JPH105990A - Production of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an element from deteriorating in its characteristics due to adhesion of adhesive, etc., by sealing at the same tome as fixing the element and connection with an external electrode without using a lead wire and an adhesive. SOLUTION: A case 11, in which, for example, a SAW filter chip 3 is accommodated in an inner space, a piercing hole 6 is arranged at a wall part corresponding to an electrode 9 of SAW filter chip 3, at least the surface of inner face/wall face of piercing hole 6 is arranged with a gold or tin metallic film 7 and which is made of glass material, is immersed, in a nitrogen atmosphere container 15, as a first process, in a solder bath 12 of a solder 8 in molten and jetting state while the wall face at the side of piercing hole 6 is arranged to rear face, as a second process, the case 11 is elevated up to the outside of molten solder bath 12 at low speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component.

[0002]

2. Description of the Related Art For example, the characteristics of a SAW filter, a SAW resonator, or a crystal resonator vary according to the external atmosphere, and therefore, these elements are sealed in a case.

[0003]

In the above conventional device, the input / output electrodes of the element are connected to the external lead-out electrodes of the case using lead wires, and the element is fixed with an adhesive. Therefore, there has been a problem that a part of the adhesive scatters and adheres to the element, thereby deteriorating its characteristics.

Accordingly, the present invention prevents the deterioration of characteristics due to the adhesion of the adhesive by fixing the element and connecting it to an external lead electrode without using a lead wire or an adhesive and simultaneously sealing the element. It is the purpose.

[0005]

Means for Solving the Problems In order to achieve this object, the present invention provides an element in which an element having an electrode on one side is accommodated in an internal space, and a through hole is provided in a wall portion corresponding to the electrode of the element. The case where the metal film is provided on the inner surface and the outer peripheral portion of the wall surface of the through hole and which is insulative and at least the surface is non-brazing, is first jetted in a molten state made of a brazing material and jetted as a first step. The molten sealing member is pressed into the through hole by immersing the sealing member in the sealing member with the wall surface on the side of the through hole facing down, and the sealing member in the molten state and the element in the case inner portion. And the second step is to raise the case to the outside of the molten state jet sealing body, thereby separating the molten state jet sealing body from the case, and at the same time, the metal film is formed at the outer part of the case. of While covering the through-hole peripheral portion even without, is intended to solidify the interior and the case through holes and the sealing member on the metal film.

According to the above manufacturing method, the element can be electrically pulled out of the case through the sealing member in the through hole, and the element can be held by the sealing member in the through hole. Since it can be performed by the fixing force of the body, fixing with an adhesive is unnecessary, and by making the diameter of the through hole larger in the outside of the case than in the case, the sealing member in the molten state can be formed. Insertion is facilitated, and this sealing body is fixed to the metal film in the through hole, and the inside of the case is formed so that its diameter is larger than the diameter of the through hole inside the case. Since the metal film does not fall off strongly and the outer peripheral portion of the through hole of the metal film is covered with the sealing material outside the case, the airtightness becomes extremely high, and as a result, the characteristic deterioration of the element does not occur.

[0007]

According to the first aspect of the present invention, an element having an electrode on one side is housed in an internal space,
A through-hole is provided in a wall portion corresponding to the electrode of the element, and a metal film is provided on an inner surface and an outer peripheral portion of the wall of the through-hole. In a molten state made of a brazing material as a first step, the case with the wall surface on the side of the through hole facing downward is immersed in the sealing body being jetted, and the case is melted as a second step. Is a method for manufacturing an electronic component which is raised outside of the jet sealing body, whereby the sealing of the through hole and the electrical connection can be performed simultaneously.

According to a second aspect of the present invention, there is provided the electronic component manufacturing method according to the first aspect, wherein the case is slightly heated by radiant heat of the molten jet sealing body and then immersed in the jet sealing bath. This prevents the case from being broken by thermal shock when the case is immersed in the jet sealing body.

Further, the invention according to claim 3 of the present invention provides
3. The method for manufacturing an electronic component according to claim 1, wherein the first step and the second step are performed in a closed container in a low oxygen concentration atmosphere, wherein oxidation can be prevented.

According to a fourth aspect of the present invention, in the first step, ultrasonic waves are applied to the jet sealing body in a molten state to cause the sealing body to penetrate into the through-hole. 3. The method for manufacturing an electronic component according to any one of the items 3, wherein the jet sealing body easily penetrates into the through hole.

