JPH1051263A - Crystal vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal vibrator, consisting of crystal vibrator bars arranged horizontally which is free from its deformation, etc., caused by the difference in the coefficients of thermal expansion and can improve its reliability by supporting each vibrator bar only at one of its both ends while the other end is kept free. SOLUTION: Every crystal vibrator bar 27 is set almost horizontally, and one of both ends of the bar 27 is not fixed and kept free and put on an inner lead 26b of a lead wire 25b. Then the bar 27 is fixed at one of its both ends and at the side of a lead wire 25a with the other end kept free. Thus, the bar 27 can absorb vibrations and therefore causes no distortions, etc. Furthermore, the bar 27 is directly fixed to a hermetic base 21 and an inner lead 26a, and the diameter of a through-hole 23 is larger than the diameters of both leads 26a and 26b. Thus, the dielectric strength of the bar 27 is secured, despite the reduction of the distance between the leads 26a and 26b and the hermetic base 21 respectively. As a result, the height of the bar 27 can be reduced, and therefore the overall height of the crystal vibrator can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal resonator.

[0002]

2. Description of the Related Art In general, a quartz oscillator is used for generating an electrical reference frequency and selecting an electric frequency by combining it with an electric circuit by utilizing its inherent mechanical vibration and the piezoelectric effect and inverse piezoelectric effect of quartz. Have been.

As shown in FIG. 21, a conventional crystal unit has a stepped conductive material provided on the inner lead side of two lead wires 3 penetrating two through holes 2 in a metal base 1. A crystal resonator element 5 is attached via a holding member 4 and hermetically sealed with a metal cap 6. Here, the base including the base 1, the lead wires 3 and the glass 9 is generically called a hermetic base 15. In this case, the base 1 is formed in a shape integrally having a flange portion 1a having a projection 8 formed over the entire circumference. The flange 1a of the base 1 and the flange 6a of the cap 6 are brought into contact with each other.
As shown in the figure, the flange portion 6a of the cap 6 and the flange portion 1a of the base 1 are pressed by a resistance welding device 7 having an upper electrode 7A and a lower electrode 7B under a pressure of, for example, about 200 kg.
And the projections 8 are joined by resistance welding to hermetically seal the crystal resonator element 5.

The lead wire 3 is fixed in the through hole 2 of the base 1 by glass fusion so as to insulate it from the base 1. The base 1 is formed of iron (SPCC; cold-rolled steel plate) or 42 alloy. The lead wire 3 is made of, for example, Kovar (Fe
-Ni-Co alloy) or an FeNi alloy. The crystal resonator element 5 is mounted and fixed on the holding member 4 by the conductive adhesive 10.

[0005] Such a crystal resonator 11 is mounted on a printed wiring board. For example, when mounting the crystal unit 11 on a double-sided printed wiring board having a wiring pattern on both sides, since the base 1 is made of metal, it is necessary to provide an insulating sheet on the back surface of the base 1 so as not to short-circuit to the wiring pattern. Alternatively, when a bent portion is provided in the middle of the lead wire 3 and the lead wire 3 is inserted into the lead insertion hole of the printed wiring board, the lead 3 is stopped at the bent portion and the base 1 is lifted from the printed wiring board. I have.

The manufacturing process of the crystal unit 11 is as follows.
The lead wire 3 is fused to the base 1 by glass to form a hermetic base 15, and the crystal resonator element 5 is placed and fixed on the holding member 4 integrated with the lead 3, and the frequency of the crystal resonator element 5 is changed. After the adjustment, the hermetic base 15 and the cap 6 are hermetically sealed by resistance welding.

At the time of this resistance welding, the hermetic base 15
And a cap 6 covering the entire periphery of the flange portion 1a
A large pressure of, for example, about 200 kg is applied to the flange portion 6a, and the protrusion 8 of the flange portion 1a is crushed over the entire circumference. In this case, the quartz oscillator piece 5 already integrated with the hermetic base 15 is unnecessary. Strong force acts, and the frequency fluctuates. The hermetic base 15 is not ideally flat in the manufacturing process, but is warped.

