JPH1079462A - Manufacturing semiconductor device and, lead frame and mold die for manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent defects due to dropping of lead frame pieces and resin chip. SOLUTION: The manufacturing process comprises, after preparing a lead frame, forming seal parts 2, outflow resin parts 3 and coupling resin parts 4 on seal-forming regions (front and back surfaces), outflow resin regions 25 (front and back surfaces) and coupling resin region 27 (back surface) and cutting lead frame parts for cutting off the outflow resin parts 3 and coupling resin parts 4. The outflow resin parts are formed by openings 23, having support parts 24 for supporting the outflow resin parts. Holes are formed through the lead frame parts at the coupling resin forming regions. The support parts are cut for cutting off the outflow resin parts 3. the lead frame resin parts 9 to which the coupling resin parts 4 adhere are cut for cutting off the coupling resin parts 4. As the resin enters in the holes, the bond strength of the coupling resin parts 4 and the lead frame parts 9 increases high so that it becomes difficult to peel them off after cutting also.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device and a lead frame and a mold used in the method of manufacturing the semiconductor device, and more particularly, to a sealing body forming area, an outflow resin body forming area, and a connecting resin connecting the two areas. After forming a sealing body (package), an outflow resin body, and a connection resin body on a lead frame having a body formation region by transfer molding, the connection resin body and the outflow resin body are separated from the lead frame by cutting the lead frame portion. The present invention relates to a technique effective when applied to a technique of cutting and separating.

[0002]

2. Description of the Related Art In a semiconductor device such as an IC (integrated circuit device), a structure in which a semiconductor chip, a wire, and the like are sealed by a sealing body made of resin (resin) is known.

A resin-sealed semiconductor device is manufactured using a lead frame. The lead frame on which the semiconductor chip has been fixed and the wire bonding has been completed is sealed in a transfer molding apparatus (sealed body formation area).
Is molded. Thereafter, removal of resin burrs protruding from the sealing region, cutting and removal of tie bars (dams) connecting leads, lead cutting, lead molding, and the like are performed, and a desired semiconductor device is manufactured.

[0004] "VLSI Packaging Technology (Lower)" published by Nikkei BP, published on May 15, 1993, P41 to P50, describes technologies such as deburring, dam cutting, lead cutting, and lead molding.

In the manufacture of a resin-encapsulated semiconductor device, a resin reservoir such as an overrunner, a dummy cavity or a flow cavity is provided in a mold to prevent air bubbles (voids) from being generated in the encapsulation body. Is guided to the overrunner, the dummy cavity, the flow cavity and the like.

The above-mentioned overrunner and dummy cavity are disclosed in, for example, "Electronic Materials" published by the Industrial Research Institute, August 1987.
The monthly issue is published on August 1, the same year, and is described on pages 73 to 79. In addition, the document describes a processing technique (trim & form) for unnecessary parts (resin removal, tie bar cut, pinch lead cut, lead cut, etc.) around the package.

[0007]

SUMMARY OF THE INVENTION In the present applicant,
In order to prevent air bubbles from being generated in the package, a mold having a cavity (flow cavity) for forming an outflow resin body is used in transfer molding. Further, after the molding, the outflow resin body formed in the outflow resin body formation cavity is cut and removed from the lead frame, and at the same time, a lead frame portion where a connection resin body for connecting the outflow resin body and the sealing body is formed. (Hereinafter, for convenience of explanation, this portion is particularly referred to as a cut-and-removed lead frame portion), and the connecting resin body is separated from the lead frame. The outflow resin body is provided in a region extending over the front and back surfaces of the lead frame. The connection resin body is provided on one surface (for example, the lower surface) of the lead frame.

FIGS. 15 and 16 show a lead frame 1 on which transfer molding has been completed. In both cases, a sealing body (package) 2 and an outflow resin body 3 extending over the front and back surfaces of the lead frame 1 and a back surface (lower surface) of the lead frame 1 are shown. The connection resin body 4 provided in ()) is shown.

After the molding, as shown in FIG. 17, the outflowing resin body 3 and the connecting resin body 4 are cut and removed by the outflowing resin body cutting mechanism 10 of the cutting device to remove the lead frame 1.
Separate from The outflow resin body cutting mechanism 10 includes a die 1
After placing the lead frame 1 on the punch 1, the punch guide 1
2 guides the punch 13, cuts the lead frame portion by pressing down the punch 13,
And the connecting resin body 4 is cut and removed.

FIG. 18 shows the outflow resin body 3 and the connecting resin body 4.
FIG. 1 is a view showing a lead frame 1 from which a wire is cut and removed.
Reference numeral 9 denotes the outflow resin body 3 and the connection resin body 4 that have been cut and separated.

Although not shown, the outflow resin body 3 is formed in an opening formed in the lead frame and is supported by a thin support extending into the opening. 13 depression pressing surface 13a
The supporting portion is cut by pushing down the outflow resin body 3 in the step (1), so that the outflow resin body 3 is separated from the lead frame 1.

