JPH09219333A - Chip inductor and its manufacturing method - Google Patents
Chip inductor and its manufacturing methodInfo
- Publication number
- JPH09219333A JPH09219333A JP2570396A JP2570396A JPH09219333A JP H09219333 A JPH09219333 A JP H09219333A JP 2570396 A JP2570396 A JP 2570396A JP 2570396 A JP2570396 A JP 2570396A JP H09219333 A JPH09219333 A JP H09219333A
- Authority
- JP
- Japan
- Prior art keywords
- core
- conductive material
- electrodes
- flange
- chip inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導線を巻回するコ
アの鍔部の周面に導線の引出線が接続する電極を設けた
チップインダクタおよびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor in which an electrode to which a lead wire of a conductive wire is connected is provided on a peripheral surface of a flange portion of a core around which the conductive wire is wound, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来のチップインダクタは、図５に示す
ように、フェライトなどにて略角柱状の巻回胴部15の両
端にフランジ状の鍔部16，16を有した略Ｈ字状にコア17
を形成し、このコア17の鍔部16，16の一周面に導電ペー
ストを印刷して電極を形成している。そして、この電極
を設けたコア17の巻回胴部15にポリウレタン被覆電線な
どの導線を巻回してコイルを形成し、この導線の両端部
である引出線を電極に半田にてそれぞれ接続して形成し
ている。2. Description of the Related Art As shown in FIG. 5, a conventional chip inductor has a substantially H-shaped configuration having flange-shaped collar portions 16 and 16 at both ends of a substantially prismatic winding body portion 15 made of ferrite or the like. Core 17
Is formed, and conductive paste is printed on one circumferential surface of the collar portions 16, 16 of the core 17 to form electrodes. Then, a conductive wire such as a polyurethane-coated electric wire is wound around the winding body portion 15 of the core 17 provided with this electrode to form a coil, and the lead wires that are both ends of the conductive wire are connected to the electrodes by soldering, respectively. Is forming.
【０００３】なお、磁界などの特性が低下したりコイル
に半田が回り込んでしまうなどの問題が生じるため、鍔
部16，16の対向する面である内面には電極が位置しない
ように形成している。すなわち、導電ペーストが鍔部1
6，16の内面に被覆されないように、図５に示すよう
に、電極を形成する面である鍔部16，16の一周面および
鍔部16，16の両端面の一部に対応して、コア17を適宜回
動するなどして印刷用のマスク18でそれぞれ覆い、導電
ペーストを印刷して電極を形成している。Since problems such as deterioration of characteristics such as magnetic field and solder wrapping around the coil occur, electrodes are formed so as not to be located on the inner surfaces of the flange portions 16, 16 facing each other. ing. That is, the conductive paste is on the collar 1
As shown in FIG. 5, so as not to cover the inner surfaces of the flanges 6 and 16, corresponding to a part of one end surface of the flange portions 16 and 16 that is a surface for forming electrodes and both end surfaces of the flange portions 16 and 16, The core 17 is appropriately rotated to cover each with a printing mask 18, and a conductive paste is printed to form electrodes.
【０００４】このため、電極を形成するために、マスク
18による被覆、導電ペーストの被覆、乾燥およびコア17
の回動を、鍔部16，16の一周面および鍔部16，16の両端
面の３方向の面に対応してそれぞれ３回行わなければな
らず、工程が煩雑であった。Therefore, a mask is used to form the electrodes.
Coating with 18, coating of conductive paste, drying and core 17
The rotation has to be performed three times for each of the three circumferential surfaces of the flange portions 16 and 16 and both end surfaces of the flange portions 16 and 16, which makes the process complicated.
【０００５】一方、３方向の各面を同時にマスク18で覆
い、同時に導電ペーストを印刷形成することも考えられ
るが、装置が非常に複雑となり、製造装置の大型化およ
び製造装置コストの増大を生じる問題がある。On the other hand, it is conceivable to simultaneously cover the respective surfaces in the three directions with the mask 18 and print the conductive paste at the same time, but the apparatus becomes very complicated, and the manufacturing apparatus becomes large and the manufacturing apparatus cost increases. There's a problem.
