JPH1064731A - Surface-mount high frequency air-core for general purpose - Google Patents
Surface-mount high frequency air-core for general purposeInfo
- Publication number
- JPH1064731A JPH1064731A JP22201496A JP22201496A JPH1064731A JP H1064731 A JPH1064731 A JP H1064731A JP 22201496 A JP22201496 A JP 22201496A JP 22201496 A JP22201496 A JP 22201496A JP H1064731 A JPH1064731 A JP H1064731A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- copper wire
- coil portion
- high frequency
- frequency air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、汎用表面実装タイ
プ高周波用空芯コイルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a general-purpose surface mount type high frequency air core coil.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
表面実装用コイルとしては、チップインダクタ，角巻き
モールドタイプチップインダクタが知られているが、こ
れらのインダクタはＱが小さいために高周波回路用には
適しているとは言えない。2. Description of the Related Art
Chip inductors and square-wound mold type chip inductors are known as surface mounting coils, but these inductors are not suitable for high frequency circuits because of their small Q.
【０００３】一方、Ｑを大きく取れ、しかもインダクタ
ンスの精度が期待できる空芯コイルについては、従来、
押さえ付けると変形し易い構造のため市販のマウンタを
使用することができず、空芯コイルを使用する必要があ
る場合には、手作業で回路基板に取り付けているため取
付工数が多くかかり問題となっている。しかも、空芯コ
イルは絶縁保護被膜を設けた銅線を単に巻いた構造のた
め変形し易く、変形するとコイルのインダクタンスが変
化してしまい、回路基板にコイルを実装した時に所望の
コイルの特性が確保できず問題となっている 本発明は、前記従来の課題を解決するためになされたも
のであり、市販のマウンタを使用してもコイル部が変形
することなく、他の部品と同程度の処理速度で回路基板
に取り付けできる汎用表面実装タイプ高周波用空芯コイ
ルを提供することを目的としている。[0003] On the other hand, for air-core coils that can obtain a large Q and can be expected to have the accuracy of inductance, conventionally,
If you hold down, you cannot use a commercially available mounter because it is easily deformed.If you need to use an air-core coil, it is manually attached to the circuit board, which requires a lot of man-hours to install. Has become. In addition, the air-core coil is easily deformed because it has a structure in which a copper wire provided with an insulating protective coating is simply wound, and when deformed, the inductance of the coil changes, and when the coil is mounted on a circuit board, the desired coil characteristics are reduced. The present invention has been made in order to solve the above-mentioned conventional problems, and the coil portion is not deformed even when a commercially available mounter is used, and the same as other components. It is an object of the present invention to provide a general-purpose surface-mount type high-frequency air-core coil that can be attached to a circuit board at a processing speed.
【０００４】[0004]
【課題を解決するための手段】添付図面を参照して本発
明の要旨を説明する。The gist of the present invention will be described with reference to the accompanying drawings.
【０００５】絶縁保護被膜を設けた銅線４を所定寸法に
切断し、この銅線４の両端部で形成する端子部２の絶縁
保護被膜を剥離した後、この銅線４の中央部を所定回数
巻回してコイル部１を形成し、前記端子部２を表面実装
に適した形状に曲げ加工を施し、前記コイル部１に樹脂
３を適宜塗布したことを特徴とする汎用表面実装タイプ
高周波用空芯コイルに係るものである。[0005] The copper wire 4 provided with the insulating protective coating is cut to a predetermined size, and the insulating protective coating of the terminal portion 2 formed at both ends of the copper wire 4 is peeled off. A general-purpose surface-mount type high-frequency device characterized in that a coil portion 1 is formed by winding a number of times, the terminal portion 2 is bent into a shape suitable for surface mounting, and a resin 3 is appropriately applied to the coil portion 1. It relates to an air core coil.
【０００６】[0006]
【発明の実施の形態】最良と考える本発明の実施の形態
（発明をどのように実施するか）を、図面に基づいてそ
の作用効果を示して簡単に説明する。BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of the present invention (how to implement the invention), which is considered to be the best, will be briefly described with reference to the drawings, showing its operational effects.
