JPH1051082A - Wiring board, and its manufacture, and liquid crystal element equipped with the wiring board, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fill resin equally and with good flatness between metallic wires by removing the squeeze-out of resin. SOLUTION: A wiring board 15 is manufactured by forming a band-shaped projection 10 around the position 5mm or more apart from the outermost metallic wiring, and pressing the UV hardening resin injected between a glass substrate 6 and a mold board thereby spreading the UV hardening resin 7, and then, hardening it. Hereby, the squeeze-out of the UV hardening resin 7 from the edge of the glass board 6 is suppressed by the band-shaped projection 10 at the time of pressing, whereby the shortage region of the UV hardening resin 7 on the glass board 6 vanishes, and the UV hardening resin 7 is filled equally and besides with good flatness between the metallic wires.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board in which a resin is filled and cured between metal wirings, a method for manufacturing the same, a liquid crystal device provided with the wiring board, and a method for manufacturing the same.

[0002]

2. Description of the Related Art TN (Twisted Nematic) and STN (Sutured Nematic)
In a liquid crystal device such as a per Twisted Nematic (Twisted Nematic) type, a transparent electrode formed on a glass substrate has conventionally been provided with ITO (In).
dium TinOxide) film is generally used.

[0003] The above-mentioned conventional transparent electrode (ITO film) has a large resistivity, so that the delay of the applied voltage waveform has recently become a problem as the display area becomes larger and the definition becomes higher. In particular, in the liquid crystal element using the ferroelectric liquid crystal, the delay of the voltage waveform was remarkable because the substrate gap was narrower. It is also conceivable to form the transparent electrode thicker, but when the film thickness is increased, there are problems such as time and cost required for film formation and poor transparency.

In order to solve such a problem, there has been proposed a wiring board having a structure in which a low-resistance metal wiring is formed in parallel with a thin transparent electrode (for example, Japanese Patent Application Laid-Open No. HEI 2 (1998) -213).
-63019). The wiring board disclosed in this publication is one in which metal wiring is embedded with a transparent insulator to form a transparent electrode such as an ITO film. In this publication, a metal wiring and a transparent electrode are electrically connected by providing a through hole in the insulator.

In the case of manufacturing a wiring board having the above-described structure, a wiring board having a structure using a transparent resin as an insulator for filling and flattening between metal wirings has been proposed (for example, Japanese Patent Application Laid-Open No. Hei 6-347810). No.).

When a wiring substrate is manufactured by forming such a low-resistivity metal wiring on a base glass substrate on which a transparent electrode is to be formed, conventionally, for example, a line is formed by a manufacturing method as shown in FIGS. Had been

First, U is placed on the surface of a smooth mold substrate 100.
A predetermined amount of the V (ultraviolet) curable resin 101 is dropped with a quantitative liquefaction jig (not shown) (see FIG. 23A). Next, U
On the mold substrate 100 on which the V-cured resin 101 has been dropped, a glass substrate 104 on which a metal wiring 103 having a thickness of about 1 μm has been formed in advance is placed.
The V-cured resin 101 is contacted so as to sandwich the V-cured resin 101 (FIG. 23).
(See (b) and (c)).

[0008] Next, an integrated product sandwiching the UV curable resin 101 between the mold substrate 100 and the glass substrate 104 is pressed by a pressing machine 105.
The mold substrate 100 and the glass substrate 104 are brought into close contact with each other by applying pressure (see FIGS. 24A and 24B). At this time, in order to keep the metal wiring 103 in contact with a transparent electrode such as an ITO film in a later process, the UV curable resin 101 is used.
Is removed from the surface of the metal wiring 103, or the mold substrate 1 is removed so that the resin is left very thinly on a part of the surface.
00 and the glass substrate 104 are strongly and uniformly adhered to the entire surface of the substrate.

Next, in order to cure the UV-curable resin 101, an integrated body of the mold substrate 100 and the glass substrate 104 is taken out of the press 105, and irradiated with UV light 106 from the glass substrate 104 side. The substrate 101 is cured (see FIG. 25A). At this time, the periphery of the substrate may be masked so that the surrounding UV-curable resin 101 is not cured (the uncured resin is washed away after the mold substrate 100 is peeled off).

Next, the integrated body of the glass substrate 104 and the UV curable resin 101 is peeled off from the mold substrate 100 by a mold release jig (not shown), and the UV curable resin
1 has been obtained (FIG. 25).
(See (b) and (c)).

[0011]

In the above-described conventional method of manufacturing a wiring board, the steps of pressing the mold substrate 100 onto which the UV curable resin 101 is dropped and the glass substrate 104 (FIGS. 24A and 24A). b)), a portion 101a of the UV curable resin 101 protrudes from the end between the mold substrate 100 and the glass substrate 104 due to the pressure.

As described above, when a part 101a of the UV curable resin 101 protrudes when the mold substrate 100 on which the UV curable resin 101 is dropped and the glass substrate 104 are brought into close contact with each other by pressing, the mold 105 is used by the press machine 105. Even if the substrate 100 and the glass substrate 104 are further pressed, the UV curable resin 10
No stretching of 1 occurs. For this reason, an area where the UV curable resin 101 does not reach uniformly is generated in a part between the mold substrate 100 and the glass substrate 104, resulting in poor flatness, and poor adhesion to a transparent electrode such as an ITO film in a later process. There were problems that occurred.