【０００６】[0006]
【発明が解決しようとする課題】上述したように、図５
に示す従来のチップインダクタの製造方法では、電極が
形成される３方向の面に対してそれぞれ電極を形成する
ための計３回の製造工程が必要となり、それだけの製造
コストがかさんでいた。As described above, FIG.
In the conventional method for manufacturing a chip inductor as shown in (3), a total of three manufacturing steps are required to form electrodes on the surfaces in three directions in which the electrodes are formed, which increases the manufacturing cost.
【０００７】本発明は、上記問題点に鑑みなされたもの
で、簡単な構成で製造が容易なチップインダクタおよび
その製造方法を提供することを目的とする。The present invention has been made in view of the above problems, and an object thereof is to provide a chip inductor having a simple structure and easy to manufacture, and a manufacturing method thereof.
【０００８】[0008]
【課題を解決するための手段】請求項１記載のチップイ
ンダクタは、柱状形の巻回胴部の両端にそれぞれフラン
ジ状の鍔部を有したコアと、前記鍔部の周面に導電材料
が被覆されて形成された一対の電極と、前記巻回胴部に
巻回され両端部に前記電極にそれぞれ接続される引出線
を有した導線とを備えたチップインダクタにおいて、前
記電極は、前記導電材料の液面に対して前記コアの軸方
向が交差する方向に位置された状態で、前記鍔部の周面
および端面の一部がそれぞれ別々に前記導電材料に浸漬
されて形成されたもので、導電材料の液面に対してコア
の軸方向が交差する方向に位置させ、一方の鍔部の周面
および端面の一部を導電材料に浸漬した後、コアを回動
させて他方の鍔部の周面および端面の一部を導電材料に
浸漬して電極を形成するため、電極の形成のための工程
が２回で済み、生産性が向上する。According to a first aspect of the present invention, there is provided a chip inductor in which a core having flange-shaped flange portions at both ends of a columnar winding body portion, and a conductive material on a peripheral surface of the flange portion. In a chip inductor including a pair of electrodes formed by coating, and a conductor wire having a lead wire wound around the winding body portion and connected to the electrodes at both ends thereof, the electrodes are formed of the conductive material. In a state in which the core is positioned in a direction in which the axial direction of the core intersects with the liquid surface, a part of the peripheral surface and the end surface of the collar portion is formed by being separately immersed in the conductive material. , The axial direction of the core intersects with the liquid surface of the conductive material, and after immersing part of the peripheral surface and end surface of one flange part in the conductive material, rotate the core to rotate the other flange. Part of the peripheral surface and end surface of the part is immersed in a conductive material to form an electrode. To, process for forming the electrodes requires twice, the productivity is improved.
【０００９】請求項２記載のチップインダクタの製造方
法によれば、柱状形の巻回胴部の両端にそれぞれフラン
ジ状の鍔部を有したコアと、前記鍔部の周面に導電材料
が被覆されて形成された一対の電極と、前記巻回胴部に
巻回され両端部に前記電極にそれぞれ接続される引出線
を有した導線とを備えたチップインダクタの製造方法に
おいて、前記電極は、前記導電材料の液面に対して前記
コアの軸方向が交差する方向に位置させ、前記一方の鍔
部の周面および端面の一部を前記導電材料に浸漬した
後、前記コアを回動させて前記他方の鍔部の周面および
端面の一部を前記導電材料に浸漬して形成するもので、
導電材料の液面に対してコアの軸方向が交差する方向に
位置させ、一方の鍔部の周面および端面の一部を導電材
料に浸漬した後、コアを回動させて他方の鍔部の周面お
よび端面の一部を導電材料に浸漬して電極を形成するた
め、電極の形成のための工程が２回で済み、生産性が向
上する。According to a second aspect of the method for manufacturing a chip inductor, a core having flange-shaped flanges at both ends of a columnar winding body, and a conductive material covering the peripheral surface of the flange. In a method of manufacturing a chip inductor comprising a pair of electrodes formed by the above, and a conductor having a lead wire wound around the winding body and connected to the electrodes at both ends thereof, the electrodes are: The core is rotated in a direction in which the axial direction of the core intersects with the liquid surface of the conductive material, and the peripheral surface and the end surface of the one flange portion are immersed in the conductive material. Is formed by immersing a part of the peripheral surface and the end surface of the other flange portion in the conductive material,
The core is positioned in the direction in which the axial direction of the core intersects the liquid surface of the conductive material, the peripheral surface and the end surface of one flange part are immersed in the conductive material, and then the core is rotated to rotate the other flange part. Since the electrode is formed by immersing a part of the peripheral surface and the end surface in a conductive material, the process for forming the electrode is required only twice and the productivity is improved.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施の一形態のチ
ップインダクタの構成を図面を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a chip inductor according to an embodiment of the present invention will be described below with reference to the drawings.
