JPH1058650A - Printing method and printing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely tear print paste apart between a printing plate retaining the paste and a substrate and thereby eliminate the cause for a bridging phenomenon by lowering the viscosity of the print paste which comes into contact with a part holding the paste by increasing the temperature of the part. SOLUTION: The viscosity of print paste for a printing plate which sticks to a part holding the print paste is lowered by increasing the temperature of a part in the neighborhood of the part holding the print paste. Thus the print paste is made easily separable from the part holding the print paste and thereby, it is facilitated to print the print paste to an object to be printed. The ring-like induction coil 28a of an induction heating part 28 is arranged, separated from each other by a specified distance, on a screen mask 11. When a cream solder 12 is packed into the through hole 11a of the screen mask 11, electric current is applied to the induction coil 28a by the time which is set by a timer to generate an induction magnetic field to run induction current to the screen mask 11 itself. Consequently, the screen mask 11 itself is directly heated by induction heating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a printing method for transferring a printing paste held on a plate to a printing medium and a printing apparatus for performing the printing method.

[0002]

2. Description of the Related Art Conventionally, for example, a flat plate stencil (screen) for printing cream solder on a land of a printed circuit board, for example.
In the type printing, as shown in FIGS. 18A and 18B, a screen mask (metal mask) 1 having through holes 1a arranged in a predetermined pattern corresponding to the lands 5 of the printed circuit board 4 is attached to the substrate 4 as shown in FIGS. It is located at the upper predetermined position and brought into contact. Next, as shown in FIGS. 18C and 19A and 19B, the cream solder 2 is supplied to one end of the screen mask 1, and the squeegee 3 removes the cream solder 2 from one end of the screen mask 1. In the through hole 1a of the screen mask 1 by moving the
Fill. Next, as shown in FIG. 18D, by removing the screen mask 1 from the substrate 4, the cream solder 2 in the through hole 1a of the screen mask 1 is moved onto the land 5 of the substrate 4, and as shown in FIG. The cream solder layer 2a is formed on the land 5 of the substrate 4 as shown in FIG.

[0003] However, in the above structure, FIG.
As shown in FIG. 9 (C), when the screen mask 1 is separated from the substrate 4, a part of the cream solder 2 adheres to the inner wall surface of the through hole 1a of the screen mask 1 due to the viscosity of the cream solder itself and remains. A phenomenon occurs in which the cream solder spreads between the cream solder 2 and the cream solder 2 placed on the land 5 of the substrate 4. As a result, as the screen mask 1 moves away from the substrate 4, the relative deformation (shear speed gradient) of the stepped cream solder increases, and the cream solder is torn off at an arbitrary portion between the screen mask 1 and the substrate 4 and torn off. As shown in FIG. 19D, a part of the cream solder adheres to a portion other than the lands 5 on the substrate 4 and adheres to the periphery of the through hole 1a on the back surface of the screen mask 1 on the substrate side, and the next time printing is performed A cause of printing bleeding, a bridge which erroneously adheres to the adjacent cream solder layer 2a on the substrate 4 occurs, or a sufficient cream solder layer is not formed on the substrate because the cream solder adheres to the screen mask side. There was such a problem.

[0004]

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problem, and it is possible to accurately tear the printing paste between a plate holding the printing paste and a substrate. A printing method and a printing apparatus that do not cause bridging, do not cause the printing paste to remain on the plate side and cause printing bleeding, and that supply of the printing paste to the substrate is not insufficient. Is to do.

[0005]

Means for Solving the Problems and Effects of the Invention In order to achieve the above-mentioned object, the present invention provides a printing paste holding portion by increasing the temperature of a portion near a portion holding a printing paste of a printing plate. The printing paste is configured to reduce the viscosity of the printing paste adhering to the printing medium, to facilitate separation of the printing paste from the holding portion, and to facilitate printing on a printing medium. According to the first aspect of the present invention, a printing paste having a property that the viscosity decreases with an increase in temperature is held on a plate, and the temperature of a portion of the plate where the printing paste is held is increased to make contact with the portion. A printing method in which the viscosity of the printing paste is reduced to facilitate separation of the printing plate and the printing paste, and the printing paste held by the printing plate is separated from the printing plate and printed on a printing medium. provide. According to a second aspect of the present invention, there is provided the printing method according to the first aspect, wherein a portion of the plate on which the printing paste is held is heated by electromagnetic induction heating to increase the temperature.

According to a third aspect of the present invention, in the second aspect, the printing plate has an opening of a predetermined pattern for holding the printing paste, and after the printing plate comes into contact with the printing medium. A printing method for printing the printing paste in the opening on the printing medium by relatively separating the plate and the printing medium. According to a fourth aspect of the present invention, in the third aspect, the electromagnetic induction heating apparatus for performing the electromagnetic induction heating provides a printing method for performing the electromagnetic induction heating on the plate in a non-contact manner. According to a fifth aspect of the present invention, in the fourth aspect, an interval between the electromagnetic induction heating device and the plate is set to a size such that a predetermined induction current flows through the plate by the electromagnetic induction heating device. Provide a printing method. According to a sixth aspect of the present invention, there is provided the printing method according to the third aspect, wherein the electromagnetic induction heating device that performs the electromagnetic induction heating contacts the plate to perform the electromagnetic induction heating.

According to a seventh aspect of the present invention, in any one of the third to sixth aspects, the electromagnetic induction heating is performed after the holding of the printing paste in the opening of the plate is completed. I will provide a. According to an eighth aspect of the present invention,
In any one of the third to seventh aspects, the present invention provides a printing method in which the opening is a through hole, and the printing plate is a screen mask, and the printing paste is filled in the through hole by moving a squeegee. According to the ninth aspect of the present invention, the third aspect
In any one of Embodiments 1 to 8, after the printing paste is printed on the printing medium, a printing state is detected, and the electromagnetic induction heating conditions of the printing plate or the printing plate and the printing medium are detected based on the detection result. The present invention provides a printing method for controlling the separation conditions for the printing. According to a tenth aspect of the present invention, in any one of the third to ninth aspects, the temperature of a portion of the printing material that is in contact with a portion held by the printing plate is high due to the electromagnetic induction heating. Provided is a printing method having a temperature gradient such that the temperature gradually decreases as the distance from the part increases. According to an eleventh aspect of the present invention, there is provided the printing method according to any one of the third to tenth aspects, wherein the induction current for generating the electromagnetic induction heating flows along a longitudinal direction of the opening of the plate.

