JP2009121868A - Ic handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC handler having a flatness adjusting part, capable of facilitating the flatness adjustment of a signal connecting part and a pressing part that can concurrently serve for horizontal connection and vertical connection to a semiconductor testing apparatus, without having to alter its constitution. <P>SOLUTION: The IC handler has the flush surface adjusting part for adjusting the flatness between the signal connecting part, at which a semiconductor device to be tested is electrically connected to the semiconductor testing apparatus and the pressing part for pressing the semiconductor device into contact with the signal connecting part. The flush surface adjusting part includes a first adjusting ring for adjustments, in an α direction for rotating about an A-axis; a second adjusting ring, arranged concentrically with the first adjusting ring and connected by a trunnion structure for adjustments, in a β direction rotating on a B-axis which intersects with the A-axis at right angles; and a fixed ring connected to either the first adjusting ring or the second adjusting ring by trunnions. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC handler that transports a semiconductor device such as an IC (Integrated Circuit), and in particular, a signal connection portion that is electrically connected to a semiconductor test apparatus, and a pressing portion that presses and contacts the semiconductor device to the signal connection portion. In particular, the present invention relates to an IC handler having a surface-fitting adjustment unit that makes it easy to adjust the flatness of the semiconductor device and allows both horizontal connection and vertical connection with a semiconductor test apparatus without changing the configuration.

  The IC handler includes a TAB (Tape Automated Bonding) handler, a horizontal transfer type (P & P) handler, a gravity drop type (Gravity) handler, and the like. The TAB handler is mainly used when testing a liquid crystal driver IC. The liquid crystal driver IC is handled in a state where it is mounted on a tape called TCP (Tape Carrier Package) or COF (Chip on Film). The TAB handler transports such a tape-like semiconductor device to a signal connection portion that is electrically connected to the semiconductor test apparatus.

  Further, the horizontal transfer handler sucks the packaged semiconductor device and transfers it to a socket which is a signal connection portion with the semiconductor test apparatus. The self-weight drop handler transfers the semiconductor device through a storage container such as a tube or a magazine to a signal connection unit that is electrically connected to the semiconductor test apparatus.

  As described above, the IC handler is a system for transporting a semiconductor device to be tested to a signal connection unit with a semiconductor test apparatus. The IC handler includes a contact head (pressing unit) that presses and contacts the conveyed semiconductor device to the signal connection unit. In general, a probe card is used for a TAB handler, and a socket is used for a horizontal transfer handler or a self-falling handler.

  When the IC handler is introduced, the flatness of the signal connecting portion and the pressing portion is adjusted (hereinafter referred to as surface copying adjustment). This is performed in order to accurately bring the semiconductor device under test into contact with the signal connection portion. If the surface tracking adjustment is not performed well, contact failure between the semiconductor device and the signal connection portion or damage to the semiconductor device may occur.

  Prior art documents related to the conventional IC handler include the following.

JP 2007-071807 A

  FIG. 2 is a structural block diagram showing such a TAB handler. In FIG. 2, a large number of semiconductor devices 1 are formed at equal intervals on a TAB tape. The supply reel 2 a and the accommodation reel 2 b are reels around which the semiconductor device 1 is wound. The pusher (pressing part) 3 is located immediately above the tape of the semiconductor device 1 and moves up and down.

  The probe card (signal connection portion) 4 includes terminals for making contact with the pads of the semiconductor device 1 formed on the TAB tape. The surface copying adjusting unit 5 has a ring shape, and the terminal portion of the probe card 4 protrudes from the ring of the ring. The attachment unit 6 is between the test head 200 of the semiconductor test apparatus and the probe card 4 and electrically connects both.

  The supply reel 2 a, the receiving reel 2 b, the pusher 3, and the surface copying adjustment unit 5 constitute a TAB handler 100.

  The operation of the TAB handler shown in FIG. 2 will be described. The TAB tape on which the semiconductor device 1 is formed is wound around the supply reel 2a in advance. Before starting the test of the semiconductor device 1, the supply reel 2a is set in the TAB handler 100, the TAB tape is pulled out from the supply reel 2a, passed under the pusher 3, and set so as to be wound around the accommodation reel 2b. .

  The test is started in this state. When the semiconductor device 1 comes under the pusher 3, the pusher 3 is lowered and presses the TAB tape against the terminal of the probe card 4 from above. As a result, the pads of the semiconductor device 1 formed on the back surface of the TAB tape come into contact with the terminals of the probe card 4.

