JPH1074673A - Manufacture of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a small electronic component, wherein its four sides except its edge faces are successively treated. SOLUTION: The upper surface of a product (electronic components) is treated at the first treatment section 5 of a first transfer table 3, the lower surface of the product is treatment at the second treatment section 6, the product is transferred onto a second transfer table 10 provided at a right angle with the first transfer table 3 keeping in the same attitude, one of the sides adjoining to the treated surfaces of the product is treated at the third treatment section 12, and the other opposed side is treatment at the fourth treatment section 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device which performs treatment on four sides while controlling the position of small electronic parts and the like requiring inspection or stamping on the upper and lower surfaces except for the end surface of the hexahedron, and on both sides. The present invention relates to a method for manufacturing a part.

[0002]

2. Description of the Related Art At present, a plurality of slits are provided as one of highly reliable and economical treatment methods for inspecting the appearance and marking of upper and lower surfaces and both side surfaces excluding the end surfaces of small electronic components. 2. Description of the Related Art A method is known in which a disk-shaped transfer table and a suction block that suctions electronic components using vacuum are used while changing the angle of the electronic components.

[0003]

However, in recent years,
As electronic components have become smaller and smaller, and the capacitance has increased as seen in multilayer capacitors, the end faces can be easily identified because external electrodes are provided. Therefore, it is difficult to reliably and economically determine and treat the upper and lower surfaces and both side surfaces both artificially and in terms of equipment. Therefore, when the conventional method is used to perform a process such as appearance inspection or marking on the four surfaces excluding the end surfaces,
There is a case where electronic components are easily transferred due to equipment capacity, and there are cases where electronic components are shipped as products without inspecting the surface that originally requires visual inspection, which has become a major problem in the reliability of electronic components. Was.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and provides a method for improving the reliability of the upper and lower surfaces and both side surfaces excluding the end surface of a small electronic component such as a multilayer capacitor by using a method of improving the reliability economically, for example, appearance inspection, stamping, etc. It is an object of the present invention to provide a production method capable of performing the above-mentioned treatment.

[0005]

SUMMARY OF THE INVENTION According to the present invention, an electronic component such as a small electronic component having a surface on which upper and lower surfaces and both sides are difficult to distinguish and which requires a process such as an appearance inspection or a seal is used. While transporting while maintaining the transport position, a first transport unit including at least a first treatment unit and a second treatment unit,
Furthermore, while being transported while maintaining the same transport attitude, which is orthogonal to the first transport section, it has a second transport section having at least a third treatment section and a fourth treatment section, and includes first to fourth treatments. Is what you do.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1 of the present invention relates to a method for manufacturing a rectangular or cubic electronic component, wherein at least a first treatment section and a first treatment section are provided between a supply section and an extraction section of the electronic component. A first transport unit having two treatment units, and a second transport unit configured to be orthogonal to the transport unit and having at least a third treatment unit and a fourth treatment unit, and the first transport unit and the second At each position in the transport unit, the electronic component is configured to maintain the same transport attitude, and further, in the first treatment unit of the first transport unit, after treating any one surface of the electronic component, The opposing surface is treated by the second treatment unit, and then transferred to the second conveyance unit while maintaining the same conveyance posture, and then the third surface is applied to one side contacting the surface on which the first and second treatments have been performed. After performing the treatment, perform a fourth treatment on the opposite side. It is obtained by the configuration. According to this configuration, since the electronic components at the respective positions of the first treatment unit and the second treatment unit, and the third treatment unit and the fourth treatment unit maintain the same transport posture, troubles on the production equipment are large. Product transfer, which is a factor, is limited to only one location from the first transport unit to the second transport unit, improving the reliability and stability of equipment, enabling stable equipment operation, and improving mass productivity. It is possible, and the reliability and economy as a product can be naturally improved.

According to a second aspect of the present invention, the first transport section has a first fixed base and a first transport table that operates intermittently on the first fixed base, and the second transport section has a second transport section. The unit has a second fixed base and a second transfer table that operates intermittently with respect to the second fixed base, and vacuums the electronic components from the first transfer table to the second transfer table while maintaining the same transfer posture. It is to suck. This makes it possible to smoothly transfer from the first transfer table to the second transfer table without rotating the surface of the electronic component,
The trouble associated with the conventional transfer is eliminated, which is preferable in terms of equipment configuration and reliability of electronic components.

[0008] The invention described in claim 3 of the present invention is the first,
And the table of the second transport unit is a disk having a drive shaft in the center, and a plurality of slits slightly larger than the outer dimensions of the electronic component for inserting and transporting the electronic component around the circumference. 3. The method for manufacturing an electronic component according to claim 1, wherein the electronic component is formed. This is to eliminate the lateral displacement of the inserted electronic component in the transport table that rotates intermittently and to improve the working accuracy in a predetermined treatment section.