【００１１】図２において、１はチップインダクタで、
このチップインダクタ１は、例えばフェライトや比透磁
率μが約１のアルミナ（Ａｌ2 Ｏ3 ）を主成分とする無
機材料などにて、略四角柱状の巻回胴部２とこの巻回胴
部２の両端に一体にフランジ状に形成した鍔部３，３と
にて断面が略Ｈ字形状に成型されたコア４を有してい
る。また、コア４の鍔部３，３の同方向の一周面、およ
び鍔部３，３の端面の一部には、一周面から端面に亘っ
て電極５，５がそれぞれ印刷形成されている。なお、こ
れら電極５，５は、例えば銀（Ａｇ）−パラジウム（Ｐ
ｄ）系の導電ペースト８が被覆形成され、この導電ペー
スト８にて形成した電極としての電極膜10の表面に図示
しないニッケル（Ｎｉ）メッキおよび半田（錫（Ｓｎ）
−鉛（Ｐｂ）系）メッキがそれぞれ施されて多層に形成
されている。なお、電極膜10のみ、あるいは半田メッキ
を施すのみでもよい。In FIG. 2, 1 is a chip inductor,
This chip inductor 1 is made of, for example, an inorganic material mainly composed of ferrite or alumina (Al 2 O 3 ) having a relative magnetic permeability μ of about 1 and the like. The core 4 is formed at both ends of 2 with flange portions 3 and 3 integrally formed in a flange shape and the cross section is molded into a substantially H shape. Further, electrodes 5 and 5 are formed by printing on one circumferential surface of the collar portions 3 and 3 of the core 4 in the same direction and a part of the end surfaces of the collar portions 3 and 3 from the circumferential surface to the end surface. The electrodes 5 and 5 are, for example, silver (Ag) -palladium (P
d) based conductive paste 8 is formed by coating, and nickel (Ni) plating and solder (tin (Sn)) (not shown) are formed on the surface of the electrode film 10 as an electrode formed by this conductive paste 8.
-Lead (Pb) -based plating is applied to form a multilayer. Note that only the electrode film 10 or only solder plating may be applied.
【００１２】そして、このコア４の巻回胴部２には、ポ
リウレタン被覆電線などの導線６が巻回されてコイル７
が構成されている。また、この導線６の両端部は、鍔部
３，３に形成された電極５，５に半田などにてそれぞれ
接続される図示しない引出線となっている。A conductor 6 such as a polyurethane-coated electric wire is wound around the winding body 2 of the core 4 to form a coil 7.
Is configured. Further, both ends of the conducting wire 6 are lead wires (not shown) which are respectively connected to the electrodes 5 and 5 formed on the collar portions 3 and 3 by soldering or the like.
【００１３】次に、上記実施の一形態のチップインダク
タの製造方法を図面を参照して説明する。Next, a method of manufacturing the chip inductor according to the above embodiment will be described with reference to the drawings.