  Then, a test signal is output from the test head 200 of the semiconductor test apparatus and applied to the semiconductor device 1 via the attachment unit 6 and the probe card 4. The semiconductor device 1 receives this test signal and outputs a signal. An output signal from the semiconductor device 1 is input to the test head 200 via the probe card 4 and the attachment unit 6. In the semiconductor test apparatus, the output signal from the semiconductor device 1 is compared with an expected value pattern to determine pass / fail.

  As described above, the surface scanning adjustment unit according to the present invention is on the IC handler side, and is in the connection portion between the IC handler and the test head of the semiconductor test apparatus.

  FIG. 3 is a block diagram showing such a conventional surface copying adjustment unit. The ring 10 is a ring in contact with a signal connection portion with a semiconductor test apparatus, and is set so that a terminal or a socket on the signal connection portion appears in the ring from under the ring. The ring 11 has the same center as the ring 10 and has a larger radius than the ring 10 and has a recessed portion along the inner periphery, and the ring 10 is placed on the recessed portion.

  The plunger 12 has four locations on the ring 11 and has a function of adjusting the flatness of the ring 11 and fixing the ring 11. The bearing 13 is provided at four places like the plunger 12 and has a function of rotating the ring 11 in the θ direction (clockwise direction about the center of the ring in the direction perpendicular to the paper surface). The locking mechanism 14 has four positions on the ring 11 like the plunger 12 and has a function of fixing the ring 11.

  The ring 10, the ring 11, the plunger 12, the bearing 13, and the lock mechanism 14 constitute a surface following adjustment unit 50.

  A procedure for performing surface copying adjustment using the surface copying adjustment unit shown in FIG. 3 will be described. First, the screws of the four plungers 12 on the ring 11 are taken in and out to adjust the α direction that rotates about the A axis and the β direction that rotates about the B axis orthogonal to the A axis.

  Then, the θ direction rotating around the centers of the ring 10 and the ring 11 is adjusted, and the ring 11 is fixed by the lock mechanism 14.

  Actually, after adjusting the α direction and the β direction, the θ direction is adjusted, and a deviation in flatness between the α direction and the β direction is confirmed. When the deviation is confirmed, the surface scanning adjustment in the α direction and the β direction is performed again, and the θ direction is confirmed to perform positioning.

  In the conventional example shown in FIG. 3, both the surface copying adjustment in the α direction and the β direction and the adjustment in the θ direction are performed by the surface copying adjustment unit 50. There was a problem that the adjustment of the direction was repeated and the adjustment took time.

  In FIG. 2, the connection to the test head of the semiconductor test apparatus is performed in a horizontal connection, but depending on the form of the IC handler, there may be a vertical connection. If the conventional surface-fitting adjustment unit shown in FIG. 3 is used in a vertical connection, there is a possibility that the ring 11 will fall off the bearing 13 and fall because there is a gap between the ring 11 and the bearing 13 for adjusting the θ direction. There was a problem that adjustment was very difficult.

For this reason, conventionally, since the horizontal connection and the vertical connection of the surface copying adjustment unit cannot be used together, it is necessary to prepare two types of a surface copying adjustment unit for horizontal connection and a surface copying adjustment unit for vertical connection.
Therefore, the problem to be solved by the present invention is to facilitate the adjustment of the flatness between the signal connection part electrically connected to the semiconductor test apparatus and the pressing part that presses and contacts the semiconductor device against the signal connection part. It is to realize an IC handler having a surface copying adjustment unit that can be used for both horizontal connection and vertical connection with a semiconductor test apparatus without changing the above.

In order to achieve such a problem, the invention according to claim 1 of the present invention is:
An IC having a surface tracking adjustment unit that adjusts the flatness of a signal connection unit in which a semiconductor device to be tested is electrically connected to a semiconductor test apparatus and a pressing unit that presses and contacts the semiconductor device to the signal connection unit In the handler, the surface scanning adjustment unit is arranged concentrically with the first adjustment ring that adjusts in the α direction that rotates about the A axis, and is connected in a trunnion structure, A second adjustment ring that adjusts in the β direction that rotates about a B-axis orthogonal to the A-axis, and a fixed ring that is trunnion-connected to either the first adjustment ring or the second adjustment ring It is characterized by comprising.

The invention according to claim 2
The IC handler according to claim 1, wherein
A plunger is used to adjust or lock the first adjustment ring or the second adjustment ring.

The invention described in claim 3
The IC handler according to claim 1, wherein
A common plunger is used for adjusting and locking the first adjusting ring or the second adjusting ring.