According to the twelfth aspect of the present invention, the temperature of the portion holding the printing paste in the plate holding the printing paste having the characteristic that the viscosity decreases with the temperature rise is increased to make contact with the portion. A heating device for reducing the viscosity of the printing paste to facilitate separation of the printing paste from the printing plate, and a printing paste separation device for separating the printing paste held by the printing plate from the printing plate and printing the printing paste on a printing medium And a printing device comprising: According to a thirteenth aspect of the present invention, there is provided the printing apparatus according to the twelfth aspect, further comprising a printing plate holding a printing paste having a characteristic that the viscosity decreases with an increase in temperature. According to a fourteenth aspect of the present invention, in the twelfth or thirteenth aspect, a printing apparatus further comprising an electromagnetic induction heating device for heating a portion of the plate holding the printing paste by electromagnetic induction heating to increase the temperature. I will provide a. According to a fifteenth aspect of the present invention, in the twelfth or thirteenth aspect, the plate has an opening having a predetermined pattern for holding the printing paste, while the separating device is configured such that the plate has the printing medium And a printing device for printing the printing paste in the opening on the printing medium by relatively separating the printing plate and the printing medium after contacting the printing paste.

[0009] According to a sixteenth aspect of the present invention, in the fifteenth aspect, the electromagnetic induction heating apparatus for performing the electromagnetic induction heating provides a printing apparatus for performing the electromagnetic induction heating on the plate in a non-contact manner. According to a seventeenth aspect of the present invention, in the sixteenth aspect, an interval between the electromagnetic induction heating device and the plate is set to a size such that a predetermined induction current flows through the plate by the electromagnetic induction heating device. Provided is a printing apparatus configured to be configured as described above. According to an eighteenth aspect of the present invention, there is provided the printing apparatus according to the fifteenth aspect, wherein the electromagnetic induction heating device that performs the electromagnetic induction heating is configured to contact the plate to perform the electromagnetic induction heating. According to a nineteenth aspect of the present invention, in any one of the fifteenth to eighteenth aspects, the electromagnetic induction heating is performed such that the printing paste is held after the holding of the printing paste in the opening of the plate is completed. Provide equipment. According to a twentieth aspect of the present invention, in any one of the fifteenth to nineteenth aspects, the opening is a through hole, the plate is a screen mask, and the printing paste is moved into the through hole by moving a squeegee. A printing device for filling is provided.

According to a twenty-first aspect of the present invention, the fifteenth to the second
In any of the 0 modes, after the printing paste is printed on the printing medium, a printing state is detected, and the electromagnetic induction heating condition of the plate or the printing plate and the printing medium are detected based on the detection result. A printing apparatus further comprising a control unit for controlling the separation condition of the printing apparatus. According to a twenty-second aspect of the present invention, in any one of the fifteenth to twenty-first aspects, the temperature of a portion of the printing material in contact with a portion held by the printing plate is high due to the electromagnetic induction heating, Provided is a printing apparatus having a temperature gradient such that the temperature gradually decreases as the distance from the part increases. According to a twenty-third aspect of the present invention, there is provided the printing apparatus according to any one of the fifteenth to twenty-second aspects, wherein the induction current for generating the electromagnetic induction heating flows along a longitudinal direction of the opening of the plate.

According to the configuration of the above aspect of the present invention, as a result of heating the plate itself by induction heating, a portion of the printing paste held by the plate (a portion of the printing paste that abuts on the inner wall surface of the through hole of the plate of the printing paste). And its vicinity) have a higher temperature and a lower viscosity than the inner part. As a result, the adhesive strength of the printing paste between the plate and the printing paste is reduced, the resistance when the printing paste is easily separated from the plate is reduced, and the plate separating operation can be performed well. Therefore, since the printing paste does not remain on the printing plate side, printing bleeding does not occur at the next printing, and the printing paste is supplied to the printing medium side in a predetermined amount, that is, a predetermined shape and a predetermined position, and the printing paste layer is printed. Can be formed. Further, according to the above aspect of the present invention, since the resistance of the printing paste at the inner wall portion of the through hole of the plate is reduced, the conventional plate separation speed (for example, 0.1 mm / s or more and 1 m or more) is used.
m / s) (for example, 1 mm / s or more and 3 mm or more)
/ S or less) or without speed control, good print results can be obtained.

In addition, according to the above-mentioned induction heating, the plate itself generates heat, so that the plate can be radiated immediately after the induction heating operation is stopped, and other parts other than the plate are not heated. There is no adverse effect on the printing operation, etc., or the devices surrounding the plate. On the other hand, hot air, radiant heating (infrared heating),
Alternatively, in a method of heating the plate by radiating heat from the outside of the plate such as conduction heating, the members and air around the plate are also heated, and the heating device itself becomes hot, so the members around the heating device are heated. And the air is also heated, which may adversely affect the next printing operation and the like and the devices around the plate. Further, such a method of transmitting heat from the heating device to the plate has a disadvantage that the heating efficiency is poor because the heat is transmitted not only to the plate but also to members around the heating device, the plate, and air.
In addition, when induction heating is performed without contacting the induction heating device without contacting the plate, the induction heating device does not come into contact with the printing paste on the surface of the plate, so that the induction heating device is not stained by the printing paste. In addition, by making it non-contact, when there is an electronic component on the lower surface of the printing medium, the distance from the electronic component is increased, and it is possible to prevent the electronic component from being adversely affected during induction heating. it can.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below in detail with reference to FIGS. 1 (A) to 17, 20, 21, 22. FIG. The printing method according to the embodiment of the present invention includes a printing paste,
For example, the present invention relates to a flat-plate stencil (screen) printing method for printing cream solder on a land of a printed circuit board. The printing method according to this embodiment is as follows. First, as shown in FIG. 1A, a screen mask (metal mask) 11 having through holes 11a arranged in a predetermined pattern corresponding to the lands 15 of the printed circuit board 14 is positioned at a predetermined position on the substrate 14. Contact. Next, the cream solder 12 is supplied to one end of the screen mask 11, and the cream solder 12 is moved by a squeegee 13 from one end of the screen mask 11 in a predetermined direction, so that the through-hole 11 of the screen mask 11 is formed.
a is filled with the cream solder 12. Then, FIG.
As shown in (B), the temperature of the inner wall surface of the through hole 11a of the screen mask 11 is increased by induction heating. At this time, the temperature of the inner wall surface is increased until the temperature of the cream solder 12 to be used becomes low enough to make it difficult to adhere to the inner wall surface of the through hole 11a of the screen mask 11. Next, as shown in FIG. 1C, by removing the screen mask 11 from the substrate 14, the cream solder 12 in the through hole 11 a of the screen mask 11 is moved onto the land 15 of the substrate 14. The cream solder layer 12a is formed on the land 15 of the substrate 14 as shown in FIG. At this time, since the viscosity of the cream solder 12 is reduced by the induction heating, the cream solder 12 in the through hole 11a of the screen mask 11 hardly adheres to the inner wall surface of the through hole 11a. Therefore, even if the screen mask 11 is removed from the substrate 14, the cream solder 12 in the through hole 11 a remains as it is.
Thus, the cream solder layer 12a having a predetermined shape can be formed at a predetermined position.