Further, since the connecting resin body 4 is continuous with the outflowing resin body 3, in order to separate the connecting resin body 4, the lead frame portion 9 to be cut and removed to which the connecting resin body 4 is adhered is connected to the connecting resin body 4. Must be cut along both sides and the interface with the package 2 must be broken. Cutting of the lead frame portion supporting the connecting resin body 4, ie,
The cutting of the lead frame portion 9 to be cut and removed
1 and the punch 13. FIG. 17 shows a state in which the lead frame portion 9 to be cut is cut into small pieces 14.

Further, since the interface between the package 2 and the connecting resin body 4 is narrowly narrowed, when the small piece 14 separated by the pressed down surface 13b of the punch 13 is pushed down, it breaks at the interface. Therefore, as shown in FIG. 19, the punched piece 8 composed of the resin body 3 flowing out and the connecting resin body 4 when the punch 13 is pressed down,
Separate from

However, the small piece 14 has a structure in which the lower surface is stuck to the connecting resin body 4 or a structure in which the lower surface of the small piece 14 is stuck to the connecting resin body 4 and the end face is stuck to the outflowing resin body 3. Therefore, the small piece 14 is easily peeled off from the connection resin body 4 and the like, and is peeled off from the punched piece 8 as shown in FIG.
The phenomenon of sticking to b occurs.

The small pieces 14 easily fall off due to the vibration of the machine or the like thereafter. In some cases, a resin lump is adhered to the small piece 14. In such a case, the small piece 14
At the time of falling off, the resin mass separates and falls. The small piece 14
And the drop of the resin mass cause the following adverse effects when processing the subsequent product.

That is, when the small pieces 14 and the resin block fall off and adhere to the lead frame (lead) or the package, the cutting die causes
A step is generated due to the interposition of the attached small pieces and the resin mass, and a large force acts on the package portion at the base of the lead, so that the package is cracked or chipped. FIG. 20 shows a state in which a crack 15 has occurred in the package 2.

Further, the stress extends to the inside of the package, and cracks and cracks may occur in the semiconductor chip. These phenomena cause product defects.

FIG. 21 shows a case where a resin mass is interposed in the lead 5 portion of the lead frame 1, and a dent 7 is formed on the surface of the lead 5. The dent 7 has a poor appearance. In addition, if the outflow resin body or the like is cut in a state where the small pieces 14 or the resin lump is interposed in the lead 5, the lead 5 may be bent.

If small pieces or resin lumps adhere to the transfer rail in the mold or the transfer rail of the apparatus, the transfer failure is caused, and the mold and the lead frame (semiconductor device) are damaged. Causes manufacturing defects.

An object of the present invention is to provide a method of manufacturing a semiconductor device which can prevent the occurrence of a product defect or a production defect due to the detachment of a lead frame piece or a resin block, a lead frame and a mold used for the production thereof. It is in.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0022]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) A molding step of molding a predetermined area of the lead frame with resin and covering with a sealing body, and a cutting and removing step of cutting and removing unnecessary parts of the lead frame and unnecessary parts of the resin body generated by molding. And
A method for manufacturing a semiconductor device, comprising a step of cutting and removing a cut-and-removed lead frame portion having the resin body formed on one surface side from a lead frame in the cutting and removing step,
In the molding step, molding is performed so that the resin body and the lead frame portion to be cut and removed are integrated.

(2) In the configuration of the means (1), a hole is provided in a portion of the lead frame to be cut and removed where the resin body overlaps, and then molding is performed.

Specifically, the configuration is as follows.

A sealing body forming area and an outflowing resin body forming area, both of which are covered with a resin by a mold, and a connecting resin body forming area for connecting the two areas, wherein the connecting resin body forming area is the lead to be cut and removed. A step of preparing a lead frame provided on a frame portion, wherein the outflow resin body formation region is provided on the front and back surfaces, and the connection resin body formation region is provided only on one surface of the front and back surfaces; A molding step of forming a sealing body, a connecting resin body, and an outflow resin body in the region and the connecting resin body forming region and the outflow resin body forming region; Cutting and removing step of cutting and removing the connecting resin body and the outflowing resin body from the lead frame. In the manufacturing method, the outflow resin body formation region of the lead frame is formed by an opening having a support portion for supporting the outflow resin body, and a hole is provided in a lead frame portion of the connection resin body formation region. In advance, after that, by performing molding, and then cutting the support portion or the lead frame portion supporting the support portion to cut and remove the outflow resin body from the lead frame, and cutting the cut-to-be-removed lead frame portion, The connection resin body is cut and removed from the lead frame.

(3) In the configuration of the means (1), when the resin body is formed, a fixed resin body connected to the resin body is formed on the back surface of the surface on which the resin body is formed.

Specifically, the configuration is as follows.

A sealing body forming area and an outflowing resin body forming area, both of which are covered with resin by a mold, and a connecting resin body forming area for connecting the two areas, wherein the connecting resin body forming area is provided with the cut-to-be-removed lead. A step of preparing a lead frame provided on a frame portion, wherein the outflow resin body formation region is provided on the front and back surfaces, and the connection resin body formation region is provided only on one surface of the front and back surfaces; A molding step of forming a sealing body, a connecting resin body, and an outflow resin body in the region and the connecting resin body forming region and the outflow resin body forming region; Cutting and removing step of cutting and removing the connecting resin body and the outflowing resin body from the lead frame. In the manufacturing method, the outflow resin body formation region of the lead frame is formed with an opening having a support portion that supports the outflow resin body, and in the mold, the outflow resin body formation region is continuous with the outflow resin body formation region and A fixed resin body is formed in a region reaching the cut-removed lead frame part surface where the connecting resin body is not provided, and then the outflowing resin body is removed from the lead frame by cutting the support portion or the lead frame portion supporting the support portion. The connecting resin body is cut and removed from the lead frame by cutting and removing the lead frame portion to be cut and removed.