The invention according to claim 4
In the IC handler according to claim 2 or claim 3,
The plunger is provided at a position rotated 90 degrees with respect to a pin forming a trunnion structure of each ring.

The invention according to claim 5
In the IC handler according to any one of claims 1 to 4,
The surface scanning adjustment unit is used for both horizontal connection and vertical connection in connection with the semiconductor test apparatus.

The invention described in claim 6
In the IC handler according to any one of claims 1 to 5,
The first adjustment ring, the second adjustment ring, and the fixing ring have an elliptical shape or a polygonal shape.

The present invention has the following effects.
According to the first to sixth aspects of the present invention, the surface scanning adjustment unit is arranged in a concentric manner with the first adjustment ring that performs adjustment in the α direction that rotates about the A axis, and the first adjustment ring. And a second adjustment ring connected in a trunnion structure and rotating in the β direction that rotates about the B axis orthogonal to the A axis, and either the first adjustment ring or the second adjustment ring By providing a trunnion-connected fixing ring, the α-direction flatness and β-direction flatness can be adjusted independently, so that the signal connection is electrically connected to the semiconductor test equipment. This makes it easy to adjust the flatness of the portion and the pressing portion that makes the semiconductor device press against and contact the signal connecting portion, and enables both horizontal connection and vertical connection with the semiconductor test apparatus without changing the configuration.

  Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of a surface copying adjusting unit according to the present invention.

  In FIG. 1, the α-plane adjusting ring 20 is a ring that rotates about the A axis, and a signal connection portion with the semiconductor test apparatus is in contact, and a terminal or socket on the signal connection portion appears in the ring from under the ring. Is set as The β-plane adjusting ring 21 is a ring that rotates about a B-axis that is orthogonal to the A-axis, has the same center as the α-plane adjusting ring 20, has a larger radius than the α-plane adjusting ring 20, and is concentric with the α-plane adjusting ring 20. Placed in. Similarly, the fixing ring 22 has the same center as the β-plane adjustment ring 21, has a larger radius than the β-plane adjustment ring 21, and is arranged concentrically with the β-plane adjustment ring 21.

  The α surface adjustment mechanism 23 is fixed to the α surface adjustment ring 20, and the α surface plunger 23 a has a function of adjusting and locking the flatness of the α surface adjustment ring 20. The β surface adjusting mechanism 24 is fixed to the fixing ring 22, and the β surface plunger 24 a has a function of adjusting and locking the flatness of the β surface adjusting ring 21.

  There are two pins 25 on the A-axis, and as shown in FIG. 1, the α-plane adjusting ring 20 and the β-plane adjusting ring 21 are connected by a trunnion structure. The trunnion structure refers to a structure that supports two places with pins or the like in this way. The α-plane adjusting mechanism 23 is provided at a position rotated 90 degrees with respect to the pin 25.

  Similarly, there are two pins 26 on the B-axis, and as shown in FIG. 1, the β-plane adjusting ring 21 and the fixing ring 22 are connected by a trunnion structure. The β plane adjusting mechanism 24 is provided at a position rotated 90 degrees with respect to the pin 26.

  The α surface adjustment ring 20, the β surface adjustment ring 21, the fixing ring 22, the α surface adjustment mechanism 23, the α surface plunger 23 a, the β surface adjustment mechanism 24, the β surface plunger 24 a, the pin 25, and the pin 26 form the surface tracking adjustment unit 51. It is composed.

  Similar to the conventional example, the surface scanning adjustment unit 51 is used in, for example, the surface copying adjustment unit 5 of the TAB handler, the horizontal conveyance handler, or the self-falling handler shown in FIG.

  A procedure for performing surface copying adjustment using the surface copying adjustment unit shown in FIG. 1 will be described. First, by adjusting the α-plane plunger 23a of the α-plane adjusting mechanism 23, the flatness in the α direction that rotates about the A axis is adjusted. After adjusting the α-plane plunger 23a, the α-plane adjustment ring 20 is fixed using a lock nut.

  Then, by adjusting the β-plane plunger 24a of the β-plane adjusting mechanism 24, the flatness in the β direction that rotates about the B axis is adjusted. After adjusting the β-plane plunger 24a, the β-plane adjusting ring 21 is fixed using a lock nut.

