JPH1076220A - 多孔質又は通気性の基材に液状体を塗布する方法 - Google Patents
多孔質又は通気性の基材に液状体を塗布する方法Info
- Publication number
- JPH1076220A JPH1076220A JP25097196A JP25097196A JPH1076220A JP H1076220 A JPH1076220 A JP H1076220A JP 25097196 A JP25097196 A JP 25097196A JP 25097196 A JP25097196 A JP 25097196A JP H1076220 A JPH1076220 A JP H1076220A
- Authority
- JP
- Japan
- Prior art keywords
- porous
- air
- liquid material
- substrate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000007788 liquid Substances 0.000 title abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 87
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000011344 liquid material Substances 0.000 claims description 84
- 239000000758 substrate Substances 0.000 claims description 62
- 238000007664 blowing Methods 0.000 claims description 25
- 239000011148 porous material Substances 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 abstract description 5
- 238000005507 spraying Methods 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 19
- 239000004744 fabric Substances 0.000 description 7
- 239000004831 Hot glue Substances 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 238000005187 foaming Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25097196A JPH1076220A (ja) | 1996-09-02 | 1996-09-02 | 多孔質又は通気性の基材に液状体を塗布する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25097196A JPH1076220A (ja) | 1996-09-02 | 1996-09-02 | 多孔質又は通気性の基材に液状体を塗布する方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003302609A Division JP2004000996A (ja) | 2003-08-27 | 2003-08-27 | 基材に塗布材を塗布する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1076220A true JPH1076220A (ja) | 1998-03-24 |
| JPH1076220A5 JPH1076220A5 (enExample) | 2004-09-09 |
Family
ID=17215758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25097196A Pending JPH1076220A (ja) | 1996-09-02 | 1996-09-02 | 多孔質又は通気性の基材に液状体を塗布する方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1076220A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004351413A (ja) * | 2003-05-01 | 2004-12-16 | Nordson Corp | 液体の塗布及び乾燥方法 |
| WO2007086530A2 (en) | 2006-01-24 | 2007-08-02 | Nordson Corporation | Method of applying and drying liquid |
| WO2007086531A1 (en) * | 2006-01-24 | 2007-08-02 | Nordson Corporation | Method of applying and drying liquid |
-
1996
- 1996-09-02 JP JP25097196A patent/JPH1076220A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004351413A (ja) * | 2003-05-01 | 2004-12-16 | Nordson Corp | 液体の塗布及び乾燥方法 |
| WO2004096450A3 (en) * | 2003-05-01 | 2005-01-27 | Nordson Corp | Method of applying and drying liquid |
| WO2007086530A2 (en) | 2006-01-24 | 2007-08-02 | Nordson Corporation | Method of applying and drying liquid |
| WO2007086531A1 (en) * | 2006-01-24 | 2007-08-02 | Nordson Corporation | Method of applying and drying liquid |
| JP2007196093A (ja) * | 2006-01-24 | 2007-08-09 | Nordson Corp | 液体の塗布及び乾燥方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051118 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051205 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060203 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070725 |