JPH11102935A - Chip thermocompression bonding tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip thermocompression bonding tool wherein parallel state of indenters is prevented from changing as time lapses under effect of repetition of heating and cooling, etc. SOLUTION: A ceramics holder 2 comprising a plurality of cooling slits 18 is attached to a lower end of a metal connection block 30 attached to a lower end of a metal tool main body 1, while the ceramics holder 2, a ceramics heater 4, and a ceramics indenter 5 are sintered. The ceramics holder 2 may be directly attached to the lower end of the metal tool main body 1, with no connection block 30 attached. First and second air blow channels 19 and 24 and chip sucking hole 13, etc., are recommended to be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip thermocompression tool, and more particularly to a thermocompression tool used for bonding a semiconductor chip to various circuit boards such as a liquid crystal substrate.

[0002]

2. Description of the Related Art Conventionally, various types of chip thermocompression bonding tools used for bonding semiconductor chips to various circuit boards such as a liquid crystal substrate are known. For example, as disclosed in Japanese Patent Application Laid-Open No. 7-86341, a chip thermocompression bonding method in which a ceramic holder is mounted on a lower end of a tool body and a ceramic heater and a ceramic indenter are mounted on a lower end of the ceramic holder. Tools.

[0003]

However, in this type of chip thermocompression bonding tool, the integration of the ceramic holder, the ceramic heater, and the ceramic indenter, that is, the fixing between the three members, is performed using an appropriate adhesive. The parallelism of the ceramic indenter is likely to change over time due to differences in thermal expansion caused by unevenness in the thickness of the adhesive applied and the deterioration of the adhesive force over time due to the non-uniformity of the adhesive thickness. Had.

In addition, since the tool body is made of metal, the tool body and the ceramic holder are fixed by bolting. However, the bolt is loosened due to repeated heating and cooling at this location. Or the heat is transmitted to a parallelism adjusting mechanism (not shown) mounted on the upper end of the tool body 1, and the parallelism of the ceramic indenter changes from this surface under the influence of the heat. It was easy.

[0005] For this reason, various attempts have been made to solve such disadvantages, but in reality, sufficient technology has not yet been developed. The parallelism of the ceramic indenter is
In particular, it is regarded as a problem in bonding that requires accuracy on the order of microns, and if it is not kept constant,
Chip displacement or the like occurs during bonding, making high-precision bonding difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described drawbacks, and sinters a ceramic holder, a ceramic heater, and a ceramic indenter, and provides a cooling slit in the ceramic holder to reduce the size of the ceramic indenter. It has been found that the parallelism can be effectively prevented from changing over time, and the present invention has been accomplished.

[0007]

That is, according to the first aspect of the present invention, there is provided a chip thermocompression bonding tool, wherein the lower end of a connection block mounted directly on the lower end of the tool main body or the lower end of the tool main body. In a chip thermocompression bonding tool in which a ceramic holder is mounted on a ceramic holder and a ceramic heater and a ceramic indenter are mounted on a lower end of the ceramic holder, the ceramic holder, the ceramic heater and the ceramic indenter are sintered, and a cooling slit is formed in the ceramic holder. Is provided.

The heating portion of the ceramic heater and the upper end of the ceramic indenter are inserted into a mounting recess formed in the lower end surface of the ceramic holder and sintered. Is preferred.

According to a third aspect of the present invention, the ceramic holder has a first air blowing passage formed on an upper end surface of a heating portion of the ceramic heater, and the ceramic holder and the tool body, or Preferably, the ceramic holder and the connection block have connection holes for forming a first air supply passage communicating with the first air blowing passage.

According to a fourth aspect of the present invention, the ceramic holder has a second air blowing passage on an upper end surface abutting on a lower end of the tool body or the connection block, and the tool body or the connection block. Preferably has a second air supply passage communicating with the second air blowing passage.