The printing method according to the above embodiment is shown in FIG.
3 can be implemented by the printing apparatus according to the embodiment of the present invention. A more specific operation of the printing method performed by the printing apparatus is shown in a flowchart of FIG. In FIG. 2, the printing device includes a substrate loading / unloading device 21 having a loading device 21a and a loading device 21b, a substrate support device 22, a screen mask 11,
Squeegee head drive device 24, XYθ position correction device 25
The stage unit 20 including the plate release device 26 and the screen mask heating device 27 including the induction heating unit 28 and the timer 29 are driven under the control of the control unit 34. The control unit 34 receives the board position recognition correction information from the board position recognition and correction unit 30 including the processing calculation unit 31 and the recognition camera unit 32, and processes the processing calculation unit 39 and the print state detection unit 40. Printing inspection information is input from a printing inspection unit 38 having an inspection reference storage unit 41. A process control unit 3 including a processing operation unit 36 and a non-defective print database 37
Process information is input and output between the control unit 5 and the control unit 34, and print state information is input from the print inspection unit 38 to perform process control. In addition, the control unit 34 displays information such as the state of the printed cream solder 12 on the display unit 33 as a result of the operation and inspection as needed.

The substrate 14 is carried into the stage 20 by the carry-in device 21a of the substrate carry-in / out device 21, is moved to the printing position after being corrected in position by the stage 20, and is printed at the printing position. The substrate is carried out of the printing device from the printing position by the carrying-out device 21b of the substrate carrying-in / out device 21. In the stage section 20, first, the position of the substrate 14 is held by the substrate support device 22 arranged on the stage section 20. How to hold the position of the substrate 14
For example, there are a method of vacuum-suctioning the substrate 14 with a number of suction holes opened on the surface of the substrate support device 22 and a method of supporting the lower surface of the substrate 14 with a number of backup pins. In the position holding state of the board 14, the position correcting mark (not shown) of the board 14 is recognized by the recognition camera section 32 of the board position recognition / correction section 30. The processing operation unit 31 calculates a position shift between the recognized position of the substrate 14 and the position of the screen mask 11 and calculates a position correction amount of the substrate 14 for correcting the position shift.
The result of this calculation is applied to the XYθ position correcting device 2 of the stage unit 20.
Enter 5 Based on the input position correction information,
The position of the substrate 14 with respect to the screen mask 11 is corrected by the XYθ position correcting device 25 of the stage section 20. That is, the XYθ position correcting device 25 corrects the position of the substrate 14 in the orthogonal XY directions along the horizontal plane of the printing device and in the θ direction around the Z axis in the vertical direction with respect to the screen mask 11 based on the position correction information. Will be The XYθ position correcting device 25 places the Y-axis on the X-direction table 25a movable along the X-direction (substrate loading / unloading direction).
A Y-direction table 25b that can be moved in the direction is placed, and a θ-direction table 25c that can be rotated in the θ direction is placed on the Y-direction table 25b, and each table is moved by the position correction amount in each direction. Thus, the position of the substrate 14 is corrected. Note that the position correction in the X direction is performed after the position correction in the Y direction and the θ direction is completed, and after the substrate 14 is moved to the print position and stopped,
Before the substrate 14 comes in contact with the substrate 14, the X-direction table 25a is used.

FIG. 20 shows an X-direction driving device 20x also serving as the X-direction position correcting device. In FIG. 20, an X-direction table 25a is arranged movably in the X direction along a pair of linear guides 25m extending in the X direction. The screw shaft 25n is rotated forward and reverse by a forward and reverse rotation drive of a drive motor 25p. An X-direction table 25a fixed to a nut 25r screwed with the screw shaft 25n is moved back and forth along the X direction. The substrate 14 held by the substrate support device 22 is connected to the X-direction driving device 2 of the stage unit 20.
By 0x, it is moved to the printing position in the X direction. In this printing position, the substrate 14 is located below the screen mask 11, and
Is raised until the upper surface of the substrate 14 contacts the lower surface of the substrate 14. Then, while the lower surface of the screen mask 11 is in contact with the upper surface of the substrate 14, the cream solder 12 is supplied to one end of the screen mask 11 in the X direction, and the squeegee 13
Is moved along the X direction from the one end to the other end in the X direction of the screen mask 11 by the squeegee head driving device 24 so that the cream solder 12 is filled in the through holes 11a of the screen mask 11. Screen mask 1
1 is formed by forming an opening made of a through hole 11a corresponding to a copper conductive pattern portion (land) 15 of the substrate 14 on a nickel or stainless steel plate having a thickness of about 150 μm, for example.

The squeegee head driving device 24 moves the squeegee 13 for filling the cream solder 12 into the through hole 11a of the screen mask 11 on the screen mask 11. The squeegee 13 is composed of a flat plate or a plate having a sword-shaped (substantially pentagonal) cross-sectional side shape. Is moved back and forth along the axial direction of the ball screw 24b to move the squeegee 13 on the screen mask 11. The squeegee head 24a is a motor 2
It can move up and down by 4d forward / reverse rotation. Also,
The inclination angle of the squeegee 13 itself with respect to the screen mask 11 can also be adjusted by the cylinder 24f. That is, the squeegee 13 is rotatably supported at a portion (not shown), and the squeegee 13 is driven by driving the cylinder 24f.
By moving one end of the squeegee up and down, the squeegee 13 can be rotated with the support point as a fulcrum to adjust the inclination.
The lower end surface of the cream solder 12 filled in the through hole 11a of the screen mask 11 is in contact with the land 15 of the substrate 14 corresponding to the through hole 11a. Is separated from the substrate 14 so that the cream solder layer 12 a is formed on the land 15 of the substrate 14.

FIG. 21 shows an example of the plate separating device 26. In FIG. 21, the drive nut 25v is rotated forward and reverse via a belt 25u by forward and reverse rotation drive of an AC servomotor 25t, and a screw shaft 25w screwed with the nut 25v.
Is moved up and down, and the substrate 14 is moved up and down by moving the substrate support device 22 fixed to the upper end of the screw up / down movement 25w up and down. Therefore, when the substrate 14 is moved along the X direction from the substrate position correcting operation position to the printing position below the screen mask 11 by the X direction driving device 20x of the stage section 20, the AC of the plate separating device 26 is moved.
By driving the servo motor 25t, the screen mask 11
The substrate 14 is raised until the upper surface of the substrate 14 contacts the lower surface of the substrate 14. On the other hand, after printing is completed, a plate separation operation is performed.
The substrate 14 is lowered with respect to the screen mask 11 by driving the AC servomotor 25t of the plate separating device 26. The substrate 14 separated from the plate is transferred to the substrate unloading device 21b.
Is carried out of the printing apparatus.

FIG. 22 shows another plate separating device. In FIG. 22, reference numeral 402 denotes a stage unit (substrate support device); 417, an AC servo controller;
Is an AC servo motor controlled by the AC servo controller 417, 408 is a ball screw rotated forward and reverse by the AC servo motor 414, 409 is an upper bearing of the ball screw 408, 410 is a lower bearing of the ball screw 408,
411 is a pulley on the ball screw 408 side, and 412 is AC
A pulley 413 on the servo motor 414 side is a timing belt, and 415 is a linear guide that guides the elevation of the stage unit 402. In this plate separating device, the stage (substrate support device) 402 includes an AC servo controller 417, an AC servomotor 414, and a ball screw 40.
8, the plate can be moved up and down at an arbitrarily set speed and range, and the plate separation speed between the substrate 14 and the screen mask 11 can be adjusted arbitrarily.