【０００７】銅線４の両端部で形成する端子部２の絶縁
保護被膜の剥離をコイル部１形成前に行うことで、コイ
ル部１に剥離した絶縁保護被膜が付着するようなことが
解消でき、高品質の汎用表面実装タイプ高周波用空芯コ
イルとすることができる。[0007] By peeling off the insulating protective film of the terminal portion 2 formed at both ends of the copper wire 4 before forming the coil portion 1, it is possible to eliminate the adhesion of the peeled insulating protective film to the coil portion 1. A high-quality general-purpose surface-mount type high-frequency air-core coil can be obtained.
【０００８】端子部２を表面実装に適した形状に曲げ加
工を施すことで、市販のマウンタを使用して他の部品と
同程度の処理速度で回路基板に容易に取り付けすること
ができる。By bending the terminal portion 2 into a shape suitable for surface mounting, the terminal portion 2 can be easily mounted on a circuit board at a processing speed similar to that of other components using a commercially available mounter.
【０００９】コイル部１に樹脂３を適宜塗布すること
で、コイル部１が外力で変形することを防止でき、市販
のマウンタを使用しても他の部品と同程度の処理速度で
回路基板に容易にしかもコイル部１が変形することなく
取り付けすることができる。By appropriately applying the resin 3 to the coil portion 1, the coil portion 1 can be prevented from being deformed by an external force. Even if a commercially available mounter is used, the coil portion 1 can be applied to the circuit board at the same processing speed as other components. It can be mounted easily and without deformation of the coil portion 1.
【００１０】以上のように、本発明の汎用表面実装タイ
プ高周波用空芯コイルを用いることで、特別に専用のマ
ウンタを準備することなく、市販のマウンタを使用して
他の部品と一緒に同じマウンタで回路基板に取り付けす
ることができる。As described above, by using the general-purpose surface-mount type high-frequency air-core coil of the present invention, it is possible to use the commercially available mounter to prepare the same components together with other parts without preparing a special mounter. It can be mounted on a circuit board with a mounter.
【００１１】[0011]
【実施例】本発明の一実施例に係る汎用表面実装タイプ
高周波用空芯コイルについて以下図面に基づいて説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A general-purpose surface mount type high frequency air core coil according to an embodiment of the present invention will be described below with reference to the drawings.
【００１２】絶縁保護被膜を設けた銅線４（例えばウレ
タン線）を所定寸法に切断する。この所定寸法は、所望
のインダクタンスと、使用する線材の直径，コイルの直
径，巻数，コイルの抵抗値などの関係で決める。A copper wire 4 (for example, a urethane wire) provided with an insulating protective film is cut into a predetermined size. The predetermined size is determined by a relationship between a desired inductance and a diameter of a wire to be used, a diameter of a coil, a number of turns, a resistance value of the coil, and the like.
【００１３】続いて、前記銅線４の両端部で形成する端
子部２の絶縁保護被膜を剥離した後、この銅線４の中央
部を所定回数巻回してコイル部１を形成し、前記端子部
２を表面実装に適した形状の曲げ加工を施し、図１
（ａ），（ｂ）或いは図２（ａ），（ｂ）に示すような
空芯コイルを形成する。Subsequently, after the insulating protective coating of the terminal portion 2 formed at both ends of the copper wire 4 is peeled off, the center portion of the copper wire 4 is wound a predetermined number of times to form the coil portion 1 and the terminal portion is formed. The part 2 is bent into a shape suitable for surface mounting, and FIG.
An air-core coil as shown in FIGS. 2A and 2B or FIGS. 2A and 2B is formed.
【００１４】続いて、図１（ｃ）或いは図２（ｃ）に示
したように、前記コイル部１に、例えば、熱硬化型樹脂
やＵＶ硬化型樹脂などの樹脂３を適宜塗布して、この樹
脂３を適宜硬化させてコイル部１を固めている。Subsequently, as shown in FIG. 1 (c) or FIG. 2 (c), a resin 3 such as a thermosetting resin or a UV curing resin is applied to the coil portion 1 as appropriate. The coil portion 1 is solidified by appropriately curing the resin 3.