Further, the invention according to claim 5 of the present invention provides:
5. The method for manufacturing an electronic component according to claim 4, wherein the vibration direction of the ultrasonic wave is a direction approximate to an axis of the through hole provided in the case, wherein the jet sealing body is more easily penetrated into the through hole. .

According to a sixth aspect of the present invention, there is provided the electronic component manufacturing method according to the fourth or fifth aspect, wherein the case is immersed in the jet sealing body in a molten state a plurality of times.
This ensures the adhesion of the jet sealing body.

The invention according to claim 7 of the present invention is characterized in that, in the second step, the case is provided outside the molten state jet sealing bath and without being separated from the molten sealing body. 7. The case according to any one of claims 1 to 6, wherein the case is raised at a low speed to a position where the case is pulled by the tension of the jet sealing body in a state, and then is raised at a high speed to instantaneously separate the case and the sealing body in a molten state. The method for manufacturing an electronic component according to the above, wherein the bonding strength between the input / output electrode of the element and the sealing body is increased.

Further, the invention according to claim 8 of the present invention provides:
In the first step, the surface of the jet sealing body in the molten state is kept substantially horizontal, and the axis of the through hole provided in the case is set to a direction slightly inclined from the vertical direction, and the case is placed in the jet sealing body in the molten state. The method of manufacturing an electronic component according to claim 1, wherein the electronic component is immersed in the electronic component, and is easily deaerated from inside the case.

According to a ninth aspect of the present invention, in the first step, while the case is rotated about an axis passing through the center of gravity of the case in parallel with the axis of the through-hole, the molten state of the jet sealing hole is formed. The method for manufacturing an electronic component according to any one of claims 1 to 8, wherein the case is immersed in the body, wherein the sealing body easily penetrates into the through hole.

Further, in the invention according to claim 10 of the present invention, in the second step, when the case rises from the molten jet sealing body, the axis passing through the center of gravity of the case in parallel with the axis of the through hole is defined. The method for manufacturing an electronic component according to any one of claims 1 to 9, wherein the electronic component rises while rotating the case as a center, and facilitates cutting of the molten sealing body.

[0017] The invention according to claim 11 of the present invention provides:
The method for manufacturing an electronic component according to any one of claims 1 to 10, wherein a plurality of cases are arranged in parallel, and a plurality of cases are simultaneously sealed.

Further, according to a twelfth aspect of the present invention, the fixing member for fixing the case is made of a material having a heat conductivity equal to or more than that of the case, and the area of the case mounting surface of the fixing member is reduced. The method for manufacturing an electronic component according to claim 1, wherein the case is fixed to the case by vacuuming, the area being larger than at least an area of a mounting surface of the case, wherein the sealing member penetrates into the case. It is what makes the body easier to solidify.

The invention according to claim 13 of the present invention provides:
13. The method for manufacturing an electronic component according to claim 1, further comprising a spacer between the element and an inner wall surface of the case inside the through hole, wherein the surface of the element is fixed to the case. This is to prevent the failure due to.

Further, according to a fourteenth aspect of the present invention, in the case, a dike is provided between the element and the inner wall surface on the through hole side inside the case, and around the opening portion of the through hole inside the case. The method for manufacturing an electronic component according to any one of claims 1 to 13, further comprising a sealing member, wherein the sealing member prevents the sealing member from wrapping around the element.

The invention according to claim 15 of the present invention provides:
The method for manufacturing an electronic component according to claim 1, wherein a sealing process is performed on a case provided with an exhaust hole on a wall surface facing the wall surface provided with the through hole. This is to make the exhaust at the time smooth.

First, an electronic component to be subjected to a sealing process according to the first and second embodiments of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a frame made of, for example, borosilicate glass. A SAW filter chip (a SAW oscillator chip or the like) 3 is housed in the opening 2 of the frame 1 as an example of an element. On the upper and lower surfaces of the frame 1, first and second plates 4, 5 made of borosilicate glass are joined by direct joining of the glasses. Further, a through hole 6 is formed in the first plate 4, and a metal film 7 is formed on the inner surface of the through hole 6 and the outer peripheral portion of the through hole on the outer surface of the first plate 4. This metal film 7
Has, for example, a three-layer structure in which the lowermost layer is made of Ti or Cr, the second layer is made of Cu or Ni, and the outermost layer is made of one of Au, Sn and Ag. By performing a sealing process on such an electronic component, the metal film 7 is formed.
A solder 8 is provided on the top as an example of a sealing body.
Are connected to the input / output electrodes 9 of each SAW filter chip 3 in the opening 2, and on the outer surface of the first plate 4, the metal film 7 provided on the outer periphery of the through hole 6 It is formed so as to cover at least the outer periphery of the through hole 6, and is connected to the external electrode 10. That is, the frame 1, the plate 4,
5, a case is formed, and an electronic component in which the SAW filter chip 3 is accommodated in the case can be manufactured.