Therefore, for example, when the hermetic base 15 is warped such that both ends face downward as shown by reference numeral 13 in FIG. When the hermetic base 15 is warped such that both ends face upward as indicated by reference numeral 14,
An inward force b acts on the quartz-crystal vibrating piece 5, which causes the frequency of the quartz-crystal vibrating piece 5 to fluctuate. Since the frequency of the quartz oscillator piece 5 is set on the order of ppm, the preset frequency may fluctuate even by the action of the slight force a or b, and the quality may be varied.

Further, there is a difference in thermal expansion between the iron constituting the base 1 and the quartz constituting the quartz oscillator piece 5. The coefficient of thermal expansion of iron is 15 × 10 ⁻⁶ , and the coefficient of thermal expansion of quartz is 7.5 × 10 ^{−6 in} the direction parallel to the axis and 13.7 × 10 ⁻⁶ in the direction perpendicular to the axis. As described above, since the thermal expansion coefficients of the base 1 and the crystal resonator element 5 are different from each other, a stress due to strain is applied to the crystal resonator element 5 due to a change in temperature, and a preset frequency fluctuates. .

In FIG. 21, the support member 4 is
Although it has some elasticity by being integrated with the lead wire 3 and having a step-like shape, since the upper part of the lead wire 3 is formed as the support member 4, the selectivity of the material is limited. As a result, the elasticity required for the support member, that is, the elasticity that can follow the vibration of the crystal unit 5 cannot be obtained. Here, for example, as shown in FIG. 23, the step-shaped portion may be partially formed to have a hollow 4a to provide some elasticity, but it is still not possible to obtain the elasticity required as a support member.

Therefore, as shown in FIGS. 24A and 24B, the shape of the vicinity of the supporting member is shown. In order to freely select the material of the supporting member 4 and to increase the elasticity of the supporting member, the upper end of the lead wire 3 is formed. A configuration has been conceived in which 3t is formed widely and an elastic supporting member 4 is fixed on the upper end 3t. FIG. 24A shows a case in which the supporting member 4 has a stepped shape, and mainly absorbs vibration in the vertical direction. Low horizontal vibration absorption. FIG. 24B shows a case where the supporting member 4 has a slope 4r in the middle of the stairs, and absorbs vertical vibration and horizontal vibration.

[0012]

However, even with such measures, it is not possible to solve all of the above-mentioned problems (characteristic abnormality due to difference in thermal expansion coefficient, oscillation failure due to impact at the time of drop), and frequency Fluctuation cannot be prevented.

In order to solve the above-mentioned problems, the present invention provides a crystal resonator which is free from stress applied to a crystal resonator piece and thus has no frequency fluctuation and can be made more compact. It is.

[0014]

According to a first aspect of the present invention, there is provided a crystal resonator having a horizontal arrangement of crystal units, wherein the crystal unit is supported at only one end and the other end is in a free state. It is.

According to a second aspect of the present invention, there is provided a crystal resonator having a pair of inner leads penetrating a base in an insulated state from the base and having a crystal resonator element arranged horizontally. One end of the piece is fixed to one inner lead and a portion of the base on the one inner lead side, one electrode of the crystal resonator piece is connected to one inner lead, and the other electrode is connected to the base. The base and the cap are sealed, and the outer surfaces of the base and the cap are partially or entirely insulated.

According to a third aspect of the present invention, there is provided a crystal resonator having a pair of inner leads which penetrate a base in an insulated state from the base and having a crystal resonator element arranged horizontally. One end of the piece is fixed to one inner lead and one portion of the auxiliary conductive member on the base on the inner lead side via an insulating member, and one electrode of the crystal resonator piece is Conducted to the inner lead, the other electrode conducted to the other inner lead via the auxiliary conductive member,
A configuration in which a cap is sealed to a base is adopted.

According to a fourth aspect of the present invention, there is provided a quartz oscillator having a pair of inner leads penetrating a base in an insulated state with the base and having a pair of quartz oscillator pieces arranged horizontally. Both ends of the crystal resonator element are electrically connected to each other by a conductive adhesive having elasticity and mechanically fixed on the lead.

According to the first aspect of the present invention, the laterally disposed quartz-crystal vibrating piece is supported only at one end thereof, and the other end is in a free state. Variations in the frequency of the crystal unit during the manufacturing process can be eliminated.

