JPH1065289A - Board - Google Patents
BoardInfo
- Publication number
- JPH1065289A JPH1065289A JP21649096A JP21649096A JPH1065289A JP H1065289 A JPH1065289 A JP H1065289A JP 21649096 A JP21649096 A JP 21649096A JP 21649096 A JP21649096 A JP 21649096A JP H1065289 A JPH1065289 A JP H1065289A
- Authority
- JP
- Japan
- Prior art keywords
- component
- identification mark
- color
- brightness
- unmounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、実装部品の位置を
表す識別マークを設けた基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate provided with an identification mark indicating a position of a mounted component.
【0002】[0002]
【従来の技術】従来、プリント基板には、図2に示すよ
うに、部品を実装する領域を示す枠を印刷したり、更に
部品番号を印刷したり、部品の実装を容易にする工夫が
施されている。以下図2の構成および実装時の部品の検
査を簡単に説明する。2. Description of the Related Art Conventionally, as shown in FIG. 2, on a printed circuit board, a frame indicating an area for mounting a component is printed, a component number is further printed, and devices for mounting the component are made easier. Have been. Hereinafter, the configuration of FIG. 2 and the inspection of components during mounting will be briefly described.
【0003】図2は、従来技術の説明図を示す。図2に
おいて、プリント基板は、部品を実装する基板であっ
て、表面に部品を実装する領域を矩形で囲んだ部品実装
位置マークと、図示しないが部品の部品番号とを印刷す
るものである。FIG. 2 is an explanatory diagram of the prior art. In FIG. 2, a printed circuit board is a board on which components are mounted, and prints a component mounting position mark that encloses a region where the components are mounted on the surface with a rectangle, and a component number (not shown) of the component.
【0004】部品実装位置マークおよび部品番号を印刷
したプリント基板に部品の実装を行った後、検査工程で
図中の未実装と記載したように、部品が部品実装位置マ
ークの内部に実装されていないときに未実装を検出する
ようにしていた。After mounting the component on the printed circuit board on which the component mounting position mark and the component number are printed, the component is mounted inside the component mounting position mark as described as unmounted in the drawing in the inspection process. When not installed, it was trying to detect unimplemented.
【0005】[0005]
【発明が解決しようとする課題】上述した図2に示すよ
うに、従来のプリント基板上には、部品よりも大きく囲
んだ矩形の部品実装位置マークを印刷していたため、部
品の形状と部品実装位置マークとが同じ形状であって、
図示の場合には“矩形”と“矩形”であり、部品が実装
されているか否かは部品自身の有無で判断する必要があ
り、特にプリント基板上に多数の部品が実装されたとき
に未実装部品を見つけることが困難であるという問題が
あった。また、部品を矩形の部品実装位置マーク部の内
部に実装してもしなくても当該部品実装位置マークが同
じように常に見えてしまい、部品の実装の有無を判断し
難いという問題もあった。As shown in FIG. 2 described above, a rectangular component mounting position mark, which is larger than a component, is printed on a conventional printed circuit board. The position mark has the same shape,
In the case shown in the figure, it is “rectangular” and “rectangular”, and it is necessary to determine whether or not a component is mounted based on the presence or absence of the component itself. There is a problem that it is difficult to find a mounted component. Further, there is also a problem that the component mounting position mark always looks the same whether or not the component is mounted inside the rectangular component mounting position mark portion, and it is difficult to determine whether or not the component is mounted.
【0006】本発明は、これらの問題を解決するため、
部品実装位置に部品種別に応じた検出し易い形状、色、
明るさの識別マークを部品実装したときに見えなくなる
部分に設け、未実装の部品を簡易に検出すると共に未実
装部品の種別をも検出可能にすることを目的としてい
る。[0006] The present invention solves these problems,
In the component mounting position, the shape, color,
An object of the present invention is to provide a brightness identification mark in a portion that cannot be seen when components are mounted, so that unmounted components can be easily detected and the type of unmounted components can be detected.
【0007】[0007]
【課題を解決するための手段】図1を参照して課題を解
決するための手段を説明する。図1において、基板1
は、部品4を実装する基板である。Means for solving the problem will be described with reference to FIG. In FIG. 1, a substrate 1
Is a board on which the component 4 is mounted.
【0008】識別マーク2は、部品4を実装したときに
見えなくなる部分に印刷した記号あるいは部品番号など
である。次に、基板1上に印刷する識別マーク2につい
て説明する。The identification mark 2 is a symbol or a part number printed on a part which cannot be seen when the part 4 is mounted. Next, the identification mark 2 printed on the substrate 1 will be described.