  As a result, the α plane adjustment ring 20 and the β plane adjustment ring 21 are connected by a trunnion structure, and the β plane adjustment ring 21 and the fixing ring 22 are connected by a trunnion structure, thereby adjusting the flatness in the α direction. Since the flatness in the β direction can be adjusted by the β-plane adjusting ring 21 with the ring 20, the signal connection portion electrically connected to the semiconductor test apparatus and the semiconductor device are pressed against the signal connection portion to make contact It becomes possible to easily adjust the flatness with the pressing portion to be made.

  In addition, the surface scanning adjustment unit 51 is not a structure in which a ring is supported using a bearing as in the conventional example, but an α surface adjustment ring 20, a β surface adjustment ring 21, and a β surface adjustment ring 21 with two trunnion structures. And the fixing ring 22 are connected to each other, so that the ring does not fall off during vertical connection. Therefore, the horizontal connection and the vertical connection with the semiconductor test apparatus can be used without changing the configuration.

  In addition, horizontal transport handlers and self-fall handlers are becoming multi-site, which simultaneously measures multiple semiconductor devices under test. Contact heads (pressing parts) and sockets (signal connection parts) are also being developed. Several have been installed. Even in such a case, it is possible to easily adjust the flatness of the signal connection portion and the pressing portion by using the surface copying adjustment portion of the present invention.

  Furthermore, by using the surface scanning adjustment unit of the present invention, the surface scanning adjustment function is not required for the pressing unit, and the adjustment function for the X, Y, θ direction and the adjustment corresponding to the variation in the height of the IC socket is applied to the pressing unit. Providing a function makes it possible to achieve reliable contact.

  In the embodiment shown in FIG. 1, the plunger 23a and the plunger 24a are used for both adjustment and locking. However, it is not always necessary to do this, and the plunger may be divided for adjustment and locking. Further, adjustment or locking may be performed using something other than the plunger.

  In addition, a surface copying adjustment method using the surface copying adjustment unit of the present invention will be described. Attach a flatness adjustment jig with pins on the pressing part side, and attach a dummy board with pin insertion holes on the signal connection part side. Then, the pressing part is slowly lowered toward the signal connection part, and the pin of the flatness adjusting jig is inserted into the pin insertion hole of the dummy board.

  In this state, the surface copying adjustment can be performed by locking the plunger 23a and the plunger 24a of the surface copying adjustment unit 51, and adjustment is possible even if the person is not an expert.

  Further, in the embodiment shown in FIG. 1, the α-plane adjusting ring 20, the β-plane adjusting ring 21 and the fixing ring 22 have a circular shape. It may be a polygon.

It is a block diagram which shows one Example of the surface copying adjustment part which concerns on this invention. It is a block diagram which shows the handler for TAB. It is a block diagram which shows the conventional surface copying adjustment part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2a Supply reel 2b Housing reel 3 Pusher (pressing part)
4 Probe card (signal connection part)
5 Surface scanning adjustment unit 6 Attachment unit 10, 11 Ring 12 Plunger 13 Bearing 14 Lock mechanism 20 α surface adjustment ring 21 β surface adjustment ring 22 Fixed ring 23 α surface adjustment mechanism 23a, 24a Plunger 24 β surface adjustment mechanism 25, 26 Pin 50, 51 Surface scanning adjustment unit 100 TAB handler 200 Test head

Claims (6)

An IC having a surface tracking adjustment unit that adjusts the flatness of a signal connection unit in which a semiconductor device to be tested is electrically connected to a semiconductor test apparatus and a pressing unit that presses and contacts the semiconductor device to the signal connection unit In the handler
The surface copying adjustment unit is
A first adjustment ring for adjusting in the α direction rotating about the A axis;
A second adjustment ring that is arranged concentrically with the first adjustment ring and is connected in a trunnion structure and that adjusts in the β direction that rotates about the B axis orthogonal to the A axis;
An IC handler, comprising: a fixing ring that is trunnion-connected to one of the first adjustment ring and the second adjustment ring.   2. The IC handler according to claim 1, wherein a plunger is used to adjust or lock the first adjustment ring or the second adjustment ring.   2. The IC handler according to claim 1, wherein a common plunger is used for adjusting and locking the first adjusting ring or the second adjusting ring. The plunger is
4. The IC handler according to claim 2, wherein the IC handler is provided at a position rotated by 90 degrees with respect to a pin forming a trunnion structure of each ring. The surface copying adjustment unit is
5. The IC handler according to claim 1, wherein the IC handler is used for both horizontal connection and vertical connection in connection with the semiconductor test apparatus. The shapes of the first adjustment ring, the second adjustment ring and the fixing ring are as follows:
6. The IC handler according to claim 1, wherein the IC handler is elliptical or polygonal.

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