The first and second plates 4 and 5 are directly joined to each other on both sides of the frame 1 by means of glass. Of course, in order to join these, the joining surface between the frame 1 and the first and second plates 4 and 5 must be in a state where the mirror surface of the glass is held. Further, in order to further secure the direct joining of these three members, it is preferable to heat these three members while applying pressure. In other words, even if a small amount of dust or the like is present on the bonding surface by applying such pressure, the outer peripheral surface of the dust is strongly pressed, so that direct bonding can be performed.

The first embodiment of the present invention will be described with reference to FIGS. 2 (a) to 2 (d)
FIG. 2A is a process cross-sectional view illustrating a sealing process of the first embodiment, and FIG. 2A is a case 11 of the electronic component described in FIG.
2 is a process sectional view showing a state before the sealing process. FIG.
As shown in (a), the manufacturing apparatus according to the first embodiment includes a solder bath 12 in which a solder 8 having a melting point of about 300 ° C. used as an example of a sealing body is jetted in a molten state, and a sealing operation is performed. Fixing device 13 for fixing case 11 to be applied and fixing device 13
, And these devices are sealed in a container 15 filled with nitrogen. By performing the sealing treatment in such an atmosphere, the case 11
The inside of the case 11 can be filled with dry nitrogen, whereby the atmosphere in the case 11 becomes a moisture-free atmosphere.
Vibration inhibition due to dew condensation on the AW filter chip 3 can be prevented. Further, it is possible to prevent oxidation of molten solder which is extremely oxidized. On the other hand, in the case 11 to be sealed, the thickness of the frame 1 is 400 μm, the thickness of the first plate 4 is 200 μm, and the thickness of the second plate 5 is 200 μm.
And the thickness of the SAW filter chip 3 is 340 μm.
It has become. That is, the SAW filter chip 3 is the frame 1
Since the thickness is smaller than that of the case 11, a space is always formed inside the case 11. When such a case 11 is fixed to the fixture 13 such that the opening outside the through hole 6 faces the lower surface, the SAW filter chip 3 and the inner wall surface of the first plate 4 come into contact with each other. . Jet solder bath 1 at this time
2 is about 350 ° C., the ambient temperature in the closed container 15 is about 160 ° C., and the temperature of the case 11 and the fixture 13 is about 12 ° C.
5 ° C. While maintaining this state for one to several minutes, the sealed container 15 is filled with nitrogen, and at the same time, the case 11 is preheated to about 150 ° C. using the radiant heat of the molten solder. In addition, about 1
By raising the temperature of the case 11 to about 50 ° C., about 35
Even if the case 11 is immersed in the jet solder bath 12 at 0 ° C., the case 11 is not damaged by heat shock.
Then, as a first step, as shown in FIG.
As a result, the case 11 is lowered and rushed into the jet solder bath 12. At this time, the case 11 is overcome by the lift 14 to overcome the buoyancy of the solder and is forcibly immersed in the jet solder bath 12.
1 is press-fitted so as to lift the SAW filter chip 3 inside. Further, if the diameter of the through hole 6 is formed so that the diameter of the through hole 6 is larger in the outer part than in the inner part of the case 11, the molten solder is more easily pressed. Then, the input / output electrodes 9 of the SAW filter chip 3 and the solder form an alloy layer, and are electrically and mechanically connected to each other.
Due to this temperature difference, the temperature of the solder inside the case drops and the solder starts to solidify. Here, the case 11 is formed of a glass material such as borosilicate glass and has a poor heat conduction, so that a temperature difference effective for solidifying the solder can be realized. Further, if the fixing member 13 is made of a material having a heat conductivity equal to or higher than that of the case, such as a ceramic material, the solidification of the solder can be further promoted. By lifting the SAW filter chip 3 in this manner, the vibration of the SAW filter is not hindered. Here, another reason for raising the temperature of the case 11 using the radiant heat of the molten solder will be described. That is, the case 11 is heated to about 150 ° C. as described above,
In this state, if the through-hole 6 is sealed with the solder 8 as shown in FIG. 2B, the case 11 is taken out of the sealed container 15 after the final step, that is, after FIG. When this happens, the inside of the case 11 becomes a negative pressure, and as a result, vibration inhibition due to air resistance of the SAW filter chip 3 does not occur. Further, the diameter of the solder inside the case 11 extending from the through hole 6 and being connected to the electrode 9 of the SAW filter chip is formed to be slightly larger than the diameter of the through hole inside the case. The connection strength can be increased. Continuing with the description of the sealing process, after the case 11 is immersed in the jet solder bath 12 in the first process, the case is quickly moved to the outside of the jet solder bath 12 as shown in FIG. Raise at low speed. At this time, the metal film 7 provided outside the case 11 (the outer peripheral portion of the through hole 6 of the first plate body 4) and the molten solder are pulled by the tension of the molten solder without being divided. Through this step, S
By diffusing the solder and the input / output electrode 9 of the AW filter chip 3 to form a thicker alloy layer, a mechanically stronger connection can be obtained. After that, the molten solder is instantaneously divided by raising it at high speed,
The amount of solder on the metal film 7 provided inside the case 11, inside the through hole 6, and outside the case 11 can be made uniform as shown in FIG. As a result, the metal film 7 is covered with the solder 8 over the entire circumference, whereby the airtightness in the case 11 is kept extremely high. To explain this point in more detail, unless the metal film 7 on the plate 4 is covered with the solder 8 as described above,
The reliability for airtightness is low. That is, the through-hole 6 is formed in the plate 4 by sandblasting or etching, and the surface thereof is largely roughened. Therefore, even if the metal film 7 is deposited here, the uneven portion cannot be completely filled, and a minute gap is formed. Further, even if the solder 8 is press-fitted, the gap cannot be completely covered, and as a result, the airtightness in the case is deteriorated.
Therefore, in the present embodiment, as shown in FIG. 2D, the solder 8 covers the metal film 7 on the outer peripheral portion of the through hole 6 outside the case. In this case, the upper surface of the plate body 4 at the outer peripheral portion of the through hole 6 has a mirror surface as glass, and thus is in close contact with the metal film 7 provided on the upper surface, and the surface of the metal film 7 is also a flat surface like a mirror surface. Becomes
Therefore, if the solder is applied as shown in FIG. 2D, airtightness can be surely achieved. Further, in the second step, after raising the case 11 at a low speed, the case 11 is raised at a high speed to divide the solder 8 so that the swelling amount of the solder is regulated to a height of about 100 μm and made uniform. Can be. If the amount of solder swells as in the first embodiment, the formation of the external electrodes 10 formed by printing becomes very easy. By performing the sealing treatment as described above, the SAW filter chip 3 can be fixed without using an adhesive, and the airtightness in the case 11 can be kept extremely high. As a result, the SAW filter chip 3 The characteristic degradation does not occur. FIG. 3 shows a state in which the cases are arranged vertically and horizontally in order to simultaneously seal a large number of cases before the sealing process of the electronic component shown in FIG. That is, a plurality of SAW filter chips 3 are provided between the large plate members 4 and 5, and in that state, a sealing process is performed on the through holes 6 of each case.
Thereafter, the individual electronic components shown in FIG. 1 are obtained by division.