【００１５】尚、使用する樹脂３は、コイル部１に樹脂
３を塗布した時、コイル部１の外形寸法がほとんど変化
しない程度の低粘度の熱硬化型或いはＵＶ硬化型の液体
状の樹脂３を使用し、この樹脂３をコイル部１の上から
滴下するとか、ハケ塗りするとか、浸漬するとかしてコ
イル部１に樹脂３を塗布する。The resin 3 to be used is a low-viscosity thermosetting or UV-curing liquid resin 3 such that when the resin 3 is applied to the coil section 1, the outer dimensions of the coil section 1 hardly change. The resin 3 is applied to the coil portion 1 by dripping, brushing, or dipping the resin 3 from above the coil portion 1.
【００１６】また、コイル部１を一定寸法の注型に入
れ、樹脂３を流し込むとかモールドする方法でもコイル
部１に樹脂３を塗布して硬化させ、コイル部１を固める
ことができる。Also, the coil portion 1 can be hardened by applying the resin 3 to the coil portion 1 and curing the same by placing the coil portion 1 in a casting having a certain size and pouring or molding the resin 3.
【００１７】以上のように形成した汎用表面実装タイプ
高周波用空芯コイルを回路基板上に取り付けする場合、
市販のマウンタを使用して他の部品と一緒に同じマウン
タで、他の部品を取り付けする時と同程度の処理速度で
回路基板に容易にしかもコイル部１が変形することなく
取り付けすることができる。When the general-purpose surface mount type high frequency air core coil formed as described above is mounted on a circuit board,
Using a commercially available mounter and the same mounter together with other parts, the coil part 1 can be easily mounted on the circuit board at the same processing speed as when mounting other parts, and without deforming the coil portion 1. .
【００１８】[0018]
【発明の効果】本発明は以上のように構成したから、銅
線の両端部で形成する端子部の絶縁保護被膜の剥離をコ
イル部形成前に行うことで、コイル部に剥離した絶縁保
護被膜が付着するようなことが解消でき、高品質の汎用
表面実装タイプ高周波用空芯コイルとすることができ
る。As described above, the present invention is configured as described above. By peeling off the insulating protective film of the terminal portion formed at both ends of the copper wire before forming the coil portion, the insulating protective film peeled off the coil portion. Can be eliminated, and a high quality general-purpose surface mount type high frequency air core coil can be obtained.
【００１９】端子部を表面実装に適した形状に曲げ加工
を施すことで、市販のマウンタを使用して他の部品と同
程度の処理速度で回路基板に容易に取り付けすることが
できる。By bending the terminal into a shape suitable for surface mounting, the terminal can be easily mounted on a circuit board using a commercially available mounter at the same processing speed as other components.
【００２０】コイル部に樹脂を適宜塗布することで、コ
イル部が外力で変形することを防止でき、市販のマウン
タを使用しても他の部品と同程度の処理速度で回路基板
に容易にしかもコイル部が変形することなく取り付けす
ることができる。By appropriately applying a resin to the coil portion, it is possible to prevent the coil portion from being deformed by an external force. Even if a commercially available mounter is used, the coil portion can be easily applied to the circuit board at the same processing speed as other components. The coil can be attached without deformation.
【００２１】以上のように、本発明の汎用表面実装タイ
プ高周波用空芯コイルを用いることで、特別に専用のマ
ウンタを準備することなく、市販のマウンタを使用して
他の部品と一緒に同じマウンタで回路基板に取り付けす
ることができる。As described above, the use of the general-purpose surface-mount type high-frequency air-core coil of the present invention makes it possible to use a commercially available mounter to prepare the same components as other components without preparing a special mounter. It can be mounted on a circuit board with a mounter.
【図１】本発明の一実施例に係る汎用表面実装タイプ高
周波用空芯コイルを示す正面図及び側面図である。FIG. 1 is a front view and a side view showing a general-purpose surface mount type high frequency air core coil according to an embodiment of the present invention.
【図２】本発明の別実施例に係る汎用表面実装タイプ高
周波用空芯コイルを示す正面図及び側面図である。FIG. 2 is a front view and a side view showing a general-purpose surface mount type high frequency air core coil according to another embodiment of the present invention.
