JPWO2015052780A1 - Manufacturing method of electronic component mounting body - Google Patents

Manufacturing method of electronic component mounting body Download PDF

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Publication number
JPWO2015052780A1
JPWO2015052780A1 JP2015541341A JP2015541341A JPWO2015052780A1 JP WO2015052780 A1 JPWO2015052780 A1 JP WO2015052780A1 JP 2015541341 A JP2015541341 A JP 2015541341A JP 2015541341 A JP2015541341 A JP 2015541341A JP WO2015052780 A1 JPWO2015052780 A1 JP WO2015052780A1
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solder paste
electronic component
connection electrode
recess
transfer mold
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JP6225193B2 (en
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近藤　健
健 近藤
直史 泉
直史 泉
恵美 淵
恵美 淵
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Lintec Corp
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Lintec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract

離型処理された転写型１０の一方の面に設けられた凹部１１に、塗布によりソルダーペースト２０を充填する工程と、凹部１１と電子部品３０の接続電極３１とを位置合わせし、凹部１１に充填されたソルダーペースト２０上に接続電極３１を載置する工程と、ソルダーペースト２０に接続電極３１を押圧した状態でリフローする工程と、転写型１０と電子部品３０とを引き離して、転写型１０からソルダーペースト２０を剥離し、電子部品３０の接続電極３１にソルダーペースト２０を転写する工程と、接続電極３１と電子回路基板５０の配線パターン５１とをソルダーペースト２０を介して電気的に接続し、電子部品３０を前記電子回路基板５０に実装する工程とを含む電子部品実装体の製造方法。The step of filling the recess 11 provided on one surface of the transfer mold 10 subjected to the mold release treatment with the solder paste 20 by coating and the recess 11 and the connection electrode 31 of the electronic component 30 are aligned to form the recess 11. The step of placing the connection electrode 31 on the filled solder paste 20, the step of reflowing the solder paste 20 while pressing the connection electrode 31, the transfer mold 10 and the electronic component 30 are separated, and the transfer mold 10 The solder paste 20 is peeled off and the solder paste 20 is transferred to the connection electrode 31 of the electronic component 30 and the connection electrode 31 and the wiring pattern 51 of the electronic circuit board 50 are electrically connected via the solder paste 20. And a step of mounting the electronic component 30 on the electronic circuit board 50.

Description

本発明は、高密度実装を施す電子回路基板における電子部品実装体の製造方法に関する。   The present invention relates to a method of manufacturing an electronic component mounting body on an electronic circuit board that performs high-density mounting.

近年、電子機器は小型軽量化、高機能化、高周波化に伴い、それを構成する電子回路基板はこれまで以上に高密度実装が要求されている。
電子回路基板を高密度実装するために、電子回路基板に実装する抵抗、コンデンサ、ＬＳＩ、ＩＣ等の電子部品の小型化が進められている。例えば、従来は「１００５」とよばれる縦１．０ｍｍ、横０．５ｍｍの電子部品が主流であったが、現在では「０６０３」（縦０．６ｍｍ、横０．３ｍｍ）や、「０４０２」（縦０．４ｍｍ、横０．２ｍｍ）とよばれるさらに小さな電子部品を実装する必要に迫られている。In recent years, as electronic devices have become smaller and lighter, higher in function, and higher in frequency, electronic circuit boards constituting the electronic devices are required to be mounted with higher density than ever before.
In order to mount an electronic circuit board at a high density, electronic components such as resistors, capacitors, LSIs, and ICs mounted on the electronic circuit board have been downsized. For example, in the past, an electronic component having a length of 1.0 mm and a width of 0.5 mm called “1005” has been mainstream, but now it is “0603” (length 0.6 mm, width 0.3 mm) or “0402”. There is a need to mount even smaller electronic components called (vertical 0.4 mm, horizontal 0.2 mm).

また、電子回路基板を高密度実装するために、電子回路基板の配線パターンは微細で複雑になってきている。配線パターンが微細で複雑になってきていることによって、電子部品を実装する際に、液状化した半田等の導電材の流れ出しによって配線間で短絡を引き起こすブリッジや、欠品、位置ずれ等の不良を生じることがある。そこで、電子部品と電子回路基板との接続強度を十分に確保しつつ、ブリッジが生じることを防止する電子部品実装体の製造方法が提案されている（例えば、特許文献１，２参照。）。   Further, in order to mount the electronic circuit board at a high density, the wiring pattern of the electronic circuit board has become fine and complicated. Due to the finer and more complicated wiring patterns, when mounting electronic components, defects such as bridges, shortages, misalignment, etc. that cause short circuits between wiring due to the flow of conductive material such as liquefied solder May occur. In view of this, there has been proposed a method of manufacturing an electronic component mounting body that prevents a bridge from occurring while sufficiently securing the connection strength between the electronic component and the electronic circuit board (see, for example, Patent Documents 1 and 2).

ブリッジが生じることを防止する電子部品実装体の製造方法として、必要最小の導電材を接続部に供給することで、ブリッジが生じることを防止する電子部品実装体の製造方法も提案されている（例えば、特許文献３，４参照。）。   As a method of manufacturing an electronic component mounting body that prevents the occurrence of a bridge, a method of manufacturing an electronic component mounting body that prevents the generation of a bridge by supplying the minimum necessary conductive material to the connection portion has also been proposed ( For example, see Patent Documents 3 and 4.)

