JPH1051188A - Mounting of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for mounting electronic components by which the movement distance of a substrate can be shortened and electronic components can be mounted on the board at high speed, when mounting many electronic components on the substrate using a multi-nozzle type mounting head. SOLUTION: A method for mounting electronic components on a substrate wherein, with mounting heads 21-25 with multiple nozzles being index-rotated along a rotary head, electronic components P1-P5 set in a parts feeder are mounted on a substrate 8 which is positioned on an XY table section. The center of gravity G as a reference point is set inside a plurality of the electronic components P1-P5 to be mounted on the substrate 8. And, the distances D1-D5, D1'-D5' between the two rotating positions of the mounting heads 21-25 which can mount the electronic components P1-P5 at specified coordinates positionsand, the center of gravity G which is the reference point, are calculated. Out of the two distances, the shorter one is selected and then the electronic components P1-P5 are mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting method using a multi-nozzle transfer head.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus for automatically mounting an electronic component on a substrate, an electronic component mounting apparatus having a rotary head is widely used. This electronic component mounting apparatus vacuum-adsorbs and picks up the electronic components provided in the parts feeder to the nozzles of the transfer head while rotating the transfer head with the rotary head by index rotation.
It is designed to be mounted on a substrate positioned on the XY table. In this case, the coordinate position at which the electronic component is mounted on the board is given in advance by a program, and X
The electronic component is mounted at a predetermined coordinate position by driving the Y table to horizontally move the board in the XY directions.

[0003] The amount of movement of the substrate is related to the length of the tact time, and the greater the amount of movement, the longer the time required for movement and the longer the mounting time. Therefore, in order to increase the mounting speed, it is advantageous to minimize the amount of movement of the substrate.

Accordingly, the present applicant has proposed an electronic component mounting apparatus of a rotary head type equipped with a multi-nozzle type transfer head, which can reduce the amount of movement of a substrate by driving an XY table to speed up mounting. A component mounting method has been proposed (Japanese Patent Application Laid-Open No. 4-1077987). In this apparatus, a transfer head is rotated about its axis by driving a motor, so that a nozzle that has vacuum-sucked an electronic component is moved in the X and Y directions, and the X and Y directions are driven by driving an XY table. A part of the movement amount in the Y direction is to be borne.

FIG. 6 is an explanatory view of an electronic component mounting method using a conventional multi-nozzle transfer head, and is a plan view of a substrate on which electronic components are mounted. In the figure, S
Is a substrate, P1 to P5 are electronic components mounted in order at predetermined coordinate positions (mounting positions) on the substrate S, and H1 to H5 are transfer heads for mounting the electronic components P1 to P5. The electronic components P1 to P5 are chip-type electronic components having no polarity direction, such as resistance chips and chip capacitors. In FIG. 6, the number of electronic components P1 to P5 is five, but the number of electronic components mounted on the substrate S may be any number.

As shown, the electronic components P1 to P5 are:
The transfer heads H1 to H5, which are index-rotated along the circumference of the rotary head, are sequentially mounted on the substrate S. In this case, the electronic components P1 to P5 are mounted on the substrate S so as to be mounted at predetermined coordinate positions. Is horizontally moved in the X and Y directions by driving an XY table (not shown). FIG. 6 shows the transfer head H1 with respect to the substrate S for convenience of drawing.
To H5 are moved, but the positions at which the transfer heads H1 to H5 mount the electronic components P1 to P5 on the substrate S are constant, and the substrates S are moved in the X direction and the Y direction. To move horizontally. In FIG. 6, the transfer heads H1 to H5 are of a multi-nozzle type having a plurality of nozzles, and are horizontally rotated around their axis O in order to increase the amount of movement of the substrate S in the horizontal direction (arrows). R1 to R3
reference).

[0007]

In FIG. 6, the substrate S
Sum of the horizontal movement distances of ΣL ′ = L1 ′ + L2 ′ +
L3 '+ L4'. In order to mount a large number of electronic components on the substrate S at a high speed, it is desirable to reduce the total distance 移動 L ′ of the moving distance as much as possible. However, the above-described conventional method does not take this point into consideration, and When mounting individual electronic components on a board, the total moving distance of the board is considerably long, and the reduction of the tact time is not sufficient.

Accordingly, the present invention provides an electronic component mounting method capable of mounting electronic components on a substrate at a high speed by shortening the total moving distance of the substrate when mounting a large number of electronic components on the substrate. The purpose is to provide.

[0009]

According to the present invention, a reference point is set inside a plurality of electronic components mounted on a substrate, and the electronic component can be mounted at a predetermined coordinate position in a predetermined posture. The distance between the two rotation positions of the mounting head and the reference point is calculated, and the mounting position of the shorter distance is selected by the transfer head to mount the electronic component.

