreases, thereby avoiding resin warpage due to a temperature drop during molding. it can. The above I
When the C module 1 is used as an IC card 7 by being fitted into a thin flat plate made of plastic or the like, even if the IC card 7 is bent, the hairpin portion 26 corresponding to the bending direction is bent. Can be dealt with. That is, even if the IC card 7 is bent, stress is prevented from being concentrated on the portion where the IC chip 3 is mounted, so that a path for supplying power to the IC chip 3 is disconnected, The disadvantage that the chip itself is damaged can be avoided.

FIG. 8 is a sectional view showing an example of a module according to the third embodiment of the present invention, and FIG. 9 is an overall perspective view showing a substrate 2 and a film material 2A constituting the module 1. FIG. 10 is an enlarged view of a region surrounded by a dashed line A in FIG.

As shown in FIG. 8, the module 1 includes:
It comprises a substrate 2 on which the IC chip 3 is mounted in the center, and a film material 2A in which a hole 29 having a diameter larger than the diameter of the IC chip 3 is formed in the center.

As shown in FIG. 9, the substrate 2 is made of a polyimide film or the like having flexibility and a resin having an insulating property in a circular shape, as in the first embodiment. A predetermined pattern is formed on the surface of the substrate 2 so that the antenna coil 2
It is set to 0.

The film material 2A is formed in a donut shape by a resin having an insulating property, for example, having flexibility on a polyimide film or the like, similarly to the substrate 2 described above. A pattern 20A substantially symmetrical to the pattern formed in No. 2 is formed.

As shown in FIG. 8, the substrate 2 and the film material 2A are bonded so that the IC chip 3 faces from the hole 29 of the film material 2A and the patterns formed on the respective surfaces overlap. Have been. That is, the pattern formed on the substrate 2 and the pattern formed on the film material 2A can be conducted to each other.

For example, the substrate 2 and the film material 2A are bonded by using the anisotropic conductive film 6 described above. FIG.
As is clearly shown in FIG.
When the anisotropic conductive film 6 is used for adhesion to the substrate, the conductive particles 60 dispersed in the anisotropic conductive film 6 are formed on the pattern formed on the substrate 2 and the pattern formed on the film material 2A. It will intervene with the appearance of bridging. That is, since the conductive particles 60 themselves have conductivity, the respective patterns can be made conductive, and the antenna coil 2
0 is substantially increased by the diameter of the conductive particles 60 and the thickness of the pattern formed on the film material 2A.

As described above, the pattern formed on the surface of the substrate 2 is formed by forming a film of copper or the like on the surface of the substrate 2 by means such as sputtering, vapor deposition, or CVD, and then performing an etching process. .
There is a limit to the thickness of the pattern formed in this way, no matter which film forming means is employed. In particular, the finer and denser the pattern, the larger the thickness. become unable. Therefore, as in the present embodiment, the antenna coil 20 is formed by bonding the film material 2A on which the pattern formed on the substrate 2 is symmetric or substantially symmetric.
Increasing the thickness of the sheet is a useful means. That is, by increasing the substantial diameter of the antenna coil 20, the characteristics of the antenna coil 20 as an antenna and a coil can be greatly improved.

Of course, also in this embodiment, the above I
Resin packaging may be performed to protect the C chip 3, and in this case, a fragile portion may be appropriately provided on the resin package 4 and / or the substrate 2. Further, the present invention is not limited to the resin package 4, and the IC chip 3 may be protected by a cap-shaped member having a concave portion capable of covering the IC chip 3.

FIG. 11 is an overall perspective view of the IC card according to the present invention, FIG. 12 is an exploded plan view of the IC card 7, and FIG. 13 is a sectional view taken along line XIII-XIII in FIG. It is.

As shown in FIG. 11 and FIG.
The C card 7 has a rectangular shape in plan view, and is formed to have a thickness of, for example, about 0.76 mm, including an adhesive for attaching the cover sheets 70, 70 described later. Module 1 according to the embodiment of the present invention
And a card body 7A into which the module 1 is fitted.
And cover sheets 70, 70 attached to the upper and lower surfaces of the card body 7A.

The card body 7A has a cylindrical shape corresponding to the shape of the module 1 and a through hole 71 into which the module 1 is fitted, at a position deviated from the center in the longitudinal direction. For example, the thickness is about 0.45 mm made of polyethylene terephthalate resin (hereinafter abbreviated as PET) or polyvinyl chloride (hereinafter abbreviated as PVC).

The cover sheets 70 are made of, for example, PET or PVC and have a thickness of 0.15.
The card body 7A is attached to each of the upper and lower surfaces of the card body 7A using, for example, an adhesive. By attaching the cover sheets 70, 70, the influence of the external atmosphere on the module 1 can be reduced and the module 1 can be protected.