According to a fifth aspect of the present invention, the ceramic indenter has a chip suction hole, and the ceramic heater, the ceramic holder, and the tool main body, or the ceramic heater, the ceramic holder, and the connection block are connected to the chip. It is preferable to have a connection hole for forming an intake passage communicating with the suction hole.

[0012]

FIG. 1 is a front view, and FIG. 2 is a left side view of FIG. 1, showing a lower end portion of a chip thermocompression bonding tool. Ceramic holder 2 directly on the lower end of tool body 1
A (ceramic holder) is mounted by a plurality of bolts 3 and a ceramic heater 4 and a ceramic indenter 5 (ceramic indenter) are sintered at the lower end of the ceramic holder 2.

That is, as shown in FIG. 3, the ceramic heater 4 connects the heat generating portion 6 and the terminal portion 7 with T.
The heater 4 is formed in a panel body having a predetermined thickness (for example, about 1 mm) arranged in a character shape, and the heat generating portion 6 of the heater 4 fits into a mounting recess 8 formed on the lower end surface of the ceramic holder 2. The upper end of the ceramic indenter 5 which is inserted and sintered with the ceramic holder 2 is also attached to the mounting recess 8.
And sintered with the ceramic holder 2 and the ceramic heater 4.

The sintering can be carried out, for example, by heating to 1700 ° C. to 1800 ° C. under several thousand atmospheres in a state where a binder mixed with silicon nitride powder is applied to the contact surface of each part. In addition, the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 can be integrated with each other.
Since the heat generating portion 6 and the upper end of the ceramic indenter 5 are fitted into the mounting concave portions 8, it is possible to firmly join them without causing positional displacement.

Further, as shown in FIGS. 3 and 4 (longitudinal sectional views of the heat generating portion 6), the ceramic heater 4 is constituted by covering the heat generating element 9 with a ceramic material 10 which is an electric insulating material. From the terminal portion 7 to the terminal 11 of the heating element 9
The connection hole 12 is made to penetrate the heat generating portion 6 and the connection hole 12 is formed into the chip suction hole 13 which is made to penetrate the ceramic indenter 5 as shown in FIG. And a connection hole 14 penetrated through the ceramic holder 2.

In FIG. 1, the upper end of the connection hole 14 is not shown, but the connection hole 14 is connected to a connection hole 15 penetrated through the tool body 1. Thus, the chip suction holes 13 are formed by the connection holes 12, 14 and 15.
To form an intake passage 16 communicating with the intake passage. Therefore, suction can be performed through the chip suction hole 13 by suctioning through the pressure-resistant hose 17 mounted on the tool body 1, and therefore, the semiconductor chip (not shown) can be suction-held by the ceramic indenter 5. Can be.

In addition, a plurality of elongated cooling slits 18 and a first air blowing passage 19 are formed in the ceramic holder 2.
And the connection hole 20 (see FIG. 5) are penetrated.
The heat generating portion 6 is formed on the upper end surface, and at the first, the left and right ends thereof are opened.

The connection hole 20 is formed in the first air outlet passage 19 and the connection hole 2 penetrating the tool body 1.
1 (see FIG. 5). Thus, the connection holes 20 and 21 form the first air supply passage 22 that communicates with the first air blow passage 19.

The first air supply passage 22 is provided as a pair as shown in FIG. Therefore, by supplying air through the pressure-resistant hose 23 (see FIG. 5) attached to the tool body 1, air can be blown out from the left and right openings of the first air blowing passage 19 in FIG. .

Accordingly, the heat generated from the heat generating portion 6 of the ceramic heater 4 is taken away by the air, so that the ceramic heater 4 and the ceramic indenter 5 can be rapidly cooled and excessively conducted to the ceramic holder 2. Can be prevented. In addition, the cooling slit 18 cools the heated ceramic holder 2 to prevent the joint between the ceramic holder 2 and the metal tool body 1 from being excessively heated.

Further, as shown in FIG. 2, a pair of second air blowing passages 24 are provided on the upper end surface of the ceramic holder 2, and the second air blowing passages 24 are provided in FIG. The second air supply passage 25 is opened at both front and rear ends, and communicates with the second air blowing passage 24 through the tool body 1.