Referring to FIGS. 4A and 4B, a second embodiment of the present invention will be described. FIG. 4A is a process sectional view of the manufacturing apparatus in which the ultrasonic horn 16 is provided in the jet solder bath 12. The ultrasonic horn 16 is attached so that the direction of vibration of the ultrasonic waves generated by the ultrasonic horn 16 and the axis of the through-hole 6 to be sealed are approximated. In this state, the preparation process for filling the inside of the closed vessel 15 with nitrogen and preheating the case 11 is the same as in the first embodiment. FIG. 4B is a process cross-sectional view illustrating a first process of the second embodiment. Similarly to the first embodiment, the case 11 is forcibly immersed in the jet solder bath 12 by the elevator 14, so that the molten solder rises the SAW filter chip 3 inside the case 11 through the through hole 6. Press fit. In addition to the above, in the second embodiment, the molten solder also acts to lift the SAW filter chip 3 inside the case 11 through the through hole 6 by the ultrasonic vibration. Due to this action, the temperature difference between the jet solder bath 12 and the case 11 is small, so that the SAW filter chip 3 is kept floating even if the solder inside the case does not start to solidify when the case 11 is in the jet solder bath 12. Can be. Case 1
Since the time during which 1 is in the jet solder bath 12 can be made slightly longer than in the first embodiment, stronger alloy bonding can be performed between the input / output electrode 9 of the SAW filter chip and the solder 8. The second and subsequent steps are the same as in the first embodiment. Here, if the connection by the solder 8 or the lifting of the SAW filter chip 3 is insufficient, the sealing process can be performed more reliably by performing the sealing process again. As the number of repetitions increases (the thickness of the alloy layer formed by diffusion depends on the thickness of the metal film 7), the electrical and mechanical connection between the solder 8 and the SAW filter chip 3 becomes stronger. .