特開２００４−２７３８５３号公報Japanese Patent Application Laid-Open No. 2004-238353 特開２００５−５１２０４号公報JP 2005-51204 A 特開２００６−３１９２５３号公報JP 2006-319253 A 特開２００８−３４７５６号公報JP 2008-34756 A

しかしながら、特許文献１〜４では、依然として、特に、「０４０２」等の微小電子部品の実装には、ブリッジ、欠品、位置ずれ等の不良の課題が残っている。また、リフロー工程において、鉛フリー半田等では比熱が高く融点も高いため加熱する際に十分な溶融時間が必要であるが、十分な溶融時間を得ようとすると大気の影響で半田の酸化が進んでしまうことにより、実装不良等の不具合が生じてしまう問題がある。半田を加熱する際に、大気下に暴露される半田の領域が多い場合、半田の酸化が顕著に生じる。   However, in Patent Documents 1 to 4, there are still problems of defects such as bridges, missing parts, misalignment, etc., particularly in mounting of minute electronic components such as “0402”. In the reflow process, lead-free solder or the like has a high specific heat and a high melting point, so a sufficient melting time is required for heating. However, if sufficient melting time is obtained, the oxidation of solder proceeds due to the influence of the atmosphere. As a result, there is a problem that defects such as mounting defects occur. When the solder is heated, if there are many areas of the solder exposed to the atmosphere, the solder is significantly oxidized.

本発明は、電子部品と電子回路基板との接続強度を十分に確保し、かつ、安定した量で電子部品を接続するために必要最小の量のソルダーペーストを電子部品の接続端子に供給し、ブリッジ、欠品、位置ずれ等の不良が生じることを防止し、半田の酸化を低減できる電子部品実装体の製造方法を提供することを目的とする。   The present invention sufficiently secures the connection strength between the electronic component and the electronic circuit board, and supplies a minimum amount of solder paste necessary for connecting the electronic component in a stable amount to the connection terminal of the electronic component, It is an object of the present invention to provide a method for manufacturing an electronic component mounting body that can prevent defects such as bridges, missing parts, and misalignment, and can reduce solder oxidation.

本発明者らは、転写型の凹部内でリフローしたソルダーペーストを電子部品の接続端子に供給することで、上記課題を解決し得ることを見出した。
すなわち、本発明は、下記［１］〜［１１］を提供するものである。The present inventors have found that the above problem can be solved by supplying the solder paste reflowed in the recess of the transfer mold to the connection terminal of the electronic component.
That is, the present invention provides the following [1] to [11].

［１］離型処理された転写型の一方の面に設けられた凹部に、塗布によりソルダーペーストを充填する工程と、前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程とを含む電子部品実装体の製造方法。
［２］離型処理された転写型の一方の面に設けられた凹部に、ディスペンサーによりソルダーペーストを充填する工程と、前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程とを含む電子部品実装体の製造方法。
［３］離型処理された転写型の一方の面に設けられた凹部に、スクリーン印刷によりソルダーペーストを充填する工程と、前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程とを含む電子部品実装体の製造方法。
［４］離型処理された転写型の一方の面に設けられた凹部に、前記転写型に設けられた充填用孔からソルダーペーストを充填する工程と、前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程とを含む電子部品実装体の製造方法。
［５］前記ソルダーペーストを充填する工程は、前記凹部から突出するように前記ソルダーペーストを充填する［１］〜［４］のいずれかに記載の電子部品実装体の製造方法。
［６］前記凹部は、前記電子部品の前記接続電極に対応する間隔で複数設けられている［１］〜［５］のいずれかに記載の電子部品実装体の製造方法。
［７］前記ソルダーペーストは、鉛フリー半田を含有する［１］〜［６］のいずれかに記載の電子部品実装体の製造方法。
［８］前記リフローする工程は、前記凹部が設けられた面の反対面側から加熱する［１］〜［７］のいずれかに記載の電子部品実装体の製造方法。
［９］前記転写型は、樹脂製のシート又は金属製のシートである［１］〜［８］のいずれかに記載の電子部品実装体の製造方法。
［１０］前記ソルダーペースト２０は、粘度が５Ｐａ・ｓ以上１０００Ｐａ・ｓ以下である［１］〜［９］のいずれかに記載の電子部品実装体の製造方法。
［１１］前記転写型の表面エネルギーが、前記ソルダーペーストの表面エネルギーよりも小さい［１］〜［１０］のいずれかに記載の電子部品実装体の製造方法。[1] The step of filling the concave portion provided on one surface of the release-molded transfer mold with a solder paste by coating, the concave portion and the connection electrode of the electronic component are aligned, and the concave portion is filled. The step of placing the connection electrode on the solder paste, the step of reflowing the solder paste in a state of pressing the connection electrode, the transfer mold and the electronic component are separated, and the transfer mold is removed from the transfer mold. Peeling the solder paste and transferring the solder paste to the connection electrode of the electronic component; electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste; Mounting the electronic circuit board on the electronic circuit board.
[2] A step of filling the concave portion provided on one surface of the transfer mold subjected to the mold release treatment with a solder paste by a dispenser, aligning the concave portion and the connection electrode of the electronic component, and filling the concave portion The step of placing the connection electrode on the solder paste, the step of reflowing the solder paste in a state of pressing the connection electrode, the transfer mold and the electronic component are separated, and the transfer mold is removed from the transfer mold. Peeling the solder paste and transferring the solder paste to the connection electrode of the electronic component; electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste; Mounting the electronic circuit board on the electronic circuit board.
[3] The step of filling the concave portion provided on one surface of the release-molded transfer mold with the solder paste by screen printing, aligning the concave portion and the connection electrode of the electronic component, and filling the concave portion Placing the connection electrode on the solder paste, reflowing the solder paste while pressing the connection electrode, separating the transfer mold and the electronic component from the transfer mold Peeling the solder paste, transferring the solder paste to the connection electrode of the electronic component, electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste, and A method of manufacturing an electronic component mounting body including a step of mounting a component on the electronic circuit board.
[4] A step of filling a concave portion provided on one surface of the transfer mold subjected to the release treatment with a solder paste from a filling hole provided in the transfer die, and the concave portion and a connection electrode of an electronic component. Aligning and placing the connection electrode on the solder paste filled in the recess, reflowing the connection electrode while pressing the connection electrode, the transfer mold and the electronic component And separating the solder paste from the transfer mold, transferring the solder paste to the connection electrode of the electronic component, and the wiring pattern of the connection electrode and the electronic circuit board via the solder paste. Electrically connecting and mounting the electronic component on the electronic circuit board.
[5] The method of manufacturing an electronic component mounting body according to any one of [1] to [4], wherein the step of filling the solder paste includes filling the solder paste so as to protrude from the recess.
[6] The method for manufacturing an electronic component mounting body according to any one of [1] to [5], wherein a plurality of the recesses are provided at intervals corresponding to the connection electrodes of the electronic component.
[7] The method for manufacturing an electronic component mounting body according to any one of [1] to [6], wherein the solder paste contains lead-free solder.
[8] The method for manufacturing an electronic component mounting body according to any one of [1] to [7], wherein the reflowing step is performed by heating from the side opposite to the surface provided with the concave portion.
[9] The method for manufacturing an electronic component mounting body according to any one of [1] to [8], wherein the transfer mold is a resin sheet or a metal sheet.
[10] The method for manufacturing an electronic component mounting body according to any one of [1] to [9], wherein the solder paste 20 has a viscosity of 5 Pa · s to 1000 Pa · s.
[11] The method for manufacturing an electronic component mounting body according to any one of [1] to [10], wherein the surface energy of the transfer mold is smaller than the surface energy of the solder paste.