The screen mask 11 is heated by induction heating by the screen mask heating device 27 immediately before performing the above-described plate separating operation, in other words, immediately after printing of the cream solder 12 is completed. The screen mask heating device 27, as shown in FIGS.
The ring-shaped induction coil 28a of the induction heating unit 28 is arranged on the top 1 at a predetermined distance. When the cream solder 12 is filled into the through-hole 11a of the screen mask 11, the induction coil 28a is set for a time set by the timer 29, for example, for a time within a few milliseconds to a few seconds.
To generate an induced magnetic field, and an induced current is applied to the screen mask 11 itself to directly heat the screen mask 11 by induction heating. As an example of the induction coil 28a, the inner wire diameter is 50 mm.
mm, an outer diameter of 170 mm, a thickness of 2 mm, a circular donut shape, and 35 enameled wires or copper wires having low electric resistance (not generating Joule heat) are wound around h = h.
The coil 21 is wound around to form an induction coil. As the induction heating conditions, electric power of 1400 W at 100 V and 60 Hz
For only a few seconds to perform induction heating. In the present embodiment, the induction coil 28a is arranged in a non-contact state apart from the upper surface of the screen mask 11 by a predetermined interval as shown in FIG. When printing the cream solder 12, the cream solder 12 is retracted from above the screen mask 11.
May be prevented from hindering the printing, and may be moved above the screen mask 11 during the induction heating to perform the induction heating. The distance between the induction coil 28a and the screen mask 11 is preferably set to a size such that a predetermined induction current flows through the screen mask 11 by the induction coil 28a.

In the induction heating, the screen mask 11 is made of a conductive material such as stainless steel, so that an induction current flows. However, since the resistance of stainless steel or the like is larger than that of copper, the screen mask itself generates heat. On the other hand, since the cream solder 12 has a small solder particle diameter or is creamy due to flux and has no conductivity, no induced current flows and no heat is generated. Therefore, FIG.
When the screen mask 11 is heated by the induction heating, the temperature of the inner wall surface of the through hole 11a of the screen mask 11 rises, so that the cream solder 12 is in contact with the inner wall surface of the through hole 11a. While the temperature rises in the portion and the surrounding portion, the temperature does not rise in the center portion of the cream solder 12, and the temperature between the center portion of the cream solder 12 and the outer peripheral portion (the portion in contact with the through hole 11a) is as shown in FIG. A temperature gradient is formed as shown in FIG. In other words, the cream solder 12 has a temperature gradient such that the temperature of the portion in contact with the inner wall surface of the through hole 11a is high and the temperature gradually decreases from the portion toward the center of the cream solder 12. . As a result,
As shown in FIG. 7A, the viscosity of the cream solder 12 is lower at the outer periphery than at the center. This is because the cream solder 12 has the characteristic as shown in FIG. 8, that is, the characteristic that the viscosity decreases as the temperature increases. Due to this induction heating, the viscosity of the cream solder 12 between the inner wall surface of the through hole 11a of the screen mask 11 and the cream solder 12 contacting the inner wall surface decreases, and the cream solder 1
2 can be easily separated from the through-hole 11a of the screen mask 11, and the plate can be separated well.

As one example of the material of the cream solder 12, a material containing 90% by weight of metal powder and 10% by weight of flux is preferable. About 62% by weight of the metal powder is tin, the remainder is lead, and the particle size is 2%.
0 to 40 μm. The flux contains 75 to 40% by weight of a solvent such as alcohol and the remaining solid content is 25%.
６０60% by weight. This solid contains rosin, activator, and thixotropic agent. A specific example of a cream solder product is a product number MR7 of 63% by weight of tin and 37% by weight of lead.
125 Panasonic cream solders. The material of the screen mask 11 is a stainless-based material such as nickel-chromium (for example, SUS30).
4) or a metal such as nickel. Further, a screen mask in which a conductive vapor-deposited film or a plated film is formed on the surface of a synthetic resin such as polyimide and the inner wall surface of the through hole can be used. In this case, electromagnetic induction can be generated at the conductive vapor deposition film or the plating film on the inner wall surface of the through hole.

Further, if the substrate 14 as the printing medium is made of copper having excellent conductivity, the substrate 14 hardly generates heat due to electromagnetic induction, which may adversely affect electronic components on the substrate. Absent. The print inspection unit 38
Is to measure the formation state of the cream solder layer 12a formed on the land 15 of the substrate 14, that is, the shape and position of the cream solder layer 12a, by using a camera or a laser length measuring device as an example of the printing state detection means 40, Based on
The processing operation unit 39 calculates the volume and the displacement of the cream solder layer 12a. The laser length measuring device irradiates a laser to the cream solder layer 12a and calculates the height and the like of the cream solder layer 12a from the position of the reflected light. The above calculation result is compared with the inspection standard stored in the inspection standard storage unit 41,
It is determined whether or not printing is good, and the determination result is sent to the control unit 34.
In the case of a printing failure, the content of the failure is numerically represented and the numerical value is also output to the control unit 34.
This determination operation is performed, for example, by calculating the height, width, volume, and the like of the cream solder layer 12a from an image captured by the camera of the printing state detection unit 40 or position data measured by a laser length measuring device, and storing the inspection reference. This is performed by comparing the determination data such as the height, width, and volume of the cream solder layer stored in the section 41 with the calculated values in the processing operation section 39 to determine whether the printing is good.

The process control section 35 changes the setting of the parameters of the printing apparatus based on the printing state data of the cream solder layer 12 after printing by the print inspection section 38. Here, the above-mentioned parameters are, for example, parameters of each equipment stored in the non-defective print database 37 (for example, printing speed, inclination angle of the squeegee 13, ambient temperature at the time of printing (for example, squeegees in the order of importance). , The temperature of the screen mask, the temperature of the substrate, and the temperature of the air around them, etc.), the printing pressure, in other words, the pressure at which the squeegee 13 is pressed against the screen mask 11, and the profile of the plate release speed and acceleration of the substrate 14. Etc.) and induction heating conditions (for example, heating output, heating time, heating start timing, etc.).
The relationship between these parameters and print quality is stored as a database, and the processing operation unit 36 of the process control unit 35 calculates the optimum parameters.