Here, a method for causing the case 11 to enter the jet solder bath 12 in the first step of the first and second embodiments of the present invention will be described in detail with reference to FIGS. As shown in FIG. 5, the direction in which the case 11 protrudes into the jet solder bath 12 is not the vertical direction, but the direction of the axis of the through hole 6 provided in the case 11 is a direction having a slight angle with respect to the vertical direction. I have. This is such that when the molten solder is press-fitted into the through-hole 6, the gas in the case 11 can be easily degassed even slightly. By doing so, the press-fitting of the molten solder is performed more smoothly. In order to obtain the same effect, as shown in FIG. 6, a method is also employed in which the case 11 is caused to enter the jet solder bath 12 while rotating the case 11 about the axis line where the elevator 14 is provided.

The method of rotating the case 11 in FIG. 6 is also performed when the case 11 is raised in the second step of the first and second embodiments of the present invention. At this time, case 11
Is rotated, the molten solder can be separated smoothly, and the amount of solder on the metal film 7 provided in the through-hole 6, the inside of the case 11, and the outside of the case 11 can be made uniform. it can.

A third embodiment of the present invention will be described with reference to FIG. FIG. 7 shows the input / output electrodes 9 on the SAW filter chip 3 before the sealing process in the electronic component of FIG.
A spacer 17 made of an inorganic material that can be easily deformed, such as Au, is bonded only to a ball portion formed at the time of wire bonding at a position different from the above and at a portion that does not hinder the vibration of the SAW filter chip 3. FIG. 3 is a cross-sectional view of a structure formed using a construction method (or also called a wire bump) or the like, in which a space necessary for vibration between the SAW filter chip 3 and the inner wall surface of the first plate body 4 is secured. If the sealing process described in the first or second embodiment of the present invention is performed using the case having such a configuration, the SAW due to the buoyancy of the solder and the ultrasonic vibration can be achieved.
Since the sealing process can be performed without expecting the rising of the filter chip 3, the vibration of the SAW filter chip 3 is not hindered after the sealing process.

A fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 shows a portion of the electronic component of FIG. 1 which does not hinder the vibration of the SAW filter chip 3 around the input / output electrode 9 on the SAW filter chip 3 before the sealing process, such as a polyimide tape. FIG. 2 is a cross-sectional view illustrating a configuration in which a thin plate-like material is processed into a donut shape to form a bank 18. If the sealing process described in the first or second embodiment of the present invention is performed using the case having such a configuration, when the solder 8 is pressed into the through hole 6, the solder 8
Protruding from the input / output electrode 9 on the AW filter chip 3,
It is also possible to prevent a short circuit with another electrode.

A fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a sectional view of the electronic component of FIG. 1 in which the spacer 17 used in the third embodiment and the embankment body 18 used in the fourth embodiment are simultaneously formed. When the sealing process described in the first or second embodiment of the present invention is performed using the case having such a configuration, the sealing is performed without expecting the floating of the SAW filter chip 3 due to the buoyancy of the solder or the ultrasonic vibration. Since hole processing can be performed, after sealing processing, S
It does not happen that the vibration of the AW filter chip 3 is disturbed, and when the solder 8 is pressed into the through hole 6,
It is also possible to prevent the solder 8 from protruding from the input / output electrodes 9 on the SAW filter chip 3 and shorting with other electrodes.