(4) In the configuration of the means (2) or (3), the cutting and removal of the outflow resin body and the connection resin body may be performed by connecting the lead frame portion supporting the outflow resin body and the connection resin body. The lead frame portion is cut into a shape in which the supporting lead frame portions are connected. In this configuration, it is not necessary to provide a hole in the cut-and-removed lead frame portion on which the resin body overlaps, and when the resin body is formed, it is fixed to the back surface of the surface on which the resin body is formed and connected to the resin body. It is not necessary to form the resin body.

(5) A sealing body forming area and an outflowing resin body forming area, both of which are covered with resin by a mold, and a connecting resin body forming area connecting the two areas, wherein the outflowing resin body forming area is a front and back surface. The connecting resin body forming region is a lead frame provided only on one surface of the front and back surfaces, and after being clamped to the upper and lower molds of a mold, the sealing body forming region and the connecting resin body forming are formed by molding. A lead frame in which a sealing body and a connection resin body and an outflow resin body are formed in a region and an outflow resin body formation region, and the connection resin body and the outflow resin body are cut and removed by cutting a lead frame portion, The outflow resin body formation region is formed of a support portion and an opening for supporting the outflow resin body, and is formed in the connection resin body formation region. Hole is provided in the lead frame part.

(6) A mold die comprising a lower die and an upper die, and having at least a cavity for forming a sealing body, a cavity for forming a resin outflow body, and a passage connecting the two cavities by mold clamping. The outflow resin body forming cavity is provided over the lower mold and the upper mold, and the passage is provided in one of the lower mold and the upper mold, and the upper mold is not provided with the passage. Alternatively, the lower mold is provided with a fixed resin body forming cavity which is continuous with the outflow resin body forming cavity and faces at least a part of the passage channel.

According to the means (1), when a resin body is formed on one surface side of the lead frame portion to be cut and removed in the molding step, the resin body and the lead frame portion to be cut and removed are integrated. From the molding, when the cut-removed lead frame portion is cut, the resin body does not peel off from the small piece due to the cut-removed lead frame portion that has been cut and separated, and the small piece is separated from the resin body. It is possible to prevent defects such as semiconductor chip cracks, package cracks, lead bending, and the like caused by peeling.

According to the means (2), a hole is provided in a portion of the lead frame to be cut and removed where the resin body overlaps, and then molding is performed. That is, in the lead frame, a hole is provided in the connecting resin body forming region (the lead frame portion to be cut and removed) between the sealing body forming region and the outflowing resin body forming region. As a result, the joining strength between the connecting resin body formed in the connecting resin body forming region and the lead frame portion is increased, and at the time of cutting, the supporting portion supporting the outflowing resin body is broken and the cut-out portion is removed. Even when the lead frame portion is cut, the connecting resin body (resin body) is less likely to be separated from the small piece by the cut and removed lead frame portion, and the semiconductor chip crack, package crack, The occurrence of defects such as lead bending can be prevented.

According to the means (3), at the time of forming the resin body, a fixed resin body connected to the resin body is formed on the back surface of the surface on which the resin body is formed by molding. That is, when molding a lead frame having a sealing body forming region, a flowing resin body forming region, and a connecting resin body forming region connecting the both regions, the lead resin region is connected to the flowing resin body forming region and the connecting resin body is provided. In order not to form a fixed resin body in a region reaching the cut-and-removed lead frame part surface, the support resin is then cut to remove the outflowing resin body from the lead frame and cut the cut-to-be-removed lead frame part. When the connection resin body is cut and removed from the lead frame by doing so, a small piece by the cut-and-removed lead frame portion is sandwiched between the connection resin body (resin body) and the fixed resin body integrated with the connection resin body. Therefore, the semiconductor chip crack and the package crack caused by the separation of the small piece from the resin body Occurrence of defects such as a lead bending can be prevented.

According to the means (4), the cutting and removing of the outflow resin body and the connection resin body are performed by connecting the lead frame portion supporting the outflow resin body and the lead frame portion supporting the connection resin body. Cutting the lead frame portion into a shaped shape, the connection resin body (resin body)
This prevents the lead frame portion from peeling off, thereby preventing the occurrence of defects such as semiconductor chip cracks, package cracks, and bent leads due to the peeling of the lead frame portion.

According to the means (5), in the lead frame, a hole is provided in the connecting resin body forming area (the lead frame portion to be cut and removed) between the sealing body forming area and the outflowing resin body forming area. ing. Therefore, at the time of molding in the manufacture of the resin-encapsulated semiconductor device, the melted resin enters the holes, so that the joining strength between the connecting resin body formed in the connecting resin body forming region and the lead frame portion is increased, and cutting is performed. At this time, the connecting resin body (resin body) is less likely to be separated from the small piece formed by the cut-and-removed lead frame portion even when the support portion supporting the outflow resin body is broken and the cut-and-removed lead frame portion is cut. . As a result, by using the present lead frame, it is possible to prevent defects such as a semiconductor chip crack, a package crack, and a bent lead due to the separation of the small piece from the resin body.

