JP2002258236A - Method and apparatus for manufacturing wiring board and method for manufacturing liquid crystal element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a wiring board and a method for manufacturing a liquid crystal element which can prevent a polymer material from outside protruding. SOLUTION: In a pressing process of a UV cured resin 5 for flatly filling between metal electrodes 3 on a glass substrate 2, a smoothing plate 1 is positioned in a position corresponding to a region L to be flatly filled with the UV cured resin 5 on the glass substrate 2 by positioning jigs 59a, 59b. Since a size of the smoothing plate 1 is larger than the region L to be flatly filled with the UV cured resin 5 on the glass substrate 2 and smaller than the glass substrate 2 and a pressed area by moving rollers 51a, 51b is larger than the region L to be flatly filled with the UV cured resin 5 on the glass substrate 2 and smaller than the glass substrate 2, the excess UV cured resin 5 protruding from a gap between the smoothing plate 1 and the glass substrate 2 does not go outside the glass substrate 2 and members of the manufacturing apparatus can be prevented from contamination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board, a method for manufacturing a liquid crystal element, and an apparatus for manufacturing a wiring board, and more particularly to a method for preventing a polymer material from protruding outside.

[0002]

2. Description of the Related Art Twisted Nemati (TN)
c) and STN (Super Twisted Nema)
In a liquid crystal element of a (tic) type or the like, a transparent electrode formed on a glass substrate has conventionally been made of ITO (Indium Ti).
An nOxide) film or the like is generally used.

[0003] Since the transparent electrode (ITO) has a large resistivity, there has recently been a problem of a delay in a voltage waveform applied with an increase in a display area and a high definition. In particular,
In a liquid crystal element using a ferroelectric liquid crystal, the substrate gap (the thickness of the liquid crystal layer) is narrower (for example, 1.0 to 2.0 μm).
m), and the delay of the voltage waveform was remarkable. It is also conceivable to form the transparent electrode to have a large thickness in order to reduce the resistance. However, when the thickness is increased, the adhesion to the glass substrate becomes poor, and it takes a long time to form the film, and the cost is high. There were problems such as becoming.

Therefore, in order to solve such a problem, a liquid crystal element having a configuration in which a metal electrode having a low resistivity is provided under a transparent electrode having a small thickness has been proposed (for example, Japanese Patent Application Laid-Open No. HEI 2 (1990) -1990). -63019, JP-A-6-347810, etc.).

As a wiring substrate for such a liquid crystal element, for example, a conductive pattern to be a plurality of auxiliary electrodes is formed on the surface of a light-transmitting substrate, and a resin material in which the conductive patterns are made of a polymer material is provided between the conductive patterns. There is a structure in which a transparent electrode is formed on the conductive pattern while being buried flat by a material. And in such a method of manufacturing a wiring board, first, a smooth plate having a flat surface is prepared,
A fluid resin material is interposed between the surface of the light-transmitting substrate on which the conductive pattern is formed and the surface of the smooth plate, and then the light-transmissive substrate and the smooth plate are brought into contact with each other by being pressed substantially linearly. .

Next, while the light-transmitting substrate and the smooth plate are in contact with each other, the pressurized portion is relatively moved from one side thereof to the other side, so that the light-transmitting substrate and the smooth plate are moved. And spread the fluid resin material over the conductive pattern forming area of the light-transmitting substrate,
After curing the spread resin material with UV light, the smooth plate is peeled off.

Here, by curing the resin material in this manner, a metal wiring board in which the conductive patterns are filled with the resin material flatly is obtained. Finally, a transparent electrode is formed on the metal wiring board. Then, the manufacture of the wiring board is completed.

Next, an example of such a manufacturing method will be described with reference to FIG.

First, as shown in (a), a UV curable resin monomer liquid (hereinafter simply referred to as “resin”) 5 as a polymer material is placed on a surface of a smooth plate 1 having a smooth surface, such as a dispenser 6. A predetermined amount is dropped using a fixed amount dropping jig. next,
As shown in (b) and (c), a metal wiring (electrode) 3 having a thickness of about 1 μm as a conductive pattern is previously provided on the surface of a glass substrate 2 which is an example of a light-transmitting substrate. The substrate 4 is brought into contact with the smoothing plate 1 with the wiring surface 4a facing the smoothing plate 1 so as to sandwich the resin 5 therebetween.

Next, as shown in FIG. 1D, an integrated member 45 sandwiching the resin 5 between the smoothing plate 1 and the metal wiring board 4 is inserted, for example, between a pair of rotating rollers 7 in the direction of the arrow (in this example, The direction of the arrow is substantially perpendicular to the metal wiring 3),
The unit 45 is pressed. As a result, the smoothing plate 1 and the metal wiring board 4 are pressed against each other, and the resin 5 is spread over the metal wiring forming area of the metal wiring board 4. The pressing pressure is such that the resin 5 can be removed from the surface of the metal wiring 3 and that the metal wiring board 4 and the smooth plate 1 can be firmly and uniformly adhered to the entire surface of the board 4. Pressure.