１ コイル部 ２ 端子部 ３ 樹脂 ４ 銅線 1 coil part 2 terminal part 3 resin 4 copper wire
Claims (1)
切断し、この銅線の両端部で形成する端子部の絶縁保護
被膜を剥離した後、この銅線の中央部を所定回数巻回し
てコイル部を形成し、前記端子部を表面実装に適した形
状に曲げ加工を施し、前記コイル部に樹脂を適宜塗布し
たことを特徴とする汎用表面実装タイプ高周波用空芯コ
イル。1. A copper wire provided with an insulating protective film is cut into a predetermined size, and after removing an insulating protective film of a terminal portion formed at both ends of the copper wire, a center portion of the copper wire is wound a predetermined number of times. A general-purpose surface mount type high frequency air core coil, wherein a coil portion is formed by turning, a terminal portion is bent into a shape suitable for surface mounting, and a resin is appropriately applied to the coil portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22201496A JPH1064731A (en) | 1996-08-23 | 1996-08-23 | Surface-mount high frequency air-core for general purpose |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22201496A JPH1064731A (en) | 1996-08-23 | 1996-08-23 | Surface-mount high frequency air-core for general purpose |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1064731A true JPH1064731A (en) | 1998-03-06 |
Family
ID=16775763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22201496A Pending JPH1064731A (en) | 1996-08-23 | 1996-08-23 | Surface-mount high frequency air-core for general purpose |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1064731A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404315B1 (en) * | 1997-03-14 | 2002-06-11 | Murata Manufacturing Co., Ltd. | Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| TWI466148B (en) * | 2013-11-15 | 2014-12-21 | Prosperity Dielectrics Co Ltd | High - frequency hollow inductance of the welding pin plating process |
| CN107871589A (en) * | 2017-05-31 | 2018-04-03 | 洪豪立 | Electrodeless formula graphene smoothing choke and preparation method thereof |
-
1996
- 1996-08-23 JP JP22201496A patent/JPH1064731A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404315B1 (en) * | 1997-03-14 | 2002-06-11 | Murata Manufacturing Co., Ltd. | Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| US6531944B1 (en) * | 1997-03-14 | 2003-03-11 | Murata Manufacturing Co., Ltd. | Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| TWI466148B (en) * | 2013-11-15 | 2014-12-21 | Prosperity Dielectrics Co Ltd | High - frequency hollow inductance of the welding pin plating process |
| CN107871589A (en) * | 2017-05-31 | 2018-04-03 | 洪豪立 | Electrodeless formula graphene smoothing choke and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3755488B2 (en) | Wire wound type chip coil and its characteristic adjusting method | |
| US4866573A (en) | Surface mounted coil | |
| JP3262107B2 (en) | Coil component and method of manufacturing the same | |
| JPH10321438A (en) | Surface mounting type inductor and manufacture thereof | |
| JPH1064731A (en) | Surface-mount high frequency air-core for general purpose | |
| JPH09219333A (en) | Chip inductor and its manufacturing method | |
| JPS5868913A (en) | Inductance element and manufacture thereof | |
| JP2002057053A (en) | Method for manufacturing surface-mount inductor | |
| US6195879B1 (en) | Method for mounting wire-wound component on a printed circuit board | |
| JP2004006696A (en) | Wire-wound inductor | |
| JP2505752Y2 (en) | Coil parts | |
| JPH0864433A (en) | Surface mounting type coil part | |
| JPS603534Y2 (en) | Coil winding frame terminal device | |
| JPH0636938A (en) | Surface mount type air-core coil | |
| JPH10172853A (en) | Coil type electronic parts and its manufacturing method | |
| JPH0582375A (en) | Manufacture of coil | |
| JPH0536530A (en) | Chip type inductor and manufacture thereof | |
| JPH0443404B2 (en) | ||
| JP2821310B2 (en) | Conductive connection method for thin coils | |
| JPH073627Y2 (en) | Air core coil manufacturing equipment | |
| JPH0369103A (en) | Chip-type coil and manufacture thereof | |
| JPH06333762A (en) | Choke coil, its manufacturing method, and hybrid integrated circuit | |
| JP2004241587A (en) | Winding coil component | |
| JPH10149926A (en) | Surface mount high frequency air-core coil chip | |
| JPH04346403A (en) | Constitution of wire-wound chip inductor and manufacture thereof |