JPH1056027A - Element jointing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an element jointing device with which the surface of an element can be closely fixed to substrate surface and the element can be jointed excellently to the substrate. SOLUTION: In this element jointing device provided with a junction head 13 where a mounting part 5 is formed and an element 10, which is mounted on the mounting part 5, is connected to a substrate 11, the junction head 13 is almost in parallel with the junction surface of the substrate 11 and it has at least a set of axes 1 and 2 which orthogonally intersect with each other. The element junction part is provided with the mounting part on which the mounting part 5 can be mounted in a freely pivotally moving manner using the axes 1 and 2 as a pivot shaft, a guide shaft 6 which guides the mounting part 5 to almost right-angle direction of the substrate 11, an elastic member 9 with which the mounting part 5 is energized to the direction of the substrate, and a receptacle member 8 which receives an energized mounting part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element bonding apparatus, and more particularly, to an element bonding apparatus used for positioning and fixing an optical element to a substrate or the like constituting an optical module when assembling an optical module.

[0002]

2. Description of the Related Art When positioning and fixing an optical element to a substrate or the like constituting an optical module by soldering or the like, in order to prevent an optical axis shift which causes an output loss of the optical module,
Precise positioning and fixing in three dimensions is required. The conventional device bonding apparatus has, for example, a structure conceptually shown in FIG. In this element bonding apparatus, the optical element 50 is made to adhere to the bonding head 51. The joining head 51 is fixed to a fixing table 52. The fixed base 52 is inscribed in a partially cylindrical stage 53 having a central axis α perpendicular to the drawing.
The rotation angle can be adjusted using (vertically in the figure) as a rotation axis. Further, the stage 53 is inscribed in a partially cylindrical stage 54 having a central axis β orthogonal to the central axis α, and the rotation angle can be adjusted using the central axis β as a rotation axis.
On the other hand, a substrate 55 to which the optical element 50 is bonded is fixed to a movable table 56 whose position can be adjusted in a horizontal plane.

The procedure for joining the optical element 50 to the substrate 55 is as follows. That is, 1) First, the rotation angle is adjusted using the fixed base 52 as the center axis α as the rotation axis, and the rotation angle is adjusted using the stage 53 as the center axis β as the rotation axis. The bonding surface of the element 50 and the bonding surface of the substrate 55 are set in parallel. 2) Next, the reference mark on the horizontal plane of the optical element 50 and the substrate 55 is aligned by moving the movable table 56 in the horizontal plane, and the position of the movable table 56 is set. 3) The optical element 50 whose inclination and reference position on the horizontal plane have been adjusted is moved downward by the vertical movement axis 57 and pressed against the substrate 55 by the heating source 58 via the heated and molten solder. To join.

[0004]

The above-described device bonding apparatus has the following problems. 1) When the optical element is joined via solder, if the solder cools and shrinks, the joining position of the optical element may be shifted. Therefore, the thickness of the solder needs to be as small as possible. However, when the thickness of the solder is reduced, the parallelism between the optical element and the substrate must be kept more strict. Therefore, it is necessary to strictly adjust the inclination of the bonding head, thereby improving the accuracy of the element bonding apparatus. And the skill of the worker was required. 2) In order to adjust the parallelism between the optical element and the substrate, the inclination of the joining head is adjusted and set in advance. However, if the joining operation is repeated, the inclination shifts, and the inclination often needs to be adjusted. Not efficient.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and comprises a mounting portion for mounting an element and a rotating shaft for supporting the mounting portion so that the orientation of the mounting portion can be freely changed. It is characterized by comprising a joining head and a movement axis for moving the joining head with respect to the surface to be joined of the element.

According to the element bonding apparatus having the above structure, the element mounted on the mounting portion comes into contact with the surface to be bonded by moving the bonding head in the direction of the surface to be bonded with the movement axis. Then, the orientation of the mounting portion is freely changed by the rotation axis, and the element surface surely becomes parallel to the surface to be joined, and the element adheres to the surface to be joined in a good state. Therefore, when performing the joining operation repeatedly using the element joining apparatus of the present invention,
Work for adjusting the inclination of the mounting portion in advance is not required, and work efficiency is improved.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1A and 1B are an explanatory cross-sectional view of a bonding head and a vertical cross-sectional view of an element bonding apparatus in an embodiment of the element bonding apparatus according to the present invention, respectively. In FIG. 1, a disc-shaped mounting portion 5 of an optical element 10 constituting the joining head 13 has a mounting surface 5
a rotating shaft 1 that is substantially parallel to a, and a ring-shaped holding member 4 that holds the rotating shaft 1 is also substantially parallel to the mounting surface 5a.
Further, a rotation shaft 2 orthogonal to the rotation shaft 1 is provided. The rotating shaft 2 is held by a ring-shaped holding member 3. Mounting part 5
Rotates freely around the intersection of the rotating shaft 1 and the rotating shaft 2. A ring-shaped holding member 3 for holding the rotating shaft 2
Are attached to two guide shafts 6 for guiding the holding member 3 in the vertical direction. An elastic member 9 (for example, a helical spring) is attached to the guide shaft 6. The elastic member 9 generates a pressure that urges the holding member 3 downward and in the direction of the substrate 11, urges the mounting portion 5 in the direction of the substrate 11, and generates a pressure necessary for joining the optical element 10 to the substrate 11. Occur. The joining head 13 is provided with a receiving member 8. The receiving member 8 positions and holds the holding member 3 and the mounting portion 5 urged downward at fixed positions. Further, a moving shaft 7 for moving the joining head 13 in a direction perpendicular to the surface of the table 12 holding the substrate 11 is provided above the joining head 13.

