JPH04245413A - Electromagnetic apparatus and manufacture of electromagnetic apparatus - Google Patents

Abstract

PURPOSE:To automate the manufacture of electromagnetic apparatuses such as current transformers or the like, to mass-produce them and to lower their costs. CONSTITUTION:The whole circumferential face of a ferrite core is covered with an insulating resin to which an electroless copper plating operation cannot be executed; an insulating resin layer 12 is formed. In succession, a resin which contains a catalyst for electroless plating use is molded on the insulating resin layer 12 so as to be a coil shape. Resin layers 13, 14 which contain a catalyst for plating use are formed. In succession, an electroless copper plating treatment is executed to them the coil-part surface of the individual resin layers 13, 14 containing the catalyst for plating use and the surface of protrusion parts 13a, 13b, 14a, 14b for terminal use are plated with copper; a coil part is formed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electromagnetic equipment such as current transformers and methods of manufacturing electromagnetic equipment.

0002

[Prior Art] Conventionally, electromagnetic equipment, such as a current transformer, is shown in FIG.
As shown in the figure, a pair of thin, insulated copper wires 2 and 3 were manually wound around the circumferential surface of an annular ferrite core 1 several turns to form primary and secondary coils. . When installing this current transformer on a circuit board, manually connect the ends of the copper wires 2 and 3 to the holes 4a and 4 of the terminal block 4, respectively.
a, . . . and then soldered and fixed, and then the lead terminals 4b, 4b, . . . of the terminal block 4 were inserted into the through holes of the circuit board and soldered.

0003

[Problems to be Solved by the Invention] When attaching a conventional current transformer to a circuit board as described above, the mounting of the terminal block 4 on the circuit board can be automated, but it is difficult to mount the terminal block 4 on the circuit board with a wire diameter of, for example, about 0.5 mm or It is difficult to automate the winding of the copper wires 2, 3 made of thin wires with a diameter smaller than that and the fixing of the copper wires 2, 3 to the terminal block 4, which requires manual labor.
Further, since a terminal block is required, it is difficult to realize complete automation of manufacturing, and there is a problem in that the cost is also high.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electromagnetic device and a method for manufacturing the electromagnetic device, which can automate the manufacturing process, and therefore can easily mass-produce and reduce costs.

[0005]

[Means and Effects for Solving the Problems] The present invention includes a magnetic material, an insulating resin layer covering the whole or a part of the circumferential surface of the magnetic material, and a coil-shaped material on the circumferential surface of the insulating resin layer. It consists of a catalyst-containing resin layer for electroless plating that has a terminal protrusion integrally formed in a part thereof, and an electroless plating layer that becomes a coil part and a terminal part formed on the surface of this catalyst-containing resin layer. Found in electromagnetic equipment.

[0006] Furthermore, in the present invention, the whole or part of the circumferential surface of a magnetic body is coated with an insulating resin, a resin containing a catalyst for electroless plating is formed in a coil shape on the insulating resin, and then a resin containing a catalyst is coated on the insulating resin. The purpose is to perform electroless plating treatment on the coil portion to form the coil portion.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, an insulating resin layer 12 is formed by covering the entire circumferential surface of a rectangular annular ferrite core 11 as an annular magnetic body with an insulating resin that cannot be subjected to electroless copper plating. At this time, if the insulating resin molding die is molded into multiple pieces and each member is connected with the insulating resin, mass production becomes possible.

Next, as shown in FIG.
Resin containing a catalyst for electroless plating (for example, silver chloride/molecular sieve, etc.) is formed into a coil shape on top of the insulating resin layer 12 at certain locations, and a resin layer 13 containing a catalyst for electroless plating is formed.
Form 14. At this time, terminal protrusions 13a, 13b, 14a, and 14b for through-hole insertion are also integrally formed at the ends of each of the catalyst-containing resin layers 13 and 14 for electroless plating. The molding at this time is performed by placing the member shown in FIG. 1 into a mold and injecting a resin containing a catalyst for electroless plating into the mold.
, 13b, 14a, and 14b can be used as injection gates.

[0010] Subsequently, electroless copper plating is applied to the coil portion surfaces and terminal protrusions 13a, 13b, 14a, 14b of each catalyst-containing resin layer 13, 14 for electroless plating.
Copper plating is performed on the surface to form a coil part and a terminal part. In the case of multi-cavity molding, the parts connected to each other with insulating resin are separated after copper plating.

[0011] Also, if necessary, terminal protrusions 13a, 1
Paint or the like is applied to the surface of the coil except for parts 3b, 14a, and 14b to prevent rust on the coil part.

[0012] In this way, an electromagnetic device such as a current transformer in which a coil is wound around the annular ferrite core 11 is manufactured.

[0013] Since no manual work is involved in this manufacturing, automation of the manufacturing can be achieved. Therefore, mass production is possible and costs can be reduced.

Next, another embodiment of the present invention will be described with reference to the drawings. Note that the same parts as in the above embodiment are given the same reference numerals and detailed explanations will be omitted.