【００１４】まず、略四角柱状の巻回胴部２の軸方向の
両端部にフランジ状に突出した鍔部３，３を一体に設け
たコア４をフェライトなどを用いてプレス成形などにて
形成する。First, a core 4 integrally formed with flange portions 3 and 3 projecting in a flange shape at both axial end portions of a winding body portion 2 having a substantially quadrangular prism shape is formed by press molding using ferrite or the like. To do.
【００１５】次に、このコア４を電極形成の導電ペース
ト８を貯溜する槽９まで搬送し、この槽９内の導電ペー
スト８の液面に対してコア４の軸方向が交差するように
傾斜した状態で槽９に向けてコア４を移動する。そし
て、図３に示すように、一方の鍔部３の一周面および端
面の一部を導電ペースト８に浸漬する。なお、この浸漬
の際、鍔部３，３の対向する面である内面には導電ペー
スト８が付着しないようにする。Next, the core 4 is conveyed to a tank 9 for storing the conductive paste 8 for forming electrodes, and is inclined so that the axial direction of the core 4 intersects the liquid surface of the conductive paste 8 in the tank 9. The core 4 is moved toward the tank 9 in this state. Then, as shown in FIG. 3, a part of one circumferential surface and one end surface of the one collar portion 3 is immersed in the conductive paste 8. During this immersion, the conductive paste 8 is prevented from adhering to the inner surfaces of the flange portions 3 and 3 which face each other.
【００１６】そして、浸漬した後、一旦コア４を上方に
引上げて導電ペースト８を乾燥させて電極膜10を形成す
る。さらに、コア４の中心で他方の鍔部３が下方に位置
するように回動させ、図１に示すように、他方の鍔部３
の一周面および端面の一部を同様に導電ペースト８に浸
漬する。そして、コア４を再び上方に引上げて導電ペー
スト８を乾燥させ、焼成して電極膜10をそれぞれ形成す
る。After the immersion, the core 4 is once pulled up and the conductive paste 8 is dried to form the electrode film 10. Further, the other flange portion 3 is rotated at the center of the core 4 so that the other flange portion 3 is located below, and as shown in FIG.
Similarly, the peripheral surface and a part of the end surface are immersed in the conductive paste 8. Then, the core 4 is pulled up again to dry the conductive paste 8 and fired to form the electrode films 10.
【００１７】この後、電極膜10の表面にニッケル（Ｎ
ｉ）メッキおよび半田（錫（Ｓｎ）−鉛（Ｐｂ）系）メ
ッキをそれぞれ施して電極５，５を形成する。After that, nickel (N
i) Plating and solder (tin (Sn) -lead (Pb) based) plating are applied to form electrodes 5 and 5.
【００１８】次に、図４に示すように、コア４の巻回胴
部２にポリウレタン被覆電線などの導線６を巻回してコ
イル７を巻装する。そして、この導線６の両端部の図示
しない引出線を、鍔部３，３に形成した電極５，５に半
田などにてそれぞれ接続する。Next, as shown in FIG. 4, a coil 7 is wound by winding a conducting wire 6 such as a polyurethane-coated electric wire around the winding body portion 2 of the core 4. Then, the lead wires (not shown) at both ends of the conducting wire 6 are connected to the electrodes 5 and 5 formed on the flange portions 3 and 3 by soldering or the like.
【００１９】さらに、コイル７を巻装したコア４に、電
極５，５を露出して絶縁性の合成樹脂にてコア４および
コイル７を被覆して図示しないモールド成形し、このモ
ールド成形体の表面に表示インクなどにてインダクタン
ス値などを表示しチップインダクタを形成する。Further, the electrodes 5 and 5 are exposed on the core 4 around which the coil 7 is wound, and the core 4 and the coil 7 are covered with an insulating synthetic resin and molded by a mold (not shown). The chip inductor is formed by displaying the inductance value on the surface with display ink.