According to the second aspect of the present invention, one end of the quartz-crystal vibrating piece is fixed to one of the inner leads and the portion of the base on the side of the one of the inner leads. The other end is in a free state, and the variation in the frequency of the crystal resonator in the manufacturing process due to the warpage and distortion of the base can be eliminated as in the first aspect of the present invention. Then, since one electrode of the crystal resonator piece is electrically connected to one inner lead and the other electrode is electrically connected to the other inner lead via the base, one of the two electrodes of the crystal resonator is Directly, the other is connected to the inner lead via the base. Furthermore, since the inner leads penetrate the base in a state insulated from the base, and the outer surfaces of the base and the cap are insulated and coated, a circuit board connected to the inner leads and the outside of the crystal unit is provided, Insulation is provided.

According to the third aspect of the present invention, one end of the quartz-crystal vibrating piece is connected to one inner lead and one inner lead side of the auxiliary conductive member disposed on the base via an insulating member. And the other end of the crystal resonator element is in a free state, and the frequency of the crystal resonator in the manufacturing process caused by the warpage and distortion of the base as in the first invention. Fluctuations can be eliminated. Then, since one electrode of the crystal oscillator piece is electrically connected to one inner lead and the other electrode is electrically connected to the other inner lead via the auxiliary conductive member, each of the two electrodes of the crystal oscillator is electrically connected to one of the electrodes. Is conducted directly to the inner lead via the auxiliary conductive member.

According to the fourth aspect of the present invention, since both ends of the crystal resonator element are fixed to the pair of inner leads by the elastic conductive adhesive, the stress is absorbed by the elasticity of the adhesive. As a result, it is possible to eliminate the fluctuation of the frequency of the crystal oscillator in the manufacturing process due to the warpage and distortion of the base. Since the adhesive has conductivity, conduction between the crystal resonator element and the inner lead is achieved.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION A quartz resonator according to the present invention has a quartz resonator piece supported at one end only and one end supported for the purpose of preventing distortion and deformation during a manufacturing process and enabling absorption of vibration. Is a free state. Hereinafter, embodiments of the crystal unit according to the present invention will be described with reference to the drawings.

FIG. 1 shows an example of the present invention (hereinafter referred to as Example 1). 1 is a plan view showing a partial cross section, FIG. 2 is a cross sectional view on a vertical plane including a lead wire, and FIG. 3 is a cross sectional view of FIG. 1 to 3, reference numeral 21 denotes a conductive base made of metal, for example, iron or a 42 alloy. The base 21 is provided with a flange portion 2 having a predetermined length so as to extend integrally therewith from the rear surface of the base over the entire circumference.
2 are formed. Two lead wires 25 (25a, 25b) made of Kovar (Fe—Ni—Co alloy), nickel, or the like are inserted into two through holes 23 provided in the base 21 through glass (soft glass or hard glass) 24. ) Is penetrated and fused with glass to form a lead wire 25 and a base 21.
Are hermetically insulated and fixed to form a so-called hermetic base.

In this embodiment, in particular, the laterally arranged quartz resonator element 27 is supported only at one end, and the other end is free to be fixed. That is, the inner lead (head) 26a of one lead wire 25a and the base 21
One end of the crystal resonator element 27 is mounted and fixed to the part on the side of the inner lead 25a (see FIGS. 1, 2, 6, and 7) via a conductive adhesive 28.

The quartz-crystal vibrating piece 27 is arranged substantially horizontally, that is, in a horizontal manner, and the other end of the quartz-crystal vibrating piece 27 is fixed to the inner lead (head) of the other lead wire 25b in a free state. ) 26b.

Incidentally, as shown in FIG.
The heads 6a and 26b are formed by header processing so as to have an area larger than the cross-sectional area of the lead wire 25 (25a, 25b). In addition, lead wire 25 (2
5a, 25b), the width of the glass-welded portion, that is, the diameter D of the through hole 23 is made larger than the diameter d of the inner leads (heads) 26a, 26b.

As shown in FIGS. 5A and 5B, the upper surface electrode 27
a, a lower surface electrode 27b is formed on the lower surface. Upper electrode 27
a has a lead portion 27a ₁ in the central end, as shown in FIG. 6, the inner lead 26a of one lead wire 25a
And so as to connect between one end of the crystal oscillator piece 27, via the lead portion 27a ₁ and the conductive adhesive 28,
It is electrically and mechanically connected to the inner lead 26a. On the other hand, the lower surface electrode 27b is provided with the leading portion 2 on both sides.
7b ₁ , 27b ₂ , and electrically and mechanically through the lead-out portions 27b ₁ , 27b ₂ and the conductive adhesive 28 to the base 21 on both sides of the through hole 23 through which the inner lead 26a passes. It is fixed (see FIGS. 1 and 7). That is, the quartz-crystal vibrating piece 27 is fixed by the conductive adhesive 28 at three places on one end side.