Further, a portion 101a of the UV curable resin 101 protruding from the end between the mold substrate 100 and the glass substrate 104
However, there is also a problem that the toner adheres to the press machine 105 and becomes contaminated, and becomes dirty when reused, which leads to a reduction in production yield.

Accordingly, the present invention provides a wiring board and a method for manufacturing the same, which can improve the uniformity and flatness of the resin filled between the metal wirings, and can prevent contamination due to the protrusion of the resin and improve the production yield. And a liquid crystal device having the wiring substrate and a method for manufacturing the same.

[0015]

In order to solve the above problems, a wiring board having a wiring pattern of metal wiring on a substrate surface and a resin provided between the metal wirings is provided. And a strip-shaped projection at a position separated from the outermost metal wiring by 5 mm or more of the wiring pattern.

Further, a metal wiring is patterned on the surface of the substrate, a resin is injected between the substrate and the mold substrate, and the substrate and the mold substrate are brought into close contact with each other and pressurized. In a method of manufacturing a wiring board that fills and cures,
Forming a belt-shaped convex portion at a position separated from the outermost metal wiring of the wiring pattern by 5 mm or more on the substrate,
Inject the resin between the substrate and the mold substrate and pressurize,
The method is characterized in that the resin is filled between the metal wirings in the strip-shaped convex portion.

Further, a metal wiring is formed on the surface of the substrate by wiring pattern, a resin is injected between the substrate and the mold substrate, and the substrate and the mold substrate are brought into close contact with each other and pressurized. In a method of manufacturing a wiring board that fills and cures,
On the mold substrate, a band-shaped convex portion is formed corresponding to a position at least 5 mm away from the outermost metal wiring of the substrate, and the resin is injected and pressurized between the substrate and the mold substrate. The method is characterized in that the resin is flatly filled between the metal wirings in the strip-shaped convex portion.

A wiring pattern of metal wiring is formed on the surface of the substrate, a resin is injected between the substrate and the mold substrate, and the substrate and the mold substrate are brought into close contact with each other and pressurized. In a method of manufacturing a wiring board that fills and cures,
Forming a wiring pattern of the metal wiring on the surface of the one substrate, and injecting the resin between the mold substrate and the substrate, from both ends of the both surfaces of the substrate and the mold substrate,
Pressurizing the substrate and the mold substrate along the longitudinal direction of the metal wiring, filling the resin between the metal wirings, and curing the resin.

Also, a pair of substrates disposed so as to face each other, a liquid crystal sandwiched between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. In a liquid crystal element having a metal wiring and a resin provided between the metal wirings,
A strip-shaped convex portion is provided on the substrate at a position separated from the outermost metal wiring of the wiring pattern by 5 mm or more.

Also, a pair of substrates arranged to face each other, a liquid crystal sandwiched between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the back surface of the transparent electrode. Forming a wiring pattern of the metal wiring on a surface of the one of the substrates, wherein the metal wiring and a resin provided between the metal wirings are provided. Forming at least a step of forming a band-shaped protrusion at a position separated from the outermost metal wiring of the wiring pattern by 5 mm or more; and filling the resin between the metal wirings in the band-shaped protrusion. It is characterized by.

Also, a pair of substrates arranged to face each other, a liquid crystal sandwiched between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. Forming a wiring pattern of the metal wiring on a surface of the one substrate in a method for manufacturing a liquid crystal element having a metal wiring formed and a resin provided between the metal wirings; The mold substrate and the substrate are brought into close contact by being injected between the substrate and the substrate,
Pressurizing, filling the resin between the metal wirings and curing, and corresponding to a position on the mold substrate which is at least 5 mm away from the outermost metal wiring of the substrate. A band-shaped convex portion is formed, and the resin is injected between the substrate and the mold substrate and pressurized, and the resin is filled flat between the metal wirings in the band-shaped convex portion.

Also, a pair of substrates disposed so as to face each other, a liquid crystal sandwiched between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode Forming a wiring pattern of the metal wiring on a surface of the one substrate in a method for manufacturing a liquid crystal element having a metal wiring formed and a resin provided between the metal wirings; And between the substrate and the substrate, pressurize the substrate and the mold substrate along the longitudinal direction of the metal wiring from both ends of the substrate and the mold substrate, and pressurize the resin with the metal. And curing between the wirings.

(Operation) When flattening the resin filled between the metal wirings by press molding, it is extremely difficult to accurately supply the amount of resin required for the flattening. Excess resin sandwiched between the substrate and the substrate protrudes from the edge of the substrate, and a region where the resin does not reach uniformly occurs. Therefore, in the present invention, on the substrate or the mold substrate,
A resin is uniformly filled between metal wirings with good flatness by providing a belt-shaped convex portion at a position at least 5 mm away from the outermost metal wiring of the wiring pattern to prevent the resin from protruding from the edge of the substrate. be able to.

[0024]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an example of a liquid crystal device provided with a wiring board according to an embodiment of the present invention. The liquid crystal element 1 includes a pair of wiring substrates, ie, electrode substrates 3a and 3b, which are disposed opposite to each other between the polarizing plates 2a and 2b, and a ferroelectric liquid crystal or the like is provided between the electrode substrates 3a and 3b. The liquid crystal 4 is filled. A spherical spacer 5 is disposed between the electrode substrates 3a and 3b filled with the liquid crystal 4 to maintain the substrate gap.