According to the means (6), in the molding die comprising a lower die and an upper die used for manufacturing a semiconductor device, the cavity for forming the outflow resin body extends over the lower die and the upper die. Provided, the passage flow path is provided in one of the lower mold or the upper mold, and the upper mold or the lower mold in which the passage flow path is not provided is connected to the outflow resin body forming cavity and the passage flow path is provided. Since the fixed resin body forming cavity facing at least a part of the lead frame is provided, after the molding, the cut-and-removed lead frame portion has the connecting resin body formed on one surface and the other surface The fixed resin body is formed on the side, and the connecting resin body and the fixing resin body are integrated via the outflowing resin body. Therefore, the lead frame portion to be cut and removed is separated from the connecting resin body (resin body). When the cut and removed lead frame portion is cut or the like, separation of the connecting resin body (resin body) from the small piece due to the cut and removed lead frame portion does not occur, and the small piece is separated from the resin body. Chip crack, package crack,
The occurrence of defects such as lead bending can be prevented.

[0039]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

Embodiment 1 In manufacturing a semiconductor device, first, a lead frame 1 as shown in FIG. 2 is prepared. The lead frame 1 is formed by etching or patterning an iron-nickel alloy plate, a copper plate, a copper alloy plate, or the like having a thickness of about 0.15 to 0.2 mm by etching or precision press.

The lead frame 1 includes a pair of outer frames 16 extending in parallel, and an inner frame 17 orthogonal to the pair of outer frames 16 and connecting the pair of outer frames 16. A rectangular support plate (tab) is provided at the center of a frame formed by the pair of outer frames 16 and two adjacent inner frames 17.
19 are located. This support plate 19 is connected to the outer frame 16.
Is supported by a support lead 20 extending from the inside.
The support lead 20 is bifurcated on the way, and the bifurcated side is fixed to the outer frame 16. Although not shown, a V-shaped groove (notch) is provided on the back surface of the base of the support lead 20 along the dividing line to facilitate division at the base.

The central portion of the outer frame 16 in which the support leads 20 extend becomes wider, and one of the wide portions 21 is provided with a rectangular outflow resin body forming region 22. The outflow resin body formation region 22 is formed by a rectangular opening 23, and the opening 23 has a thin support portion 24 extending across the center thereof and extending parallel to the outer frame 16.
have. Although not shown, a V-shaped groove is provided on the back surface along the dividing line, although not shown, since the root portion of the support portion 24 is a broken portion.

The outflow resin body forming area 22 is an area where the outflow resin body formation cavity (flow cavity) is located in the mold, and the outflow resin body is formed over the front and back of the lead frame by transfer molding. . Therefore, the outflow resin body formation region 22
Exist on the front and back surfaces of the lead frame 1.

On the other hand, a plurality of leads 5 extend from the inside of the inner frame 17 toward the inside of the frame. These leads 5 are parallel to the outer frame 16. The lead 5 is supported by a tie bar (dam) 25 in the middle. One end of the outermost tie bar 25 is connected to the wide portion 21 of the outer frame 16. Further, some of the leads 5 are bent closer to the center of the frame than the tie bars 25, and the leading ends thereof are exposed to the vicinity of the support plate 19.

The region inside the wide portion 21 and the tie bar 25 becomes a sealing body forming region 26. The sealing body forming regions 26 are present on the front and back surfaces of the lead frame 1, respectively.

The back surface (lower surface) of the lead frame portion between the sealing body forming area 26 and the outflowing resin body forming area 22 has a constant width as the connecting resin body forming area 27. The connecting resin body forming region 27 is a region for guiding the resin melted from the sealing body forming region 26 to the outflowing resin body forming region 22 during transfer molding.

The connecting resin body forming region 27 is a region which is finally cut and removed. The portion to be cut and removed is referred to as a cut-and-removed lead frame portion 9. The lead frame portion 9 to be cut and removed is connected to the connection resin body forming region 2.
7, or the shape of the edge of the cut-and-removed lead frame portion 30 may be larger than the connecting resin body forming region 27 located outside the connecting resin body forming region 27. For example, a portion shown by a dotted line in FIG. 2 is a cutting line. Although not shown, a V-shaped groove is provided along the cutting line.

A hole 31 is provided at the center of the cut / removed lead frame portion 9. The hole 31 is filled with the melted resin during molding. When the resin enters the hole 31, the connecting resin body formed on the lower surface of the lead frame 1 has a larger bonding force with the lead frame 1 (the lead frame portion 9 to be cut and removed). Therefore, by cutting the lead frame portion 9 to be cut and removed, the lead frame portion 9 to be cut and removed becomes an independent small piece 14. The small piece 14 is formed by the resin that has entered the hole 31. From the body).

In the lead frame 1 shown in FIG. 2, the rear center portion at the front is the gate position during transfer molding.