Further, the inner lead (head) 26b of the other lead wire 25b and the base 21 outside the through hole around the lead wire 25b are electrically connected via the conductive adhesive 28. It is connected to the. Thereby, the base 2
1 acts as an element of the electrical circuit configuration, and the lower surface electrode 27b of the crystal resonator element 27 conducts to the other inner lead 26b through the base 21. The other lead wire 25b, the inner lead 26b and the conductive adhesive 28 thereon, and the upper electrode 27a of the crystal unit 27
And the lower electrode 27b so as not to directly touch the lower electrode 27b.
The ends of a and 27b are retracted from the inner leads 26b and the conductive adhesive 28. This conductive adhesive 28
For example, a silver-epoxy conductive adhesive can be used.

Then, a metal such as iron or nickel silver (Cu-Ni-Zn alloy) is formed so as to cover the quartz oscillator piece 27.
A cap 29 integrally having a flange portion 30 corresponding to the flange portion 22 of the base is arranged, the base 21 and the cap 29 are joined, and the outer surfaces of the base 21 and the cap 29 are further insulated. A target crystal resonator 32 is formed by insulatingly coating the coating material 31. An inert gas such as a nitrogen gas is sealed in a container including the base 21 and the cap 29.

The insulating coating material 31 can be formed, for example, by coating with a heat-shrinkable tube or the like, or by applying a powder coating such as epoxy.

According to the present embodiment, the quartz resonator element 27 arranged horizontally is fixed at one end on one lead wire 25a side and the other end is free, so that vibration can be absorbed. There is no distortion or the like of the crystal resonator element 27. Therefore, it is possible to prevent a change in the frequency of the crystal resonator element 27 in the manufacturing process.

The quartz-crystal vibrating piece 27 is directly fixed to the base 21 and the inner lead 26a without a support member, and the diameter D of the through hole 23 is equal to the diameter of the inner lead (head) 26a, 26b. Since the diameter is wider than the diameter d, the withstand voltage is reliably maintained even when the distance l between the inner leads (heads) 26a and 26b and the hermetic base is shortened. The height of the entire crystal unit 32 can be reduced, and the number of components can be reduced.

Further, when the support member 4 is used as shown in FIGS. 23 and 24, it is necessary to adjust the direction of the support member so as to be exactly straight. Quartz vibrator piece 2 directly on inner lead 26a
Since the inner lead 7 is fixed, the inner lead 26a has no directionality, and the adjustment of the direction is not required, so that the manufacturing process of the crystal unit is simplified.

Further, since a part or the whole of the crystal unit 32 is insulated and coated with the insulating covering material 31, the crystal unit 32 can be directly mounted when mounted on a circuit board.

As shown in FIG. 8, which is a cross-sectional view of a main part of the quartz oscillator 32, the other end of the quartz oscillator piece 27 in a free state may be floated from an inner lead 26b below it. it can. By doing so, the crystal resonator element 2
Even if the vibrator 7 vibrates greatly, the vibrator 7 does not hit the inner lead 26b, and it is possible to prevent the crystal vibrator piece 27 from being distorted due to the collision. Therefore, it is suitable when the frequency is required to be particularly high precision.

9 to 11 show another embodiment of the present invention (hereinafter, referred to as Embodiment 2). 9 to 11, parts corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description is omitted. In this example, the quartz oscillator 3 of the first embodiment is used.
2, an insulating sheet 4 is further provided on the surface in contact with the circuit board.
1, a groove 42 is formed in the insulating sheet 41,
The outside of the lead wire 25 (25a, 25b), that is, the outer lead 43 (43a, 43b) is processed to bend at the insulating sheet 41, and the groove 42 of the insulating sheet 41 is formed.
A so-called chip-type crystal unit 40 is directly mounted on the circuit board and connected thereto. Other configurations are the same as in the first embodiment.