本発明によれば、電子部品と電子回路基板との接続強度を十分に確保し、かつ、安定した量で電子部品を接続するために必要最小の量のソルダーペーストを電子部品の接続端子に供給し、ブリッジ、欠品、位置ずれ等の不良が生じることを防止し、半田の酸化を低減できる電子部品実装体の製造方法を提供することができる。   According to the present invention, a sufficient amount of solder paste is supplied to the connection terminal of the electronic component to ensure sufficient connection strength between the electronic component and the electronic circuit board and to connect the electronic component in a stable amount. In addition, it is possible to provide a method of manufacturing an electronic component mounting body that can prevent the occurrence of defects such as bridges, missing parts, misalignment, and the like, and reduce solder oxidation.

本発明の第１〜第３の実施の形態に係る電子部品実装体の製造方法の工程断面図である。It is process sectional drawing of the manufacturing method of the electronic component mounting body which concerns on the 1st-3rd embodiment of this invention. 本発明の実施の形態に係る転写型のサイズを示す模式的断面図である。It is a typical sectional view showing size of a transfer type concerning an embodiment of the invention. 本発明の第４の実施の形態に係る電子部品実装体の製造方法の工程断面図である。It is process sectional drawing of the manufacturing method of the electronic component mounting body which concerns on the 4th Embodiment of this invention.

（第１の実施の形態）
本発明の第１の実施の形態に係る電子部品実装体の製造方法について、図１を参照しながら説明する。(First embodiment)
A method for manufacturing an electronic component mounting body according to the first embodiment of the present invention will be described with reference to FIG.

まず、図１（ａ）に示すように、一方の面に凹部１１が設けられ、離型処理された転写型１０を用意する。転写型１０に設けられる凹部１１は、単数であってもよいが、通常、複数設けられている。凹部１１の形状は、断面がＵ字型、Ｖ字型等の種々の形状を採用することができる。
凹部１１のサイズは、図２に示すように、凹部ピッチＡ、凹部幅Ｂ、凹部高さＣによって決定される。凹部１１のサイズは、電子部品のサイズ及びソルダーペーストの転写量によって任意に決定されるが、電子部品のサイズが「０６０３」及び「０４０２」等の非常に微小なサイズである場合には、凹部ピッチＡが１００μｍ以上２００μｍ以下であることが好ましく、凹部幅Ｂが５０μｍ以上１００μｍ以下であることが好ましく、凹部高さＣが３０μｍ以上１００μｍ以下であることが好ましい。凹部１１が複数である場合は、凹部１１と電子部品の接続電極との位置合わせを容易にし、接続電極へのソルダーペースト供給を容易にするという観点から、電子回路基板に実装する電子部品の接続電極に対応する間隔で設けられることが好ましい。First, as shown in FIG. 1A, a transfer mold 10 having a recess 11 on one surface and subjected to a release process is prepared. Although the number of the recesses 11 provided in the transfer mold 10 may be single, usually a plurality of recesses 11 are provided. As the shape of the recess 11, various shapes such as a U-shaped and V-shaped cross section can be adopted.
The size of the recess 11 is determined by the recess pitch A, the recess width B, and the recess height C as shown in FIG. The size of the recess 11 is arbitrarily determined depending on the size of the electronic component and the transfer amount of the solder paste. If the size of the electronic component is very small such as “0603” and “0402”, the recess 11 The pitch A is preferably from 100 μm to 200 μm, the recess width B is preferably from 50 μm to 100 μm, and the recess height C is preferably from 30 μm to 100 μm. When there are a plurality of the recesses 11, the connection of the electronic components mounted on the electronic circuit board is facilitated from the viewpoint of facilitating the alignment between the recesses 11 and the connection electrodes of the electronic components and facilitating the supply of the solder paste to the connection electrodes. It is preferable to be provided at intervals corresponding to the electrodes.