On the other hand, a guide hole 35 is provided in the outer frame 16 of the lead frame 1. This guide hole 35
Is used as a guide for transferring and positioning the lead frame 1. Note that the lead frame 1 is plated at desired locations as needed.

Next, a method of manufacturing an SOJ type semiconductor device using such a lead frame 1 will be described.

As shown in FIG. 2, after the semiconductor chip 36 is fixed on the support plate 19 of the lead frame 1, the electrodes (not shown) of the semiconductor chip 36 are connected to the tips of the leads 5 by conductive wires 37.

Next, as shown in FIG. 3, the lead frame 1 on which chip bonding and wire bonding have been completed is sandwiched (clamped) and molded in a mold 40 of a conventional transfer molding apparatus. The mold 40 includes a lower mold 41 and an upper mold 42, and the runner 4 is a space through which the melted resin flows by clamping.
3, a gate 44, a sealing body forming cavity 45, a passage channel 46, an outflow resin body forming cavity (flow cavity) 47 and the like are formed.

Each part is filled with a resin and cured by a mold so as to be hardened. The runner 4
3, a gate 44 and a passage channel 46 are provided on the lower surface (back surface) of the lead frame 1 and
5 and the outflow resin body forming cavity 47 are provided over the front and back surfaces of the lead frame 1. As a result, the sealing body (package) 2 is formed in the sealing body forming cavity 45, and the outflow resin body forming cavity 4 is formed.
The outflow resin body 3 is formed in 7, and the connecting resin body 4 is formed in the passage channel 46.

FIG. 4 is a perspective view showing the lead frame 1 after molding, and FIG. 5 is a sectional view. The package 2 is formed on the front and back surfaces at the center of the lead frame 1, and the outflow resin body 3 is formed on the rear wide portion 21. The connecting resin body 4 is formed on the back surface of the lead frame portion 9 to be cut and removed. The resin portion that has entered the hole 31 of the cut-and-removed lead frame portion 9 is integrated with the connecting resin body 4. As a result, the adhesive strength between the connecting resin body 4 and the lead frame portion 9 to be cut and removed increases.

Further, as shown in FIG. 4 by the transfer molding, the resin leaks into a region surrounded by the package 2, the tie bar 25, the lead 5 and the like, so that a so-called resin burr 52 is generated.

FIG. 4 and FIG.
The resin body cured in three parts is not shown. Since the resin body cured at the runner 43 breaks at the gate when the lead frame 1 is removed from the mold, the resin body does not adhere to the lead frame 1 in the state.

Next, unnecessary cutting and removal of the lead frame portion and cutting and molding of the lead are performed on the lead frame 1 to manufacture a resin-sealed semiconductor device 55 as shown in FIG.

For example, (1) cutting and removing the outflow resin body 3 and the connecting resin body 4 connected to the outflow resin body 3;
Cutting and removing the resin burr 52, (3) cutting and removing the support lead 20 and the tie bar 25, (4) cutting of the lead 5,
(5) The molding and processing of the lead 5 proceeds.

FIG. 6 is a schematic exploded perspective view showing a part of the outflow resin body cutting mechanism 10 in the cutting device. Die 1
The punch 13, which descends relatively to 1, cuts and removes the outflow resin body 3 and the connection resin body 4 of the lead frame 1 by being guided by the punch guide 12.

FIG. 7 is a partial sectional view showing the lead frame 1 set in the outflow resin body cutting mechanism 10, FIGS. 1 and 8
Is a partial cross-sectional view showing a state in which the outflow resin body 3 and the connecting resin body 4 are cut and separated by the outflow resin body cutting mechanism 10.

The die 11 supports the bottom of the package 2 and the wide portion 21 outside the connecting resin body 4, and the punch guide 12 sandwiches the wide portion 21 with the die 11.

The outflow resin body 3 is formed in the outflow resin body formation area 22 of the lead frame 1, and the outflow resin body formation area 22 is formed by an opening 23 formed in the lead frame 1.
And a support portion 24 provided so as to straddle the opening portion 23.
It is formed with. Therefore, the outflow resin body 3 formed by the mold is configured to be supported by the support portion 24.
Is broken and the outflow resin body 3 falls downward. Further, since the V-shaped groove is provided along the dividing line of the support portion 24, the support portion 24 is easily broken.

Therefore, the supporting portion is easily cut by pushing down the outflow resin body 3 with the depressed pressing surface 13a of the punch 13.

On the other hand, since the connecting resin body 4 is attached to the lead frame portion 9 to be cut and removed, the connecting resin body 4 is removed by cutting the lead frame portion 9 to be cut and removed. That is, the lead frame portion 9 to be cut is cut along both side edges of the connection resin body 4. In addition, this cutting is performed by the connecting resin
May be cut off at a predetermined distance from both side edges of the lead frame.

Since the V-shaped groove is also provided along the cut line of the lead frame portion 9 to be cut and removed, the lead frame portion 9 to be cut and removed can be easily cut.

The lead frame portion 9 to be cut and removed is cut by pressing down the pressing surface 13 b of the punch 13.

Since the interface between the package 2 and the connecting resin body 4 is narrowly narrowed, if the lead frame portion 9 to be cut and removed is pushed down by the projected pressing surface 13b of the punch 13, the interface is broken at the interface. Therefore, punch 1
3 and the outflow resin body 3 and the connecting resin body 4
The punched piece 8 made of the same is separated from the lead frame 1 as shown in FIGS.