Next, the procedure for joining the optical elements according to the present embodiment will be explained with reference to FIG. In order to join the optical element 10 mounted on the mounting section 5 to the substrate 11 set on the table 12, the moving head 7 lowers the bonding head 13 toward the substrate 11. When the optical element 10 comes into contact with the substrate 11 and is pressed, the mounting section 5 on which the optical element 10 is mounted floats up from the receiving member 8, and when completely separated from the receiving member 8, the mounting section 5
Is tilted about the rotation axis 1 and the rotation axis 2, and the mounting surface 5 a follows the surface of the substrate 11, and the mounting portion 5, the optical element 10, and the substrate 1
1 is face-to-face and in close contact. Accordingly, regardless of the inclination of the surface of the substrate 11 set on the table 12, the optical element 10 is in parallel with and closely adheres to the substrate 11. At this time, if the elastic coefficient of the elastic member 9 is appropriately set, the optical element 1
0 can be pressed against the substrate 11 with an appropriate pressure, and the optical element 10 can be bonded to the substrate 11 in a good state by soldering or the like.

FIG. 3 is an explanatory partial plan view of a bonding head 21 according to another embodiment. In FIG. 3, the disc-shaped mounting portion 22 of the joining head 21, a torsion shaft portion 23 parallel to the surface of the mounting portion 22, a ring-shaped holding portion 24 of the torsion shaft portion 23, and a mounting portion 24 are provided. Torsion shaft 23 parallel to the surface
The torsion shaft portion 25 orthogonal to the axis and the ring-shaped holding portion 26 for holding the torsion shaft portion 25 are formed by integrally forming a stainless steel plate by wire cutting or the like. Other configurations, such as the attachment of the holding portion 26 to the guide shaft 6, are the same as those of the embodiment shown in FIG. In the present embodiment, when an element (not shown) mounted on the mounting portion 22 is pressed against a substrate (not shown), the torsion shaft 2
3, 25 are twisted by elastic deformation, the mounting portion 22 is freely tilted, and the mounting portion 22, the optical element, and the substrate are brought into close contact with each other. Note that, in the present embodiment, as the rotation mechanism of the mounting portion 22, elastic deformation is used instead of the mechanical rotation shaft of the above-described embodiment, and the mounting portion 22, the torsion shaft portion 23,
25, the holding parts 24 and 26 are integrally processed,
Unlike the embodiment shown in FIG. 1, assembly of these parts becomes unnecessary.

FIG. 4 is an explanatory longitudinal sectional view of a joining head 31 according to still another embodiment. In FIG. 4, a connecting portion 33 having a hemispherical portion at the tip is provided on the disc-shaped mounting portion 32 of the joining head 31 at a position substantially perpendicular to the mounting surface 32a above the position where the optical element 10 is mounted. Have been. The connecting portion 33 is fitted in a connecting portion 35 having a bowl-shaped portion provided on a disk-shaped holding member 34. Holding member 34
Are mounted on two guide shafts 6 that guide in a direction orthogonal to the mounting surface 32a of the mounting portion 32. An elastic member 9 that urges the holding member 34 downward and in the direction of the mounting portion 32 is attached to the guide shaft 6. A receiving member 8 for positioning and receiving the holding member 34 and the mounting portion 32 urged downward by the elastic member 9 at a predetermined position, and a moving shaft 7 for lowering the joining head 31 downward and in the direction of a substrate (not shown). The points provided are the same as those of the embodiment shown in FIG. In the present embodiment, since the hemispherical portion of the connecting portion 33 can freely rotate within the bowl-shaped portion of the connecting portion 35, the mounting surface 32a can freely move along the spherical surface around the hemispherical portion. The inclination can be changed. This is equivalent to having two orthogonal rotation axes that are orthogonal to the center of the hemispherical portion and that are substantially parallel to the substrate surface.