The electrode substrates 3a and 3b are made of a glass substrate 6a,
6b, insulating films 7a and 7b made of UV-curable resin on glass substrates 6a and 6b, and low-resistance metal such as Cr, A
Metal wirings 8a and 8b made of l, Ag, Cu, etc., and transparent electrodes 9a and 9b made of an ITO film that are in electrical contact with metal wirings 8a and 8b, respectively.

The transparent electrodes 9a and 9b are formed in stripes, respectively, and are matrix electrodes which cross each other at an angle of 90 °. On the transparent electrodes 9a and 9b, alignment films 11a and 11b are formed, respectively.

The electrode substrates 3a, 3b of the liquid crystal element 1 described above
Is applied to the wiring board shown in FIG.
As shown in (a) and (b), a metal wiring 8 having a wiring pattern formed in a stripe pattern is formed on a glass substrate 6, and has the same thickness as the metal wiring 8 around the entire periphery of the glass substrate 6. A belt-shaped convex portion 10 is formed. Note that, in the present embodiment, the band-shaped convex portion 10 is cut off in a scribing step when the liquid crystal element 1 is manufactured, so that the band-shaped convex portion 10 does not remain in the liquid crystal element 1.

It is preferable that the belt-like convex portion 10 is formed by the same process using the same material as the metal wiring 8, but it may be formed separately from the metal wiring 8 by using a material such as a resist.
The thickness of the convex portion 10 is approximately the same as that of the metal wiring 8 or the extent that the glass substrate 6 is not distorted, and the width of the convex portion 10 is generally about 1 to 20 mm, preferably 3 to 15 mm. Is 5 to 10 mm. In addition, the width of the protrusion 10 is 20 m.
m or more, but the space on the glass substrate 6 is large, and
There is a high possibility that the V-cured resin (not shown) may run off when it gets over. In addition, a gap for venting air may be formed in a part of the protrusion 10. In this case, it is preferable that such a gap be provided in a portion of the protrusion 10 that is not parallel to the metal wiring 8.

When a roller having a certain direction is used for pressing the UV curable resin, the UV curable resin is likely to protrude on a side parallel to the pressing direction, resulting in insufficient resin. As shown in FIGS. 3 (a) and 3 (b), band-shaped convex portions 10c are formed only on the peripheral edges of both sides of the glass substrate 6 parallel to the pressing direction (the direction of arrow A) of the UV curing resin (not shown).
10d is preferably formed.

As shown in FIGS. 4A and 4B,
Instead of forming the band-shaped protrusions 10 on the periphery of the glass substrate 6 described above, a band-shaped protrusion 10e is formed on the entire periphery of the mold substrate 12 for extending the UV curing resin (not shown). You may. Further, as shown in FIG. 5, strip-shaped convex portions 10f and 10g may be respectively formed on the periphery of both sides of the mold substrate 12 parallel to the pressing direction (the direction of arrow A) of the UV curing resin (not shown). Good. In addition, regardless of which of the glass substrate 6 and the mold substrate 12 is provided with the band-shaped convex portion, the extra UV is formed between the convex portion and the outside of the metal wiring 8 without protruding outside.
A certain amount of space is required to store the cured resin, and it is generally preferable to consider an interval of 5 mm or more, preferably 8 mm or more, and optimally 10 mm or more when designing the pattern.

As described above, the UV-curable resin is prevented from protruding from the edge of the glass substrate 6 by the belt-shaped convex portions 10 formed on the glass substrate 6, so that the UV-curable resin Insufficient regions do not occur, and the metal wiring 8 can be buried uniformly and with good flatness with the UV curing resin.

Next, a method of manufacturing a wiring substrate applied to the electrode substrates 3a and 3b of the liquid crystal element 1 according to the present invention shown in FIG. 1 will be described with reference to FIGS.

First, a metal wiring 8 is formed on a glass substrate 6, and a belt-shaped convex portion 10 is formed on the entire periphery of the glass substrate 6 so as to surround the metal wiring 8 by the same process. 8 with the metal wiring 8 facing the mold substrate 12.
The UV curable resin 7 dropped between them is brought into contact so as to sandwich it (see FIGS. 6A and 6B).

The metal wiring 8 and the strip-shaped convex portions 10 can be formed by forming a metal film layer on the glass substrate 6 by, for example, a sputtering method and then patterning by a photolithographic method. Further, as the mold substrate 12, metal, glass,
Ceramic, synthetic resin, or the like can be used. As the UV-curable resin 7, an epoxy-based or acrylic-based UV-curable resin can be used. The UV curable resin 7 may be dropped on either the glass substrate 6 or the mold substrate 12.

Next, the glass substrate 6 and the mold substrate 12 sandwiching the UV-curable resin 7 are pressed together from above and below by a press machine 13 to bring them into close contact with each other (see FIG. 7). In addition, the metal wiring 8
Is exposed from the flattened UV curable resin 7 or the resin is very thin on a part of the surface. Thereafter, the glass substrate 6 and the mold substrate 12 removed from the press 13 are irradiated with UV light 14 from the mold substrate 12 side to
By curing the V-cured resin 7 and peeling the mold substrate 12, the wiring substrate 15 is manufactured (FIGS. 8, 9A,
(B)).

The UV light 14 may be irradiated from the mold substrate 12 side, from the glass substrate 6 side, or from both sides simultaneously.

Then, a transparent electrode (not shown) made of an ITO film is formed by sputtering and patterned on the UV curing resin 7 so as to be in electrical contact with the metal wiring 8.
The electrode substrates 3a and 3b shown in FIG. 1 are obtained.