FIG. 9 is a perspective view of the lead frame 1 from which the connecting resin body 4 and the outflowing resin body 3 have been cut and removed.
0 is a perspective view showing the punched piece 8 cut and separated.

The cut lead frame portion 9 to be cut becomes small pieces 14 as shown in FIG. 10, but as shown in FIG. Since the resin enters, the anchor effect is generated, the bonding strength between the small piece 14 and the connection resin body 4 is increased, and the small piece 14 stuck on the upper surface of the connection resin body 4 is formed.
Is difficult to peel off from the punched piece 8, that is, the connecting resin body 4.

The punched pieces 8 are removed at predetermined locations by a vacuum vacuum mechanism (not shown).

Thereafter, in the lead frame 1, the cutting and removing of the resin burr 52, the cutting and removing of the support lead 20 and the tie bar 25, and the cutting of the lead 5 are sequentially performed as described above. Further, the leads of the single semiconductor device are formed, and the SOJ semiconductor device 55 as shown in FIG. 11 is manufactured.

Since the small pieces 14 do not stick to the punch 13, the small pieces 14 and the resin lumps adhering to the small pieces 14 do not fall off in the subsequent processing, and the small pieces 14 and the resin lumps do not fall. The resulting product defects (semiconductor chip cracks, package cracks, bent leads, etc.) do not occur, and semiconductor devices of stable quality can be manufactured with high yield.

Further, since the resin block does not adhere to the driving portion of the transport mechanism of the lead frame 1 or the cutting / molding die, defective transport of the lead frame 1 does not occur, and the cutting / molding die is not damaged. Since it can be prevented, the operating rate of the cutting / forming apparatus does not decrease. As a result, it is possible to achieve a reduction in product cost from an improvement in manufacturing yield and an improvement in productivity.

In the first embodiment, the outflowing resin body 3 and the connecting resin body 4 are cut and removed by the outflowing resin body cutting mechanism 10. However, the resin burr 52 may be cut and removed at the same time.

(Embodiment 2) FIG. 12 is a cross-sectional view of a molding die showing a transfer mold state in manufacturing a semiconductor device according to Embodiment 2 of the present invention. FIG. 13 shows a punched piece separated in manufacturing a semiconductor device. FIG.

Lead frame 1 used in Embodiment 2
May use the lead frame 1 used in the first embodiment, or in the lead frame 1 of the first embodiment,
A structure in which the hole 31 is not provided in the lead frame portion 9 to be cut and removed may be used. In the second embodiment, the lead frame 1 without the hole 31 is used.

The mold 40 of the second embodiment comprises a lower mold 41 and an upper mold 42, and at least a cavity 45 for forming a sealing body and a cavity (flow cavity) 47 for forming an outflow resin body, and The structure has a passage 46 that connects both cavities. Further, the flow cavity 47 is provided over the lower mold 41 and the upper mold 42, and the passage channel 46 is provided in the lower mold 41 and the upper mold 42 in which the passage channel 46 is not provided. Is provided with a fixed resin body forming cavity 61 which is connected to the flow cavity 47 and faces at least a part of the passage channel 46.

According to such a mold 40, at the time of molding, the fixed resin body 63 is formed by the resin 62 filled in the fixed resin body forming cavity 61.
The fixing resin body 63 is integrated with the connecting resin body 4 via the outflowing resin body 3 and is held by the fixing resin body 63 and the connecting resin body 4 so as to sandwich the lead frame portion 9 to be cut and removed.

As a result, by cutting the lead frame portion 9 to be cut and removed and the support portion 24 by the outflow resin body cutting mechanism 10, the punched piece 8 is formed as shown in FIG. Small piece 14
Are punched pieces 8 to be sandwiched by the connecting resin body 4, the outflowing resin body 3, and the fixed resin body 63, in other words, the connecting resin body 4
No peeling from

Therefore, it is possible to prevent the occurrence of defects such as semiconductor chip cracks, package cracks, lead bending, and the like due to peeling of the cut / removed lead frame portion 9 from the connecting resin body (resin body) 4.

(Embodiment 3) FIG. 14 is a perspective view showing a part of a lead frame used in manufacturing a semiconductor device according to Embodiment 3 of the present invention.

In the third embodiment, the lead frame 1
The portion along the cutting line of the cut / removed lead frame portion 9 has a structure in which the cut / removed lead frame portion 9 is supported by thin supporting portions 64 arranged intermittently. This facilitates the cutting and removal of the lead frame portion 9 to be cut and removed.

(Embodiment 4) In Embodiment 4, the outflow resin body 3 and the connection resin body 4 are cut and removed by a lead frame portion that supports a support portion 24 that supports the outflow resin body 3, The lead frame portion is cut into a shape in which the lead frame portions supporting the connection resin body 4 are connected. That is, the lead frame portion including the outflow resin body 3 and the connection resin body 4 is largely cut into a square shape (FIG. 1).
4).