As shown in FIG.
Is fitted into the through hole 71 of the card body 7A and is sandwiched between the cover sheets 70, 70, and as a result, is buried in the card body 7A. When the module 1 is fitted into the through hole 71, for example, an epoxy resin-based adhesive or the like may be used, and the means may be appropriately selected.

It goes without saying that in the IC card 7 configured as above, the effects of the module 1 described above can be enjoyed. That is, such an IC card bends to some extent due to the force received during handling by the user or the force received from the transport system of the machine reading device, and the module may naturally bend. In the case where the fragile portion is provided, when the module 1 is bent by the scale, stress is concentrated on the fragile portion and external force can be absorbed. Therefore, it is possible to protect the IC chip 3 and prevent the stress from being concentrated on the IC chip 3 even when the module 1 is bent.

Note that the present invention is not limited to the above-described embodiment of the IC card 7. For example, as shown in FIG.
The card body 7A may have a recess 71a instead of the through hole 71. In this case, the cover sheet 70 has at least the recess 7.
What is necessary is just to stick on only the surface on the opening side of 1a.

[Brief description of the drawings]

FIG. 1 is an overall perspective view illustrating an example of a module according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a state where an IC chip constituting the module is mounted on a substrate.

FIG. 3 is a plan view of the substrate.

FIG. 4 is an overall perspective view illustrating a modified example of a fragile portion formed in the module.

FIG. 5 is a perspective view illustrating another modified example of the fragile portion.

FIG. 6 is a plan view illustrating a substrate constituting a module according to a second embodiment of the present invention.

FIG. 7 is a plan view illustrating a modified example of the substrate.

FIG. 8 is a sectional view illustrating an example of a module according to a third embodiment of the present invention.

FIG. 9 is an overall perspective view showing a substrate and a film material constituting the module.

FIG. 10 is an enlarged view of a region surrounded by a dashed line A in FIG. 8;

FIG. 11 is an overall perspective view of an IC card according to the present invention.

FIG. 12 is an exploded plan view of the IC card.

FIG. 13 is a sectional view taken along the line XIII-XIII of FIG. 11;

FIG. 14 is an exploded plan view showing a modification of the IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Module 2 Substrate 2A Film material 3 IC chip 4 Resin package 6 Anisotropic conductive film 7 IC card 7A Card main body 20 Antenna coil 25 Slit (formed on substrate) 26 Hairpin part (of substrate) 29 Hole (for film material) (Formed) 30 holes (formed on substrate) 40, 41 through holes (of resin package) 60 conductive particles (of anisotropic conductive film) 61 resin film (of anisotropic conductive film) 70 cover sheet 71 penetration Hole (of the card body) 71a Recessed part (of the card body)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoharu Horio 21 Ryozaki-cho, Saiin, Ukyo-ku, Kyoto City Inside ROHM Co., Ltd.

Claims (14)

[Claims] An IC chip is mounted on a substrate.
An IC module having a resin package formed so as to enclose a C chip, wherein the substrate and / or the resin package is provided with a fragile portion. 2. The IC module according to claim 1, wherein said fragile portion is a concave portion formed on a surface of said resin package. 3. The IC module according to claim 2, wherein the recess is a slit or a pinhole. 4. The IC module according to claim 1, wherein the fragile portion is a through hole vertically penetrating the resin package. 5. The I according to claim 1, wherein said fragile portion is a slit formed in said substrate.
C module. 6. A substrate on which an IC chip is mounted at the center and an antenna coil conducting to the IC chip is patterned on the surface, and a hole having a diameter larger than the diameter of the IC chip is formed at the center. And a film material on the surface of which a pattern symmetrical or substantially symmetrical to the pattern of the antenna coil is formed, wherein the substrate and the film material have patterns formed on their respective surfaces overlapping each other. Characterized in that they are adhered so as to be conductive. 7. The IC module according to claim 6, wherein the substrate and the film material are bonded via an anisotropic conductive film in which conductive particles are dispersed in an adhesive resin film. 8. The IC module according to claim 6, wherein at least the IC chip on the substrate is sealed with a sealing member. 9. The IC module according to claim 1, wherein said substrate has a plurality of slits extending radially from a mounting position of said IC chip. 10. An IC module comprising: an IC chip mounted on a substrate; an antenna coil conductive to the IC chip; and a resin package surrounding the IC chip, wherein the IC chip is located at a central portion of the substrate. An IC module, wherein the substrate is formed in a gear shape or a star shape having a plurality of hairpin portions extending radially from a mounting position of the IC chip. 11. The IC module according to claim 10, wherein the antenna coil is patterned on the substrate and is formed in a gear or star shape as a whole according to the shape of the substrate. 12. The IC module according to claim 10, wherein the resin package is formed in a gear shape or a star shape substantially similar to the substrate in plan view. 13. An IC module according to any one of claims 1 to 12, and a card body having a flat plate shape and having a through hole or a recessed portion into which the IC module is fitted. Characterized by
IC card. 14. The IC card according to claim 13, wherein a cover sheet is attached to at least one surface of the card body.