【００２０】上記実施の一形態によれば、従来のマスキ
ングによる印刷形成では、３方向の面に対してそれぞれ
別個に計３回の印刷形成により電極が形成されるのに対
して、コア４を回動して鍔部３，３の一部をそれぞれ別
々に浸漬する計２回の工程のみで済み、製造工程数を減
少でき、生産性を向上できる。According to the above-mentioned embodiment, in the conventional print formation by the masking, the electrodes are formed by the print formation of three times on the respective surfaces in the three directions, whereas the core 4 is formed. Only a total of two steps of rotating and partially immersing the collar parts 3 and 3 separately are required, the number of manufacturing steps can be reduced, and the productivity can be improved.
【００２１】さらに、槽９に貯溜する導電ペースト８に
浸漬する簡単な構造であるため、電極５，５を形成する
ための製造装置を簡略化でき、製造装置の小型化による
設置スペースの縮小化および製造装置のコストの低減が
容易に図れる。Furthermore, since the structure is soaked in the conductive paste 8 stored in the tank 9, the manufacturing apparatus for forming the electrodes 5, 5 can be simplified, and the installation space can be reduced by downsizing the manufacturing apparatus. And the cost of the manufacturing apparatus can be easily reduced.
【００２２】なお、上記実施の一形態において、図示し
ないモールド成形体を形成して説明したが、このモール
ド成形体を設けなくてもよい。In the above-described embodiment, a molded body (not shown) is formed and explained, but this molded body may not be provided.
【００２３】また、あらかじめ傾斜した状態にコア４を
回動させておき下方に移動して導電ペースト８に浸漬す
る方法について説明したが、例えば導電ペースト８を貯
溜する槽９上に導電ペースト８の液面から所定の位置と
なるように移動させ、コア４を回動して一方の鍔部３に
電極膜を形成した後、コア４を反対方向に回動して他方
の鍔部３に電極膜を形成するようにもできる。The method of rotating the core 4 in an inclined state in advance and moving it downward to immerse it in the conductive paste 8 has been described. For example, the conductive paste 8 is placed on a tank 9 for storing the conductive paste 8. After moving to a predetermined position from the liquid surface, the core 4 is rotated to form an electrode film on one of the collar portions 3, and then the core 4 is rotated in the opposite direction to form an electrode on the other collar portion 3. It is also possible to form a film.
【００２４】また、コア４を略四角柱状の巻回胴部２を
有する形状に形成して説明したが、略円柱形状や多角柱
状の巻回胴部を有したものなどいずれの形状に形成した
ものでも同様の効果が得られる。Further, although the core 4 has been described as being formed in a shape having the winding body portion 2 having a substantially quadrangular prism shape, it may be formed in any shape such as having a winding body portion having a substantially cylindrical shape or a polygonal column shape. The same effect can be obtained with one.
【００２５】[0025]
【発明の効果】請求項１記載のチップインダクタによれ
ば、導電材料の液面に対してコアの軸方向が交差する方
向に位置させ、一方の鍔部の周面および端面の一部を導
電材料に浸漬した後、コアを回動させて他方の鍔部の周
面および端面の一部を導電材料に浸漬して電極を形成す
るため、電極の形成のための工程が２回で済み、生産性
を向上できるとともに、製造装置を簡略化できる。According to the chip inductor of the first aspect of the invention, the core is positioned in a direction in which the axial direction of the core intersects the liquid surface of the conductive material, and the peripheral surface and a part of the end surface of the one flange portion are electrically conductive. After immersing in the material, the core is rotated to immerse a part of the peripheral surface and the end surface of the other flange portion in the conductive material to form the electrode, so that the step for forming the electrode is performed only twice. The productivity can be improved and the manufacturing apparatus can be simplified.
