JPH1067919A - Epoxy resin composition and semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in release resistance and crack resistance in mounting to electronic equipment and storage stability and provide a semiconductor device by using the resin composition. SOLUTION: This epoxy resin composition consists essentially of (A) an inorganic filler whose surface is combined with a aminoalkylalkoxysilane and (B) a curing accelerator-containing microcapsule having a core/shell structure in which a core part comprising a curing accelerator is coated with a shell part comprising a thermoplastic resin. This semiconductor device is obtained by sealing a semiconductor element with the epoxy resin composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition having high bending strength at high temperature and excellent storage stability, and a semiconductor device using the same.

[0002]

2. Description of the Related Art Generally, semiconductor devices such as transistors, ICs, and LSIs are encapsulated with an epoxy resin composition to form semiconductor devices. In recent years, as this type of package, a surface mount type package capable of reducing a mounting area has been increasing. This surface mount type package is
The area occupied by the mounting board is small, and
It has the advantage that double-sided mounting is also possible.

[0003]

However, in a semiconductor device using a surface mount type package as described above, there is a problem that a package crack occurs if the package itself absorbs moisture before surface mount. . That is, moisture absorbed during storage and diffused inside the package accumulates at the interface between the element and the lead frame and the sealing resin layer, and peels and cracks due to steam pressure under high temperature conditions in the subsequent solder mounting process. Occur. Conventionally, as a solution to such a problem, a dry pack method in which a semiconductor device obtained by encapsulating a semiconductor element in a package is hermetically sealed, and opened and used immediately before mounting, or a physical property of a sealing material is used. Improvement techniques have been adopted.

[0004] To improve the properties of the above-mentioned sealing material, low moisture absorption by changing the resin skeleton, low moisture absorption by increasing the amount of the inorganic filler, high strength by reacting aminoalkylalkoxysilane or the like in the resin, amino There is a technique for increasing the strength by fixing an alkylalkoxysilane or the like on the surface of an inorganic filler. Among them, the technique of fixing the aminoalkylalkoxysilane or the like on the surface of the inorganic filler is as follows.
Although it has the effect of improving strength, it also has the problem of significantly reducing the storage stability of the epoxy resin composition as the sealing material. This is because the aminoalkylalkoxysilane fixed on the surface of the inorganic filler causes a catalytic action, and the epoxy resin and the curing accelerator of the phenol resin combine to accelerate the reaction of the epoxy resin during storage.

The present invention has been made in view of such circumstances, and an epoxy resin composition which is excellent in peel resistance and crack resistance during mounting and excellent in storage stability when mounting electronic equipment, and an epoxy resin composition therefor. It is an object of the present invention to provide a semiconductor device obtained by using the method.

[0006]

In order to achieve the above object, the present invention provides, as a first gist, an epoxy resin composition containing the following (A) and (B) as essential components. (A) An inorganic filler having an aminoalkylalkoxysilane fixed on its surface. (B) Microcapsules containing a hardening accelerator having a core / shell structure in which a core made of a hardening accelerator is covered with a shell made of a thermoplastic resin.

[0007] A second aspect of the present invention is a semiconductor device in which a semiconductor element is sealed using the epoxy resin composition.

That is, the present inventors have conducted a series of studies to solve the problems of the conventional epoxy resin composition used for increasing the strength described above. As a result, together with the inorganic filler (A) having the aminoalkoxysilane fixed on the surface, the core portion composed of the curing accelerator is
Hardening accelerator-containing microcapsules having a core / shell structure covered with a shell portion made of a thermoplastic resin (B)
In addition to improving the strength at a high temperature based on the above (A), the interaction between the aminoalkoxysilane and the curing accelerator does not occur due to microencapsulation, and good storage stability is realized. The inventors have found that the present invention has been achieved.

[0009]

Next, embodiments of the present invention will be described in detail.

The epoxy resin composition of the present invention comprises an inorganic filler (A) having an aminoalkylalkoxysilane fixed on its surface, and a microcapsule (B) containing a curing accelerator.
Is obtained by using as an essential component, usually,
It is in the form of a powder or a tablet obtained by compressing it.

