JPH1092853A - Device for manufacturing resin sealed semiconductor and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing device for a semiconductor device which suppresses generation of voids, concaves, cracks and so on by resin clogging at an air bent part of a sealing mold during resin sealing. SOLUTION: When a semiconductor manufacturing device 100 is so comprised as resin sealing of a resin sealed objective 120 to be made, the semiconductor manufacturing device 100 is made to contain a cavity part 103 which internally supports the resin sealed objective 120. The device is also made to contain an air bent part 109 which is provided at a part of the cavity part 103 to exhaust air in a resin supplying passage 121 provided at a part of the cavity part 103 and of the inside of the cavity part 103, because resin material 107 to make resin sealing of the resin sealed objective 120 is attempted to introduce into the cavity part 103. Additionally an aperture adjusting means 130 which can adjust an aperture of the air bent part 109 is provided at the air bent part 109.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a resin-encapsulated semiconductor and a method for manufacturing a resin-encapsulated semiconductor. The present invention relates to an apparatus and a method for manufacturing a resin-encapsulated semiconductor that can be manufactured.

[0002]

2. Description of the Related Art Conventionally, many techniques have been disclosed for a semiconductor manufacturing apparatus. Among them, a particular problem has been whether to uniformly inject the resin material into the cavity provided in the resin sealing mold, and therefore, into the cavity. The focus was on how to treat the remaining air.

[0003] An example of such a conventional typical apparatus for manufacturing a resin-encapsulated semiconductor will be described with reference to FIG. 4. As shown in FIG. A cavity 4 for encapsulating an object to be sealed with a resin, a gate 8 for injecting a resin material, and an air vent 9 for venting air from inside the cavity 3, comprising an upper mold 1 and a lower mold 2. Was mainly provided.

[0004] When encapsulating the resin in such an encapsulating mold, first, either the upper mold 1 or the lower mold 2 is opened, and then the semiconductor chip 5 to be resin-encapsulated is bonded onto the lead frame 4. The conductive pads (not shown) of the semiconductor chip and the internal leads of the lead frame 4 are electrically connected by gold wires 6 respectively. Next, one of the upper mold 1 and the lower mold 2 is closed, and the mold is clamped. The resin 7 is heated and press-fitted from a portion (not shown), and the resin 7 is inserted into the cavity 3 through the gate 8 from the left side of the drawing. Inject 7

At this time, the air remaining inside the cavity 3 is released between the upper mold 1 and the lead frame 4 and between the lower mold 2 and the lead frame 4 by the pressure of the resin 7. After passing through the provided air vent part 9, it is discharged out of the enclosed mold. However, when the resin is not completely filled with the resin at the time of filling the resin, the resin may be chipped or scoured.

The reason for this is that a predetermined opening degree cannot be obtained due to resin clogging or accumulation in the air vent portion, and air remains. As one method for solving such a problem, a technique described in Japanese Patent Application Laid-Open No. 1-292834 is known. An outline of such a technique will be described with reference to FIG. 5. As shown in FIG. 5, a cavity 3 and a movable pin 1
A lead frame 4 on which a semiconductor pellet 5 is mounted is used by using an encapsulation mold having a resin injection gate 11.

In the conventional example, in the initial state of the resin injection, as shown in FIG. 5A, the movable pin 10 restricts the resin from flowing into a portion indicated by b in the cavity 3. The resin injected from the resin injection gate 11 is filled in the cavity as indicated by an arrow F through a portion indicated by a in the cavity 3. Next, as shown in FIG. 5B, during the injection of the resin, the movable pin 10 is retracted to open the flow path of the portion b, and the flow path resistance is set small.

As a result, the resin easily flows into the portion b in the cavity 3, the resin easily flows mainly into the portion b, and the resin mainly flows through the portion b as shown by an arrow G. The cavity 3 is filled. That is,
In the above conventional example, when the resin in the cavity is finally filled by changing the resistance of the resin inflow path in the cavity during resin injection by moving the movable pin 10. That is, it is possible to arbitrarily set a location where air bubbles are frequently generated by residual air, and to adjust the movable pin so that the air vent portion in the cavity is finally filled, thereby easily discharging the residual air. Can do it.