Next, as shown in (e), the resin 5 is irradiated with UV light from the side of the metal wiring substrate 4 to cure the spread resin 5, and as shown in FIG. The metal wiring board 4 integrated with the resin 5 is peeled from the smooth plate 1 in the direction of the arrow by a release jig not shown. Finally, a transparent electrode 15 such as an ITO film indicated by a two-dot chain line is formed on the metal wiring board 4 in which the space between the metal wirings 3 is thus buried flat with the resin 5 to form the wiring board 10. Get.

In such a wiring board and a method of manufacturing the wiring board, when the metal wiring board 4 is brought into contact with the smooth plate 1 so as to sandwich the resin 5 as shown in FIG. As shown in ()), bubbles 21 may be entrained in the resin 5. Here, usually, bubbles 21 are formed in the resin 5 as described above.
2C, for example, during the pressing process shown in FIG. 2C, the resin 5 flows by the rotation of the roller 7, so that the bubbles 21 are also pushed out of the integrated body 45.

FIGS. 3A to 3H show another example of a case where a metal electrode having a low resistivity is formed on an underlying glass substrate on which a transparent electrode is formed to produce a wiring substrate. There are various manufacturing methods.

First, the metal electrode 1 having a thickness of about 1 μm is
02 of the glass substrate 101 on which the metal electrode 02 is formed.
Dispenser 1 with flowable UV curable resin 103 on 2 side
A predetermined amount is dropped at 04 (see FIG. 3A). Next, a light-transmitting smooth plate 105 having a smooth surface is brought into contact with the UV curable resin 103 dropped on the glass substrate 101 (see FIGS. 3B and 3C).

Next, an integrated body sandwiching the UV-curable resin 103 between the smoothing plate 105 and the glass substrate 101 is placed between the upper and lower rotatable rollers 106a and 106b of a pressing device by an arrow A.
It is conveyed from the direction, and is brought into close contact by pressing (see FIG. 3D). In this case, the pressurized portion is advanced substantially perpendicular to the stripe direction of the metal electrode 102. At this time, UV curable resin 1
03 is discharged from the surface of the metal electrode 102,
And the glass substrate 101 are strong.
And evenly adhere to the entire surface.

Next, an integrated body sandwiching the UV curable resin 103 between the smoothing plate 105 and the glass
The UV curable resin 103 is cured by irradiating it with UV light 107 from above the smoothing plate 105 side (see FIG. 3E).

Next, the integrated body of the glass substrate 101 and the UV curable resin 103 is peeled off from the smooth plate 105 by a release jig (not shown), and the UV curable resin
3 has been obtained (FIG. 3).
(See (f) and (g)). Then, each of the metal electrodes 102 of the wiring board 108 is electrically connected to the
A transparent electrode 109 such as an O film is formed (FIG. 3H).
reference).

In such a method, the glass substrate 1
When the resin 103 is sandwiched between the sheet 103 and the smoothing plate 105, the resin 103 flows due to the rotation of the rollers 106a and 106b in the process shown in FIG. Can be discharged out of the system (not shown).

[0019]

However, in the above-described conventional method of manufacturing a wiring board, the method shown in FIGS.
In the method shown in FIG. 3, it is difficult to control the amount of the UV curable resin 103 dropped by the dispenser 104 between the metal electrodes 102 on the glass substrate 101 to an appropriate amount with good reproducibility.

As described above, it is difficult to control the amount of dripping of the resin such as the UV curable resin to be dripped, because the viscosity of the resin changes sensitively to the temperature change of the wiring board manufacturing apparatus or the environment such as the atmosphere. , Dripping conditions (eg, pressure, pressurization time, nozzle diameter, etc. for a pneumatic feed type dispenser)
In some cases, reproducibility of the drop amount was not obtained despite the fact that was constant.

In such a situation, for example, in the method shown in FIGS. 1 and 2, when the amount of the resin 5 to be dropped is small, the flow is insufficient, or the height of the metal wiring 3 is high, and the side wall of the resin 5 In the case of obstruction of the flow of air, the air bubbles 21
5 is not pushed out of the metal wiring 3 as shown in FIG.
The phenomenon that is left behind occurs.

Then, as shown in FIG. 2 (d), the resin material 5 is cured by irradiating the integrated object 45 with UV light while the air bubbles 21 as described above are entrapped in the resin 5, and thereafter (e). )
Even when the metal wiring board 4 integrated with the resin 5 is peeled off from the smooth plate 1 as described above, the surface of the hardened resin 5 with the air bubbles 21 remaining in this metal wiring board 4 is greatly depressed.