For this purpose, air is supplied through a pressure-resistant hose 26 mounted on the tool main body 1 so that the air shown in FIG.
In this case, air can be blown from the front and rear openings of the second air blowing passage 24. Therefore, the joint between the ceramic holder 2 and the metal tool body 1 can be forcibly cooled.

As described above, one of the chip thermocompression bonding tools according to the present invention includes a ceramic holder 2, a ceramic heater 4, and a ceramic indenter 5 directly mounted on the lower end of a metal tool body 1 having a low coefficient of thermal expansion. And a cooling slit 18 is provided in the ceramic holder 2.

Therefore, even if the tool body 1 is moved downward and the semiconductor chips are successively thermocompression-bonded (ie, bonded) to a circuit board set on a bonding stage (not shown), It is possible to effectively prevent the parallelism of the ceramic indenter 5 from changing outside the specified range in a short period of time. The same applies to flatness.

That is, in the present invention, the holder,
Since both the heater and the indenter are made of ceramic, the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 can be sintered and firmly integrated, and have poor heat conductivity. Due to the characteristics of the ceramic materials, excessive heating caused by their use is prevented by providing the cooling slits 18. As a synergistic effect of this, the parallelism of the ceramic indenter 5 is out of the specified range in a short period of time. It is effectively prevented from changing to.

In addition, the heating part 6 of the ceramic heater 4 and the upper end of the ceramic indenter 5 are attached to the ceramic holder 2.
Is sintered by being inserted into the mounting recessed portion 8 formed on the lower end surface thereof.

Further, a first air blowing passage 19 is formed on the upper end surface of the heat generating portion 6 of the ceramic heater 4, and
Since the first air supply passage communicating therewith is formed, heat conduction from the heat generating portion 6 of the ceramic heater 4 to the ceramic holder 2 can be suppressed, and it can be more effectively prevented. it can.

Further, since the second air blowing passage 24 is formed in the upper end surface of the ceramic holder 2 and the second air supply passage 25 communicating with the second air blowing passage 24 is formed in the tool main body 1, it is even more effective. It can be prevented.

Although the chip thermocompression bonding tool according to the present invention may not be provided with the intake passage 16 and the chip suction hole 13, it is preferable to provide them. Also, a ceramic holder 2, a ceramic heater 4
The ceramic indenter 5 may be made of any of oxide ceramics such as alumina and zirconia, and non-oxide ceramics such as aluminum nitride, boron nitride and silicon nitride. For the ceramic indenter 5, the latter having higher thermal conductivity than the former is used.

The ceramic holder 2 may be mounted on the tool body 1 using an appropriate adhesive, but is mounted by bolting so that the ceramic heater 4 can be replaced when it is damaged. Preferably, other clamping mechanisms may be used.

Although the cooling slits 18 are preferably penetrated, they may be provided at a predetermined depth without penetrating, and the number of the cooling slits 18 is selected as required and the shape thereof is also selected. It is provided in a predetermined shape as needed.

As described above, the embodiment in which the ceramic holder 2 is directly attached to the lower end of the metal tool body 1 has been described. In the present invention, as shown in FIGS. At the lower end of the tool body 1, a metal connection block 30 is mounted, and at the lower end of the connection block 30, the ceramic holder 2 is mounted, and the ceramic holder 2, the ceramic heater 4 and the ceramic indenter 5 are sintered. You may.

FIG. 7 is a front view, and FIGS. 8 and 9 are left side views of FIG. 7. As shown in these figures, the connection block 30 is formed to form the intake passage 16a. The connection hole 15a of FIG.
A connection hole 21a for forming the air supply passage 25a and the first air supply passage 22a is penetrated, and
As in the case of the above-described first air supply passage 22 shown in FIG. 6, a pair of first air supply passages 22a are provided at predetermined intervals in the front-rear direction in FIG. 9, and pressure-resistant hoses 17a, 23a, and 26a are further provided. It is installed.