[0009] The invention described in claim 4 of the present invention is characterized in that:
4. The method for manufacturing an electronic component according to claim 3, wherein the table of the second transport section is made of aluminum, and the inner surfaces of the plurality of slits formed in the circumferential portion are coated with a wear-resistant substance. This is to reduce the moment of inertia of the transfer table that makes an intermittent circular motion to correctly stop at the fixed position of each treatment unit. The reason why the inner surface of the slit is coated with a wear-resistant substance is to prevent scratches from being generated on the inner surface of the slit that comes into contact with the electronic component to be inserted and conveyed or the contact surface of the electronic component.

[0010] The invention described in claim 5 of the present invention is characterized in that:
The method for manufacturing an electronic component according to claim 1, wherein the fourth treatment is at least one operation such as inspection, processing, stamping, or surface treatment, and the operation is performed alone or in combination. It is. This defines the work to be performed in the transport unit.

(Embodiment 1) Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking as an example the case of performing an appearance inspection on four sides excluding an end of a multilayer ceramic capacitor as an electronic component.

FIG. 1 is a schematic view of a transfer section in the present invention, FIG. 2 is an enlarged schematic view of a main part of FIG. 1, and FIG. 3 is a multilayer ceramic capacitor.

First, according to the manufacturing method of the present invention, as shown in FIG. 3, a rectangular parallelepiped or cubic multilayer ceramic capacitor (hereinafter, referred to as a product) 1 is provided from the component supply section 2 of FIG. The product 1 is fed into the slit 4 with its attitude regulated, and the product 1 slides between the first fixed bases 21 in FIG. 2A with the position regulated by the slit 4 provided therein by the rotation of the first transfer table 3. Transported to Here, the first transfer table 3 is installed on the first fixed base 21 so as to be intermittently rotatable, and slits 4 are provided on the outer periphery of the first transfer table 3 at equal intervals. The products 1 are sequentially supplied to the slits 4 of the first transport table 3. The supplied product 1 is rotated by the rotation of the first transfer table 3 so that the first treatment section 5
2A, and the image of the appearance inspection of the upper surface is set on the upper side of the product 1 in a state where the lower surface of the product 1 is sucked by the vacuum suction unit 22 by the first treatment unit 5 shown in FIG. It is taken into the visual inspection camera 23 and inspected. First treatment unit 5
The product 1 having undergone the visual inspection at step 1 is conveyed to the second treatment section 6 with its position regulated by the rotation of the first conveyance table 3 while maintaining the same conveyance posture at the slit 4. Next, FIG.
The upper surface of the product 1 is sucked by the vacuum suction unit 24 by the second treatment unit 6 shown in (a), and the appearance inspection image of the lower surface is captured and inspected by the appearance inspection camera 25 installed below the product 1. The product 1, which has undergone the first and second inspections, is regulated in position by the rotation of the first transport table 3 while maintaining the same transport attitude in the slit 4, and transported to the primary defective take-out unit 7, where the first treatment unit The product 1 determined to be defective in 5 and the second treatment section 6 is discharged. On the other hand, the product 1 determined as a non-defective product is conveyed to the chute inlet 8 while being regulated by the slit 4 by the rotation of the first conveyance table 3. The product 1 conveyed to the chute inlet 8 is sucked by the vacuum suction hole 9 provided on the second transfer table 10 side, and the first transfer table 3
The chute 8A is maintained in the slit 11 of the second transfer table 10 while maintaining the same transfer posture.
Transferred through. Here, the upper surface and the lower surface of the product 1 are in contact with the side surfaces of the slit 11 of the second transfer table 10, respectively, so that the product 1 is apparently rotated by 90 degrees. Thereafter, the product 1 is set in the same transfer position as the first transfer table 3 by the slit 11 of the second transfer table 10 installed so as to be able to intermittently rotate between the second fixed bases 26 in FIG. It is conveyed so as to slide with its position regulated while keeping it. At the position of the third treatment unit 12 shown in FIG. 1, as shown in FIG. 2B, with one side of the product 1 being suctioned by the vacuum suction unit 27, the appearance inspection image of the other side is transmitted to the appearance inspection camera 28. Captured and inspected. Next, the position of the product 1 is regulated by the rotation of the second transfer table 10 while maintaining the same transfer posture by the slit 11, the product 1 is transferred to the fourth treatment unit 13, and the side surface inspected by the third treatment unit 12 is removed by the vacuum suction unit 29. Product 1
The appearance inspection image on the opposite side is captured by the appearance inspection camera 30 and inspected. The product 1 for which the appearance inspection of both sides has been completed is conveyed to the take-out part 14 of the product 1 while sliding between the second fixed bases 26 while the position is regulated while maintaining the same conveying posture by the slit 11, Based on the results of the appearance inspection of the third and fourth treatment units 12 and 13, the products 1 are taken out for non-defective products and defective products, classified, and stored.
Here, how to classify and store the product 1 based on the measurement result by the appearance inspection is not directly related to the configuration of the present invention, and thus the description is omitted.