In the inorganic filler (A) having the aminoalkylalkoxysilane fixed on the surface, the aminoalkylalkoxysilane fixed on the surface of the inorganic filler has at least one amino group and at least one amino group in one molecule. A silane compound having one alkoxy group, for example, 3-aminopropyltrimethoxysilane,
3-aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3
-Aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyldiethoxysilane, p- [N- (2-aminoethyl) aminomethyl] phenethyltrimethoxysilane, γ-anilinopropyltri Methoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl)
γ-aminopropylmethyldimethoxysilane, etc., and these can be used alone or in combination of two or more.

Examples of the inorganic filler for fixing the above aminoalkylalkoxysilane on the surface include crystalline silica and fused silica, as well as alumina oxide, beryllium oxide, silicon carbide, silicon nitride and the like.

As a combination of the aminoalkylalkoxysilane and the inorganic filler, a combination using 3-aminopropyltrimethoxysilane as the aminoalkylalkoxysilane and particularly a spherical fused silica as the inorganic filler is used from the viewpoint of improving strength. preferable.

The fixing of the aminoalkylalkoxysilane to the surface of the inorganic filler is carried out as follows. That is, a general stirrer such as a Henschel mixer is used, and the above-mentioned materials are put into the stirrer and stirred.

The aminoalkylalkoxysilane is fixed to the surface of the inorganic filler by fixing the alkoxy group of the aminoalkylalkoxysilane to the surface of the inorganic filler.
Because of the reaction with the H group, temperature and time are major factors. Therefore, the processing conditions are significantly different, such as 24 hours or more at room temperature and 5 hours or more at 80 ° C. In this case, it is necessary to consider the thermal decomposition of the aminoalkylalkoxysilane itself.

The weight ratio of the aminoalkylalkoxysilane fixed to the surface of the inorganic filler is from 0.05 to 0.05.
It is preferably set to 1.0% by weight. Particularly preferably, it is 0.2 to 0.4% by weight. That is, when the weight ratio of the aminoalkylalkoxysilane is less than 0.05% by weight, it is difficult to obtain a sufficient strength improving effect, and when it exceeds 1.0% by weight, self-condensation between aminoalkylalkoxysilanes occurs. This is because the effect is halved.

The amount of the inorganic filler (A) having the aminoalkylalkoxysilane fixed on the surface is preferably set to 50% by weight or more of the entire inorganic filler. It is particularly preferably at least 80% by weight. That is, if the amount of the inorganic filler (A) in which the aminoalkylalkoxysilane is fixed on the surface is less than 50% by weight, the effect of improving strength is hardly remarkable.

Next, a hardening accelerator-containing microcapsule (B), which is used together with the inorganic filler (A) having the aminoalkylalkoxysilane fixed on its surface, is used.
Is a microcapsule having a core / shell structure in which a core made of a curing accelerator is covered with a shell made of a thermoplastic resin.

The hardening accelerator included in the core is not particularly limited, and may be a conventionally known hardening accelerator such as an amine-based, imidazole-based, phosphorus-based, boron-based, or the like.
A curing accelerator such as a phosphorus-boron type is exemplified. Specifically, alkyl-substituted guanidines such as ethylguanidine, trimethylguanidine, phenylguanidine, diphenylguanidine, and the like, 3- (3,4-dichlorophenyl)-
3-substituted phenyl-1,1-dimethylureas such as 1,1-dimethylurea, 3-phenyl-1,1-dimethylurea, 3- (4-chlorophenyl) -1,1-dimethylurea, 2-methyl Imidazolines such as imidazoline, 2-phenylimidazoline, 2-undecylimidazoline and 2-heptadecylimidazoline; monoaminopyridines such as 2-aminopyridine; N, N-dimethyl-N- (2
-Hydroxy-3-allyloxypropyl) amine-N '
Amine imides such as lactoimide, ethyl phosphine, propyl phosphine, butyl phosphine, phenyl phosphine, trimethyl phosphine, triethyl phosphine, tributyl phosphine, trioctyl phosphine, triphenyl phosphine, tricyclohexyl phosphine, triphenyl phosphine / triphenyl borane complex, Phosphorus-based compounds such as tetraphenylphosphonium tetraphenylborate, 1,8-diazabicyclo [5,
4,0] undecene-7, 1,4-diazabicyclo [2,2,2] octane and the like. These may be used alone or in combination of two or more.

Examples of the thermoplastic resin forming the shell portion (wall film) include polyurea, polyurethane, amino resin, and acrylic resin. Among them, polyurea and polyurethane are preferably used in consideration of stability during storage.