That is, in the above conventional example, the movable pin 10
Has a structure that penetrates into the cavity portion 3,
It is set so that the cavity portion surface is formed at the retracted position.

[0010]

However, in the above-mentioned prior art, although the supply of the resin material to be sealed with the resin is restricted, the air existing in the cavity portion is efficiently discharged to the outside. No solution for the emission is given, and the conventional problems mentioned above remain.

An object of the present invention is to improve the above-mentioned drawbacks of the prior art, and to discharge air remaining in a cavity portion in a process of manufacturing a semiconductor device in accordance with a resin inflow state in a mold during resin encapsulation. By controlling the state, it is possible to suppress the occurrence of resin voids, scouring, or defective filling in a semiconductor device, to provide a highly reliable semiconductor device, and to provide a method of manufacturing a semiconductor device having high productivity. Accordingly, a semiconductor assembly process having high productivity is to be constructed.

[0012]

SUMMARY OF THE INVENTION The present invention basically employs the following technical configuration to achieve the above object. That is, a first aspect of the present invention is a semiconductor manufacturing apparatus for sealing a resin-sealed object with a resin, wherein the semiconductor manufacturing apparatus includes a cavity portion for holding the resin-sealed object inside. And a resin supply path provided in a part of the cavity portion and an inside of the cavity portion for introducing a resin material for sealing the object to be resin-sealed into the cavity portion. And an air vent portion provided at a part of the cavity portion for discharging the air. The air vent portion has an opening degree adjusting means capable of adjusting the opening degree of the air vent portion. The present invention relates to an apparatus for manufacturing a resin-sealed semiconductor provided, and as a second aspect of the present invention, a semiconductor manufacturing apparatus for resin-sealing an object to be sealed with a resin. , Holding the resin-sealed object inside A resin supply path provided in a part of the cavity part for introducing a resin material for sealing the object to be resin-sealed into the cavity part, the resin supply path including the cavity part, and the resin supply path; And an air vent portion provided at a part of the cavity portion for discharging air inside the portion. In the apparatus for manufacturing a resin-encapsulated semiconductor, the air is discharged from the air vent portion. This is a method of manufacturing a resin-sealed semiconductor in which the resin material is injected into the cavity while changing the amount of air.

[0013]

In the apparatus and method for manufacturing a resin-encapsulated semiconductor according to the present invention, the cavity is moved from the cavity by, for example, a movable pin used as the aperture adjusting means. In the case where the opening degree of the air vent section for discharging the air remaining in the section is made variable and the resin is injected into the cavity section and only air is discharged from the air vent section, The opening degree of the air vent is set to be the maximum, and after the state where the injected resin is approaching the air vent, the opening degree of the air vent is gradually reduced, and the final operation of the injection operation of the resin is performed. In the step, the semiconductor is manufactured while setting the aperture to be the minimum.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a resin-sealed semiconductor manufacturing apparatus according to the present invention; FIG. FIG. 1 is a cross-sectional view illustrating the outline of the configuration of one specific example of a resin-encapsulated semiconductor manufacturing apparatus according to the present invention.

That is, in FIG. 1, in a semiconductor manufacturing apparatus 100 for sealing a resin sealed object 120 with a resin, the semiconductor manufacturing apparatus 100 includes a cavity for holding the resin sealed object 120 therein. In order to introduce the resin material 107 for sealing the resin-sealed object 120 with the resin material 107 into the cavity 103, a resin supply provided in a part of the cavity 103 is included. An air vent 109 provided in a part of the cavity 103 to discharge air from the passage 121 and the inside of the cavity 103
And a resin-encapsulated semiconductor manufacturing apparatus 100 in which the air vent 109 is provided with an opening adjusting means 130 capable of adjusting the opening of the air vent 109. I have.

That is, in the resin-sealed semiconductor manufacturing apparatus 100 according to the present invention, the movable pin is fitted into the cavity as in the above-described conventional example shown in FIG. Therefore, unlike the method of regulating the flow of the resin material itself injected into the cavity, the opening degree of the air vent is adjusted in order to effectively discharge the air itself remaining in the cavity 103. The opening degree adjusting means is provided at the entrance of the air vent, which is the end of the cavity 103.