As described above, in the wiring board 15 according to the present invention, the metal wiring 8
The tip side of the UV curable resin 7 which is spread and flattened in between is kept in the gap between the strip-shaped convex portion 10 and the metal wiring 8 so that it does not protrude from the edge of the glass substrate 6.

Further, since the UV curable resin 7 is blocked by the band-shaped convex portion 10 and does not protrude from the edge of the glass substrate 6, there is no shortage area of the UV curable resin 7 on the glass substrate 6, and the metal UV curing resin 7 between wiring 8
Are filled uniformly and with good flatness.

Further, the UV curable resin 7 stretched by pressurization by the press machine 13 at the time of manufacturing protrudes out of the glass substrate 6 by being blocked by the belt-shaped convex portions 10 and is fixed to the jig of the press machine 13 or the like. Is prevented from being contaminated, so that even if the press machine 13 or the like is reused as it is, it is possible to prevent a decrease in the production yield due to the adhesion of the UV curable resin 7.

In the above-described embodiment, the strip-shaped convex portions 10 of the glass substrate 6 are cut off in the scribe step in manufacturing the liquid crystal element 1, but as shown in FIG. 10, the glass substrates 6a and 6b are cut off. All around the periphery or facing 2
It is also possible to manufacture the liquid crystal element 1a with the strip-shaped concave portions 10a and 10b left on the sides.

[0043]

Next, a method for manufacturing the above-described wiring board will be described in detail with reference to examples.

(Embodiment 1) FIGS. 11 to 15 schematically show the steps of manufacturing a wiring board according to Embodiment 1 of the present invention.

In this embodiment, the thickness is 1 mm, 100 mm ×
On a 100 mm glass substrate 20, a film having a width of 10 μm and a film thickness of 2
100 μm of metal wiring 21 made of Cr (chromium) film of μm
Simultaneously with the formation of stripes at m pitches, a strip-shaped protrusion 22 having a width of 5 mm and a thickness of 2 μm was formed on the entire periphery of the glass substrate 20 at a distance of 10 mm from the metal wiring 21 (see FIG. 11). The metal wiring 21 and the belt-shaped convex portion 22
After forming a Cr thin film layer on the glass substrate 20 by a sputtering method, it was formed by patterning by a photolithographic method.

After the glass substrate 20 was subjected to UV irradiation ozone treatment for 5 minutes, a silane coupling agent (A-174 manufactured by Nippon Unicar Co., Ltd.) and ethyl alcohol were mixed at a ratio of 1: 4. Spin-coat
A heat treatment was performed at 0 ° C. for 20 minutes to perform an adhesion treatment.

Next, an acrylic UV curable resin (pentaerythritol triacrylate: neopentyl glycol diacrylate: 1-hydroxycyclohexyl phenyl ketone = 50: 50) is formed on the metal wiring 21 of the glass substrate 20 by using a dispenser 23. 2) 40 mg of 24
The mixture was dropped and held in close contact with a mold substrate 25 made of a glass material, and pressure (a pressure of 20 kg / cm ² ) was applied for about 3 minutes by a press machine 26 (FIGS. 12A, 12B, and 12C). ), FIG.
reference). At this time, the front end side of the UV curable resin 24 to be stretched was blocked by the belt-like convex portion 22.

Next, the integrated body of the glass substrate 20 and the mold substrate 25 is removed from the press 26, and the UV
Light (center wavelength 365 nm, ultraviolet intensity 200 mJ / cm
² ) Irradiate 27 to cure the UV curable resin 24 (FIG. 1)
4).

Next, the mold substrate 25 is released from the glass substrate 20 using a release device (not shown), and the uncured UV-curable resin 24 is removed by ultrasonic cleaning in an isopropanol solution. The wiring substrate 28 was manufactured (FIG. 15).
(See (a) and (b)).

As described above, in this embodiment, the belt-like convex portions 22 are formed.
As a result, the UV curable resin 24 was prevented from protruding from the edge of the glass substrate 20, and the space between the metal wirings 21 was uniformly and well-filled with the UV curable resin 24.

(Comparative Example) FIGS. 16A and 16B show a manufacturing process for comparison with the above-described embodiment.

In this comparative example, a metal wiring 21 was formed on a glass substrate 20 by the same process as in the above-described embodiment. On the periphery of the glass substrate 20, the above-mentioned band-shaped convex portion is not formed. Then, after performing the same silane coupling treatment as in the above-described embodiment, the same UV curable resin 24 as in the first embodiment is dropped, sandwiched by a mold substrate (not shown), and closely adhered to each other, and a press machine (not shown) UV curing resin 2
4 was stretched and cured with UV light to produce a wiring board 29.

As described above, since the wiring substrate 29 of the comparative example does not have a belt-like convex portion formed on the periphery of the glass substrate 20 as in the above-described embodiment, the UV curable resin 24
Of the UV curable resin 24 embedded between the metal wirings 21 is reduced in resin uniformity in a region adjacent to the protruding portion due to the part 24 a of the UV curable resin 24 protruding outside the glass substrate 20.

Further, when the UV curable resin 24 is stretched by the press machine, the press machine is contaminated with the UV curable resin 24 protruding outside the glass substrate 20, and it is necessary to clean the dirt before reuse. .