The one shown in FIG. 3 has terminal protrusions 15a, 15b, 15 for inserting through holes in each turn of each coil-shaped catalyst-containing resin layer 13, 14 for electroless plating.
c, 15d, 16a, 16b, 16c, and 16d are integrally formed.

[0016] In this way, the number of turns of the coil can be easily changed by selecting which terminal protrusion to connect to the circuit board and cutting to remove the remaining parts.

It goes without saying that this embodiment also provides the same effects as those of the previous embodiment.

The circuit board shown in FIG. 4 is mounted on the surface of the circuit board at the end of the coiled catalyst-containing resin layer 13, 14 for electroless plating instead of the terminal protrusions 13a, 13b, 14a, 14b for through-hole insertion. terminal protrusions 17a, 17b for
(Note that the catalyst-containing resin layer 13 side for electroless plating is not shown).

It goes without saying that this embodiment also provides the same effects as those of the previous embodiment.

The one shown in FIG. 5 has terminal projections 15a, 15b, 15c, 15d, 16a, 15a, 15b, 15c, 15d, 16a, 15a, 15b, 15c, 15d, 16a, 15a, 15b, 15c, 15d, 16a, 15a, 15b, 15c, 15d, 16a, 15a, 15b, 15c, 15d, 16a, 15b, 15c, 15d, 16a, for through-holes are inserted in the coiled catalyst-containing resin layers 13, 14 for electroless plating.
Terminal protrusions 18a, 18b, 18c (the catalyst-containing resin layer 13 side for electroless plating is not shown) are integrally formed with terminals 16b, 16c, and 16d for each turn. .

[0021] In this way, the present device can be attached to a through hole of a circuit board or can be surface mounted on a circuit board.

It goes without saying that this embodiment also provides the same effects as those of the previous embodiment.

Although an annular ferrite core is used in each of the above embodiments, the present invention is not limited to an annular core, and rod-shaped ferrite cores may be used alone or in combination.

[0024] Furthermore, although the entire circumferential surface of the ferrite core is coated with an insulating resin that cannot be subjected to electroless copper plating, it is not necessarily limited to this. For example, a resin layer containing a catalyst for electroless plating may be used. Only the part where is formed may be covered with an insulating resin,
In short, it is sufficient that the space between the ferrite core and the coiled portion is covered with an insulating resin.

Furthermore, in each of the above embodiments, coil portions were formed on the surface of the coiled portion of the catalyst-containing resin layer for electroless plating and on the surface of the protruding portion for the terminal by only electroless copper plating, but the present invention is not necessarily limited to this. Instead, if the surface of the coiled part of the catalyst-containing resin layer for electroless plating and the surface of the protruding part for the terminal is thinly plated with copper using electroless copper plating process, then copper plating with electrolytic copper plating process will result in a relatively thick plate. The coil portion and terminal portion can be formed more quickly.

[0026]

[Effects of the Invention] As detailed above, according to the present invention, it is possible to automate manufacturing suitable for electromagnetic equipment such as current transformers using coiled wire with a small diameter, and therefore mass production is easy. It is possible to provide an electromagnetic device and a method of manufacturing the electromagnetic device that can reduce costs.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view showing a state in which an annular ferrite core is coated with an insulating resin in an embodiment of the present invention.

FIG. 2 is a perspective view showing a catalyst-containing resin layer for electroless plating formed on an insulating resin layer in the same example.

FIG. 3 is a perspective view showing another embodiment of the invention.

FIG. 4 is a perspective view showing another embodiment of the invention.

FIG. 5 is a perspective view showing another embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional example.

[Explanation of symbols]

11... Annular ferrite core, 12... Insulating resin layer, 13
, 14...Catalyst-containing resin layer for electroless plating, 13a, 13
b, 14a, 14b...Terminal protrusions for through-hole insertion, 17a, 17b...Terminal protrusions for circuit board surface mounting.

Claims (3)

[Claims] Claim 1: A magnetic material, an insulating resin layer covering the whole or a part of the circumferential surface of the magnetic material, and a coil-like structure formed on the circumferential surface of the insulating resin layer and having a protrusion for a terminal on a part of the insulating resin layer. An electromagnetic device comprising: a catalyst-containing resin layer for electroless plating integrally formed with a coil section and an electroless plating layer forming a terminal section formed on the surface of the catalyst-containing resin layer. [Claim 2] A coil part, a protruding part for a terminal for through-hole insertion, and a protruding part for a terminal for surface mounting on a circuit board are integrally formed by a resin layer containing a catalyst for electroless plating. The electromagnetic device described in 1. 3. Covering the whole or part of the circumferential surface of the magnetic material with an insulating resin, forming a catalyst-containing resin for electroless plating in a coil shape on the insulating resin, and then coating the catalyst-containing resin with the insulating resin. A method of manufacturing an electromagnetic device, characterized in that a coil portion is formed by electroless plating.