As a result, in the present invention, the opening degree of the air vent portion is set to be maximum in the initial to middle stages of the resin injecting operation, and the air venting operation is facilitated. At the end of the resin injection operation, there is provided an opening degree adjusting means which is set so as to minimize the opening degree of the air vent portion. Therefore, in the resin-sealed semiconductor manufacturing apparatus 100 according to the present invention, while the resin injecting operation is being performed inside the cavity portion, the resin material itself does not leak while the air bleeding operation is continued. It is constituted in.

Furthermore, in the apparatus 100 for manufacturing a resin-sealed semiconductor according to the present invention, the air vent 109
Even if the resin is clogged in the previous resin filling operation or the resin material remains inside the cavity 103, the air passage of the air vent 109 is formed to the maximum, Since the existing air is reliably and rapidly discharged to the outside of the cavity 103,
There is no occurrence of defective semiconductor shaping unlike the conventional case.

Resin-to-be-sealed 1 used in the present invention
20 is a semiconductor pellet or a semiconductor chip 1, for example.
05 and the lead frame 104 are mainly included. Further, in the present invention, the resin material 107 used for encapsulating the resin is not particularly limited, and a resin material generally used conventionally is used.

Next, the opening degree adjusting means 130 used in the present invention is, as described above, provided with an air vent section provided at an end of the cavity section 103 of the apparatus for manufacturing a resin-sealed semiconductor. It is desirable to be arranged at a joint position between the cavity 109 and the cavity 103, and as shown in FIG.
In a plan view of, for example, the lower mold 102 of the manufacturing apparatus 100 for the resin-sealed semiconductor, the resin supply path 1 for the resin material 107 provided at one corner of the cavity 103 is provided.
It is desirable that the air vent portions 109-1 to 109-3 provided at the other three corners except for the portion 21 are arranged.

Particularly preferably, the aperture adjusting means 13 is used.
0 is preferably disposed in the air vent portion 109-2 in FIG. Further, the opening degree adjusting means 130 used in the present invention is, as described above, provided with the air vent portion 109.
It is necessary that the opening degree, that is, the cross-sectional area of the air passage, can be arbitrarily changed, and the configuration is not particularly limited as long as the means has such a function.

As shown in FIG. 1, a specific example of the opening degree adjusting means 130 in the present invention is, for example, a main part of the resin-encapsulated semiconductor manufacturing apparatus 100, for example, an upper mold 101 or a lower mold 101. Member 11 that slides through any of molds 102
0, for example, a movable pin. The movable sliding member 110 of the opening degree adjusting means 130 includes:
The tip of the air vent 109 is configured to fit into the inside of the air vent 109, and the degree of opening of the air vent 109 is adjusted according to the injection state of the resin 107 injected into the cavity 103. Is desirable.

Therefore, in the specific example of the apparatus 100 for manufacturing a resin-encapsulated semiconductor according to the present invention shown in FIG. 1, the movable sliding member 110 is constituted by a movable pin,
0 is the upper mold 101 by an appropriate control circuit 113.
The inside is moved up and down by a predetermined stroke to adjust the cross-sectional area of the air passage in the air vent 109.

The material of the movable pin 110 is not particularly limited. However, it is preferable that the movable pin 110 is made of a cemented carbide in particular because it slides frictionally with the mold 101 or 102. Further, in the present invention, the structure of the movable pin is such that when the movable pin 110 is fully lowered as shown in FIG. It is desirable to have a shape that matches the side wall of the tee 103.

As described above, the movable pin 110 is moved up and down by the injection state of the resin material 107 injected into the cavity 103, for example, the injection amount, the injection pressure, or the injection of the resin material 107. It is desirable to be operated in response to the operating position of the plunger.
The cross-sectional shape of the movable pin is not particularly limited, but an appropriate cross-sectional shape such as a circular shape or a square shape can be adopted.