The hardening agent-containing microcapsules are
There is no particular limitation as long as it can be microencapsulated, and it can be prepared by various conventionally known methods. In particular, it is preferable to form a shell portion (wall film) by using an interfacial polymerization method and microencapsulate the shell portion (wall film) from the viewpoint of homogenizing the shell portion (wall film) and adjusting the thickness of the wall film.

The microcapsules containing a curing accelerator by the above interfacial polymerization method can be obtained, for example, as follows.
That is, a polyvalent isocyanate is dissolved therein using a liquid curing accelerator as a core component. The solution obtained in this way is oily, and this is dispersed in the water phase as an oil phase in the form of oil droplets to produce an O / W type (oil phase / water phase type) emulsion. At this time, the particle diameter of each dispersed oil droplet is 0.05 to 500 μm, preferably 0.05 to 50 μm.
It is preferred to be about m from the viewpoint of the stability of the emulsion during polymerization.

On the other hand, when a solid curing accelerator is dissolved in an organic solvent to form a core component, an S / O / W (solid phase / oil phase / water phase) type emulsion is obtained. In the above emulsion type, the curing accelerator is lipophilic, but in the case of hydrophilicity, it is difficult to form the emulsion type. In this case, the solubility is adjusted to adjust the O / O (oil phase). / Oil phase) emulsion type and S
Interfacial polymerization may be performed as a / O / O (solid phase / oil phase / oil phase) emulsion type.

Then, polyhydric amines or polyhydric alcohols are added to the aqueous phase of the emulsion to cause interfacial polymerization with polyhydric isocyanates in the oil phase to carry out a polyaddition reaction. A hardening accelerator-containing microcapsule having a polyurethane polymer as a shell portion (wall film) is obtained.

The hardening accelerator-containing microcapsule (B) thus obtained has a core / shell structure, in which a hardening accelerator is included as a core component in a shell portion. The hardening accelerator-containing microcapsules can be isolated by a conventionally known means, for example, a method of drying after centrifugation or a method of spray drying. Further, it can be dissolved and mixed in an epoxy resin or a phenol resin. At this time, if necessary, the organic solvent in the microcapsules can be removed by using a means such as drying under reduced pressure.

The average particle size of the curing accelerator-containing microcapsules (B) is, as described later, 0.05 to 50 in consideration of the shearing force applied during the production of the epoxy resin composition.
It is preferable to set it in the range of μm, preferably in the range of 0.1 to 4 μm from the viewpoint of the stability and dispersibility of the microcapsules. In the present invention, the shape of the hardening agent-containing microcapsules (B) is preferably spherical, but may be elliptical. If the microcapsules are not spherical in shape but have a uniform particle size, such as elliptical or flat, the simple average value of the longest and shortest diameters is defined as the average particle size.

In the hardening accelerator-containing microcapsules (B), the amount of the hardening accelerator included is preferably set to 5 to 70% by weight of the total amount of the microcapsules, particularly preferably 10 to 50% by weight. is there. That is, when the encapsulation amount of the curing accelerator is less than 5% by weight, the curing reaction time is too long, resulting in poor reactivity. ) Is too thin, and there is a possibility that the encapsulated curing accelerator (core component) may have poor isolation and mechanical strength.

The ratio of the shell (wall film) thickness to the particle size of the hardening agent-containing microcapsules (B) is set to 3 to 25%, particularly preferably 5 to 25%.
That is, if the above ratio is less than 3%, sufficient mechanical strength cannot be obtained with respect to the shear added in the kneading step in the production of the epoxy resin composition, and if it exceeds 25%, the release of the included curing accelerator is not achieved. This is because there is a tendency to be insufficient.

The compounding amount of the curing accelerator-containing microcapsules (B) is preferably set to 0.1 to 30 parts with respect to 100 parts by weight of epoxy resin (hereinafter abbreviated as "parts"). Particularly preferably, the ratio is 5 to 15 parts. That is, if the amount of the curing accelerator-containing microcapsules (B) is less than 0.1 part, the curing speed is too slow, causing a decrease in strength. Is impaired.

The epoxy resin used for obtaining the epoxy resin composition containing the inorganic filler (A) having the aminoalkylalkoxysilane fixed on the surface and the microcapsule (B) containing the curing accelerator as essential components is a liquid. Alternatively, there is no particular limitation on the solid state or the like, and various conventionally known epoxy resins, for example, various epoxy resins such as cresol novolak type, phenol novolak type, novolak bis A type, bisphenol A type and the like can be mentioned. Among them, it is preferable to use an epoxy resin in which a cured product obtained by adding a biphenyl type or lower alkyl group to a phenyl ring exhibits low moisture absorption. In this case, the epoxy resin preferably has an epoxy equivalent of 120 to 300 and a softening point of 50 to 130 ° C.