FIG. 5 is an explanatory longitudinal sectional view of a joining head 41 according to still another embodiment. In FIG. 5, the disc-shaped mounting portion 42 of the joining head 41 has a size sufficiently smaller than the area of the mounting surface 42a above the position where the optical element 10 is mounted, that is, in a direction substantially perpendicular to the mounting surface 42a. A constriction 43 having a circular cross section is provided. Also, the constricted portion 43
A disk-shaped holding section 44 is provided on the side opposite to the mounting section 42. The holding section 44 is mounted on the mounting surface 42 of the mounting section 42.
It is attached to two guide shafts 6 that guide in a direction orthogonal to a. The guide shaft 6 is provided with an elastic member 9 for urging the holding section 44 downward, that is, in the direction of the mounting section 42. The holding portion 44 and the mounting portion 4 urged downward.
1 is similar to the embodiment shown in FIG. 1 in that a receiving member 8 for positioning and receiving the fixing member 2 at a fixed position and a moving shaft 7 for lowering the joining head 41 in a direction of a substrate (not shown) are provided. It is. In the present embodiment, the mounting surface 42
a can be freely changed in inclination along a spherical surface around a point on the central axis of the constricted portion 43. This is equivalent to having two rotation axes orthogonal to the central axis of the constricted portion 43 and substantially parallel to and orthogonal to the substrate surface. In the present embodiment, elastic deformation is used instead of a mechanical rotation shaft as a rotation mechanism of the mounting portion 42 so that the mounting portion 42, the constricted portion 43, and the holding portion 44 are integrated. Since it is processed, assembly of members as in the embodiment shown in FIG. 1 becomes unnecessary.

[0012]

As described above, according to the present invention, a joining head including a mounting portion for mounting an element and a rotating shaft for supporting the mounting portion so that the orientation of the mounting portion can be freely changed is provided. Since it consists of a moving axis that moves the element against the surface to be joined, the surface of the element mounted on the mounting part can be securely adhered to the surface to be joined, and can be joined to the surface to be joined in good condition. There is an excellent effect that can be. In addition, when the joining operation is repeatedly performed, there is no need to adjust the inclination of the mounting portion in advance, and there is an effect that the operation efficiency is improved.

[Brief description of the drawings]

FIGS. 1A and 1B are a cross-sectional explanatory view of a bonding head and a vertical cross-sectional view of an element bonding apparatus in an embodiment of an element bonding apparatus according to the present invention, respectively.

FIG. 2 is a view for explaining a procedure for joining the optical elements according to the present embodiment shown in FIG. 1;

FIG. 3 is an explanatory partial plan view of a bonding head according to another embodiment of the present invention.

FIG. 4 is an explanatory longitudinal sectional view of a joining head according to another embodiment of the present invention.

FIG. 5 is an explanatory longitudinal sectional view of a joining head according to still another embodiment of the present invention.

FIG. 6 is a conceptual explanatory view of a conventional device bonding apparatus.

[Explanation of symbols]

 1, 2 rotating shaft 3, 4, 34 holding member 5, 22, 32, 42 mounting portion 5a, 32a, 42a mounting surface 6 guide shaft 7 moving shaft 8 receiving member 9 elastic member 10 optical element 11 substrate 12 table 13, 21, 31, 41 Joining head 23, 25 Torsion shaft part 24, 26, 44 Holding part 33, 35 Connecting part 43 Constriction part

Claims (6)

[Claims] 1. A joining head comprising a mounting portion for mounting an element and a rotating shaft for supporting the mounting portion so that the orientation of the mounting portion can be freely changed, and a movement for moving the bonding head with respect to a surface to be bonded of the element. An element bonding apparatus comprising a shaft. 2. The joining head according to claim 1, wherein the mounting portion, a first rotary shaft provided on the mounting portion, and positioned on an extension of a center line of the mounting portion, rotate the first rotary shaft. A first holding member that freely supports the first holding member;
A second rotating shaft positioned on an extension of a center line orthogonal to the rotating shaft, and a second holding member rotatably holding the second rotating shaft. The second holding member is attached to the moving shaft. An element bonding apparatus, comprising: 3. The bonding head according to claim 2, wherein
A first rotating shaft provided on the mounting portion, a first holding member supporting the first rotating shaft, a second rotating shaft provided on the first holding member,
An element joining device, wherein a second holding member that supports a second rotating shaft is integrally formed of an elastic material. 4. The joining head according to claim 1, comprising a mounting portion, a sphere provided at the center of the back surface of the mounting portion, and a holding member formed of a spherical surface rotatably supporting the sphere. Characteristic device bonding device. 5. The element joining device according to claim 1, wherein the joining head comprises a mounting portion, an elastic member provided at the center of the back surface of the mounting portion, and a holding member for supporting the elastic member. apparatus. 6. The element joining element according to claim 1, wherein the joining head and the moving shaft are attached via an elastic body.