Preferably, it is desirable to select a cross-sectional shape according to the shape of the joint between the cavity and the air vent. As the means for vertically moving the movable pin 110, for example, a known means such as a hydraulic cylinder, an electric servo means, or a solenoid can be used. Further, in the resin-encapsulated semiconductor manufacturing apparatus 100 according to the present invention, when a predetermined resin material 107 is injected into the cavity 103, an appropriate gate 108 is inserted into the resin supply passage 121.
It is also possible to adjust the injection amount of the resin material 107 into the cavity 103 by the resin supply path 108, and further provide a gate adjusting means 122 and a control circuit 123 therefor. It is possible.

Further, it is possible to execute more precise resin injection processing by interlocking the gate adjusting means 122 and the opening degree adjusting means 130 described above. Hereinafter, a specific example of the resin-encapsulated semiconductor manufacturing apparatus 100 according to the present invention will be described in detail with reference to FIGS. FIG. 1 shows a configuration of a specific example of a resin-encapsulated semiconductor manufacturing apparatus 100 according to the present invention.
9 shows a configuration in which a movable pin 110 is replaced with a movable pin 110.

And, in order to secure the effect of air release,
The movable pin 110 is configured up to a region including a part of the cavity 103. Further, in order to drive the movable pin 110 provided in the air vent 109,
Drive mechanism 111 including a hydraulic cylinder, drive mechanism 11
Control circuit 113 and position sensor 11 for controlling the operation of
2 are provided.

The control circuit 113 includes the hydraulic cylinder 11
The opening / closing and forward / reverse switching of an electromagnetic valve (not shown) connected to 1 are directly controlled, and the position sensor 112 detects the operating position of the movable pin 110. On the other hand, the control circuit 113 is incorporated so as to synchronize with the molding control circuit of the molding machine main body and take timing of the opening and closing of the mold and the injection operation of the resin.

Although the material of the movable pin 110 is not particularly limited as described above, the upper mold 101
If the material is stainless steel that has been subjected to surface treatment using chromium or the like, it is desirable to use a cemented carbide in consideration of the abrasion resistance of the material. Hereinafter, the operation of the resin-encapsulated semiconductor manufacturing apparatus 100 of the above specific example according to the present invention will be described with reference to FIG.
This will be described with reference to FIG.

FIG. 3 shows the operation of closing and opening the upper mold 101 and the lower mold 102 in FIG. 2, the operation of an injection plunger (not shown) for injecting the resin material 107, and the movable pin. 4 is a time chart showing the operation of the embodiment 110. As shown in FIG. 3, the master mold clamping start time T1 to the injection start time T
2, a mold clamping operation between the upper mold 101 and the lower mold 102 is performed.

Next, the injection plunger rises (falls) from the injection start time T2, the injection of the resin material 107 starts, and at the same time, the movable pin 110 rises, and the air vent 109 is set to the maximum opening. You. (Refer to the state in FIG. 2A) In this state, the air existing inside the cavity 103 is easily and efficiently discharged from the air vent 109 to the outside of the cavity 103.

Next, the injection plunger continues to rise and reaches the injection conversion point T3 when the resin material 107 is filled in the cavity 103 with a considerable amount. During this time,
In the closing / opening operation of the upper mold 101 and the lower mold 102, the unifying speed of either the upper mold 101 or the lower mold 102 changes between the times T1 and T2. When the two molds 101 and 102 are combined and clamped at a constant high speed, the two molds 101 and 102
If there is a foreign substance in between, the mold itself will be damaged, so in the middle of the coalescing process,
It is desirable to reduce the coalescing speed.

When the injection plunger reaches the injection conversion point T3, the injection plunger at this point is reduced in its ascending speed, switched to the slow ascending speed, and the movable pin 110 starts descending at the same timing. When the injection plunger reaches the uppermost part, that is, in the vicinity where the maximum injection pressure is applied to the cavity 103, as shown in FIG. 2B, the movable pin 110 is set to a predetermined minimum opening degree,
Air can be vented, and a position that does not cause resin leakage is maintained.

In this case, the operation of the movable pin 110 is as shown in the graph of FIG.
May exhibit an overshoot due to its descending operation. The reason why the overshoot-like descending behavior is performed is that the minimum aperture actually required is 10 μm to 100 μm.
And the distance is affected by the state of resin adhesion of the air vent portion 109. Therefore, it is more accurate to lower the movable pin 110 to the required position after lowering the movable pin 110 until it reaches the lowest point of the operating range. This is because accurate positioning can be performed.