転写型１０の材質としては、樹脂及び金属を用いることができる。転写型１０として用いる樹脂としては、半田耐熱性を有する樹脂であり、例えばポリイミド、熱硬化性エポキシ樹脂、液晶ポリマー等を挙げることができる。また、転写型１０として用いる金属としては、鉄、銅、アルミニウム、マグネシウム等、及びそれらの合金を挙げることができる。転写型１０は、汎用性が高く、凹部１１が形成し易いという点から、樹脂製のシート又は金属製のシートであることが好ましい。   As a material of the transfer mold 10, a resin and a metal can be used. The resin used as the transfer mold 10 is a resin having solder heat resistance, and examples thereof include polyimide, thermosetting epoxy resin, and liquid crystal polymer. Further, examples of the metal used as the transfer mold 10 include iron, copper, aluminum, magnesium, and alloys thereof. The transfer mold 10 is preferably a resin sheet or a metal sheet from the viewpoint of high versatility and easy formation of the recess 11.

転写型１０は、離型性を有することが必須であるので、例えばフッ素系樹脂、シリコーン系樹脂、オレフィン系樹脂を塗布する等の離型処理が施されている。
フッ素系樹脂としては、フッ素シリコーン樹脂、フッ素ボロン樹脂等が挙げられる。シリコーン系樹脂としては、基本骨格としてジメチルポリシロキサンを有するシリコーン系樹脂が挙げられる。オレフィン系樹脂としては、ポリエチレン樹脂、ポリプロピレン樹脂、ポリエチレン−プロピレン共重合体樹脂等が挙げられる。転写型１０の表面エネルギーは、ソルダーペースト２０の表面エネルギーよりも小さいことが好ましい。これにより、ソルダーペースト２０が転写型１０に付着するのを防止することができ、後述の工程において、電子部品３０の接続電極３１にソルダーペースト２０を容易に転写することができる。Since it is essential that the transfer mold 10 has releasability, a release treatment such as applying a fluorine resin, a silicone resin, or an olefin resin is performed.
Examples of the fluorine resin include fluorine silicone resin and fluorine boron resin. Examples of the silicone resin include silicone resins having dimethylpolysiloxane as a basic skeleton. Examples of the olefin resin include polyethylene resin, polypropylene resin, and polyethylene-propylene copolymer resin. The surface energy of the transfer mold 10 is preferably smaller than the surface energy of the solder paste 20. Thereby, it can prevent that the solder paste 20 adheres to the transcription | transfer mold 10, and can transfer the solder paste 20 to the connection electrode 31 of the electronic component 30 easily in the process mentioned later.

次に、図１（ｂ）に示すように、転写型１０の凹部１１にソルダーペースト２０を充填する。
凹部１１にソルダーペースト２０を充填する際には、凹部１１と電子部品の接続電極３１との位置合わせを容易に行えるという観点から、凹部１１から突出するようにソルダーペースト２０を充填することが好ましい。
凹部１１にソルダーペースト２０を充填する方法としては、ソルダーペースト２０を転写型１０上に塗布して凹部１１に充填させる方法を採用する。ソルダーペースト２０を転写型１０上に塗布する方法としては、公知の方法を用いることができ、例えば、グラビアコート法、バーコート法、スプレーコート法、スピンコート法、ロールコート法、ダイコート法、ナイフコート法、エアナイフコート法、カーテンコート法等が挙げられる。転写型１０に塗布されたソルダーペースト２０は、転写型１０の離型処理の影響と表面張力により、凹部１１内に自己充填する。
ソルダーペースト２０としては、鉛含有半田及び鉛フリー半田等の電気用半田を含有させて用いることができ、中でも鉛フリー半田が好適である。鉛フリー半田としては、ＳｎＡｇＣｕ系半田、ＳｎＺｎＢｉ系半田、ＳｎＣｕ系半田、ＳｎＡｇＩｎＢｉ系半田、ＳｎＺｎＡｌ系半田等が挙げられる。ソルダーペースト２０は、粘度が５Ｐａ・ｓ以上１０００Ｐａ・ｓ以下であることが好ましく、５０Ｐａ・ｓ以上１０００Ｐａ・ｓ以下であることがより好ましく、２５０Ｐａ・ｓ以上５００Ｐａ・ｓ以下であることがさらに好ましい。ソルダーペースト２０の粘度が上記範囲であれば、ソルダーペースト２０の表面張力により、凹部１１内にソルダーペースト２０を良好に充填することができる。Next, as shown in FIG. 1 (b), the solder paste 20 is filled into the recess 11 of the transfer mold 10.
When filling the concave portion 11 with the solder paste 20, it is preferable to fill the solder paste 20 so as to protrude from the concave portion 11 from the viewpoint that the concave portion 11 and the connection electrode 31 of the electronic component can be easily aligned. .
As a method for filling the recess 11 with the solder paste 20, a method of applying the solder paste 20 onto the transfer mold 10 and filling the recess 11 is adopted. As a method for applying the solder paste 20 onto the transfer mold 10, known methods can be used. For example, a gravure coating method, a bar coating method, a spray coating method, a spin coating method, a roll coating method, a die coating method, a knife Examples thereof include a coating method, an air knife coating method, and a curtain coating method. The solder paste 20 applied to the transfer mold 10 is self-filled in the recesses 11 due to the influence of the release treatment of the transfer mold 10 and the surface tension.
The solder paste 20 can be used by containing electrical solder such as lead-containing solder and lead-free solder, among which lead-free solder is preferable. Examples of the lead-free solder include SnAgCu solder, SnZnBi solder, SnCu solder, SnAgInBi solder, SnZnAl solder, and the like. The solder paste 20 preferably has a viscosity of 5 Pa · s or more and 1000 Pa · s or less, more preferably 50 Pa · s or more and 1000 Pa · s or less, and further preferably 250 Pa · s or more and 500 Pa · s or less. . If the viscosity of the solder paste 20 is within the above range, the solder paste 20 can be satisfactorily filled into the recess 11 by the surface tension of the solder paste 20.