【0009】識別マーク2について、基板1上の部品4
を実装する領域内で当該部品4を実装したときに見えな
くなる部分に周囲と異なる形状、色あるいは明るさで設
けるようにしている。Regarding the identification mark 2, the component 4 on the substrate 1
Is provided in a part, which becomes invisible when the component 4 is mounted in a region where the component 4 is mounted, in a shape, color, or brightness different from the surroundings.
【0010】この際、識別マーク2の形状を、実装する
部品4の形状と異なりかつ部品4の種別毎に異ならせ
て、いずれの部品の種別が未実装であるかを検出し易く
している。At this time, the shape of the identification mark 2 is different from the shape of the component 4 to be mounted and is different for each type of the component 4, so that it is easy to detect which component type is not mounted. .
【0011】また、識別マーク2の色を、蛍光塗料と
し、未実装の部品4を容易に検出し易くしている。ま
た、識別マーク2の代わりに部品番号とし、未実装の部
品4の部品番号を検出し易くしている。The color of the identification mark 2 is a fluorescent paint, so that the unmounted component 4 can be easily detected. In addition, a component number is used instead of the identification mark 2 so that the component number of the unmounted component 4 can be easily detected.
【0012】従って、基板1上の部品4の実装位置に部
品種別に応じた検出し易い形状、色あるいは明るさの識
別マーク2について部品4を実装したときに見えなくな
る部分に設けることにより、未実装の部品4を簡易に検
出すると共に未実装の部品4の種別をも簡易に検出する
ことが可能となる。Therefore, the identification mark 2 of the shape, color, or brightness, which can be easily detected according to the component type, is provided at the mounting position of the component 4 on the substrate 1 at a portion which cannot be seen when the component 4 is mounted. It is possible to easily detect the mounted component 4 and also easily detect the type of the unmounted component 4.
【0013】[0013]
【発明の実施の形態】次に、図1を用いて本発明の実施
の形態および動作を順次詳細に説明する。図1は、本発
明の1実施例説明図を示す。これは、基板1上に部品を
実装したときの一部を模式的に表したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment and operation of the present invention will be described in detail with reference to FIG. FIG. 1 shows an explanatory view of one embodiment of the present invention. This is a schematic representation of a part when components are mounted on the substrate 1.
【0014】図1において、基板1は、図示のように、
複数の部品4を実装するためのものであって、本発明に
係る識別マーク2、端子3などを予め印刷したものであ
る。識別マーク2は、図示のように、部品4を実装する
領域内であって、部品4を実装したときに見えなくなる
部分に印刷したものであって、形状、色、明るさを周囲
から異ならしたり、更に蛍光塗料で印刷して周囲から異
ならしたりし、未実装のときに容易に検出できるように
したものである。また、形状の代わりに部品番号を印刷
し、いずれの部品4が未実装であるかを容易に判断でき
るようにしてもよい。In FIG. 1, a substrate 1 is, as shown in FIG.
It is for mounting a plurality of components 4, and is formed by printing the identification mark 2, the terminal 3, and the like according to the present invention in advance. As shown in the figure, the identification mark 2 is printed in an area where the component 4 is mounted and becomes invisible when the component 4 is mounted, and is different in shape, color, and brightness from the surroundings. Or, it is printed with a fluorescent paint to make it different from the surroundings, so that it can be easily detected when it is not mounted. Alternatively, a part number may be printed instead of the shape so that it can be easily determined which part 4 is not mounted.
【0015】端子3は、部品4を実装するときに半田付
けなどして電気的に接続する端子である。部品4は、基
板1上に実装する部品であって、例えば抵抗、コンデン
サ、トランジスタ、コイルなどの部品である。The terminal 3 is a terminal that is electrically connected by soldering or the like when the component 4 is mounted. The component 4 is a component mounted on the substrate 1 and is, for example, a component such as a resistor, a capacitor, a transistor, and a coil.