That is, in the present embodiment, it is desirable to control and adjust the movable pin 110 so as to be lowered once beyond the set position and then raised again. Further, in the present invention, the injection plunger is lowered again from the injection lowering start time T4 until the mold opening operation is started at time T5. Meanwhile, the movable pin 110 rises again.

Thereafter, when the mold opening operation is started at time T6, the movable pin 110 and the injection plunger are both lowered. The movable pin 110 and the injection plunger repeat ascending and descending again from the time of the start of the injection descent at the time T4 to the time of the completion of the mold clamping / mold opening operation at the time T7 because the resin material 107 and the The purpose is to make the mold separation between the movable pins 110 good and to discharge resin burrs and the like, but it is not always necessary.

In the specific example of the resin-encapsulated semiconductor manufacturing apparatus 100 according to the present invention, as shown in FIG. 2A, when the movable pin 110 rises to reach the maximum aperture. The interval is, for example, the air vent 1 of the lower mold 102.
The value obtained by subtracting the thickness of the lead frame 104 from the value of the distance from the upper surface of the movable pin 110 to the lower surface of the movable pin 110 is, for example, 1 mm to 2 mm.

The interval when the minimum aperture is reached is:
0.04mm to 0.1mm when expressed in the same dimension
Becomes The lower limit value and the upper limit value of the maximum opening degree are set based on the optimum speed and the height of the cavity 103 when discharging the volume of air in the cavity 103, respectively.

The lower limit value and the upper limit value of the minimum opening degree are set based on the flow characteristics of the resin used, in particular, the length of the burrs flowing out. Next, a resin-sealed semiconductor manufacturing apparatus 1 according to the present invention 1
To describe another specific example of 00, in the operation of the movable pin 110 of FIG. 3, an operation shown by a graph B different from the graph A may be performed.

In this example, the operation of the movable pin 110 is temporarily stopped on the way to reaching the minimum opening degree, and then, after a certain period of time, the same operation as in the above embodiment is resumed. It is. According to this operation, since the movable pin 110 is not completely closed, the resin material 107
Leaks out of the cavity 103, and after a predetermined time, the resin material 107 stops flowing,
Return to normal molding state.

That is, by adopting such an operation,
When a plurality of cavities 103 are present, in all the cavities 103, due to a difference in a resin injection state in each of the cavities 103 and an amount of air present therein, A uniform processing state is not formed, and the resin encapsulation operation in some of the cavities 103 is completed in order to complete the operation of encapsulating the resin in all the cavities 103 at the same time. Or a certain time delay, or the flow front portion of the resin material 107 injected into the cavity portion 103 contains a lot of fine air,
This part can be intentionally discharged to the outside of the cavity 103, and furthermore, the advanced cavity 10
This is advantageous when filling control within 3 is required.

As described above, the manufacturing method of the resin-sealed semiconductor according to the second aspect of the present invention includes, for example,
A semiconductor manufacturing apparatus for sealing a resin-sealed object with a resin,
The semiconductor manufacturing apparatus includes a cavity for holding the resin-sealed object inside, and a resin material for resin-sealing the resin-sealed object is introduced into the cavity. A resin further comprising a resin supply passage provided in one part of the cavity part and an air vent part provided in one part of the cavity part for discharging air inside the cavity part. In an apparatus for manufacturing a sealed semiconductor, a method of manufacturing a resin-sealed semiconductor in which the resin material is injected into the cavity while changing the amount of air discharged from the air vent. In the above configuration, means for adjusting the opening degree of the air vent is provided in the air vent, and the opening is adjusted at an initial stage when the resin material is injected into the cavity. In the stage immediately before completion of the injection operation of the resin material, at the stage immediately before completion of the injection operation of the resin material, the operation of injecting the resin material is performed while adjusting the opening degree to the minimum. It is a manufacturing method.