次に、図１（ｃ）に示すように、凹部１１と電子部品３０の接続電極３１とを位置合わせし、凹部１１に充填されたソルダーペースト２０上に接続電極３１を載置する。
電子部品３０は、電子回路基板５０に実装するチップ抵抗器、チップコンデンサ、チップＬＳＩ、チップＩＣ等のチップ状の回路部品が挙げられる。電子部品３０の両端側面には、電子回路基板５０から電力を受給するための接続電極３１が設けられている。電子部品３０のサイズとしては、ブリッジ、欠品、位置ずれ等の不良を防止する効果が顕著に得られるという観点から、縦１．０ｍｍ未満、横０．５ｍｍ未満の微小なサイズ（例えば、「０６０３」及び「０４０２」等）であることが好ましい。Next, as shown in FIG. 1C, the recess 11 and the connection electrode 31 of the electronic component 30 are aligned, and the connection electrode 31 is placed on the solder paste 20 filled in the recess 11.
Examples of the electronic component 30 include chip-shaped circuit components such as chip resistors, chip capacitors, chip LSIs, and chip ICs that are mounted on the electronic circuit board 50. Connection electrodes 31 for receiving electric power from the electronic circuit board 50 are provided on both side surfaces of the electronic component 30. The size of the electronic component 30 is a minute size (for example, “less than 1.0 mm in length and less than 0.5 mm in width) from the viewpoint that the effect of preventing defects such as bridges, missing parts, and misalignment can be remarkably obtained. 0603 "and" 0402 ").

次に、図１（ｄ）に示すように、ソルダーペースト２０に接続電極３１を押圧した状態で、ソルダーペースト２０をリフローする。
ソルダーペースト２０をリフローさせるために、ソルダーペースト２０を融点以上まで加熱する。ソルダーペースト２０を融点以上まで加熱する方法としては、ソルダーペースト２０を一様に加熱することができるという観点から、例えば、凹部１１が設けられた面の反対面側から加熱ステージ等の加熱装置４０で加熱することが好ましい。加熱温度は、ソルダーペースト２０の融点以上であればよく、例えば、ソルダーペースト２０がＳｎＡｇＣｕ系半田である場合は、２１７℃〜２２０℃程度まで加熱することでリフローさせることができる。Next, as shown in FIG. 1 (d), the solder paste 20 is reflowed while the connection electrode 31 is pressed against the solder paste 20.
In order to reflow the solder paste 20, the solder paste 20 is heated to a melting point or higher. As a method of heating the solder paste 20 to the melting point or more, from the viewpoint that the solder paste 20 can be uniformly heated, for example, a heating device 40 such as a heating stage from the opposite side of the surface where the recess 11 is provided. It is preferable to heat with. The heating temperature should just be more than melting | fusing point of the solder paste 20, for example, when the solder paste 20 is SnAgCu type solder, it can be made to reflow by heating to about 217 degreeC-220 degreeC.

次に、図１（ｅ）に示すように、転写型１０と電子部品３０とを引き離して、転写型１０からソルダーペースト２０を剥離し、電子部品３０の接続電極３１にソルダーペースト２０を転写する。
接続電極３１に転写するソルダーペースト２０は、図１（ｅ）に示したように、凹部１１に充填されたソルダーペースト２０の一部分であってもよく、凹部１１に充填されたソルダーペースト２０の全部であってもよい。接続電極３１に転写するソルダーペースト２０の転写量制御は、ソルダーペースト２０の充填量、ソルダーペースト２０のリフロー加熱程度（温度、時間）を制御することにより行う。これにより、所望の量のソルダーペースト２０が、電子部品３０の接続電極３１に転写される。Next, as illustrated in FIG. 1E, the transfer mold 10 and the electronic component 30 are separated from each other, the solder paste 20 is peeled from the transfer mold 10, and the solder paste 20 is transferred to the connection electrode 31 of the electronic component 30. .
As shown in FIG. 1E, the solder paste 20 transferred to the connection electrode 31 may be a part of the solder paste 20 filled in the recess 11, or the entire solder paste 20 filled in the recess 11. It may be. The transfer amount of the solder paste 20 transferred to the connection electrode 31 is controlled by controlling the filling amount of the solder paste 20 and the reflow heating degree (temperature, time) of the solder paste 20. Thereby, a desired amount of the solder paste 20 is transferred to the connection electrode 31 of the electronic component 30.