(Embodiment 2) FIGS. 17 to 19 schematically show steps of manufacturing a wiring board according to Embodiment 2 of the present invention.

In this embodiment, the thickness is 1 mm, 100 mm ×
A metal wiring 21 made of a Cr (chromium) film having a width of 10 μm and a thickness of 2 μm is formed on a 100 mm glass substrate 20 by the same process as in the first embodiment.
10 mm away from the metal wiring 21 on both sides of the belt-shaped convex portions 22a and 22b having a width of 5 mm and a thickness of 2 μm.
Was formed. The band-shaped convex portions 22a and 22b were formed only on both sides of the glass substrate 10 parallel to the wiring direction of the metal wires 21 wired in a stripe shape.

Next, after performing the same silane coupling treatment as in the first embodiment, the same U-type as in the first embodiment is formed on the metal wiring 21 of the glass substrate 20 using a dispenser (not shown).
The V-cured resin 24 was dropped. At this time, the UV curable resin 24
Is dropped at one end of the metal wiring 21 wired in a stripe shape so as to be distributed in a direction perpendicular to the wiring direction of the metal wiring 21 (the direction of arrow A) (FIG. 17A,
(B)).

Next, the mold substrate 25 is adhered to the glass substrate 20 on which the UV curable resin 24 has been dropped, and inserted into the roll press 26a from the end surface of the glass substrate 20 from which the UV curable resin 24 has been dropped (FIG. 18 (a)). ), (B)) and pressurizing (3 kgw pressure) the glass substrate 20 and the mold substrate 25.
Is sent in the direction of arrow B (the longitudinal direction of the metal wiring 21) at a constant speed, and the UV curable resin 24 is stretched over the entire surface of the glass substrate 20 and cured with UV light to produce the wiring substrate 30 (FIG. 19 ( a), (b)).

As described above, also in the present embodiment, the UV-curable resin 24 is prevented from protruding out of the glass substrate 20 by the belt-shaped convex portions 22a and 22b, and the metal wiring 21 is formed.
The space was evenly filled with the UV curable resin 24 with good flatness.

Further, as in this embodiment, the UV curable resin 2
In the case where the pressing of step 4 is performed by a roll press machine 26a having a certain directionality, the UV curable resin 24 is likely to protrude on the side parallel to the pressing direction, resulting in insufficient resin. It is only necessary to form the band-shaped projections 22a and 22b only on the peripheral edge of the glass substrate 20 parallel to the pressing direction (the direction of arrow A).

(Embodiment 3) In this embodiment, the thickness is 1 mm,
A metal wiring made of a Cr film having a width of 10 μm and a film thickness of 2 μm is formed at a pitch of 100 μm on a 100 mm × 100 mm glass substrate by the same process as in the first embodiment, and at the same time, a film thickness of 10 mm is formed 8 mm apart from the metal wiring. A 3 μm band-shaped convex portion was formed on the periphery (entire periphery) of the glass substrate.
Other configurations were the same as in the first embodiment.

As described above, even when the width of the gap between the metal wiring and the band-shaped convex portion is changed and the width and the film thickness of the band-shaped convex portion are changed as compared with the first embodiment, Is not blocked by the belt-like convex portion and does not protrude out of the glass substrate.
In addition, it was possible to embed it with good flatness.

(Embodiment 4) FIGS. 20 to 21 schematically show the steps of manufacturing a wiring board according to Embodiment 4 of the present invention.

In this embodiment, the thickness is 1 mm, 100 mm ×
On a 100 mm glass substrate 20, metal wirings 21 made of an Al film having a width of 10 μm and a film thickness of 2 μm are formed at a pitch of 100 μm by the same process as in Example 1, while the entire periphery of a mold substrate 25 made of glass is formed. 10mm wide and 3μm thick
A UV-curable resin 24 is dropped on the glass substrate 20 to form a mold substrate 25.
(See FIGS. 20A and 20B).

The band-like convex portion 22 c is formed between the metal wiring 21 and the mold substrate 25 when the mold substrate 25 is bonded to the glass substrate 20.
It is formed at a position having a gap of about mm. Then, as in the case of the first embodiment, an integrated product of the mold substrate 25 and the glass substrate 20 is pressed by a press (not shown).
The same UV curable resin 24 was stretched over the entire surface of the glass substrate 20 and cured by irradiating UV light from the mold substrate 25 side to produce a wiring substrate 31 (see FIGS. 21A and 21B).

As described above, the band-shaped convex portion 2 is provided on the mold substrate 25 side.
Even if 2c is formed, the UV curable resin 24 to be stretched
Does not protrude from the edge of the glass substrate 20 by being blocked by the belt-shaped convex portion 22c,
The space was evenly filled with the UV curable resin 24 with good flatness.

Embodiment 5 In this embodiment, as shown in FIG. 22, an Al film having a width of 10 μm and a thickness of 2 μm is formed on a glass substrate 20 having a thickness of 1 mm and a size of 100 mm × 100 mm by the same process as in the first embodiment. Are formed at a pitch of 100 μm, while a mold substrate 25 made of stainless steel is formed.
A belt-like convex portion 2 having a width of 10 mm and a thickness of 3 μm on the entire periphery of
5a are integrally formed by a cutting method.
A UV curable resin 24 similar to that of Example 1 was dropped on the mold 0, and a mold substrate 25 was adhered.