Further, a specific example of the method of manufacturing a resin-sealed semiconductor according to the present invention will be described. In the method of manufacturing a semiconductor for sealing a material to be sealed with a resin, an upper mold and a lower mold are used. When performing mold clamping by combining the resin mold, the moving speed of at least one of the molds is changed during the one step of the mold clamping operation when the upper mold and the lower mold are combined. A method of manufacturing a semiconductor, wherein an injection plunger for injecting a predetermined resin material into the cavity is provided, and the injection plunger is moved and extruded from a predetermined end to a predetermined other end. This is a method for manufacturing a resin-encapsulated semiconductor in which the injection plunger is controlled so as to change its moving speed in the course of the above-described one step.

As another specific example, the opening degree adjusting means temporarily sets the opening degree of the air vent portion to a maximum and then lowers the opening degree to a predetermined position where the opening degree is minimized. It may be configured to be controlled so as to move down beyond the lowering position, and then to the predetermined lowering position, and furthermore, the opening degree adjusting means once sets the opening degree of the air vent portion to the maximum. When lowering to a predetermined position that minimizes the aperture,
Once at a position that does not reach the predetermined lowering position,
After a predetermined time elapses at that position, control may be performed so as to temporarily exceed the predetermined lowering position, lower the same, and then raise the same to the predetermined lowering position.

As another specific example, for example, when the injection processing of a predetermined resin material into the cavity portion is completed, the injection plunger starts retreating from its maximum projecting position, and at the same time, adjusts the opening degree. The means rises again, and after the opening degree adjusting means reaches the position where the opening degree is maximized again, the injection plunger also starts moving again toward the maximum protruding position, and the integrated upper metal body is moved. Control is performed so that both the opening degree adjusting means and the injection plunger are operated to return to the initial positions from the start of the mold opening operation of the mold and the lower mold until the completion of the resin enclosing operation cycle. It is also possible to configure a system.

[0047]

As described above, in the apparatus and method for manufacturing a resin-encapsulated semiconductor according to the present invention, the maximum opening for facilitating air bleeding by raising and lowering the movable pin 110 is described. Since it is possible to set the degree of opening and the minimum opening degree for suppressing resin leakage, it is possible to prevent the occurrence of defective filling such as resin voids, scours, and chips when encapsulating a semiconductor pellet or a semiconductor chip with resin.

Further, the movable pin 110 is used for a certain time,
By allowing the resin material to flow out, the resin portion at the tip end containing a lot of air can be intentionally discharged, and furthermore, the completion of the injection can be delayed until the filling in the cavity is stabilized, so that the resin void is conventionally used. Lower, allowing for advanced molding control.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of one specific example of an apparatus for manufacturing a resin-sealed semiconductor according to the present invention.

FIGS. 2A and 2B are cross-sectional views illustrating the operation of a movable pin in the apparatus for manufacturing a resin-sealed semiconductor according to the present invention.

FIG. 3 is a waveform diagram showing operations of a mold clamping / mold opening operation, an injection plunger, and a movable pin in a resin-sealed semiconductor manufacturing apparatus.

FIG. 4 is a cross-sectional view showing an example of the configuration of a conventional resin-encapsulated semiconductor manufacturing apparatus.

FIG. 5 is a cross-sectional view showing the configuration of another specific example of a conventional resin-encapsulated semiconductor manufacturing apparatus.

FIG. 6 is a plan view showing an arrangement position of movable pins in the apparatus for manufacturing a resin-encapsulated semiconductor according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 101 ... Upper mold 2, 102 ... Lower mold 3 ... Cavity part 4, 104 ... Lead frame 5, 105 ... Semiconductor pellet, semiconductor chip 6, 106 ... Gold wire 7, 107 ... Resin material 8, 108 ... Gate section 9, 109 Air vent section 10, 110 Movable pin, movable piece 11 Resin injection gate 100 Manufacturing apparatus for resin-encapsulated semiconductor 111 Drive mechanism 112 Position sensor 113 Control circuit 120 Resin-sealed Object 121: Resin supply path 122: Gate adjusting means 123: Control circuit 130: Opening degree adjusting means

Claims (12)