Next, the printing method performed by the printing apparatus will be described with reference to the flowchart of FIG. The series of operations is controlled by the control unit 34. In step S1, the loading device 21 of the substrate loading / unloading device 21
The substrate 11 is carried into the stage section 20 by a. next,
In step S2, the substrate 1 loaded into the stage unit 20
4 is held by the substrate support device 22. Next, in step S <b> 3, the position of the substrate 14 held by the substrate support device 22 is recognized by the substrate position recognition / correction unit 30, and the position correction amount of the substrate 14 with respect to the screen mask 11 is calculated. Next, in step S4, the position of the substrate 14 in the XYθ direction with respect to the screen mask 11 is corrected by the XYθ position correction device 25 of the stage unit 20 based on the calculated position correction amount. Next, in step S5, the substrate 14 is positioned at a printing position below the screen mask 11 by the stage unit 20, and the substrate 14 is raised by the stage unit 20 so that the screen mask 11 contacts the upper surface of the substrate 14. .

Next, in step S6, the squeegee 13 is moved on the screen mask 11 to
Is filled in the through holes 11a of the screen mask 11. Next, in step S7, it is determined whether or not the screen mask 11 is to be induction-heated. When the induction heating is not performed, for example, when the cream solder 12 is easily separated from the through hole 11a, the process proceeds to step S8. In the case of induction heating, the process proceeds to step S9, in which a timer 29 is set at a predetermined heating time, and immediately after the printing of the cream solder 12 is completed in step S10, the induction coil 2 of the induction heating unit 28 is set.
The screen mask 11 is induction-heated by 8a. In step S8, when the induction heating is performed, the plate separating operation is performed immediately after the induction heating. That is, by driving the plate separating device 26 of the stage section 20, the substrate 14 is lowered with respect to the screen mask 11 to separate the substrate 14 from the screen mask 11, and the cream solder 12
From the through hole 11a of the screen mask 11 to the substrate 14
Is transferred onto the land 15. When the induction heating is not performed, the above-described separation operation is performed after the printing of the cream solder 12 is completed, and the cream solder 12 is removed from the screen mask 11.
Is transferred onto the land 15 of the substrate 14 from the inside of the through hole 11a.

Next, in step S12, the print inspection unit 3
In step 8, the shape and position of the cream solder layer 12a formed on the substrate 14 are inspected. Next, in step S13,
As a result of the inspection, it is determined whether the printing state is good. If it is determined that the printing state is good, step S14
In step S14, the substrate 14 is unloaded from the printing device by the unloading device 21b, and a series of printing operations is completed. If it is determined in step S13 that the printing state is defective, the process proceeds to step S15, where the process control unit 35 changes the design of the process parameters, and ends a series of printing operations. The next cream solder 12 is printed based on the information on the optimum conditions whose design has been changed in step S15, and the plate separating step in step S8 after the printing and the induction heating step of the screen mask 11 in step S10 are performed. I have to. In some cases, remove the cream solder layer determined to be defective in printing,
Again, a new printing operation may be performed under the conditions changed in design in step S15, and the plate separating step in step S8 after printing and the induction heating step of the screen mask 11 in step S10 may be performed. In this flowchart, as an example, the plate separation condition is redesigned and the step S
8 shows a case where the plate separation process is performed, and a case where the induction heating process of steps S9 and S10 is performed by changing the design of the induction heating condition. In the design change of the parameters, design changes of all parameters are not made at the same time, but design changes of only parameters appropriately selected according to the printing state are made.

According to the above embodiment, as a result of the screen mask 11 itself being heated by induction heating, the outer peripheral portion of the cream solder 12 contacting the inner wall surface of the through-hole 11a of the screen mask 11 has a higher temperature than its central portion. And its viscosity decreases. As a result, the adhesive force between the inner wall surface of the through hole 11a of the screen mask 11 and the cream solder 12 decreases, and the screen mask 11
The cream solder 12 is easily separated from the plate, and the plate separating operation can be performed satisfactorily. Therefore, the cream solder 12 does not remain on the screen mask 11 side, so that printing bleeding does not occur at the next printing, and the cream solder 12 is supplied to the substrate 14 side in a predetermined amount, that is, in a predetermined shape and a predetermined position. The solder layer 12a can be formed by printing.

According to the induction heating, since the screen mask 11 itself generates heat, the heat of the screen mask 11 can be released immediately after the induction heating operation is stopped, and other members other than the screen mask 11 are heated. As a result, there is no adverse effect on the next printing operation and the like and the devices around the screen mask 11. On the other hand, in a method of heating the screen mask 11 by simply radiating heat from the outside of the screen mask 11 such as hot air, radiant heating (infrared heating), or conduction heating, members and air around the screen mask 11 are heated. Is also heated, and the heating device itself is also heated, so that members and air surrounding the heating device are also heated, which may adversely affect the next printing operation and the devices around the screen mask 11. is there. Further, in the method of transferring heat from the heating device to the screen mask 11, the screen mask 1
In addition to 1, heat is transmitted to the heating device, members around the screen mask 11 and air, and thus there is a disadvantage that heating efficiency is poor.

When induction heating is performed without contacting the induction heating section 28 with the screen mask 11, the induction coil 28a of the induction heating section 28 does not contact the cream solder 12 remaining on the surface of the screen mask 11. Therefore, the induction coil 28a is not stained by the cream solder 12. In addition, by making it non-contact, the substrate 1
When there is an electronic component on the lower surface of 4, the distance to the electronic component is increased, and it is possible to prevent the electronic component from being adversely affected during induction heating. Here, an experiment was conducted as to how much the cream solder 12 having a fine pattern can be satisfactorily separated from the through hole 11a by induction heating. The diameter of the through hole was about 0.1 mm, and the distance between the centers of the through holes, that is, the pitch between adjacent through holes was 0.2 mm. The ambient temperature of air, cream solder, screen mask and the like was 23 ° C. FIGS. 11A and 11B show the experimental results.
Shown in As shown in FIGS. 11A and 11B, in this experiment, when the shearing force of the cream solder 12 filled in the through-hole 11a of the screen mask 11 when the plate is separated is seen, the pitch of the through-hole is 0. No reduction in the shearing force was observed in the portion of 0.2 mm or less, and the pitch of the fine printing was limited to 0.2 mm.
The limit was 2 mm, and it was thought that a large reduction in shearing force could not be expected if the distance d from the inner wall surface of the through hole was 0.05 mm or less. Therefore, in the present invention, by using induction heating, the pitch of 0.3
In addition to being able to sufficiently perform fine printing with a thickness of mm, fine printing with a pitch of about 0.2 mm can also be performed depending on conditions such as cream soldering.