The band-shaped convex portion 25 a is formed between the metal substrate 21 and the mold substrate 25 when the mold substrate 25 is bonded to the glass substrate 20.
It is formed at a position having a gap of about mm. Then, in the same manner as in the first embodiment, an integrated product of the mold substrate 25 and the glass substrate 20 is pressed by a press machine, and the UV curable resin 24 is stretched over the entire surface of the glass substrate 20.
It was cured by irradiating light to produce a wiring substrate.

As described above, the band-shaped convex portion 2 is provided on the mold substrate 25 side.
Even when the 5a is integrally formed, the UV curable resin 24 to be stretched is not blocked by the band-shaped convex portions 25a and does not protrude from the edge of the glass substrate 20, and the space between the metal wirings 21 is covered with the UV curable resin 24. It could be embedded uniformly and with good flatness.

[0070]

As described above, according to the present invention,
The strip-shaped protrusions located at a distance of 5 mm or more from the outermost metal wiring on the substrate prevent the resin filled between the metal wirings from protruding outside the edge of the substrate, and the resin is formed between the metal wirings. It is possible to provide a wiring board that is uniformly and well-filled.

Further, according to the method of manufacturing a wiring board of the present invention, the belt is pressed and stretched by the belt-shaped projection formed at a position at least 5 mm away from the outermost metal wiring on the substrate or the mold substrate. The resin to be spread uniformly over the entire substrate without protruding from the edge of the substrate, and the resin can be uniformly filled between metal wirings with good flatness. Further, since the stretched resin is prevented from protruding from the edge of the substrate, a jig such as a press machine is not contaminated by the resin at the time of pressurization, and the production yield can be improved.

Further, according to the liquid crystal device provided with the wiring substrate and the method of manufacturing the same according to the present invention, in the manufacturing process, 5 m from the outermost metal wiring on the substrate or the mold substrate.
m, the resin filled between the metal wirings is prevented from protruding from the edge of the substrate, and the resin is uniformly and flat between the metal wirings on the substrate. Filled well. Furthermore, by filling the UV curable resin with good flatness, the adhesion to the transparent electrode is also improved.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a liquid crystal element provided with a wiring board according to the present invention.

FIG. 2A is a plan view showing a state before filling a UV curable resin into a wiring board according to an embodiment of the present invention, and FIG.
Is a sectional view taken along the line II.

FIG. 3A is a plan view showing a state before a wiring board according to another embodiment of the present invention is filled with a UV curable resin,
(B) is the II-II sectional view taken on the line.

FIG. 4A is a plan view showing a state before filling a UV curable resin between a wiring substrate and a mold substrate according to the embodiment of the present invention, and FIG. 4B is a plan view showing the mold substrate.

FIG. 5 is a plan view showing a mold substrate of a wiring board according to another embodiment of the present invention.

FIG. 6A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped between a wiring substrate and a mold substrate according to an embodiment of the present invention, and FIG. 6B shows a state in which the wiring substrate and the mold substrate are in close contact with each other. FIG.

FIG. 7 is a schematic cross-sectional view showing a state where a UV curable resin is being pressed by a press.

FIG. 8 is a schematic cross-sectional view showing a state where a UV curable resin is irradiated with UV light.

FIG. 9A is a plan view showing a manufactured wiring board,
(B) is a sectional view taken along the line III-III.

FIG. 10 is a schematic cross-sectional view showing a liquid crystal element including a wiring board according to a modification of the embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view showing a state before the wiring board according to the first embodiment of the present invention is filled with a UV curable resin.

12A is a schematic cross-sectional view illustrating a state in which a UV curable resin is dropped between metal wirings, FIG. 12B is a schematic cross-sectional view illustrating a state before the UV curable resin is sandwiched between mold substrates, and FIG. FIG. 3 is a schematic cross-sectional view showing a state in which a wiring substrate and a mold substrate are in close contact with each other.

FIG. 13 is a schematic cross-sectional view showing a state where a UV curable resin is being pressed by a press machine.

FIG. 14 is a schematic cross-sectional view showing a state where a UV curable resin is irradiated with UV light.

FIG. 15A is a plan view showing a manufactured wiring board,
(B) is the IV-IV sectional view taken on the line.

16A is a schematic cross-sectional view showing a state before filling a wiring substrate according to a comparative example with a UV curable resin, and FIG. 16B is a schematic cross-sectional view showing a wiring substrate according to a comparative example.

17A is a plan view showing a state in which a UV curable resin is dropped on a wiring board according to Embodiment 2 of the present invention, and FIG. 17B is a sectional view taken along line VV.

FIG. 18A is a schematic cross-sectional view showing a state before a UV curable resin dropped on a wiring substrate according to a third embodiment of the present invention is sandwiched between mold substrates, and FIG. FIG. 3 is a schematic cross-sectional view showing a state where pressure is applied.

FIG. 19A is a plan view showing a manufactured wiring board,
(B) is the VI-VI line sectional view.

FIG. 20A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped between a mold substrate and a wiring substrate according to Embodiment 4 of the present invention, and FIG. FIG. 3 is a schematic cross-sectional view showing a pressurized state.

FIG. 21A is a plan view showing a manufactured wiring board,
(B) is a sectional view taken along the line VII-VII.

FIG. 22 is a schematic cross-sectional view showing a state where a UV curable resin is dropped between a mold substrate and a wiring substrate according to Embodiment 5 of the present invention.