次に、図１（ｆ）に示すように、接続電極３１と電子回路基板５０の配線パターン５１とをソルダーペースト２０を介して電気的に接続し、電子部品３０を電子回路基板５０に実装する。
接続電極３１と配線パターン５１とを電気的に接続する際には、再度加熱して、ソルダーペースト２０をリフローさせることで接続することができる。
以上の工程により、電子部品３０と電子回路基板５０が電気的に接続された電子部品実装体が作製される。Next, as shown in FIG. 1 (f), the connection electrode 31 and the wiring pattern 51 of the electronic circuit board 50 are electrically connected via the solder paste 20, and the electronic component 30 is mounted on the electronic circuit board 50. .
When the connection electrode 31 and the wiring pattern 51 are electrically connected, they can be connected by reheating and reflowing the solder paste 20.
Through the above steps, an electronic component mounting body in which the electronic component 30 and the electronic circuit board 50 are electrically connected is manufactured.

本発明の第１の実施の形態に係る電子部品実装体の製造方法によれば、転写型１０の凹部１１内に充填されたソルダーペースト２０に接続電極３１を押圧した状態で、ソルダーペースト２０をリフローすることで、ソルダーペースト２０が大気下に暴露される領域が少ないため、大気下リフローによる半田の酸化を低減することができる。
更に、本発明の第１の実施の形態に係る電子部品実装体の製造方法によれば、接続電極３１にソルダーペースト２０を転写する前にリフロー工程を行うことで、１回半田が溶融しているため、半田粒子の粒径の影響がなくなり、電子部品３０を電子回路基板５０に実装した際に、電子部品３０と電子回路基板５０との接続強度を十分に確保することができる。
更に、本発明の第１の実施の形態に係る電子部品実装体の製造方法によれば、必要最小のソルダーペースト２０を接続端子３１に供給することできるので、ソルダーペースト２０を溶融させた際のブリッジ発生を防止することができる。According to the method for manufacturing an electronic component mounting body according to the first embodiment of the present invention, the solder paste 20 is applied in a state where the connection electrode 31 is pressed against the solder paste 20 filled in the recess 11 of the transfer mold 10. By reflowing, since the area where the solder paste 20 is exposed to the atmosphere is small, it is possible to reduce solder oxidation due to reflow in the atmosphere.
Furthermore, according to the manufacturing method of the electronic component mounting body according to the first embodiment of the present invention, the solder is melted once by performing the reflow process before transferring the solder paste 20 to the connection electrode 31. Therefore, the influence of the particle size of the solder particles is eliminated, and when the electronic component 30 is mounted on the electronic circuit board 50, the connection strength between the electronic component 30 and the electronic circuit board 50 can be sufficiently secured.
Furthermore, according to the manufacturing method of the electronic component mounting body according to the first embodiment of the present invention, the minimum solder paste 20 can be supplied to the connection terminals 31, so that the solder paste 20 is melted. Bridging can be prevented.

（第２の実施の形態）
本発明の第２の実施の形態に係る電子部品実装体の製造方法は、第１の実施の形態で示した電子部品実装体の製造方法と比して、凹部１１にソルダーペースト２０を充填させる方法として、ディスペンサーにより凹部１１にソルダーペースト２０を充填させる方法を採用する点が異なる。その他については実質的に同様であるので記載を省略する。(Second Embodiment)
The manufacturing method of the electronic component mounting body according to the second embodiment of the present invention fills the recess 11 with the solder paste 20 as compared with the manufacturing method of the electronic component mounting body shown in the first embodiment. As a method, the point which employ | adopts the method of filling the solder paste 20 in the recessed part 11 with a dispenser differs. Since other parts are substantially the same, the description is omitted.

本発明の第２の実施の形態に係る電子部品実装体の製造方法でも、第１の実施の形態に係る電子部品実装体の製造方法と同様の効果を得ることができる。
さらに、本発明の第２の実施の形態に係る電子部品実装体の製造方法によれば、ディスペンサーにより直接凹部１１にソルダーペースト２０を充填させることで、所望の量であって、必要最小のソルダーペースト２０を凹部１１に供給することできるため、ソルダーペースト２０を溶融させた際のブリッジ発生を防止することができる。Even in the method for manufacturing an electronic component mounting body according to the second embodiment of the present invention, the same effects as those of the method for manufacturing an electronic component mounting body according to the first embodiment can be obtained.
Furthermore, according to the manufacturing method of the electronic component mounting body according to the second embodiment of the present invention, the solder paste 20 is filled with the solder paste 20 directly into the concave portion 11 by the dispenser, and the desired amount of the minimum solder is obtained. Since the paste 20 can be supplied to the recess 11, it is possible to prevent the occurrence of a bridge when the solder paste 20 is melted.