[Claims] In a semiconductor manufacturing apparatus for sealing an object to be sealed with a resin, the apparatus for manufacturing a semiconductor includes a cavity portion for holding the object to be sealed with a resin inside the semiconductor manufacturing apparatus. In order to introduce a resin material for sealing the resin sealing material into the cavity portion, a resin supply passage provided in a part of the cavity portion and a resin supply passage provided for discharging air inside the cavity portion. And an air vent provided in a part of the cavity, and the air vent is provided with an opening adjusting means capable of adjusting the opening of the air vent. Manufacturing equipment for resin-sealed semiconductors. 2. The apparatus according to claim 1, wherein said opening degree adjusting means is means for changing a sectional area of an air passage in said air vent portion. 3. The apparatus for manufacturing a resin-sealed semiconductor according to claim 1, wherein said opening degree adjusting means is provided in said air vent portion in contact with said cavity portion. 4. An apparatus according to claim 1, wherein said opening degree adjusting means is constituted by a member which slides through a main part of said resin-encapsulated semiconductor manufacturing apparatus. 3. The apparatus for manufacturing a resin-encapsulated semiconductor according to claim 1. 5. The opening degree adjusting means for adjusting the opening degree of the air vent according to the injection state of the resin injected into the cavity. 5. The apparatus for manufacturing a resin-encapsulated semiconductor according to any one of 4. 6. A semiconductor manufacturing apparatus for sealing an object to be resin-sealed with a resin, wherein the semiconductor manufacturing apparatus includes a cavity for holding the object to be resin-sealed therein, In order to introduce a resin material for sealing the resin sealing material into the cavity portion, a resin supply passage provided in a part of the cavity portion and a resin supply passage provided for discharging air inside the cavity portion. In a manufacturing apparatus for a resin-encapsulated semiconductor, further comprising an air vent provided in a part of the cavity, the cavity is changed while changing the amount of air discharged from the air vent. A method of manufacturing a resin-encapsulated semiconductor, comprising injecting the resin material into a tee. 7. A means for adjusting the degree of opening of the air vent portion is provided in the air vent portion, and the opening degree is maximized in an initial stage when the resin material is injected into the cavity portion. 7. The injection operation of the resin material according to claim 6, wherein, at the stage immediately before the completion of the injection operation of the resin material, the opening degree is adjusted to be set to the minimum. A method for manufacturing a resin-encapsulated semiconductor. 8. In a method of manufacturing a semiconductor in which an object to be sealed with a resin is sealed with a resin, when the upper mold and the lower mold are combined and mold clamping is performed, the upper mold and the lower mold are combined. 7. The method for manufacturing a resin-encapsulated semiconductor according to claim 6, wherein the moving speed of at least one of the molds is changed during one step of the mold clamping operation. 9. An injection plunger for injecting a predetermined resin material into the cavity is provided, and when the injection plunger is moved and extruded from a predetermined one end to a predetermined other end, 7. The method according to claim 6, wherein the moving speed of the injection plunger is changed during the one step. 10. The opening degree adjusting means, after once maximizing the opening degree of the air vent section, when lowering the air vent section to a predetermined position where the opening degree is minimized, once exceeding the predetermined lowering position, 8. The method of manufacturing a resin-encapsulated semiconductor according to claim 7, wherein control is performed such that the temperature is raised to the predetermined lowering position. 11. The opening degree adjusting means sets the opening degree of the air vent portion to a maximum and then lowers the opening degree to a predetermined position where the opening degree is minimized. After stopping for a predetermined time at that position, once passing the predetermined lowering position,
8. The method for manufacturing a resin-encapsulated semiconductor according to claim 7, wherein the control is performed such that the semiconductor device is lowered and then raised to the predetermined lowered position. 12. When the injection of a predetermined resin material into the cavity is completed, the injection plunger starts retreating from its maximum protruding position, and at the same time, the opening degree adjusting means rises again. After the opening degree adjusting means reaches the position where the opening degree is maximized again, the injection plunger also starts moving toward the maximum projecting position again, and the combined upper and lower molds are moved. The method according to claim 7, wherein both the opening degree adjusting means and the injection plunger are operated so as to return to an initial position from the start of the opening operation to the completion of the resin enclosing operation cycle. A method for manufacturing a resin-encapsulated semiconductor.