Accordingly, the chip thermocompression bonding tool in which the connection block 30 is mounted on the lower end of the metal tool body 1 is also similar to the chip thermocompression tool in which the ceramic holder 2 is mounted directly on the lower end of the metal tool body 1. In addition, it is possible to suppress the heat conduction from the heat generating portion 6 of the ceramic heater 4 to the ceramic holder 2, and to achieve the above-described excellent effects such that the heat conduction can be more effectively prevented.

Although not shown, the connection block 30 is mounted on the lower end of the metal tool body 1 by bolting. A thermocouple 31 for temperature measurement is attached to the ceramic indenter 5 (see FIGS. 2 and 8), and the tool body 1 can be moved in three axial directions via an XYZ table (not shown). It is attached to.
However, it may be mounted so as to be able to move only in the Z-axis direction or to rotate at a predetermined angle θ in addition thereto. Further, the air supplied from the first and second air supply passages 22 (or 22a) and 25 (or 25a) to the first and second air outlet passages 19 and 24 may be either room temperature air or cooling air. Good.

[0036]

As described above, according to the present invention, it is possible to obtain a chip thermocompression bonding tool capable of effectively preventing the parallelism of the ceramic indenter from changing over time.

[Brief description of the drawings]

FIG. 1 is a front view of a lower end portion of a chip thermocompression bonding tool.

FIG. 2 is a left side view of FIG.

FIG. 3 is a perspective view of a ceramic heater.

FIG. 4 is a longitudinal sectional view of a heat generating portion of the ceramic heater.

FIG. 5 is a left side view of FIG. 1;

FIG. 6 is a front view of a lower end portion of the chip thermocompression bonding tool.

FIG. 7 is a front view of a lower end portion of the chip thermocompression bonding tool.

FIG. 8 is a left side view of FIG. 7;

FIG. 9 is a left side view of FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tool main body 2 Ceramic holder 4 Ceramic heater 5 Ceramic indenter 6 Heating part 8 Mounting recess 12 Connection hole 13 Chip suction hole 14 Connection hole 15, 15a Connection hole 16, 16a Intake passage 18 Cooling slit 19 First air blowing passage 20 Connection Holes 21, 12a Connection holes 22, 22a First air supply passage 24 Second air supply passage 25, 25a Second air supply passage 30 Connection block

Claims (5)

[Claims] A chip thermocompression bonding tool in which a ceramic holder is mounted directly on a lower end of a tool main body or on a lower end of a connection block mounted on a lower end of the tool main body, and a ceramic heater and a ceramic indenter are mounted on a lower end of the ceramic holder. 2. The chip thermocompression bonding tool according to claim 1, wherein the ceramic holder, the ceramic heater, and the ceramic indenter are sintered and a cooling slit is provided in the ceramic holder. 2. The ceramic heater according to claim 1, wherein the heat-generating portion of the ceramic heater and the upper end of the ceramic indenter are inserted into a mounting recess formed on the lower end surface of the ceramic holder and sintered. The chip thermocompression bonding tool according to 1. 3. The ceramic holder has a first air blowing passage formed on an upper end surface of a heating portion of the ceramic heater, and the ceramic holder and the tool body, or the ceramic holder and the connection block, The chip thermocompression bonding tool according to claim 2, further comprising a connection hole for forming a first air supply passage communicating with the first air blowing passage. 4. A ceramic holder having a second air outlet passage on an upper end surface abutting on a lower end of the tool body or the connection block, and the tool body or the connection block communicates with the second air outlet passage. 4. The chip thermocompression bonding tool according to claim 1, further comprising a second air supply passage formed. 5. A ceramic indenter having a chip suction hole, and a ceramic heater, a ceramic holder, and a tool body, or a ceramic heater, a ceramic holder, and a connection block form an intake passage communicating with the chip suction hole. 5. The chip thermocompression bonding tool according to claim 1, further comprising a connection hole for forming the chip thermocompression bonding tool.