FIG. 23A is a schematic cross-sectional view showing a state in which a UV curable resin is dropped on a mold substrate in a method for manufacturing a wiring board according to a conventional example, and FIG. (C) is a schematic sectional view showing a state in which the wiring substrate and the mold substrate are in close contact with each other.

24A is a schematic cross-sectional view showing a state before pressing a UV-curable resin with a press in a method of manufacturing a wiring board according to a conventional example, and FIG. FIG.

FIG. 25A is a schematic cross-sectional view showing a state in which a UV curable resin is irradiated with UV light in a method of manufacturing a wiring substrate according to a conventional example, and FIG. FIG. 1C is a schematic cross-sectional view showing a manufactured wiring board.

[Explanation of symbols]

1, 1a Liquid crystal element 3a, 3b Electrode substrate 4 Liquid crystal 6, 6a, 6b, 20 Glass substrate (substrate) 7, 7a, 7b, 24 UV curable resin (resin) 8, 8a, 8b, 21 Metal wiring 9a, 9b Transparent Electrodes 10, 10a to 10g, 22, 22a to 22c, 25a
Belt-shaped convex portion 12, 25-type substrate 13, 26 Press machine 26a Roll press machine 14, 27 UV light 15, 28, 29, 30, 31 Wiring board

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yuji Matsuo 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc.

Claims (47)