[0010]

According to the present invention, each of the transfer heads selects a rotation position in which the amount of movement of the substrate becomes shorter, so that a large number of electronic components can be moved at high speed to a predetermined coordinate position on the substrate. It can be mounted in a predetermined posture.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an upside down perspective view of a transfer head provided in the electronic component mounting apparatus, and FIG. Illustration of electronic component mounting method,
FIG. 4 is a flowchart of the electronic component mounting, and FIG. 5 is an explanatory diagram of selection of a rotational position of a transfer head of the electronic component mounting apparatus.

First, a schematic configuration of an electronic component mounting apparatus will be described with reference to FIG. Reference numeral 1 denotes a rotary head, and a plurality of transfer heads 2 are provided along the circumferential direction. Reference numeral 4 denotes an electronic component supply device.
The table 6 includes a plurality of parts feeders 5 such as a tape unit and a tube feeder provided on the table 6, and a feed screw 7 for horizontally moving the parts feeder 5 in the X direction.

Reference numeral 9 denotes an XY table provided on the opposite side of the electronic component supply device 4, on which a substrate 8 is placed.
When the XY table unit 9 is driven, the substrate 8 moves horizontally in the X direction and the Y direction, and the mounting position of the electronic component is located immediately below the nozzle of the transfer head 2.

As shown in FIG. 2, the transfer head 2
This is a multi-nozzle transfer head having a plurality of nozzles 11a to 11d in the circumferential direction. In FIG. 1, reference numeral 3 denotes a motor for rotating the transfer head 2 about its axis O by a belt 10. Each nozzle 11a
11d have various shapes and dimensions, and by rotating the transfer head 2 according to the type of electronic component, the nozzle 11
One of the nozzles a to 11d is selected. The selected nozzle (the nozzle 11a in the example of FIG. 2) protrudes downward. These nozzles 11a to 11d are located at positions eccentric from O with respect to the axis of the transfer head. In this electronic component mounting apparatus, in FIG. 1, the transfer head 2 rotates the index in the direction of arrow N together with the rotary head 1 while moving the electronic component provided in the parts feeder 5 at the pickup station PST to the lower end of any nozzle. The wafer is picked up by vacuum suction, and mounted on the substrate 8 by performing a mounting operation (elevating operation) at the mount station MST. In this case, the electronic component is mounted on the XY
The table unit 9 is driven to horizontally move the substrate 8 in the X direction or the Y direction. Further, the motor 3 is driven so that the direction of the electronic component is correct, and the direction is adjusted.

The electronic component mounting apparatus has the above-described configuration. Next, a method for mounting an electronic component on a substrate will be described with reference to FIGS. In this example, as shown in FIG.
The electronic components P1 to P5 are transferred to predetermined coordinate positions (x1, y1), (x2, y) on the substrate 8 by the transfer heads 21 to 25.
2), (x3, y3), (x4, y4), (x5, y
It shall be implemented in 5). In FIGS. 3 and 5,
Reference numerals 21 to 25 are assigned to distinguish the five transfer heads. Also, in order to make it easier to understand the relative positional relationship between each transfer head 2 and the substrate 8, the substrate 8 is shown as a reference similarly to FIG. First, in step 1 of FIG. 4, the center of gravity G (x0, y0) of five coordinate positions is obtained. The center of gravity G is inside the electronic components P1 to P5 mounted on the board 8, and serves as a reference point for distance calculation described later. The calculation and determination of the flow shown in FIG. 4 are performed by a computer.

Next, in step 2, each of the electronic components P1 to P
Data relating to mounting coordinates and mounting angles of the electronic component having no polarity directionality among the electronic components 5 are read by a storage unit (not shown) of the control device. Steps 3 and 4 are not performed in the case of an electronic component having a polarity direction, but are performed only in the case of an electronic component having no polarity direction. That is, in the mounting method of the present electronic component, the transfer component 2 is rotated by 180 ° about its axis O, and the electronic component is mounted on the substrate 8 while selecting one of the two rotational positions.
Depending on the rotational position, the direction of the electronic component is horizontally reversed 180 ° left and right. Therefore, only electronic components having no polarity direction, such as a resistor chip and a capacitor chip, are subjected to step 3 or less. , But those with directional polarity, such as electronic components with leads, are not. In the present embodiment, it is assumed that the electronic components P1 to P5 have no polarity direction for convenience of explanation.