【0016】次に、識別マーク2の形状、色、明るさ、
および蛍光塗料で印刷したときについて詳細に説明す
る。第1に、識別マーク2の形状は、実装する部品4の
形状と異ならすと共に、実装する部品4の種別毎に異な
る形状とし、部品4が未実装であることを容易に検出で
き、かつ検出したときにいずれの部品4の種別のものか
を容易に判断できるようにする。例えば図示のように、
部品の形状が矩形“□”のときに、識別マーク2の形状
を丸“○”や三角“△”にし、かつ部品4の種別毎に異
なる形状とする。Next, the shape, color, brightness,
And when printing with a fluorescent paint will be described in detail. First, the shape of the identification mark 2 is different from the shape of the component 4 to be mounted, and is different for each type of the component 4 to be mounted, so that it is easy to detect that the component 4 is not mounted. Then, it is possible to easily determine which type of the component 4 is of which type. For example, as shown
When the shape of the component is a rectangle “□”, the shape of the identification mark 2 is a circle “○” or a triangle “Δ”, and the shape is different for each type of the component 4.
【0017】第2に、識別マーク2の色は、実装する部
品4の色と異ならすと共に、実装する部品4の種別毎に
異なる色とし、部品4が未実装であることを容易に検出
でき、かつ検出したときにいずれの部品4の種別のもの
かを容易に判断できるようにする。例えば、部品の色が
灰色や茶色のときに、識別マーク2の色を赤色、ピンク
色などにし、かつ部品4の種別毎に異なる色とする。Second, the color of the identification mark 2 is different from the color of the component 4 to be mounted, and is different for each type of the component 4 to be mounted, so that the fact that the component 4 is not mounted can be easily detected. In addition, when it is detected, it is possible to easily determine which type of the component 4 is. For example, when the color of the component is gray or brown, the color of the identification mark 2 is set to red, pink, or the like, and is different for each type of the component 4.
【0018】第3に、識別マーク2の明るさは、実装す
る部品4の明るさと異ならすと共に、実装する部品4の
種別毎に異なる明るさとし、部品4が未実装であること
を容易に検出でき、かつ検出したときにいずれの部品4
の種別のものかを容易に判断できるようにする。例え
ば、部品の色が灰色のときに、識別マーク2の色を白色
や黒色などにし、かつ部品4の種別毎に異なる明るさの
色とする。Third, the brightness of the identification mark 2 is different from the brightness of the component 4 to be mounted, and is different for each type of the component 4 to be mounted, so that it is easy to detect that the component 4 is not mounted. Any parts 4
It can be easily determined whether the type is of the type. For example, when the color of the component is gray, the color of the identification mark 2 is set to white or black, and the color of the brightness differs for each type of the component 4.
【0019】第4に、識別マーク2の色あるいは明るさ
として、蛍光塗料などのように特殊な光(例えば赤外
線)を照射したときに特有の光を放射する塗料で印刷し
て実装する部品4の色や明るさと異なって浮き上がるよ
うにし、部品4が未実装であることを容易に検出でき、
かつ検出したときにいずれの部品4の種別のものかを容
易に判断できるようにする。Fourth, a component 4 to be printed and mounted with a paint that emits a specific light when irradiated with a special light (for example, infrared light) such as a fluorescent paint as the color or brightness of the identification mark 2. The color and brightness of the component 4 are raised differently, and it can be easily detected that the component 4 is not mounted.
In addition, it is possible to easily determine which type of component 4 is detected when the type is detected.
【0020】第5に、識別マーク2の形状の代わりに、
部品4の部品番号あるいは部品4を特定する数字、記号
列、更にバーコードとし、部品4が未実装でこれら数
字、記号列、更にバーコードが見えたときに自動的に画
像として取り込み、未実装部品を自動検出するようにし
てもよい。Fifth, instead of the shape of the identification mark 2,
The part number of the part 4 or the number, symbol string, and bar code that specify the part 4 are used, and when these numbers, symbol strings, and bar codes are visible when the part 4 is not mounted, it is automatically captured as an image and not mounted. The components may be automatically detected.
【0021】実際には、上述した第1ないし第5の識別
マーク2を組み合わせ、基板1上で未実装の部品4を容
易に検出できかつその種別を判断できるようにする。例
えば部品が図示のように矩形“□”のときに、異なる形
状の丸“○”や三角“△”などの形状を識別マーク2と
して用いかつ色を部品4や周囲の色と異なり検出し易い
例えば赤色とし、未実装を赤色で検出し、部品4の種別
を形状である丸“○”や三角“△”などで判断するよう
にする。同様に他の組み合わせでもよい。In practice, the first to fifth identification marks 2 described above are combined so that unmounted components 4 on the board 1 can be easily detected and their types can be determined. For example, when the component is a rectangle “□” as shown in the figure, a different shape such as a circle “○” or a triangle “△” is used as the identification mark 2 and the color is different from the component 4 and the surrounding color, and is easily detected. For example, the color of the component 4 is determined as red, and the unmounted component is detected as red, and the type of the component 4 is determined based on the shape of a circle “○” or a triangle “△”. Similarly, other combinations may be used.