A sixth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a configuration sectional view of the electronic component of FIG. 1 in which a second through hole 19 is provided in the second plate 5. If the sealing process described in the first or second embodiment of the present invention is performed using the case having such a configuration, the second through hole 19 becomes an exhaust hole, and the buoyancy of the solder and the ultrasonic vibration are reduced. , The air resistance generated when the SAW filter chip 3 rises can be reduced, and the SAW filter chip 3 can be easily lifted by the buoyancy of the solder and ultrasonic vibration. No vibrations are disturbed. After performing the sealing treatment of the present invention, the sealing treatment of the present invention, or another hermetic sealing treatment on the second through-hole 19,
For example, by performing a hermetic sealing process such as filling and fusing low-melting glass, the hermeticity in the case of FIG. 10 can be kept extremely high, and as a result, the characteristic deterioration of the SAW filter chip 3 does not occur. is there.

As described above, in each embodiment of the present invention, for example, the SAW filter chip 3 is housed in the internal space, and the through-hole 6 is provided in the wall surface portion corresponding to the electrode 9 of the SAW filter chip 3. First, a case 11 made of a glass material and having a metal film 7 of gold or tin provided at least on the inner surface and the outer peripheral portion of the wall surface of the hole 6 is placed in a container 15 in a nitrogen atmosphere by solder 8 as a first step. The molten solder bath 12 is forcibly immersed in the molten and jetted solder bath 12 with the wall surface on the side of the through hole 6 facing downward so as to overcome the buoyancy of the molten solder. The solder penetrates into the through-hole 6 by the ultrasonic vibration applied inside, and the S
The AW filter chip 3 is lifted up, and the case 11
In the inner part, the solder in the molten state is connected to the electrode 9 of the SAW filter chip. Subsequently, as a second step, the case is quickly raised outside the molten solder bath 12 to a position where the case is pulled by the tension of the molten solder without being separated from the molten solder, and then at a high speed. At the same time, the solder in the molten state is instantaneously separated from the case 11, and at the same time, the inside of the through hole 6, the inside of the case 11 and the metal film The upper solder 8 is solidified. Then, as described above, the electrical extraction of the electrode 9 of the SAW filter chip out of the case 11 is as follows.
It can be performed through the solder 8 in the through hole 6 and
Since the W filter chip 3 can be held by the fixing force of the solder 8 in the through hole 6, it is not necessary to fix the W filter chip 3 with an adhesive, and the solder 8 is fixed to the metal film 7 in the through hole 6. Inside the case, the diameter is formed so as to be larger than the diameter of the through hole 6 inside the case 11, so that the strength is strong and no dropout occurs. Further, outside the case 11, the through hole 6 of the metal film 7 is formed. Since the outer peripheral portion is covered with the solder 8, the airtightness becomes extremely high, and as a result, the characteristics of the element do not deteriorate.

[0033]

As described above, according to the present invention, an element having an electrode on one side is accommodated in an internal space, and a through hole is provided in a wall portion corresponding to the electrode of the element. First, as a first step, a through hole is formed in a molten and jetted sealing body made of a brazing material, as a first step. By dipping with the side wall face down, the molten sealing body is pressed into the through hole, and the molten sealing body and the electrode of the element are connected in the case inner part, As a second step, the case is raised to the outside of the molten jet sealing body to separate the molten jet sealing body from the case, and at the same time, at least the outer peripheral portion of the metal film in the outer portion of the metal film. To There will, is to solidify the sealing material on the through hole and the casing interior and the metal film.

According to the above-described manufacturing method, the element can be electrically pulled out of the case through the sealing member in the through hole, and the element can be held in the sealing hole in the through hole. Since it can be performed by the fixing force of the body, fixing with an adhesive is unnecessary, and by making the diameter of the through hole larger in the outside of the case than in the case, the sealing member in the molten state can be formed. Insertion is facilitated, and this sealing body is fixed to the metal film in the through hole, and the inside of the case is formed so that its diameter is larger than the diameter of the through hole inside the case. Since the metal film does not fall off strongly and the outer peripheral portion of the through hole of the metal film is covered with the sealing material outside the case, the airtightness becomes extremely high, and as a result, the characteristic deterioration of the element does not occur.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an electronic component used in first and second embodiments of the present invention.

FIGS. 2A to 2D are cross-sectional views illustrating steps of a first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a process for simultaneously sealing a large number of pieces in the first embodiment of the present invention.

FIGS. 4A and 4B are cross-sectional views showing steps of a second embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a rush method in a first step of the first and second embodiments of the present invention.

FIG. 6 is a sectional view illustrating another inrush method in the first step of the first and second embodiments of the present invention.

FIG. 7 is a cross-sectional view of an electronic component to be subjected to a sealing process in a third embodiment of the present invention.