The induction heating condition is 1400 W
By supplying power of 1 to 2 seconds, a gap of 1 mm
Thus, the screen mask 11 can be raised to about 50 to 70 ° C. Further, by setting the supplied power to about 2000 W, the same temperature rise can be achieved within one second, whereby the cream solder in the through-hole 11a becomes larger between the inner wall surface of the through-hole 11a and the center thereof. A temperature difference can be realized. Further, by bringing the induction coil into contact with the screen mask 11, a more efficient temperature rise can be achieved. Further, in the above-described method of separating the induction heating plate, the inner wall surface of the through hole 11a and the through hole 1
The temperature difference from the central portion of 1a depends on the width of the through hole. Therefore, in a screen mask having a plurality of types of through-hole widths, the condition may be set according to the smallest through-hole size among the plurality of through-holes to be subjected to induction heating. That is, if the minimum through-hole width is about 0.15 mm, as described above, rapid control is required such that the power supply to the induction coil is 2000 W and the supply time is about 1 second. In the case of a relatively rough plurality of through-holes having a minimum through-hole width of 1 mm, the supply power is 1000
W, power supply may be 2-3 seconds. Therefore, the heating condition of the induction coil can be determined in advance by the pattern of the screen mask (in other words, the arrangement and size of the through-holes). At this time, the induction coil heating conditions suitable for the through-hole size are determined based on the pre-measured characteristic values of the cream solder (viscosity with respect to temperature, shear stress value, yield value). A heating condition close to the optimum characteristic value may be selected.

When performing the mask cleaning of the screen mask 11, the temperature can be controlled by induction heating. Thereby, the cream solder remaining in the screen mask through-hole and on the back surface can be more efficiently removed. The conditions at this time do not need to be controlled as strictly as when the plate is separated, and it is sufficient that the solder can be heated to such an extent that the fluidity of the cream solder is improved. For example, heating may be performed at 1000 W during the cleaning time. In addition,
The present invention is not limited to the above embodiment, and can be implemented in various other modes.

For example, in the above embodiment, in order to relatively separate the screen mask 11 and the substrate 14, the substrate 14 is lowered while the screen mask 11 is stationary. However. The present invention is not limited to this, and the screen mask 11 may be moved while the substrate 14 is stationary, and both the screen mask 11 and the substrate 14 may be moved in a direction in which they are separated from each other. Good. The printing paste is not limited to the cream solder 12, but may be any material as long as the present invention is applicable. For example, instead of cream solder, a metal powder having a fine particle diameter of about 200 μm or less and a flux may be used. Examples of the metal powder include silver and copper. Further, in the case of screen printing, induction heating is performed after the scraping operation of the printing paste by the squeegee. However, the invention is not limited to this, and the induction heating is started at the same time as the scraping operation. Heating may be performed at a temperature lower than the heating temperature, and after the scraping operation is completed, the outer peripheral portion of the printing paste may be raised to the above-mentioned predetermined temperature by induction heating to lower its viscosity.

In addition, the screen coil 11 is not limited to the one in which the entire screen mask 11 is uniformly induction-heated, but the induction coil 28a is partially opposed only to a portion of the circuit pattern of the cream solder 12 where the plate separation is poor. Alternatively, only that portion may be induction-heated. Further, the present invention is not limited to the case where the induction heating is performed in a non-contact manner.
8 may be brought into contact with the upper surface of the screen mask 11 for induction heating. In this case, the induction heating unit 28
Since the distance between the induction coil 28a and the screen mask 11 becomes small, the induction heating can be efficiently and locally concentrated. In FIG. 9, reference numeral 28b denotes an induction magnetic field. In addition, in the through-hole that is long along the direction in which the induction current of induction heating flows, the inner wall surface is easily subjected to induction heating, but the inner wall surface of the through-hole that is long in the direction orthogonal to the direction in which the induction current flows is difficult to be induction-heated. Tend. Therefore, as shown in FIG. 10A, the through-hole 11a that is long along the X direction has the induction coil 28c arranged along the longitudinal direction of the through-hole 11a, and the line indicated by 28c in FIG. It is preferable from the viewpoint of heat generation efficiency to generate an induced current by passing a current through the induction coil. Therefore, as shown in FIG.
a also arranges the induction coil 28c along its longitudinal direction,
It is preferable to generate an induced current by applying a current to the induction coil as indicated by a line 28c in FIG.
In FIG. 10B, if an induction coil is arranged in the direction of arrow 28e and a current flows through the induction coil, the inner wall surface of the through hole 11a along the Y direction does not generate much heat. A QFP (Quad) as shown in FIG.
In Flat Package), the through hole 1 on the adjacent side
Since the longitudinal direction of 1a intersects at 45 degrees, the induction coils are arranged in a V-shape as shown in FIG. 10C, and the induction coils are arranged as shown by a line 28c in FIG. 10C. It is preferable from the viewpoint of heat generation efficiency to generate an induced current by passing a current through the device.

For example, as shown in FIG. 10A, a first induction coil for flowing a current in the X direction and a second induction coil for flowing a current in the Y direction as shown in FIG. It can also be used as one induction heating unit. In the induction heating unit configured by stacking two induction coils in this manner, power is alternately applied to one of the first induction coil and the second induction coil or to the first induction coil and the second induction coil. By supplying the same, even if the pattern of the through-holes is different, the same induction heating section allows a current to flow through the induction coil only in the X-direction with respect to the through-holes along the X-direction as shown in FIG. 10B, a current flows through the induction coil only in the Y direction for the through hole along the Y direction as shown in FIG. 10B, or the X direction and the Y direction as shown in FIGS. 10C and 10D. It is possible to pass currents through the two induction coils alternately in the X direction and the Y direction through the through holes in both directions. As a result, with respect to the through holes in FIGS. 10C and 10D, both the through hole 11a along the X direction and the through hole 11a along the Y direction can be substantially uniformly induction-heated.
Further, even if the patterns of the through holes are different as shown in FIGS.
The current can be applied to the induction coil only in the direction, the current can be applied to the induction coil only in the Y direction, or the current can be applied to the induction coil alternately in the X and Y directions. Can be increased.

FIGS. 12A and 12B show an embodiment of the present invention in which the cream solder 12 is filled by using a filling roller 100 instead of a squeegee in a screen printing method. In this embodiment, a cylindrical filling roller 1 is used.
By rotating 00, the printing material, for example, the cream solder 12 is rolled in, and the cream solder 12 is forcibly filled in the through-hole 11 a of the screen mask 11. The cylindrical shape of the filling roller 100 may be a saw-shaped and spiral-shaped groove 100a shown in FIG. In FIG. 12A, reference numeral 101 denotes a cream solder scraper. In the embodiment in which the present invention is applied to the dispensing method, FIG.
A printing material 112 such as cream solder is forcibly penetrated through the screen mask 11 by a nozzle 111 having an extruding function by a piston 110 as shown in FIG. 13A or an extruding function by compressed air as shown in FIG. Hole 1
It is also possible to fill 1a. In FIG. 13B, reference numeral 112 denotes a cream solder scraper at the tip of the nozzle 111.