According to this configuration, since the whole of the crystal unit 40 is insulated and covered with the insulating covering material 31, the chip type can be easily formed. Moreover, by further providing the insulating sheet 41 and fitting the outer leads 43 into the grooves 42, the entire lower surface of the chip type crystal resonator 40 where the outer leads 43 (43a, 43b) are bent is flattened. When the crystal unit 40 is mounted on the circuit board, stable mounting on the circuit board can be achieved.

Further, since the crystal unit can be directly mounted on the circuit board, space can be saved. Further, the connection between the lead wire and the circuit on the circuit board can be easily performed.

FIG. 12 shows a main part of still another embodiment (hereinafter, referred to as Embodiment 3) of the present invention. 9 to 11 show a configuration in which the insulating sheet 41 is provided. However, the crystal resonator 70 of the present example is configured such that the outer sheet 43 (43
a, 43b) are bent to form a chip type. Other configurations are the same as those in FIGS.

Therefore, in the crystal resonator 70 of the third embodiment, the same effects as those of the above example can be obtained, and the insulating sheet 41
Can be omitted.

Although not shown, the insulating sheet 41 can be provided directly on the lower surface of the base 21 even if the entire crystal unit is not covered with the insulating coating material 31 as in the second embodiment. And insulation between the circuit board and the lead wire 25
It is also possible to adopt a configuration in which the base 21 and the circuit board are electrically connected via the.

FIGS. 13A and 13B show still another embodiment of the present invention (hereinafter, referred to as Embodiment 4). In FIG. 13, portions corresponding to FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description will be omitted. The crystal unit 50 of the present example is
An insulating auxiliary substrate 51 is formed thereon, and a substantially rectangular frame-shaped conductive pattern 52 is formed on the surface of the auxiliary substrate 51. As shown in FIGS. 14A and 14B, the auxiliary substrate 51 has a hole 51a having a diameter slightly larger than the diameter of the inner leads 26a and 26b. The auxiliary board 51 is provided on the base 2.
1 is fixed with an adhesive 53 or the like.

The upper electrode 27a of the crystal resonator element 27 is fixed and electrically connected to the head of one of the inner leads 26a with a conductive adhesive 28 in the same manner as in the above-described example.
Then, as shown in FIG. 15, the lower surface electrode 27b of the crystal resonator element 27 is fixed and electrically connected to one end of the conductive pattern 52 on the auxiliary substrate 51 by the conductive adhesive 28. The other end of the conductive pattern 52 on the auxiliary substrate 51 is electrically connected to the other inner lead 26b via a conductive adhesive 28.

The insulating auxiliary substrate 51 can be made of, for example, ceramics, glass, insulating paint or the like. When the auxiliary substrate 51 is made of ceramics, one large ceramic plate on which the conductive pattern 52 is formed can be cut to form a large number of auxiliary substrates 51, thereby simplifying the manufacturing process. Can be planned.

On the other hand, when the auxiliary substrate 51 is made of glass, it can be formed by fusing similarly to the insulating glass 24 in the through hole 23. At this time, the conductive pattern 52 is formed by printing insulating glass on a frame of the metal conductive pattern 52 prepared in advance, pre-baking the glass, placing the glass surface on a base, adjusting the position, and then removing the glass. The auxiliary substrate 51 is formed by fusion. In order to reduce the stray capacitance, printing and fusing of the insulating glass may be performed not on the entire surface but on a part thereof, that is, as a so-called spotting.

FIGS. 16A, 16B and 17 show still another embodiment of the present invention (hereinafter, referred to as a fifth embodiment). FIG.
FIG. 16B is a cross-sectional view taken along line RR ′ of FIG. 16A.
16 and 17, parts corresponding to those in FIGS. 13 to 15 are denoted by the same reference numerals, and redundant description is omitted.

The quartz oscillator 60 of this embodiment is an insulating glass (for example, soft or hard) on a small rectangular base 21 in which semicircular portions at both ends are removed instead of an oval base. Or a crystallized glass), and a substantially rectangular frame-shaped conductive pattern 52 is formed on the surface of the glass auxiliary substrate 61. Glass auxiliary substrate 61
As shown in FIGS. 18A and 18B, is formed in a substantially rectangular frame shape similarly to the conductive pattern 52, and the cross section is formed in a substantially trapezoidal shape in which upper and lower surfaces are parallel.