Next, at step 3, the distance between the axis (center of rotation) of the transfer head and the center of gravity G at two rotational positions of the mountable transfer head is calculated. Here, two rotational positions of the transfer head that can be mounted will be described with reference to FIG. In FIG. 5, the electronic components P1 to P5 are mounted at the illustrated coordinate positions with the illustrated posture. In this case, there are two rotational positions that the transfer heads 21 to 25 can take. These two rotational positions are shown by a solid line and a broken line in FIG. FIG. 5A shows an enlarged view of the case where the electronic component P1 is mounted. In FIG. 5A, the transfer head 21 can mount the electronic component P1 in a predetermined posture at two rotation positions, a rotation position indicated by a solid line and a rotation position indicated by a broken line.
That is, the motor 3 is driven to transfer the transfer head 2 indicated by a broken line.
By rotating 1 by 180 ° about its axis O, the transfer head 21 shown by the solid line can be obtained. When the transfer head 21 is rotated by 180 ° in this manner,
Although the electronic component P1 is inverted left and right, there is no problem because the electronic component P1 has no polarity direction.

Therefore, in step 3, the
The distances D1 and D1 '(FIG. 3) between the axis (O and O') of the transfer head and the center of gravity G at two rotation positions are calculated. Then, the data of the rotational position of the transfer head 21 in the case of the shorter distance (axis D ') (that is, D1) is stored in the memory of the computer. Hereinafter, similarly, other electronic components P2 to P5
Also, the distance (D) between the axis of the transfer head and the center of gravity G at two rotational positions mountable in step 3
2, D2 ') to (D5, D5'), and
Transfer head 2 in case of shorter distance D2 to D5
Data of the rotation positions 2 to 25 are selected and stored in the memory. In FIG. 5, (b) and (c) respectively show the nozzle 1
1d and 11b show a case where the electronic components P3 and P5 are mounted by vacuum suction.

As described above, all the electronic components P1 to P1
Regarding P5, the transfer heads 21 to 21 for mounting on the substrate 8
When the data of the 25 rotational positions is stored in the memory, the operation of mounting the electronic components P1 to P5 on the board 8 is started.
That is, as described above, while the transfer head 2 is index-rotated along the rotary head 1, the electronic components provided in the parts feeder 5 are supplied to the nozzles 11a to 11d.
Is picked up by vacuum suction at the lower end of the motor, and mounted on the substrate 8 one after another. In this case, the motor 3 is moved so that the transfer head 2 takes a rotational position shown by a solid line in FIGS. Is driven to rotate the transfer head 2, and the XY table 9 is driven to move the substrate 8 to a predetermined position (step 5).

Referring to FIG. 3, the advantages of the method are better understood. That is, the substrate 8 shown by a broken line (this is
The same as the prior art example)).
Comparing 1 ′ + L2 ′ + L3 ′ + L4 ′ with the total movement distance ΔL = L1 + L2 + L3 + L4 of the substrate 8 indicated by the solid line, the latter (ΔL) is shorter than the former (ΔL ′).
Therefore, the moving distance of the substrate 8 by driving the XY table 9 can be shortened accordingly, and a large number of electronic components can be mounted on the substrate at a high speed.

In the above embodiment, the positions of the centers of gravity G of a large number of electronic components are calculated and used as reference points for distance comparison. However, the determination of the reference points is not limited to this. May be set inside a plurality of electronic components mounted on the board, and calculating the center of gravity G in step 1 of FIG. 4 is one method for determining a reference point.

[0022]

According to the present invention, the amount of movement of the substrate by driving the XY table can be reduced, and a large number of electronic components can be mounted on the substrate at high speed.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is an upside-down inverted perspective view of a transfer head provided in the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 3 is an explanatory diagram of an electronic component mounting method by the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a flowchart of electronic component mounting according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram of a rotation position selection of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 6 is an explanatory diagram of an electronic component mounting method using a conventional multi-nozzle transfer head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rotary head 2, 21-25 Transfer head 3 Motor 5 Parts feeder 8 Substrate 9 XY table part P1-P5 Electronic components

Claims (1)

[Claims] An electronic component provided in a parts feeder is vacuum-adsorbed to a lower end of one of nozzles and picked up while rotating a rotary head provided with a plurality of transfer heads having a multi-nozzle by index rotation. In mounting the electronic component at a predetermined coordinate position on the substrate positioned on the XY table, the nozzle is moved in the horizontal direction by rotating the transfer head around its axis by driving a motor. An electronic component mounting method that bears a part of a horizontal movement amount of an XY table unit, wherein a reference point is set inside a plurality of electronic components mounted on the board, and the electronic component is mounted. The distance between the transfer head and the reference point at two rotation positions of the transfer head that can be mounted at a predetermined coordinate position in a predetermined posture is calculated, and the distance is calculated. An electronic component mounting method, wherein the transfer head selects the shorter rotation position to mount an electronic component.