As a result, since the lead frame portion supporting the outflow resin body 3 and the lead frame portion supporting the connection resin body 4 are integrated, the resin body does not separate from the cut lead frame portion. Semiconductor chip crack, package crack caused by peeling,
The occurrence of defects such as lead bending can be prevented.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

[0087]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) In the molding step in the manufacture of a semiconductor device, the cut-and-removed lead frame portion cut and separated in the subsequent cutting and removing step is not cut and removed so as not to be separated from the resin body to be cut and removed. A hole is formed in the lead frame portion so that the resin enters the hole, or the cut and removed lead frame portion is sandwiched by the resin body. Small pieces are not peeled off. Therefore, the small pieces do not stick to the punch of the outflow resin body cutting mechanism, and defects such as semiconductor chip cracks, packages, lead bending, and the like due to dropping of small pieces and resin lumps adhering to the small pieces do not occur. Improvement can be achieved.

(2) In the step of cutting and removing the lead frame in the manufacture of the semiconductor device, the detachment of the small pieces due to the cut and removed lead frame portion and the detachment of the resin lumps adhering to the small pieces can be prevented. The resulting breakage of the cutting / molding die can be prevented.

(3) In the step of cutting and removing the lead frame in the manufacture of the semiconductor device, it is possible to prevent the detachment of the small pieces and the resin lump adhering to the small pieces in the lead frame portion to be cut and removed. Since it is possible to prevent the occurrence of troubles in the device drive system such as the transport mechanism, it is possible to improve the operation rate of the device and improve the productivity.

(4) According to the above (1) to (3), a reduction in the manufacturing cost of the semiconductor device can be achieved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a cut and removed state of an outflow resin body and a connection resin body portion in manufacturing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a lead frame used in manufacturing the semiconductor device of the first embodiment.

FIG. 3 is a cross-sectional view of a mold portion showing a transfer mold state in manufacturing the semiconductor device of the first embodiment.

FIG. 4 is a perspective view showing a lead frame after transfer molding in manufacturing the semiconductor device of the first embodiment.

FIG. 5 is a cross-sectional view showing the lead frame after transfer molding in manufacturing the semiconductor device of the first embodiment.

FIG. 6 is a schematic view showing an outflow resin body cutting mechanism for cutting and separating outflow resin bodies and the like in the manufacture of the semiconductor device of the first embodiment.

FIG. 7 is a partial cross-sectional view showing a lead frame set as an outflow resin body cutting mechanism in the manufacture of the semiconductor device of the first embodiment.

FIG. 8 is a partial cross-sectional view showing a state in which the outflow resin body and the connecting resin body are cut and separated by the outflow resin body cutting mechanism in the manufacture of the semiconductor device of the first embodiment.

FIG. 9 is a perspective view of the lead frame in which the outflow resin body and the connection resin body are cut and removed in the manufacture of the semiconductor device of the first embodiment.

FIG. 10 is a perspective view showing an outflow resin body and the like separated in the manufacture of the semiconductor device of the first embodiment.

FIG. 11 is a perspective view of a semiconductor device manufactured by manufacturing the semiconductor device of the first embodiment.

FIG. 12 is a cross-sectional view of a molding die showing a transfer molding state in manufacturing the semiconductor device according to the second embodiment of the present invention.

FIG. 13 is a perspective view showing an outflow resin body and the like separated in the manufacture of the semiconductor device of the second embodiment.

FIG. 14 is a perspective view showing a part of a lead frame used in manufacturing a semiconductor device which is Embodiment 3 of the present invention.

FIG. 15 is a perspective view showing a lead frame in which a sealing body, an outflow resin body, and the like are formed by transfer molding in the manufacture of a semiconductor device by the present applicant.

FIG. 16 is a front view showing a lead frame in which a sealing body, an outflow resin body, and the like are formed by transfer molding in the manufacture of a semiconductor device by the present applicant.

FIG. 17 is a partial cross-sectional view showing a cut-off state of the outflow resin body and the connection resin body in the manufacture of the semiconductor device by the present applicant.

FIG. 18 is a perspective view of a lead frame obtained by cutting and removing portions of an outflow resin body and a connection resin body in the manufacture of a semiconductor device by the present applicant.

FIG. 19 is a perspective view showing an outflow resin body and the like separated in the manufacture of a semiconductor device by the present applicant.

FIG. 20 is a perspective view of a part of the lead frame showing a state where a crack has occurred in a package portion.

FIG. 21 is a perspective view showing a part of the lead frame showing a state in which an indent is generated in a lead portion.

[Explanation of symbols]

1 ... lead frame, 2 ... sealed body (package), 3 ...
Outflow resin body, 4 ... connection resin body, 5 ... lead, 7 ... dent,
8: punched piece, 9: lead frame part to be cut and removed,
10: Outflow resin body cutting mechanism, 11: Die, 12: Punch guide, 13: Punch, 13a, 13b: Pressed surface, 14
... small pieces, 15 ... cracks, 16 ... outer frame, 17 ... inner frame, 1
9 ... support plate (tab), 20 ... support lead, 21 ... wide part, 22 ... outflow resin body formation area, 23 ... opening, 24 ...
Supporting portion, 25: Tie bar (dam), 26: Sealing body formation region, 27: Connection resin body formation region, 31: Hole, 35: Guide hole, 36: Semiconductor chip, 37: Wire, 40: Mold, 41 ... lower mold, 42 ... upper mold, 43 ... runner,
44: gate, 45: cavity for forming a sealing body, 46:
Passage passage 47, a cavity (flow cavity) for forming an outflow resin body, 52, resin burrs, 55, a semiconductor device,
61: cavity for forming a fixed resin body, 62: resin, 63
... fixed resin body, 64 ... support part.