【００２６】請求項２記載のチップインダクタの製造方
法によれば、導電材料の液面に対してコアの軸方向が交
差する方向に位置させ、一方の鍔部の周面および端面の
一部を導電材料に浸漬した後、コアを回動させて他方の
鍔部の周面および端面の一部を導電材料に浸漬して電極
を形成するため、電極の形成のための工程が２回で済
み、生産性を向上できるとともに、製造装置を簡略化で
きる。According to the method of manufacturing a chip inductor according to the second aspect, the core is positioned in a direction in which the axial direction of the core intersects with the liquid surface of the conductive material, and the peripheral surface and a part of the end surface of the one flange portion are arranged. After immersing in the conductive material, the core is rotated to immerse the peripheral surface and part of the end surface of the other flange part in the conductive material to form the electrode, so the process for forming the electrode is performed only twice. The productivity can be improved and the manufacturing apparatus can be simplified.
【図１】本発明の実施の一形態を示す電極を形成する状
況を示す説明図である。FIG. 1 is an explanatory diagram showing a state of forming an electrode according to an embodiment of the present invention.
【図２】同上チップインダクタの斜視図である。FIG. 2 is a perspective view of the same chip inductor.
【図３】同上一方の鍔部に電極を形成する状況を示す説
明図である。FIG. 3 is an explanatory view showing a situation in which an electrode is formed on one of the flange portions of the same.
【図４】同上導線を巻回した状況を示す説明図である。FIG. 4 is an explanatory view showing a situation in which the above-mentioned conducting wire is wound.
【図５】従来のチップインダクタの電極を形成する状況
を示す説明図である。FIG. 5 is an explanatory view showing a state of forming electrodes of a conventional chip inductor.
【符号の説明】 １ チップインダクタ ２ 巻回胴部 ３ 鍔部 ４ コア ５ 電極 ６ 導線 10 電極としての電極膜[Explanation of symbols] 1 chip inductor 2 winding body 3 collar 4 core 5 electrode 6 conducting wire 10 electrode film as electrode
Claims (2)
ンジ状の鍔部を有したコアと、前記鍔部の周面に導電材
料が被覆されて形成された一対の電極と、前記巻回胴部
に巻回され両端部に前記電極にそれぞれ接続される引出
線を有した導線とを備えたチップインダクタにおいて、 前記電極は、前記導電材料の液面に対して前記コアの軸
方向が交差する方向に位置された状態で、前記鍔部の周
面および端面の一部がそれぞれ別々に前記導電材料に浸
漬されて形成されたことを特徴としたチップインダク
タ。1. A core having flange-shaped flanges at both ends of a columnar winding body, a pair of electrodes formed by coating a peripheral surface of the flange with a conductive material, and the winding. In a chip inductor provided with a conducting wire wound around a body and having lead wires respectively connected to the electrodes at both ends thereof, the electrodes are arranged such that an axial direction of the core with respect to a liquid surface of the conductive material is A chip inductor, characterized in that, in a state of being positioned in a direction intersecting with each other, a part of a peripheral surface and an end surface of the collar portion are separately immersed in the conductive material.