Usually, when an epoxy resin composition is used as a sealing material for a semiconductor element, a curing agent having a curing effect on the epoxy resin is blended. The curing agent is not particularly limited, and examples thereof include various phenol resins. Specific examples include phenol novolak, cresol novolak, naphthol novolak, phenol aralkyl resin, and cyclopentadiene-containing phenol resin. In particular, in order to reduce the moisture absorption of the cured product, it is preferable to use a phenol aralkyl resin, naphthol novolak, or the like, which exhibits low moisture absorption.

The mixing ratio of the epoxy resin and the phenol resin when a curing agent is used is such that the hydroxyl group in the phenol resin is 0.8 to 1.2 equivalents per equivalent of the epoxy group in the epoxy resin. It is preferable to mix them.

The epoxy resin composition of the present invention contains, in addition to the inorganic filler (A) having the aminoalkylalkoxysilane fixed on its surface and the microcapsules (B) containing a curing accelerator, and an epoxy resin and a curing agent. If necessary, other conventionally used additives can be appropriately compounded.

The other additives include, for example, inorganic fillers, flame retardants, waxes and the like.

As described above, the inorganic filler includes, as described above, not only crystalline silica and fused silica, but also alumina oxide, beryllium oxide, silicon carbide, silicon nitride and the like.

Examples of the flame retardant include novolak type brominated epoxy resin, bis-A type epoxy resin, antimony trioxide, antimony pentoxide and the like, and these may be used alone or in combination of two or more.

Examples of the wax include compounds such as higher fatty acids, higher fatty acid esters, higher fatty acid calcium and the like, and these can be used alone or in combination of two or more.

Further, the epoxy resin composition of the present invention may contain components such as silicone oil, silicone rubber, synthetic rubber, etc., in addition to the above-mentioned other additives, in order to reduce stress, and to improve reliability in a moisture resistance reliability test. An ion trapping agent such as hydrotalcites and bismuth hydroxide may be blended for the purpose of improving the properties.

The epoxy resin composition of the present invention is, for example,
It can be manufactured as follows. First, as described above, the aminoalkylalkoxysilane and a predetermined amount of the inorganic filler are stirred with a Henschel mixer, and then left at room temperature for 2 days, whereby the aminoalkylalkoxysilane is fixed to the surface of the inorganic filler. Agent (A) is prepared. On the other hand, as described above, the curing accelerator-containing microcapsules (B) are produced by the interfacial polymerization method.

Next, the above-mentioned aminoalkylalkoxysilane is fixed on the surface together with the inorganic filler (A) and the hardening accelerator-containing microcapsule (B), and all other remaining components are mixed. And kneading in a heated state and then melt-mixing. At this time, heat and shear force act on the hardening accelerator-containing microcapsules (B). At this stage, the microcapsules have good thermal stability. Is used as a shell part (wall film) forming material.
In particular, polyurea or polyurethane is preferably used as the thermoplastic resin. Further, with respect to the shearing force applied to the microcapsules, it is preferable to set the average particle size of the microcapsules in the range of 0.05 to 50 μm, preferably 0.1 to 4 μm in view of the stability and dispersibility of the microcapsules. Is preferred.

Next, after cooling the mixture at room temperature, it is pulverized by a known means and, if necessary, tableted to produce a desired epoxy resin composition through a series of steps. it can.

In the present invention, the encapsulation of a semiconductor element using the above epoxy resin composition is not particularly limited, and can be performed by a known molding method such as ordinary transfer molding.

The semiconductor device obtained in this way is made of an epoxy resin composition using an inorganic filler (A) having an aminoalkylalkoxysilane fixed on its surface and a microcapsule (B) containing a curing accelerator. Because of the sealing, the strength at high temperatures is high, and the epoxy resin composition used has excellent storage stability.

Next, examples will be described together with comparative examples.

Prior to the examples, an inorganic filler having an aminoalkylalkoxysilane fixed on its surface and a microcapsule containing a curing accelerator were prepared according to the following method.