[Claims] 1. A wiring pattern of metal wiring on a surface of a substrate,
A wiring board having a resin provided between the metal wirings, wherein the wiring board has a band-shaped convex portion at a position separated from the outermost metal wiring of the wiring pattern by 5 mm or more on the substrate. Wiring board. 2. The wiring board according to claim 1, wherein the strip-shaped convex portion is provided on the entire circumference of a position at least 5 mm away from the outermost metal wiring on the substrate. 3. The wiring board according to claim 1, wherein the strip-shaped convex portions are provided on both sides in a longitudinal direction of the metal wiring at a position separated from the outermost metal wiring by 5 mm or more on the substrate. 4. The wiring board according to claim 1, wherein the width of the band-shaped projection is 1 to 20 mm. 5. The wiring board according to claim 1, wherein the band-shaped projection has substantially the same thickness as the metal wiring. 6. The wiring board according to claim 1, wherein the belt-shaped convex portion is made of the same metal as the metal wiring. 7. The wiring board according to claim 1, wherein the metal wiring is made of one of Cr, Al, Ag, and Cu. 8. The wiring board according to claim 1, wherein the resin is a UV curing resin. 9. The wiring substrate according to claim 1, wherein the substrate is a glass substrate. 10. A wiring pattern of a metal wiring is formed on the surface of the substrate, and a resin is injected between the substrate and the mold substrate to bring the substrate and the mold substrate into close contact with each other and pressurized, so that the resin is interposed between the metal wirings. In the method for manufacturing a wiring board that fills and cures, forming a strip-shaped convex portion at a position on the substrate that is at least 5 mm away from the outermost metal wiring of the wiring pattern,
Inject the resin between the substrate and the mold substrate and pressurize,
A method for manufacturing a wiring board, comprising: filling the resin between the metal wirings in the strip-shaped projections. 11. The method for manufacturing a wiring board according to claim 10, wherein the belt-shaped convex portion is formed on the entire periphery of the substrate at a position separated from the outermost metal wiring by 5 mm or more. 12. The method of manufacturing a wiring board according to claim 10, wherein the band-shaped projections are formed on both sides of the metal wiring in the longitudinal direction at positions separated from the outermost metal wiring by 5 mm or more on the substrate. Method. 13. The method of manufacturing a wiring board according to claim 10, wherein the width of the band-shaped convex portion is 1 to 20 mm. 14. The method of manufacturing a wiring board according to claim 10, wherein the band-shaped projections are formed of the same metal as the metal wiring and have substantially the same thickness in the same step. 15. The method according to claim 10, wherein the metal wiring is made of any one of Cr, Al, Ag, and Cu. 16. The method according to claim 10, wherein the resin is a UV curable resin. 17. The method according to claim 10, wherein the substrate is a glass substrate. 18. A wiring pattern of a metal wiring on a surface of a substrate, a resin is injected between the substrate and the mold substrate, and the substrate and the mold substrate are brought into close contact with each other and pressurized so that the resin is interposed between the metal wirings. In the method for manufacturing a wiring substrate that is filled and cured, a band-shaped convex portion is formed corresponding to a position on the mold substrate that is at least 5 mm away from the outermost metal wiring of the substrate. A method for manufacturing a wiring board, comprising: injecting the resin between mold substrates and pressurizing the resin, and filling the resin flatly between the metal wirings in the strip-shaped convex portion. 19. The wiring board according to claim 18, wherein the band-shaped convex portion is formed on the entire periphery of the mold substrate corresponding to a position separated from the outermost metal wiring of the substrate by 5 mm or more. Production method. 20. The mold substrate parallel to a direction in which the resin is uniaxially pressed by the mold substrate corresponding to a position where the band-shaped convex portion is at least 5 mm away from the outermost metal wiring of the substrate. The method for manufacturing a wiring board according to claim 18, wherein the wiring board is formed on both upper sides. 21. The method for manufacturing a wiring board according to claim 18, wherein the width of the band-shaped convex portion is 1 to 20 mm. 22. The method according to claim 18, wherein the metal wiring is made of one of Cr, Al, Ag, and Cu. 23. The method according to claim 18, wherein the resin is a UV curable resin. 24. The method according to claim 18, wherein the substrate is a glass substrate. 25. A wiring pattern of metal wiring is formed on the surface of the substrate, a resin is injected between the substrate and the mold substrate, and the substrate and the mold substrate are brought into close contact with each other and pressurized. In the method for manufacturing a wiring board that is filled and cured, a step of forming a wiring pattern of the metal wiring on the surface of the one substrate; and injecting the resin between a mold substrate and the substrate, and Pressurizing the substrate and the mold substrate along the longitudinal direction of the metal wiring from both end sides of the mold substrate, filling the resin between the metal wirings and curing the resin. A method for manufacturing a wiring board, comprising: 26. The method according to claim 25, wherein the pressing is performed using a roll press. 27. A pair of substrates arranged to face each other, a liquid crystal interposed between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. A liquid crystal element having a metal wiring provided and a resin provided between the metal wirings, wherein a strip-shaped convex portion is provided on the substrate at a position separated from the outermost metal wiring of the wiring pattern by 5 mm or more. A liquid crystal element characterized by the above-mentioned. 28. The liquid crystal device according to claim 27, wherein the band-shaped convex portion is provided on the entire circumference of a position at least 5 mm away from the outermost metal wiring on the substrate. 29. The liquid crystal element according to claim 27, wherein the band-shaped convex portion is provided on both sides in a longitudinal direction of the metal wiring at a position separated from the outermost metal wiring by 5 mm or more on the substrate. 30. The liquid crystal device according to claim 27, wherein the width of the band-shaped projection is 1 to 20 mm. 31. The liquid crystal device according to claim 27, wherein the band-shaped projection has substantially the same thickness as the metal wiring. 32. The liquid crystal device according to claim 27, wherein the band-shaped projection is made of the same metal as the metal wiring. 33. The liquid crystal device according to claim 27, wherein the metal wiring is made of one of Cr, Al, Ag, and Cu. 34. The liquid crystal device according to claim 27, wherein the resin is a UV curable resin. 35. The liquid crystal device according to claim 27, wherein the substrate is a glass substrate. 36. The liquid crystal device according to claim 27, wherein the transparent electrode is made of an ITO film. 37. The liquid crystal device according to claim 27, wherein the liquid crystal is a ferroelectric liquid crystal. 38. A pair of substrates disposed so as to face each other, a liquid crystal interposed between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. A method of manufacturing a liquid crystal element having a metal wiring formed and a resin provided between the metal wirings, wherein a wiring pattern of the metal wiring is formed on a surface of the one substrate; A step of forming a band-shaped protrusion at a position separated from the outermost metal wiring by 5 mm or more of the wiring pattern; and a step of filling the resin between the metal wirings in the band-shaped protrusion. A method for manufacturing a liquid crystal element, comprising: 39. The method for manufacturing a liquid crystal element according to claim 38, wherein a step of forming a wiring pattern of the metal wiring and a step of forming the strip-shaped convex portion are performed simultaneously. 40. The method for manufacturing a liquid crystal element according to claim 38, wherein the band-shaped convex portion is formed on the entire periphery of the substrate at a position separated from the outermost metal wiring by 5 mm or more. 41. The liquid crystal device according to claim 38, wherein the band-shaped convex portions are formed on both sides of the metal wiring on the substrate at a position separated from the outermost metal wiring by 5 mm or more in the longitudinal direction. Method. 42. The method according to claim 38, further comprising a step of cutting off the convex portion after the step of filling the resin. 43. A pair of substrates disposed so as to face each other, a liquid crystal sandwiched between the substrates, a wiring electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. A method for manufacturing a liquid crystal element having a metal wiring provided and a resin provided between the metal wirings, wherein a wiring pattern of the metal wiring is formed on a surface of the one substrate; And injecting between the substrate and the mold substrate and the substrate in close contact with each other, pressurizing, filling and curing the resin between the metal wirings, and curing the resin. Forming a band-shaped protrusion corresponding to a position at least 5 mm away from the outermost metal wiring of the substrate, injecting the resin between the substrate and the mold substrate and applying pressure, thereby forming the band-shaped protrusion. Place the resin between the metal wires in the A method for producing a liquid crystal element, wherein the method comprises: 44. The manufacturing method of a liquid crystal device according to claim 43, wherein the band-shaped convex portion is provided on the entire periphery of the mold substrate corresponding to a position separated from the outermost metal wiring of the substrate by 5 mm or more. Method. 45. The mold substrate parallel to a direction in which the resin is uniaxially pressed by the mold substrate corresponding to a position where the band-shaped convex portion is separated from the outermost metal wiring of the substrate by 5 mm or more. The method for manufacturing a liquid crystal element according to claim 43, wherein the liquid crystal element is formed on both upper sides. 46. A pair of substrates arranged so as to face each other, a liquid crystal sandwiched between the substrates, a transparent electrode provided on at least one of the substrates, and a wiring pattern electrically contacting the rear surface of the transparent electrode. A method for manufacturing a liquid crystal element having a metal wiring provided and a resin provided between the metal wirings, wherein a wiring pattern of the metal wiring is formed on a surface of the one substrate; And between the substrate and the substrate, pressurize the substrate and the mold substrate along the longitudinal direction of the metal wiring from both ends of the substrate and the mold substrate, and pressurize the resin with the metal. Filling between the wirings and curing. A method of manufacturing a liquid crystal element. 47. The method according to claim 46, wherein the pressing is performed using a roll press.