In the first embodiment, the product 1
Although the case where the appearance inspection of the upper surface, the lower surface, and both side surfaces is performed has been described, the manufacturing method of the present invention can be applied to the case where some treatment is performed on the four surfaces except the end surface of the product 1.
Further, the manufacturing method of the present invention is applicable not only to the equipment of the rotation mechanism shown in the first embodiment but also to the equipment of the linear motion mechanism. In the present embodiment, the base material of the first and second transfer tables 3 and 10 shown in FIG. 1 is made of metal aluminum, and the slits 4 and 11 provided on the circumference thereof are sprayed with alumina having high wear resistance. The stop position of the first and second transfer tables 3 and 10, which intermittently move at high speed, is not displaced, and the alumina is provided in the slits 4, 11 so that the side of the product 1 is not damaged. It became possible to do.

[0015]

As described above, the structure of the manufacturing method according to the present invention can be applied to the production of small electronic components even if it is difficult to discriminate each of the four surfaces because the upper and lower surfaces and both side surfaces have substantially the same area. A single product transfer process where trouble is likely to occur in the equipment.Electronic components are in the same transport position in each of the first and second treatment units and the third and fourth treatment units. Since the treatment is performed while maintaining the condition, stable equipment operation can be performed without damaging the electronic components, and the reliability and stability of the equipment can be dramatically improved, and the mass productivity can be improved. Things. In addition, as described above, the treatment of the four sides of the upper and lower surfaces and both side surfaces is made a single transfer mechanism, so that the equipment can be simplified and the economic effect on the product can be improved. It is. Therefore, the manufacturing method of the present invention is extremely effective when performing measures such as visual inspection, marking, etc. of four sides excluding the end faces of electronic components that are increasingly miniaturized and formed into chips in the future.

[Brief description of the drawings]

FIG. 1 is a perspective view of a transport unit according to an embodiment of the present invention.

FIGS. 2 (a) and 2 (b) are enlarged perspective views showing a part of the main part constituting section in cross section.

FIG. 3 is a perspective view of a multilayer ceramic capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Product 2 Parts supply part 3 First conveyance table 4 Slit 5 First treatment part 6 Second treatment part 7 Primary defective extraction part 8 Chute inlet 9 Vacuum suction hole 10 Second conveyance table 11 Slit 12 Third treatment part 13 Fourth Treatment unit 14 Take-out unit 21 First fixed base 22 Vacuum suction unit 23 Visual inspection camera 24 Vacuum suction unit 25 Visual inspection camera 26 Second fixed base 27 Vacuum suction unit 28 Visual inspection camera 29 Vacuum suction unit 30 Visual inspection camera

Claims (5)

[Claims] A first transport unit having at least a first treatment unit and a second treatment unit between an electronic component supply unit and an electronic component take-out unit in manufacturing a rectangular parallelepiped or cubic electronic component; It is configured to be orthogonal to the first transport unit, and includes a second transport unit having at least a third treatment unit and a fourth treatment unit, at respective positions in the first transport unit and the second transport unit, The electronic component is configured to maintain the same transport attitude, and further, in the first treatment unit of the first transport unit, after treating any one surface of the electronic component,
The opposite surface is treated by the second treatment unit, and then transferred to the second conveyance unit while maintaining the same conveyance posture, and then contacted with the surface on which the first treatment and the second treatment are performed. A method for manufacturing an electronic component, wherein a third treatment is performed on the side surface of the third part by the third treatment part, and then a fourth treatment is performed on the opposite side by the fourth treatment part. 2. The first transfer section has a first fixed base and a first transfer table intermittently operated with respect to the first fixed base. The second transfer section has a second fixed base and a second fixed base. 2. The electronic component according to claim 1, further comprising a second transport table that performs an intermittent operation with respect to the second fixed base, wherein the electronic component is vacuum-sucked from the first transport table to the second transport table while maintaining the same transport attitude. Manufacturing method. 3. A table of the first and second transport units is a disk having a drive shaft at a central portion, and external dimensions of the electronic components for inserting and transporting electronic components around the circumference thereof. The method for manufacturing an electronic component according to claim 1, wherein a plurality of slightly larger slits are formed. 4. The electronic component according to claim 3, wherein the tables of the first and second transport units are made of aluminum, and the inner surfaces of the plurality of slits formed in the circumferential portion are coated with a wear-resistant substance. Manufacturing method. 5. The first to fourth treatments refer to at least one of inspection, processing, stamping and surface treatment, which are performed alone or in combination. A method for producing the electronic component described in the above.