[Surface-treated inorganic filler A] 3-Aminopropyltriethoxysilane and fused silica powder (average particle size: 30 μm, spherical) were charged into a Henschel mixer, stirred at 2000 rpm for 1 minute, and then stirred at room temperature. 48
An inorganic filler having 3-aminopropyltriethoxysilane fixed on the surface was prepared by being left for a while.

[Surface-treated inorganic filler B] γ-anilinopropyltrimethoxysilane and fused silica powder (average particle size: 20 μm, spherical) are charged into a Henschel mixer, stirred at 2,000 rpm for 1 minute, and then cooled to room temperature. 48
An inorganic filler having γ-anilinopropyltrimethoxysilane fixed on the surface was prepared by being left for a time.

[Surface-treated inorganic filler C] Glycidoxyalkylalkoxysilane (γ-glycidoxypropyltrimethoxysilane) and fused silica powder (average particle size: 30 μm, spherical) were charged into a Henschel mixer,
After stirring at 000 rpm for 1 minute, the mixture was allowed to stand at room temperature for 48 hours to prepare an inorganic filler having glycidoxyalkylalkoxysilane fixed on the surface.

[Hardening Accelerator-Containing Microcapsules D] The microcapsules D were produced by the above-described interfacial polymerization method. More specifically, an oil phase was prepared by uniformly dissolving 10 parts of an adduct of 3 mol of xylylene diisocyanate and 1 mol of trimethylolpropane in 4 parts of triphenylphosphine as a curing agent. Further, an aqueous phase composed of 95 parts of distilled water and 5 parts of polyvinyl alcohol was separately prepared, and the oil phase prepared above was added thereto, and a homomixer (8000 rpm) was added.
m) to emulsify to an emulsion state,
The polymerization reactor was equipped with a stirrer and a dropping funnel.

On the other hand, 13 parts of an aqueous solution containing 3 parts of triethylenetetramine was prepared, placed in a dropping funnel provided in the polymerization reactor, dropped into the emulsion in the reactor, and polymerized at 70 ° C. for 3 hours. Then, microcapsules D were prepared. Thus, a microcapsule having a polyurea shell structure containing triphenylphosphine was produced (average particle size: 2 μm).

[Hardening Accelerator-Containing Microcapsules E] The microcapsules E were produced by the above-described interfacial polymerization method. The preparation method was the same as that described above, but the homomixer used for emulsification and preparation of the emulsion was performed at 10,000 rpm. Thus, microcapsules having a polyurea shell structure containing triphenylphosphine were produced (average particle size: 0.1 μm).

[Hardening Accelerator-Containing Microcapsules F] The microcapsules F were produced by the interfacial polymerization method described above. The preparation method was the same as described above, except that the homomixer used for emulsification and preparation of the emulsion was performed at 4000 rpm. In this way, microcapsules having a polyurea shell structure containing triphenylphosphine were produced (average particle size: 4.0 μm).

On the other hand, the following components were prepared.

[Epoxy resin] 4,4'-bis (2,3
-Epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl epoxy resin (epoxy equivalent 200)

[Phenol resin] Phenol aralkyl resin (hydroxyl equivalent: 175)

[Inorganic filler] Fused silica (average particle size 1
5μm, crushed)

[Brominated epoxy resin] Novolac type brominated epoxy resin (epoxy equivalent: 275)

[0058]

Examples 1 to 8 and Comparative Examples 1 to 5 Tables 1 and 2 below
Were mixed in the proportions shown in the same table, kneaded with a mixing roll machine (100 ° C.), cooled and pulverized to obtain a desired powdery epoxy resin composition.

[0059]

[Table 1]

[0060]

[Table 2]

The powdery epoxy resin compositions of Examples and Comparative Examples thus obtained were subjected to the following evaluation tests (flexural strength, spiral flow retention). The results are shown in Tables 3 and 4 below.

[Bending strength] A test piece for bending strength (5 "x 1/2" x 1/4 ") was molded using each epoxy resin composition, and the molded product was heated to 85 ° C / 85% RH. 168
After moisture absorption for a period of time, the bending characteristics were measured in a 250 ° C. temperature atmosphere (according to JIS K-6911).