The present invention can be applied not only to screen printing but also to other printing methods. For example,
FIG. 14 shows an embodiment in which the present invention is applied to a direct printing planographic planographic transfer printing system. Here, the printing material 122 supplied in a predetermined pattern to the planographic plate 120 is directly transferred to a predetermined position 115 of a substrate 114 as a printing medium. In FIG. 14, the surface where the printing material 122 is in close contact with the lithographic plate 120 is induction-heated,
The adhesive force between the lithographic plate 120 and the printing material 122 decreases,
There is an effect that the image can be easily transferred to a predetermined position 115 of the printing medium 114. FIGS. 15A and 15B show an embodiment in which the present invention is applied to an offset printing method. The printing material 142 is supplied from the tank 139 storing the printing material 142 to the recess 136a of the plate cylinder 136 by three rollers 140, and the printing material 1 in the recess 136a is supplied.
42 is transferred onto the blanket cylinder 137, and paper 135 as a printing medium sandwiched between the blanket cylinder 137 and the impression cylinder 138.
Then, the printing material 142 on the blanket cylinder 137 is transferred for printing. In this embodiment, the inner surface of the concave portion 136a in which the printing material 122 is in close contact with the plate cylinder 136 is induction-heated, so that the concave portion 1 of the plate cylinder 136 is heated.
The adhesive force between the inner wall surface of 36a and the printing material 122 is reduced, and there is an effect that transfer to the paper 135 is facilitated.

FIG. 16 shows an embodiment in which the present invention is applied to a planographic intaglio transfer printing system. In this embodiment, similar to the screen printing method, the intaglio 1
By inducing heating of the intaglio 150 to increase the temperature of the intaglio 150 itself, the shearing force of the printing material, for example, the cream solder 152, on the inner wall surface of the indent 150a decreases, and the transferability of the substrate 154 to a predetermined position 155 such as a land is reduced. Is obtained. FIG. 17 shows an embodiment in which the present invention is applied to an intaglio transfer printing method (gravure printing method). The printing material in the tank 165, for example, the cream solder 162, is supplied to the concave portion 163a of the plate cylinder 163 by the supply roller 166, and the printing material 162 in the concave portion 163a is supplied.
Is the substrate 1 sandwiched between the plate cylinder 163 and the impression cylinder 161
The printing is transferred to 60 and printed. In FIG. 17, reference numeral 164 denotes a doctor. The doctor 164 scrapes off an excess amount of the printing material 162 filled in the recess 163a. In this embodiment, as in the screen printing method, the plate cylinder 163 is induction-heated to raise the temperature of the plate cylinder 163 itself, so that the shearing force of the printing material 162 on the inner wall surface of the concave portion 163a decreases, and The effect that the transfer property to the material 160 is improved is obtained.

FIG. 23 is a perspective view of an induction coil according to another embodiment of the present invention. The induction coil is not limited to an annular coil, and may be a square frame-shaped or rectangular frame-shaped induction coil 728. There may be. FIG. 24 shows a case where two induction coils 728 of 728a and 728b of FIG. 23 are prepared and arranged on two diagonally opposite corners on the substrate on which the QFP is to be positioned. FIG. 13 is a perspective view showing a state in which an induced current 729 flows along the longitudinal direction of FIG. Two induction coils 728a and 728b
Are desirably operated simultaneously. FIG. 25 shows the induction coil 728 of FIG.
d, 728e and 728f are prepared and arranged on four corners on the substrate where the QFP is to be positioned, respectively.
FIG. 11 is a perspective view showing a state in which an induced current 729 flows along the longitudinal direction of each through hole 11a. Also in this case, the four induction coils 728c to 728f are operated simultaneously. FIG. 26 is a diagram illustrating the induction coil 728 of FIG.
g is prepared and arranged above the portion of the substrate on which the QFP is to be positioned, and arranged such that one side edge of the induction coil 728g is inclined at 45 degrees with respect to the arrangement direction of the through holes 11a. FIG. 9 is a perspective view showing a state in which the same amount of induced current 729 flows through each through hole 11a.

[Brief description of the drawings]

FIGS. 1A to 1D are explanatory views for explaining a printing method according to an embodiment of the present invention; FIG.

FIG. 2 is a block diagram of a printing apparatus according to an embodiment of the present invention.

FIG. 3 is a perspective view of the printing apparatus of FIG. 2;

FIG. 4 is a flowchart of a printing operation of the printing apparatus in FIG. 2;

FIG. 5 is a cross-sectional view of a state where the screen mask is heated by the screen mask heating device of the printing apparatus.

6 is a perspective view of an induction coil of the screen mask heating device of FIG.

FIGS. 7A to 7C are explanatory diagrams showing a graph of a viscosity distribution of a cream solder by induction heating, a graph of a temperature distribution, and a state of the cream solder in a through hole of a screen mask, respectively.

FIG. 8 is a graph showing the relationship between the temperature and the viscosity of cream solder.

FIG. 9 is a cross-sectional view of one embodiment of the present invention in which the screen mask heating device is in direct contact with the screen mask.

FIGS. 10A to 10D are explanatory views of a state in which through-holes of a screen mask are arranged at 45 degrees along the X direction and along the Y direction, respectively. FIGS.
It is a perspective view of QFP which uses the pattern of the through-hole like (C).

FIGS. 11A and 11B are a graph and a diagram illustrating a relationship between a distance from an inner wall surface of a through hole of a screen mask and a shearing force, respectively.

12A and 12B are a perspective view of a filling roller according to an embodiment of the present invention using a cylindrical filling roller instead of a squeegee, and a partial cross section of a printing state by the filling roller. FIG.

FIGS. 13A and 13B are explanatory views of an embodiment of the present invention using a pushing function by a piston instead of a squeegee, and an embodiment of the present invention using a pushing function by compressed air, respectively. It is explanatory drawing of a form.

FIG. 14 is an explanatory diagram of one embodiment of the present invention when the present invention is applied to a direct printing lithographic transfer printing method.

FIGS. 15A and 15B are explanatory diagrams of an embodiment of the present invention when the present invention is applied to an offset printing method.

FIG. 16 is an explanatory diagram of one embodiment of the present invention when the present invention is applied to a lithographic intaglio transfer printing method.

FIG. 17 is an explanatory diagram of an embodiment of the present invention when the present invention is applied to an intaglio transfer printing method (gravure printing method).

FIGS. 18A to 18E are explanatory diagrams each showing a conventional screen printing method.

FIGS. 19A to 19D are explanatory views showing a conventional screen printing method.

FIG. 20 is a perspective view of the X-direction drive device according to the embodiment of the present invention.

FIG. 21 is a perspective view of a plate separating device (Z-direction driving device) according to the embodiment of the present invention.

FIG. 22 is a perspective view of another plate separation device (Z-direction driving device) according to the embodiment of the present invention.

FIG. 23 is a perspective view of a rectangular induction coil according to another embodiment of the present invention.

FIG. 24 shows a QFP prepared by preparing two induction coils shown in FIG. 23;
FIG. 5 is a perspective view showing a state in which induced currents flow along the longitudinal direction of each through hole, respectively, arranged on two corners located at opposite corners of FIG.

25 shows a QFP prepared by preparing four induction coils of FIG. 23;
FIG. 9 is a perspective view showing a state in which induced currents are respectively arranged on the four corners of FIG.