The surface of the base 21 in contact with the circuit board on which the crystal unit 60 is mounted is provided on the surface of the base 21 shown in FIG.
The insulating sheet 41 is directly formed in the same manner as
a (outer lead) 43a, 43b outside of 25b
Are penetrated through the insulating sheet 41 and are fitted into grooves 42 provided in the insulating sheet 41. That is, the chip-type crystal resonator 60 is configured.

The upper electrode 27a of the crystal resonator element 27 is electrically and mechanically fixed to one inner lead 26a via a conductive adhesive 28, and the lower electrode 27b is connected to the conductive pattern on the auxiliary substrate 51. The conductive adhesive 28 on 52
And the electrical connection is made. Lower electrode 27b
Is connected to the other inner lead 26b by the conductive adhesive 2
8 electrically. In addition, the quartz oscillator piece 27
Can be placed upside down.

In this case, the glass auxiliary substrate 61 can be formed by fusing similarly to the insulating glass in the through hole 23. At this time, the conductive pattern 52 is formed by printing insulating glass on the frame of the metal conductive pattern 52 created in advance, pre-baking the glass, placing the glass surface on the base 21 and adjusting the position. Auxiliary glass substrate 61
To form Also in this case, as described above, printing and fusing of the insulating glass may be performed as spotting.

In the fifth embodiment, the fourth embodiment
The adhesive 53 for attaching the auxiliary substrate to the base 21 is not required as compared with the quartz oscillator 50 of the first embodiment, and there is no need to provide a space for attaching the adhesive. Can be shortened, whereby the size of the crystal unit 60 can be further reduced.

FIG. 19 shows still another embodiment (hereinafter, referred to as Embodiment 6) of the crystal resonator of the present invention. FIG. 19 is a cross-sectional view of the plane including the inner leads. In this example,
This is a case where both ends of the crystal resonator element are fixed on the inner lead with a conductive adhesive having elasticity. still,
In FIG. 19, portions corresponding to the embodiments shown in FIGS. 1 to 16 are denoted by the same reference numerals, and redundant description will be omitted.

Also in the crystal resonator 80 of this embodiment, the lead wires 25 (25a, 25b) are passed through the two through holes 23 provided in the conductive base 21 through the insulating glass 24, and are fused by glass. The lead wire 25 and the base 21 are hermetically insulated and fixed to each other. 27 denotes a quartz oscillator piece, and 29 denotes a cap.

In the crystal resonator 80 of this embodiment, the crystal resonator element 2 is placed on the pair of inner leads 26a and 26b, that is, on the large diameter head of the lead wire 25.
7, the inner leads 26a, 26b are fixed to the quartz vibrator piece 27 via an elastic conductive adhesive 81. At this time, the upper electrode 27a and the lower electrode 27b of the quartz vibrator piece 27 are fixed. Are electrically connected to the respective inner leads 26a and 26b via a conductive adhesive 81 having elasticity, and conduction between the lead wire 25 and the crystal resonator element 27 is achieved. In FIG. 19, the upper electrode 27a is connected to the inner lead 26a, and the lower electrode 27b is
Is connected to the inner lead 26b.

As the conductive adhesive 81 having elasticity, for example, a modified urethane-based or silicone-based resin is used as a binder, and a flexible elastic conductive adhesive using silver, nickel, or carbon as a conductive agent is used. This conductive adhesive has a rubbery shape after curing and is excellent in flexibility, so that the curing shrinkage hardly affects the quartz vibrator piece. In addition, there is no change in hardness due to temperature from low temperature to high temperature, and the rubber elasticity is maintained even after heat aging. In the case of this elastic conductive adhesive, the hardness of a normal epoxy-based conductive adhesive is equivalent to 4H in pencil hardness (JIS.K.5400), whereas it is considerably soft as B to 6B. .

An adhesive which releases volatile components gradually after fixing will affect the atmosphere inside the crystal unit, and is not used for the conductive adhesive 81 having elasticity.

Also in the crystal resonator 80 of the sixth embodiment, the height of the crystal resonator element 27 can be reduced correspondingly by not using a supporting member.
The overall height can be reduced. Therefore, the size of the crystal unit 80 can be reduced.