（第３の実施の形態）
本発明の第３の実施の形態に係る電子部品実装体の製造方法は、第１の実施の形態で示した電子部品実装体の製造方法と比して、凹部１１にソルダーペースト２０を充填させる方法として、スクリーン印刷により凹部１１にソルダーペースト２０充填させる方法を採用する点が異なる。その他については実質的に同様であるので記載を省略する。(Third embodiment)
Compared with the manufacturing method of the electronic component mounting body shown in the first embodiment, the manufacturing method of the electronic component mounting body according to the third embodiment of the present invention fills the recess 11 with the solder paste 20. The difference is that a method of filling the recess 11 with the solder paste 20 by screen printing is adopted. Since other parts are substantially the same, the description is omitted.

本発明の第３の実施の形態に係る電子部品実装体の製造方法でも、第１の実施の形態に係る電子部品実装体の製造方法と同様の効果を得ることができる。
さらに、本発明の第３の実施の形態に係る電子部品実装体の製造方法によれば、スクリーン印刷を採用することで、転写型１０が硬いものでも柔らかいものでもソルダーペースト２０を凹部１１に供給することができる。また、スクリーン印刷を採用することで、所望の量のソルダーペースト２０を凹部１１に供給することができるため、ソルダーペースト２０を溶融させた際のブリッジ発生を防止することができる。Even in the method for manufacturing an electronic component mounting body according to the third embodiment of the present invention, the same effect as that of the method for manufacturing an electronic component mounting body according to the first embodiment can be obtained.
Furthermore, according to the method for manufacturing an electronic component mounting body according to the third embodiment of the present invention, the solder paste 20 is supplied to the recess 11 regardless of whether the transfer mold 10 is hard or soft by adopting screen printing. can do. Moreover, since a desired amount of solder paste 20 can be supplied to the recess 11 by adopting screen printing, it is possible to prevent generation of a bridge when the solder paste 20 is melted.

（第４の実施の形態）
本発明の第４の実施の形態に係る電子部品実装体の製造方法は、第１の実施の形態で示した電子部品実装体の製造方法と比して、図３に示すように、凹部１１にソルダーペースト２０を充填させる方法として、転写型１０に設けられた充填用孔１２からソルダーペースト２０を充填させる方法を採用する点が異なる。その他については実質的に同様であるので記載を省略する。(Fourth embodiment)
Compared with the manufacturing method of the electronic component mounting body shown in the first embodiment, the manufacturing method of the electronic component mounting body according to the fourth embodiment of the present invention, as shown in FIG. The method of filling the solder paste 20 with the solder paste 20 from the filling hole 12 provided in the transfer mold 10 is different. Since other parts are substantially the same, the description is omitted.

転写型１０は、図３（ａ）に示すように、凹部１１と連通していて、凹部１１にソルダーペースト２０を供給するための充填用孔１２が設けられている。
図３（ｂ）に示すように、転写型１０の凹部１１にソルダーペースト２０を充填する工程において、凹部１１にソルダーペースト２０を充填する方法として、転写型１０に設けられた充填用孔１２からソルダーペースト２０を充填させる方法を採用する。As shown in FIG. 3A, the transfer mold 10 communicates with the recess 11, and is provided with a filling hole 12 for supplying the solder paste 20 to the recess 11.
As shown in FIG. 3B, in the step of filling the recess 11 of the transfer mold 10 with the solder paste 20, as a method of filling the recess 11 with the solder paste 20, a filling hole 12 provided in the transfer mold 10 is used. A method of filling the solder paste 20 is employed.

本発明の第４の実施の形態に係る電子部品実装体の製造方法でも、第１の実施の形態に係る電子部品実装体の製造方法と同様の効果を得ることができる。
さらに、本発明の第４の実施の形態に係る電子部品実装体の製造方法によれば、転写型１０に設けられた充填用孔１２からソルダーペースト２０を充填させる方法を採用することで、所望の量のソルダーペースト２０を容易に凹部１１に供給することできるため、ソルダーペースト２０を溶融させた際のブリッジ発生を防止することができる。The electronic component mounting body manufacturing method according to the fourth embodiment of the present invention can provide the same effects as the electronic component mounting body manufacturing method according to the first embodiment.
Furthermore, according to the method for manufacturing an electronic component mounting body according to the fourth embodiment of the present invention, a method of filling the solder paste 20 from the filling hole 12 provided in the transfer mold 10 is desirable. Since the amount of solder paste 20 can be easily supplied to the recess 11, it is possible to prevent generation of a bridge when the solder paste 20 is melted.