Claims (8)

[Claims] 1. A molding step of molding a predetermined area of a lead frame with a resin and covering with a sealing body, and a cutting and removing step of cutting and removing an unnecessary portion of the lead frame and an unnecessary portion of a resin body generated by the molding. Wherein the cutting and removing step includes a step of cutting and removing, from the lead frame, a cut-and-removed lead frame portion having the resin body formed on one surface side, and wherein the molding step includes A method of manufacturing a semiconductor device, comprising molding a body and the lead frame portion to be cut and removed into one body. 2. The method of manufacturing a semiconductor device according to claim 1, wherein a hole is provided in a portion of the lead frame to be cut and removed where the resin body overlaps, and then molding is performed. 3. The method of manufacturing a semiconductor device according to claim 1, wherein at the time of forming the resin body, a fixed resin body connected to the resin body is formed on a back surface of a surface on which the resin body is formed. . 4. A sealing body forming area and an outflowing resin body forming area, both of which are covered with a resin by a mold, and a connecting resin body forming area connecting the two areas, wherein the connecting resin body forming area is cut by the cut resin. A step of preparing a lead frame provided on the removed lead frame portion, wherein the outflow resin body formation region is provided on the front and back surfaces, and wherein the connection resin body formation region is provided only on one surface of the front and back surfaces; A molding step of forming a sealing body, a coupling resin body, and an outflow resin body in the body formation area, the connection resin body formation area, and the outflow resin body formation area, and cutting the lead frame portion to be cut and removed and other lead frame portions Cutting and removing step of cutting and removing the connecting resin body and the outflowing resin body from the lead frame by the In the manufacturing method, the outflow resin body formation region of the lead frame is formed with an opening having a support portion for supporting the outflow resin body, and a hole is provided in a lead frame portion of the connection resin body formation region. In advance, after that, by performing molding, and then cutting the support portion or the lead frame portion supporting the support portion to cut and remove the outflow resin body from the lead frame, and cutting the cut-to-be-removed lead frame portion, 2. The method according to claim 1, wherein the connecting resin body is cut and removed from a lead frame. 5. A sealing body forming area and an outflowing resin body forming area, both of which are covered with a resin by a mold, and a connecting resin body forming area connecting the two areas, wherein the connecting resin body forming area is formed by the cutting. A step of preparing a lead frame provided on the removed lead frame portion, wherein the outflow resin body formation region is provided on the front and back surfaces, and wherein the connection resin body formation region is provided only on one surface of the front and back surfaces; A molding step of forming a sealing body, a coupling resin body, and an outflow resin body in the body formation area, the connection resin body formation area, and the outflow resin body formation area, and cutting the lead frame portion to be cut and removed and other lead frame portions Cutting and removing step of cutting and removing the connecting resin body and the outflowing resin body from the lead frame by the In the manufacturing method, the outflow resin body formation region of the lead frame is formed with an opening having a support portion that supports the outflow resin body, and in the mold, the outflow resin body formation region is connected to the outflow resin body formation region, and A fixed resin body is formed in a region reaching the cut-removed lead frame part surface where the connecting resin body is not provided, and then the outflowing resin body is removed from the lead frame by cutting the support portion or the lead frame portion supporting the support portion. 2. The method according to claim 1, wherein the connecting resin body is cut and removed from the lead frame by cutting and removing the lead frame portion to be cut and removed. 6. The cutting and removing of the outflow resin body and the connection resin body is performed by cutting the lead frame portion into a shape in which a lead frame portion supporting the outflow resin body and a lead frame portion supporting the connection resin body are connected. The method of manufacturing a semiconductor device according to claim 4, wherein: 7. A sealing body forming area and an outflowing resin body forming area, both of which are covered with a resin by a mold, and a connecting resin body forming area connecting the two areas, wherein the outflowing resin body forming area is provided on the front and back surfaces. The connection resin body forming region is a lead frame provided only on one surface of the front and back surfaces, and is sealed by the upper and lower dies of a mold and then molded to form the sealing body formation region and the connection resin body formation region. And a lead frame in which a sealing body, a connection resin body, and an outflow resin body are formed in the outflow resin body formation region, and the connection resin body and the outflow resin body are cut and removed by cutting a lead frame portion, The outflow resin body formation region is formed of a support portion and an opening for supporting the outflow resin body, and a lead hole of the connection resin body formation region. A lead frame having holes in the frame portion. 8. A molding die comprising a lower die and an upper die, and having at least a sealing body forming cavity and an outflow resin body forming cavity by a mold clamping, and a passage channel connecting the two cavities, The outflow resin body forming cavity is provided over the lower mold and the upper mold, and the passage channel is provided in one of the lower mold and the upper mold, and the upper mold where the passage channel is not provided or A lower mold is provided with a cavity for forming a fixed resin body, which is connected to the cavity for forming an outflow resin body and faces at least a part of the passage channel.