ンジ状の鍔部を有したコアと、前記鍔部の周面に導電材
料が被覆されて形成された一対の電極と、前記巻回胴部
に巻回され両端部に前記電極にそれぞれ接続される引出
線を有した導線とを備えたチップインダクタの製造方法
において、 前記電極は、前記導電材料の液面に対して前記コアの軸
方向が交差する方向に位置させ、前記一方の鍔部の周面
および端面の一部を前記導電材料に浸漬した後、前記コ
アを回動させて前記他方の鍔部の周面および端面の一部
を前記導電材料に浸漬して形成することを特徴としたチ
ップインダクタの製造方法。2. A core having flange-shaped flanges at both ends of a columnar winding body, a pair of electrodes formed by coating a peripheral surface of the flange with a conductive material, and the winding. In a method of manufacturing a chip inductor, comprising: a conductor having a lead wire that is wound around a body and is connected to the electrodes at both ends thereof, the electrode is of the core with respect to a liquid surface of the conductive material. Positioned in the direction in which the axial directions intersect, after immersing a part of the peripheral surface and the end surface of the one flange portion in the conductive material, the core is rotated to rotate the peripheral surface and the end surface of the other flange portion. A method of manufacturing a chip inductor, characterized in that a part thereof is immersed in the conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02570396A JP3771308B2 (en) | 1996-02-13 | 1996-02-13 | Manufacturing method of chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02570396A JP3771308B2 (en) | 1996-02-13 | 1996-02-13 | Manufacturing method of chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09219333A true JPH09219333A (en) | 1997-08-19 |
| JP3771308B2 JP3771308B2 (en) | 2006-04-26 |
Family
ID=12173156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02570396A Expired - Lifetime JP3771308B2 (en) | 1996-02-13 | 1996-02-13 | Manufacturing method of chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3771308B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135048A (en) * | 1996-10-31 | 1998-05-22 | Kyocera Corp | Rectangular chip inductor |
| US6804882B2 (en) * | 1999-08-26 | 2004-10-19 | Murata Manufacturing Co., Ltd. | Method for manufacturing a coil device |
| JP2007012861A (en) * | 2005-06-30 | 2007-01-18 | Fuonon Meiwa:Kk | Substrate for core of winding-type common mode coil, core using the substrate, and winding-type common mode coil |
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| WO2015182374A1 (en) * | 2014-05-30 | 2015-12-03 | 株式会社村田製作所 | Method for manufacturing winding-wire coil component |
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| JP7172971B2 (en) | 2019-12-06 | 2022-11-16 | 株式会社村田製作所 | WINDING CORE, COIL COMPONENT, AND COIL COMPONENT MANUFACTURING METHOD |
-
1996
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135048A (en) * | 1996-10-31 | 1998-05-22 | Kyocera Corp | Rectangular chip inductor |
| US6804882B2 (en) * | 1999-08-26 | 2004-10-19 | Murata Manufacturing Co., Ltd. | Method for manufacturing a coil device |
| JP2007012861A (en) * | 2005-06-30 | 2007-01-18 | Fuonon Meiwa:Kk | Substrate for core of winding-type common mode coil, core using the substrate, and winding-type common mode coil |
| JP2012235080A (en) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | Chip-type coil component |
| US9831033B2 (en) * | 2012-12-04 | 2017-11-28 | Sumida Components And Modules Gmbh | Method for producing magnetic cores |
| US20150318096A1 (en) * | 2012-12-04 | 2015-11-05 | SUMIDA Components & Modules GmbH | Magnetic cores and method for producing same |
| WO2015182374A1 (en) * | 2014-05-30 | 2015-12-03 | 株式会社村田製作所 | Method for manufacturing winding-wire coil component |
| CN106415755A (en) * | 2014-05-30 | 2017-02-15 | 株式会社村田制作所 | Multilayer capacitor |
| JPWO2015182374A1 (en) * | 2014-05-30 | 2017-04-20 | 株式会社村田製作所 | Method for manufacturing wire-wound coil component |
| US10395824B2 (en) | 2014-05-30 | 2019-08-27 | Murata Manufacturing Co., Ltd. | Method of manufacturing winding-type coil component |
| WO2016027659A1 (en) * | 2014-08-19 | 2016-02-25 | 株式会社村田製作所 | Winding coil component manufacturing method |
| JPWO2016027659A1 (en) * | 2014-08-19 | 2017-04-27 | 株式会社村田製作所 | Method for manufacturing wire-wound coil component |
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| US10199156B2 (en) | 2014-08-19 | 2019-02-05 | Murata Manufacturing Co., Ltd. | Method of manufacturing winding-type coil component |
| JP2018523299A (en) * | 2015-06-10 | 2018-08-16 | クアルコム，インコーポレイテッド | Capacitor structure for power delivery applications |
| CN106340373A (en) * | 2015-07-06 | 2017-01-18 | Tdk株式会社 | Coil component and manufacturing method thereof |
| US10418174B2 (en) | 2015-07-06 | 2019-09-17 | Tdk Corporation | Coil component and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3771308B2 (en) | 2006-04-26 |
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