Further, the quartz oscillator piece 27 is attached to the inner leads 26a, 2a by the conductive adhesive 81 having elasticity.
6b, the stress applied to the crystal resonator element at the time of manufacturing is absorbed by the elasticity of the adhesive 81, so that the fluctuation of the frequency of the crystal resonator element 27 due to the stress can be prevented.

Further, in this embodiment, since the quartz oscillator piece 27 is directly fixed to the inner leads 26a and 26b via the elastic conductive adhesive 81, the number of parts is reduced and the manufacturing process is simplified. Can be achieved.

Further, the quartz oscillator 80 of the sixth embodiment is
The present invention can be applied to the chip type crystal resonator such as the second embodiment. As shown in FIG. 20, similarly to the second embodiment and the like shown in FIG.
Is attached, and the outer lead 43 is bent and fitted into the groove 42 of the insulating sheet 41, whereby a chip type crystal resonator 85 can be formed.

In each of the above embodiments, the base 21 can be formed thin by selecting the material of the base 21 and controlling the strength. As a result, the overall height of the crystal unit can be reduced, and the size of the crystal unit can be reduced.

The quartz resonator of the present invention is not limited to the above-described example, but may take various other configurations without departing from the gist of the present invention.

[0063]

According to the above-described quartz oscillator of the present invention, the quartz oscillator piece is fixed to the lead wire at one end and the other end is free, so that the quartz oscillator piece can be attached to the quartz oscillator piece during the manufacturing process. Deformation due to distortion and a difference in the coefficient of thermal expansion from the base due to temperature change is prevented, and the frequency set in advance to the crystal resonator piece does not fluctuate. Therefore, according to the present invention, the accuracy of the frequency of the crystal unit can be kept good, and the reliability of the crystal unit can be improved.

Further, since one end of the crystal resonator element is fixed to one inner lead and the part of the base on the one inner lead side, the other end is free and the accuracy of the frequency of the crystal resonator is improved. And the height of the quartz-crystal vibrating piece can be reduced by using no supporting member or the like, thereby reducing the overall height of the quartz-crystal vibrating piece. Further, one electrode of the crystal resonator element is electrically connected to one inner lead, and the other electrode is electrically connected to the other inner lead through the base, so that the other end of the crystal element can be freely connected. Even in the state, conduction to each electrode of the crystal unit can be achieved.

In the case where one end of the crystal unit is fixed on an auxiliary substrate formed on the base instead of the base and the other electrode of the crystal unit is made conductive, the other end is also free. As a result, the accuracy of the frequency of the crystal unit is kept good, and the height of the crystal unit piece can be reduced by using no support members, thereby reducing the overall height of the crystal unit. In addition, even when the other end of the quartz-crystal vibrating piece is in a free state, conduction to each electrode of the quartz-crystal vibrating piece can be achieved.

When both ends of the crystal unit are fixed on the pair of inner leads with a conductive adhesive having elasticity, stress is absorbed by the elasticity of the adhesive and the frequency of the crystal unit is reduced. Accuracy can be kept good, and the height of the crystal resonator element can be reduced by using no support member or the like. This has the effect of reducing the overall height of the crystal resonator. Further, the effect of reducing the number of parts and the number of manufacturing steps is great.

According to the present invention, since the height of the crystal unit can be reduced, it is possible to reduce the size of a device incorporating the crystal unit. Further, since no support member is used, the number of components can be reduced, and the adjustment of directionality is not required, so that the manufacturing process can be simplified.

When the auxiliary substrate is used, the number of components increases by the amount of the auxiliary substrate. However, a large number of auxiliary substrates can be manufactured at one time, and the manufacturing process can be simplified.

[Brief description of the drawings]

FIG. 1 is a plan view showing a partial cross section of an embodiment of the crystal unit of the present invention.

FIG. 2 is a cross-sectional view showing a cross section including a lead wire of the crystal unit shown in FIG. 1;

FIG. 3 is a cross-sectional view of the crystal unit shown in FIG.

FIG. 4 is a schematic configuration diagram of a main part near a lead wire of the crystal resonator of FIG. 1;

5A and 5B are views showing a crystal resonator element of the crystal resonator of FIG.

FIG. 6 is a diagram showing a state of connection of upper electrodes of a crystal resonator element of the crystal resonator of FIG. 1;

FIG. 7 is a diagram showing a connection state of a lower surface electrode of a crystal resonator element of the crystal resonator of FIG. 1;

FIG. 8 is a schematic configuration diagram when a crystal resonator element is floated from an inner lead.