【0022】[0022]
【発明の効果】以上説明したように、本発明によれば、
基板1上の部品4の実装位置に部品種別に応じた検出し
易い形状、色、明るさの識別マーク2について部品4を
実装したときに見えなくなる部分に設ける構成を採用し
ているため、未実装の部品4を簡易に検出すると共に未
実装の部品4の種別をも簡易に検出することができる。
更に、蛍光塗料の識別マーク2を設けて簡易に未実装の
部品4および種別を検出できる。As described above, according to the present invention,
Since the identification mark 2 of the shape, color, and brightness that can be easily detected according to the component type is provided at a position where the component 4 is not visible when the component 4 is mounted on the mounting position of the component 4 on the substrate 1, It is possible to easily detect the mounted component 4 and easily detect the type of the unmounted component 4.
Further, by providing the fluorescent paint identification mark 2, the unmounted component 4 and its type can be easily detected.
【図1】本発明の1実施例説明図である。FIG. 1 is an explanatory view of one embodiment of the present invention.
【図2】従来技術の説明図である。FIG. 2 is an explanatory diagram of a conventional technique.
1:基板 2:識別マーク 3:端子 4:部品 1: Board 2: Identification mark 3: Terminal 4: Component
Claims (4)
基板において、 部品を実装する領域内で当該部品を実装したときに見え
なくなる部分に周囲と異なる色あるいは明るさの識別マ
ークを設けたことを特徴とする基板。In a substrate provided with an identification mark indicating a position of a mounted component, an identification mark of a color or brightness different from the surroundings is provided in a portion where the component is not visible when the component is mounted in an area where the component is mounted. A substrate, characterized in that:
異ならすと共に必要に応じて部品の種別毎に異ならした
ことを特徴とする請求項1記載の基板。2. The substrate according to claim 1, wherein the shape of the identification mark is different from a component to be mounted and, if necessary, is different for each component type.
とを特徴とする請求項1あるいは請求項2記載の基板。3. The substrate according to claim 1, wherein the color of the identification mark is a fluorescent paint.
としたことを特徴とする請求項1ないし請求項3記載の
いずれかの基板。4. The substrate according to claim 1, wherein the identification mark is replaced with a number representing a component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21649096A JPH1065289A (en) | 1996-08-16 | 1996-08-16 | Board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21649096A JPH1065289A (en) | 1996-08-16 | 1996-08-16 | Board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1065289A true JPH1065289A (en) | 1998-03-06 |
Family
ID=16689256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21649096A Pending JPH1065289A (en) | 1996-08-16 | 1996-08-16 | Board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1065289A (en) |
-
1996
- 1996-08-16 JP JP21649096A patent/JPH1065289A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20120106099A1 (en) | Packaging board | |
JP2007109750A (en) | Electric/electronic component and its manufacturing method | |
US20100155106A1 (en) | Method and apparatus for optical differentiation to detect missing components on a circuit board | |
JPH1065289A (en) | Board | |
JPH04303988A (en) | Printed wiring board | |
JP2002344098A (en) | Printed wiring board | |
JPH1065288A (en) | Printed board | |
JP3872482B2 (en) | Printed board | |
JPH05183242A (en) | Printed wiring board | |
US6268616B1 (en) | Electrical wiring board and method for identifying same | |
JPH05167219A (en) | Substrate printing method | |
JPH0513899A (en) | Printed board | |
JPH05121849A (en) | Printed board | |
JP2002076543A (en) | Printed board | |
JPH0623015Y2 (en) | Printed wiring board | |
JPH0621591A (en) | Printed circuit board | |
JP2006173181A (en) | Printed-wiring board | |
JPS5930545Y2 (en) | printed wiring board | |
JP3380075B2 (en) | How to create mounting inspection data | |
JPH10180437A (en) | Soldering inspection device | |
JP2696878B2 (en) | Substrate inspection method and apparatus | |
JPS62194443A (en) | Method for inputting reference data in printed circuit board inspection apparatus | |
JPH05145206A (en) | Printed wiring board | |
JPH0520359U (en) | Printed circuit board | |
JP2009123856A (en) | Printed wiring board, printed circuit board, and method of manufacturing printed circuit board |