FIG. 8 is a sectional view of an electronic component to be subjected to a sealing process according to a fourth embodiment of the present invention.

FIG. 9 is a sectional view of an electronic component to be subjected to a sealing process in a fifth embodiment of the present invention.

FIG. 10 is a cross-sectional view of an electronic component to be subjected to sealing processing according to a sixth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 2 Opening part 3 SAW filter chip 4 First plate 5 Second plate 6 Through hole 7 Metal film 8 Solder 9 Chip electrode 10 External electrode 11 Case 12 Jet solder bath 13 Fixture 14 Elevator 15 Closed container 16 Ultrasonic horn 17 Spacer 18 Embankment 19 Second through hole

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical indication location H03H 3/08 7259-5J H03H 3/08 9/02 9/02 A (72) Inventor Shinji Umeda Matsushita Electric Industrial Co., Ltd. (1002) Kazuma Kadoma, Kadoma City, Osaka Prefecture (72) Inventor Tetsuo Yuzawa 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (15)

[Claims] An element having an electrode on one side is accommodated in an internal space, a through hole is provided in a wall portion corresponding to an electrode of the element, and a metal film is provided on an inner surface and an outer peripheral portion of the wall surface of the through hole. In addition, the case that is insulative and at least the surface is non-brazing, in the molten state of the brazing material as a first step, and in the sealing body that is jetting,
A method of manufacturing an electronic component in which the case with the wall surface on the side of the through hole facing downward is immersed and immersed, and as a second step, the case is raised to the outside of the molten jet sealing body. 2. The method for manufacturing an electronic component according to claim 1, wherein the case is slightly heated by radiant heat of the molten jet sealing body and then immersed in the jet sealing bath. 3. The method for manufacturing an electronic component according to claim 1, wherein the first step and the second step are performed in a closed container in a low oxygen concentration atmosphere. 4. The electronic component according to claim 1, wherein, in the first step, ultrasonic waves are applied to the jet sealing body in a molten state to cause the sealing body to penetrate into the through hole. Manufacturing method. 5. The method for manufacturing an electronic component according to claim 4, wherein the vibration direction of the ultrasonic wave is in a direction approximate to the axis of the through hole provided in the case. 6. The method for manufacturing an electronic component according to claim 4, wherein the case is immersed in the molten jet sealing body a plurality of times. 7. In the second step, the case is pulled out of the molten-state jet sealing body bath by the tension of the molten-state jet sealing body without being separated from the molten-state sealing body. The method for manufacturing an electronic component according to claim 1, wherein the case is raised at a low speed to a position, and then is raised at a high speed to instantaneously separate the case and the sealing body in a molten state. 8. In the first step, the surface of the jet sealing body in the molten state is kept substantially horizontal, and the axis of the through hole provided in the case is set at a direction slightly inclined from the vertical direction, so that the jet sealing in the molten state is formed. The method for manufacturing an electronic component according to claim 1, wherein the case is immersed in the body. 9. The method according to claim 1, wherein in the first step, the case is immersed in the jet sealing body in a molten state while rotating the case around an axis passing through the center of gravity of the case in parallel with the axis of the through hole. 9. The method for manufacturing an electronic component according to any one of 8. 10. In the second step, when the case rises from the molten jet sealing body, the case rises while rotating the case around an axis passing through the center of gravity of the case in parallel with the axis of the through hole. 10. The method for manufacturing an electronic component according to any one of 1 to 9. 11. The method for manufacturing an electronic component according to claim 1, wherein a plurality of cases are arranged in parallel, and the plurality of cases are simultaneously sealed. 12. A fixing device for fixing the case is made of a material having a heat conductivity equal to or more than that of the case, wherein an area of a case mounting surface of the fixing device is at least larger than an area of the case mounting surface. The method for manufacturing an electronic component according to claim 1, wherein the case is fixed by evacuation. 13. A spacer inside the case, between the element and the inner wall surface on the through hole side inside the case.
13. The method for manufacturing an electronic component according to any one of the above items. 14. The embankment body according to claim 1, wherein a dike is provided inside the case, between the element and the inner wall surface on the through hole side inside the case, and around the opening of the through hole inside the case. A method for manufacturing an electronic component according to one aspect. 15. The method for manufacturing an electronic component according to claim 1, wherein a sealing process is performed on a case provided with an exhaust hole on a wall surface facing the wall surface provided with the through hole.