１０…転写型
１１…凹部
１２…充填用孔
２０…ソルダーペースト
３０…電子部品
３１…接続電極
４０…加熱装置
５０…電子回路基板
５１…配線パターンDESCRIPTION OF SYMBOLS 10 ... Transfer mold 11 ... Recess 12 ... Filling hole 20 ... Solder paste 30 ... Electronic component 31 ... Connection electrode 40 ... Heating device 50 ... Electronic circuit board 51 ... Wiring pattern

Claims (11)

離型処理された転写型の一方の面に設けられた凹部に、塗布によりソルダーペーストを充填する工程と、
前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、
前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、
前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、
前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程
とを含む電子部品実装体の製造方法。Filling a solder paste by coating a recess provided on one side of the release mold subjected to the mold release treatment; and
Aligning the recess and the connection electrode of the electronic component, and placing the connection electrode on the solder paste filled in the recess;
Reflowing the solder paste in a state of pressing the connection electrode;
Separating the transfer mold and the electronic component, peeling the solder paste from the transfer mold, and transferring the solder paste to the connection electrode of the electronic component;
Electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste, and mounting the electronic component on the electronic circuit board. 離型処理された転写型の一方の面に設けられた凹部に、ディスペンサーによりソルダーペーストを充填する工程と、
前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、
前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、
前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、
前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程
とを含む電子部品実装体の製造方法。Filling a solder paste with a dispenser into a recess provided on one surface of the release mold subjected to the mold release treatment; and
Aligning the recess and the connection electrode of the electronic component, and placing the connection electrode on the solder paste filled in the recess;
Reflowing the solder paste in a state of pressing the connection electrode;
Separating the transfer mold and the electronic component, peeling the solder paste from the transfer mold, and transferring the solder paste to the connection electrode of the electronic component;
Electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste, and mounting the electronic component on the electronic circuit board. 離型処理された転写型の一方の面に設けられた凹部に、スクリーン印刷によりソルダーペーストを充填する工程と、
前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、
前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、
前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、
前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程
とを含む電子部品実装体の製造方法。Filling a solder paste by screen printing into a recess provided on one surface of the release mold subjected to the mold release treatment;
Aligning the recess and the connection electrode of the electronic component, and placing the connection electrode on the solder paste filled in the recess;
Reflowing the solder paste in a state of pressing the connection electrode;
Separating the transfer mold and the electronic component, peeling the solder paste from the transfer mold, and transferring the solder paste to the connection electrode of the electronic component;
Electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste, and mounting the electronic component on the electronic circuit board. 離型処理された転写型の一方の面に設けられた凹部に、前記転写型に設けられた充填用孔からソルダーペーストを充填する工程と、
前記凹部と電子部品の接続電極とを位置合わせし、前記凹部に充填された前記ソルダーペースト上に前記接続電極を載置する工程と、
前記ソルダーペーストに前記接続電極を押圧した状態でリフローする工程と、
前記転写型と前記電子部品とを引き離して、前記転写型から前記ソルダーペーストを剥離し、前記電子部品の前記接続電極に前記ソルダーペーストを転写する工程と、
前記接続電極と電子回路基板の配線パターンとを前記ソルダーペーストを介して電気的に接続し、前記電子部品を前記電子回路基板に実装する工程
とを含む電子部品実装体の製造方法。Filling a solder paste from a filling hole provided in the transfer mold into a recess provided in one surface of the release mold subjected to the mold release treatment;
Aligning the recess and the connection electrode of the electronic component, and placing the connection electrode on the solder paste filled in the recess;
Reflowing the solder paste in a state of pressing the connection electrode;
Separating the transfer mold and the electronic component, peeling the solder paste from the transfer mold, and transferring the solder paste to the connection electrode of the electronic component;
Electrically connecting the connection electrode and the wiring pattern of the electronic circuit board via the solder paste, and mounting the electronic component on the electronic circuit board. 前記ソルダーペーストを充填する工程は、前記凹部から突出するように前記ソルダーペーストを充填する請求項１〜４のいずれかに記載の電子部品実装体の製造方法。   5. The method of manufacturing an electronic component mounting body according to claim 1, wherein the step of filling the solder paste includes filling the solder paste so as to protrude from the recess. 前記凹部は、前記電子部品の前記接続電極に対応する間隔で複数設けられている請求項１〜５のいずれかに記載の電子部品実装体の製造方法。   The manufacturing method of the electronic component mounting body according to claim 1, wherein a plurality of the concave portions are provided at intervals corresponding to the connection electrodes of the electronic component. 前記ソルダーペーストは、鉛フリー半田を含有する請求項１〜６のいずれかに記載の電子部品実装体の製造方法。   The said solder paste is a manufacturing method of the electronic component mounting body in any one of Claims 1-6 containing lead-free solder. 前記リフローする工程は、前記凹部が設けられた面の反対面側から加熱する請求項１〜７のいずれかに記載の電子部品実装体の製造方法。   The method for manufacturing an electronic component mounting body according to any one of claims 1 to 7, wherein in the reflowing step, heating is performed from a surface opposite to a surface on which the concave portion is provided. 前記転写型は、樹脂製のシート又は金属製のシートである請求項１〜８のいずれかに記載の電子部品実装体の製造方法。   The method for manufacturing an electronic component package according to claim 1, wherein the transfer mold is a resin sheet or a metal sheet. 前記ソルダーペーストは、粘度が５Ｐａ・ｓ以上１０００Ｐａ・ｓ以下である請求項１〜９のいずれかに記載の電子部品実装体の製造方法。   The method for manufacturing an electronic component mounting body according to claim 1, wherein the solder paste has a viscosity of 5 Pa · s to 1000 Pa · s. 前記転写型の表面エネルギーが、前記ソルダーペーストの表面エネルギーよりも小さい請求項１〜１０のいずれかに記載の電子部品実装体の製造方法。   The manufacturing method of the electronic component mounting body in any one of Claims 1-10 in which the surface energy of the said transfer type | mold is smaller than the surface energy of the said solder paste.
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