[Spiral Flow Retention] First, the powdery epoxy resin composition was tableted (diameter: 24.5 mm).
× thickness 20 mm). The tablet was inserted into a spiral spiral flow mold pot heated to a specified temperature (175 ± 5 ° C.) in advance, and clamped to increase the mold clamping pressure to 210 ± 10 kg / cm ² . Next, when the mold clamping pressure reached 210 ± 10 kg / cm ² , the epoxy resin composition was injected with a plunger,
After the injection pressure reaches 70 ± 5 kg / cm ² , 50 minutes per minute
A second injection pressure was applied. Next, the plunger pressure of the transfer molding machine was released, and the mold clamping pressure was released to open the mold. Then, the spiral length of the molded product should be at least 2.5 mm.
To obtain a spiral flow value (E
MMI 1-66). This was defined as the initial spiral flow value (initial SF value).

On the other hand, the powdery epoxy resin composition was tablet-shaped (diameter: 24.5 mm × thickness: 20) in the same manner as described above.
mm), and the tablet was left at a temperature of 30 ° C. for 3 days. Using this tablet after leaving,
A spiral flow value was obtained in the same manner as in the measurement of the initial SF value. This was defined as a spiral flow value after storage for 3 days (SF value after storage).

The spiral flow retention (%) was calculated from the above initial SF value and SF value after storage by the following equation.

[0066]

## EQU1 ## Spiral flow retention (%) = (SF after storage)
Value) / (initial SF value) × 100

Further, the powdered epoxy resin compositions obtained in the above Examples and Comparative Examples were preformed into tablets (diameter: 24.5 mm × thickness: 20 mm), and the tablets were subjected to a temperature condition of 30 ° C. For 3 days. Then, the semiconductor device [Q
FP-80 (14 mm x 20 mm x thickness 2.0 mm),
Lead frame MF202, semiconductor element (8 mm x 8 m
m × thickness 0.37 mm)] by transfer molding (condition: 175 ° C. × 2 minutes). The obtained semiconductor device was pre-baked at 120 ° C. × 1 hour, and then subjected to moisture absorption at 85 ° C./85% RH × 168 hours.
An evaluation test (crack resistance) for 90 seconds was performed using a VPS at 90 ° C. The results are shown in Tables 3 and 4 below.

[0068]

[Table 3]

[0069]

[Table 4]

From the results shown in Tables 3 and 4, it can be seen that all the products of Examples have high bending strength and high spiral flow retention. Therefore, the epoxy resin composition of the example product has high storage stability, and when it is used as a sealing material for a semiconductor device, a semiconductor device having excellent peeling resistance and crack resistance during mounting can be obtained. It is clear. In fact, good results were obtained for all crack resistance tests. On the other hand, although the product of Comparative Example 1 had a high spiral flow retention, the bending strength was low and the result of the crack resistance test was poor.
Although the product had a certain degree of bending strength, the spiral flow retention was low.

[0071]

As described above, the epoxy resin composition of the present invention comprises the inorganic filler (A) having the aminoalkylalkoxysilane fixed on the surface thereof and the curing accelerator-containing microparticle having a core / shell structure. Since the capsule (B) is an essential component, high strength at a high temperature can be achieved, and excellent storage stability can be realized by microencapsulation without interaction between the aminoalkoxysilane and the curing accelerator. Therefore, a semiconductor device in which a semiconductor element is sealed using the epoxy resin composition does not cause peeling or cracking in a mounting process such as solder mounting even if the package itself has absorbed moisture, and Those having excellent properties and crack resistance are obtained.

In particular, from the viewpoint of storage stability, the material for forming the shell portion (wall film) of the microcapsules in the hardening accelerator-containing microcapsules (B) is preferably polyurea or polyurethane.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masahiro Hata 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation (72) Inventor Tomohiro Taruno 1-1-1-2 Shimohozumi, Ibaraki-shi, Osaka No. Nitto Denko Corporation (72) Inventor Tsutomu Nishioka 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation

Claims (4)

[Claims] 1. An epoxy resin composition comprising the following components (A) and (B) as essential components. (A) An inorganic filler having an aminoalkylalkoxysilane fixed on its surface. (B) Microcapsules containing a hardening accelerator having a core / shell structure in which a core made of a hardening accelerator is covered with a shell made of a thermoplastic resin. 2. The epoxy resin composition according to claim 1, wherein the thermoplastic resin forming the shell part of the curing accelerator-containing microcapsule (B) is a polyurea or a polyurethane. 3. The curing accelerator-containing microcapsule (B) has an average particle size of 0.1 to 4 μm.
Or the epoxy resin composition according to 2. 4. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition according to claim 1.