FIG. 9 is a plan view showing a partial cross section of another embodiment of the crystal unit of the present invention.

FIG. 10 is a cross-sectional view showing a cross section including a lead wire of the crystal resonator of FIG. 9;

FIG. 11 is a cross-sectional view of the crystal unit shown in FIG.

FIG. 12 is a schematic configuration diagram of a main part of still another embodiment of the crystal resonator of the present invention.

FIG. 13 is a schematic configuration diagram of still another embodiment of the crystal unit of the present invention. A is a plan view of a partial cross section. It is sectional drawing by the cross section containing B lead wire.

14 is a configuration diagram of an auxiliary substrate of the crystal unit of FIG. It is a top view of A auxiliary board. B It is sectional drawing in QQ 'of FIG. 14A.

FIG. 15 is a configuration diagram of a main part for explaining a connection state of the crystal resonator of FIG. 13;

FIG. 16 is a schematic configuration diagram of still another embodiment of the crystal resonator of the present invention. A is a plan view of a partial cross section. It is sectional drawing by the cross section containing B lead wire.

FIG. 17 is a sectional view taken along line RR ′ of FIG. 16A.

18 is a configuration diagram of a glass auxiliary substrate of the crystal unit of FIG. It is a top view of A glass auxiliary substrate. B It is sectional drawing in AA 'of FIG. 18A.

FIG. 19 is a schematic configuration diagram (cross-sectional view) of still another embodiment of the crystal resonator of the present invention.

20 is a schematic configuration diagram (cross-sectional view) when the crystal resonator of FIG. 19 is applied to a chip type.

FIG. 21 is a schematic configuration diagram (cross-sectional view) of an example of a conventional crystal unit.

FIG. 22 is a cross-sectional view of a main part used for describing a conventional example.

FIG. 23 is a view showing the shape of a conventional support member.

24A and 24B are diagrams showing shapes of other conventional support members.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 21 Base 22, 30 Flange part 23 Through-hole 24 Insulating glass 25, 25a, 25b Lead wire 26a, 26b Inner lead (head) 27 Crystal oscillator piece 27a Upper surface electrode 27b Lower surface electrode 28 Conductive adhesive 29 Cap 31 Insulation Coating material 32, 40, 50, 60, 70, 80, 85 Quartz vibrator 41 Insulating sheet 42 Groove 43, 43a, 43b Outer lead (outside) 51 Auxiliary substrate 52 Conductive pattern 53 Adhesive 61 Glass auxiliary substrate 81 Elasticity Conductive adhesive having a diameter D of a through hole d diameter of an inner lead

Claims (4)

[Claims] 1. A crystal resonator in which a crystal resonator element is horizontally arranged, wherein the crystal resonator element is supported at only one end and the other end is in a free state. 2. A quartz resonator having a pair of inner leads penetrating a base in an insulated state from the base and having a horizontal arrangement of quartz oscillator pieces, wherein one end of the quartz oscillator piece is One of the inner leads is fixed to a portion of the base on the side of the one of the inner leads, and one electrode of the quartz resonator element is electrically connected to the one inner lead, and the other electrode is connected to the base. A quartz crystal resonator comprising: a base that is electrically connected to the other inner lead through the base; a cap that is sealed to the base; and an outer surface of the base and the cap that is partially or entirely insulated. 3. A quartz oscillator having a pair of inner leads penetrating the base in an insulated state from the base and having a quartz oscillator piece arranged horizontally, wherein one end of the quartz oscillator piece has One of the inner leads is fixed to a portion of the auxiliary conductive member disposed on the base via an insulating member on the side of the one of the inner leads, and one electrode of the crystal resonator element is connected to the one inner lead. A crystal resonator comprising: a lead connected to a lead; the other electrode connected to the other inner lead via the auxiliary conductive member; and a cap sealed to the base. 4. A quartz oscillator having a pair of inner leads penetrating a base in an insulated state from the base, and a quartz oscillator piece arranged horizontally, wherein the quartz crystal is provided on the pair of inner leads. A crystal resonator, wherein both ends of a resonator element are electrically connected and mechanically fixed by a conductive adhesive having elasticity.