FIG. 26 shows a QFP prepared by preparing one induction coil shown in FIG. 23;
And 45 with respect to the pattern of the through holes.
It is a perspective view showing the state where it arrange | positioned in the shape inclined at an angle and made the same amount of induced current flow into each through-hole.

[Explanation of symbols]

11: Screen mask, 11a: Through hole, 12: Cream solder, 12a: Cream solder layer, 13: Squeegee,
14 ... substrate, 15 ... land, 20 ... stage part, 21 ...
Substrate loading / unloading device, 22 ... substrate support device, 24 ...
Squeegee head driving device, 25 ... XYθ position correcting means,
26: plate separating means, 27: screen mask heating device,
28 ... induction heating section, 28a ... induction coil, 28b ... induction magnetic field, 28c ... induction current, 29 ... timer, 30 ... board position recognition correction section, 31 ... processing operation section, 32 ... recognition camera section, 33 ... display section, 34 control section, 35 process control section, 36 processing section, 37 non-defective print database, 38 print inspection section, 39 processing section, 40 processing section
Print state detecting means, 41: inspection reference storage unit, 100: filling roller, 101: scraper for scraping cream solder, 110: piston, 111: nozzle, 112: scraper for scraping cream solder, 114: base material, 115
... predetermined position, 120 ... lithographic, 122 ... printing material, 135
.., Paper, 136, plate cylinder, 136a, recess, 137, rubber cylinder, 138, impression cylinder, 139, tank, 140, supply roller, 142, printing material, 150, intaglio, 150a, recess, 152, printing material, 154 ... base material, 155 ... predetermined position, 160 ... base material, 161 ... impression cylinder, 162 ... printing material,
163: plate cylinder, 163a: concave portion, 164: doctor, 16
5: tank, 166: supply roller.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Toshiaki Yamauchi 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.

Claims (23)

[Claims] 1. A printing paste (12, 122, 142, 152, 1) having a characteristic that the viscosity decreases with an increase in temperature.
62) to plate (11, 120, 136, 150, 163)
The temperature of a portion of the plate where the printing paste is held is increased to lower the viscosity of the printing paste in contact with the portion to facilitate separation of the printing paste from the printing plate, A printing method for separating the printing paste held in the printing plate from the plate and printing the printing paste on the printing medium (14, 114, 135, 154, 160). 2. The printing method according to claim 1, wherein a portion of the plate on which the printing paste is held is heated by electromagnetic induction heating to increase the temperature. 3. The printing plate has a predetermined pattern of openings (11a, 150a, 16a) for holding the printing paste.
3a) such that after the plate comes into contact with the printing medium, the printing paste in the opening is printed on the printing medium by relatively separating the printing plate and the printing medium. 3. The printing method according to claim 2, wherein: 4. The printing method according to claim 3, wherein the electromagnetic induction heating device for performing the electromagnetic induction heating performs the electromagnetic induction heating on the plate in a non-contact manner. 5. The apparatus according to claim 4, wherein the distance between the electromagnetic induction heating device and the printing plate is set to a size such that a predetermined induction current flows through the printing plate by the electromagnetic induction heating device. Printing method. 6. The printing method according to claim 3, wherein the electromagnetic induction heating device for performing the electromagnetic induction heating contacts the plate to perform the electromagnetic induction heating. 7. The printing method according to claim 3, wherein the electromagnetic induction heating is performed after the holding of the printing paste in the opening of the plate is completed. 8. The opening is a through hole (11a),
The printing method according to any one of claims 3 to 7, wherein the printing plate is a screen mask (11), and the printing paste is filled in the through holes by moving a squeegee (13). 9. After the printing paste is printed on the printing medium, a printing state is detected, and the condition of the electromagnetic induction heating of the plate or separation of the printing plate and the printing medium is determined based on the detection result. 9. The printing method according to claim 3, wherein the conditions are controlled. 10. Due to the electromagnetic induction heating, the printing material has a temperature gradient such that the temperature of a portion in contact with the portion held by the plate is high, and the temperature gradually decreases as the distance from the portion increases. Claims 3 to 9 having
The printing method according to any one of the above. 11. The printing method according to claim 3, wherein the induction current for generating the electromagnetic induction heating flows along a longitudinal direction of the opening of the plate. 12. A printing paste (12, 122, 142, 152, 152) having a property that the viscosity decreases as the temperature rises.
162) (11, 120, 136, 15)
A heating device (27) for increasing the temperature of the portion where the printing paste is held in (0, 163) to lower the viscosity of the printing paste in contact with the portion and to facilitate separation of the printing paste from the plate; And the printing paste held on the printing plate is separated from the printing plate and
4, 114, 135, 154, 160), and a printing paste separation device (26, 137, 138, 161). 13. The printing paste (12, 122, 142, 15) having a characteristic that viscosity decreases with increasing temperature.
2,162) (11,120,13)
The printing apparatus according to claim 12, further comprising: (6, 150, 163). 14. The apparatus according to claim 12, further comprising an electromagnetic induction heating device (27) for heating a portion of the plate holding the printing paste by electromagnetic induction heating to increase the temperature. Printing device. 15. The plate has openings (11a, 150a, 1a) of a predetermined pattern for holding the printing paste.
63a), the separating device relatively separates the plate and the printing medium after the printing plate comes into contact with the printing medium, and transfers the printing paste in the opening on the printing medium. 15. The printing apparatus according to claim 14, wherein the printing is performed on the printer. 16. The printing apparatus according to claim 15, wherein the electromagnetic induction heating device for performing the electromagnetic induction heating performs the electromagnetic induction heating on the plate in a non-contact manner. 17. The apparatus according to claim 16, wherein a distance between the electromagnetic induction heating device and the plate is set to a size such that a predetermined induction current flows through the plate by the electromagnetic induction heating device. Printing device. 18. The printing apparatus according to claim 15, wherein the electromagnetic induction heating device for performing the electromagnetic induction heating contacts the plate to perform the electromagnetic induction heating. 19. The printing apparatus according to claim 15, wherein the electromagnetic induction heating is performed after the holding of the printing paste in the opening of the plate is completed. 20. The printing apparatus according to claim 20, wherein the opening is a through hole, and the printing plate is a screen mask, and the printing paste is filled in the through hole by moving a squeegee. Item 20. The printing device according to any one of Items 15 to 19. 21. After the printing paste is printed on the printing medium, a printing state is detected, and the condition of the electromagnetic induction heating of the printing plate or separation of the printing plate and the printing medium is determined based on the detection result. The printing apparatus according to any one of claims 15 to 20, further comprising a control unit (34) for controlling a condition. 22. Due to the electromagnetic induction heating, the printing material has a temperature gradient such that the temperature of a portion in contact with a portion held by the plate is high, and the temperature gradually decreases as the distance from the portion increases. Claims 15-
22. The printing device according to any one of 21. 23. The printing apparatus according to claim 15, wherein the induction current for generating the electromagnetic induction heating flows along a longitudinal direction of the opening of the plate.