For this reason, when the transparent electrode 15 is formed later, the transparent electrode 15 is disconnected at this recessed portion, or when a cell is formed to form a liquid crystal element, the cell thickness of the recessed portion is compared with that of other regions. As a result, it becomes extremely large, and consequently causes serious defects such as uneven alignment of liquid crystal.

In order to avoid such a problem, if the amount of the resin 5 is increased, after the pressing step shown in FIGS. 7 and need to be removed, leading to a decrease in productivity (FIGS. 1 and 2 are not shown).

On the other hand, in the example of the manufacturing method shown in FIG. 3, if the amount of the UV curable resin 103 dropped is small, the aforementioned FIG.
As in the case of Example 2, bubbles in the resin are not sufficiently discharged out of the system, and the UV curable resin 103 is placed between the smoothing plate 105 and the glass substrate 101 on which the metal electrodes 102 are formed as shown in FIG. The upper and lower rollers 106a, 10
When the pressure was applied between the electrodes 6b, the UV curable resin 103 did not spread between all the metal electrodes 102, especially on both ends, and the metal electrodes 102 could not be evenly embedded and flattened.

As shown in FIG. 5, when the amount of the UV curable resin 103 dropped is increased, an integrated body having the UV curable resin 103 interposed between the smooth plate 105 and the glass substrate 101 on which the metal electrode 102 is formed is formed. Upper and lower rollers 106a, 10
6b, the excess UV curable resin 103a protrudes from between the flat plate 105 and the glass substrate 101 and adheres to the rollers 106a and 106b, members of the manufacturing apparatus, and the like. Must be removed, which has led to a decrease in productivity.

As shown in FIGS. 6 and 7, a UV curable resin 103 containing bubbles 110 is dropped on a glass substrate 101 on which a metal electrode 102 is formed.
5 and the glass substrate 101 on which the metal electrode 102 is formed.
When the V-cured resin 103 is sandwiched, the bubbles 110 mixed in the UV-cured resin 103 are separated from the upper and lower rollers 106a, 1
In order to completely discharge the UV-curable resin 103 by pressing with the pressure of 06b, it is necessary to previously set the UV-curable resin 103 to an amount larger than the minimum required amount and drop it. UV curable resin 103a protrudes outside and adheres to rollers 106a and 106b, parts of a manufacturing apparatus, etc.
03a had to be removed.

An object of the present invention is to prevent a polymer material (a resin) having fluidity from protruding outside when pressed between a smooth plate and a substrate on which a metal electrode is formed and pressed. It is another object of the present invention to provide a method of manufacturing a wiring board, a manufacturing apparatus of a wiring board, and a method of manufacturing a liquid crystal element, in which a region to be buried with a polymer material of a substrate can be uniformly embedded with a polymer material.

[0029]

According to the present invention, there is provided a smooth plate having a smooth surface and a polymer material having fluidity interposed between substrates formed by patterning electrodes on the surface. After pressing the integrated body sandwiching the polymer material between the substrates, stretching the polymer material, bringing the substrate on which the electrodes are formed into close contact with the surface of the smooth plate, and curing the polymer material By peeling the substrate from the smooth plate, in the method of manufacturing a wiring board to produce a wiring board in which the polymer material is flattened and embedded between the electrodes on the substrate, the size of the smooth plate, The area of the substrate to be buried flat with the polymer material is made larger than the area to be buried flat with the polymer material, and the area of the pressure is made larger than the area of the substrate to be buried flat with the polymer material. Yo Smaller, it is characterized in.

The present invention also provides a smoothing plate having a smooth surface, a polymer material dropping means for interposing a polymer material having fluidity between substrates formed by patterning conductive electrodes on the surface, Pressing means for pressing an integrated body sandwiching the polymer material between a smooth plate and the substrate, stretching the polymer material and bringing the substrate on which the electrodes are formed into close contact with the surface of the smooth plate, A curing means for curing the polymer material, the substrate is peeled from the smooth plate, and the polymer material is flattened and embedded between the electrodes on the substrate to produce a wiring board for producing a wiring board. In the manufacturing apparatus, the size of the smooth plate is made larger than a region of the substrate to be buried flat with the polymer material, and smaller than the substrate, and the pressing range of the substrate is set by the pressing unit. Polymer material Positioning means for positioning the smoothing plate larger than the area to be buried flat, smaller than the substrate, and corresponding to the area of the substrate to be buried flat with the polymer material, Is what you do.

Further, according to the present invention, a liquid crystal is sandwiched between a pair of wiring boards which are arranged so as to face each other to form an electrode group, and at least one of the wiring boards is provided on a light-transmitting substrate. In a method for manufacturing a liquid crystal element, which is formed by patterning electrodes and is planarized by embedding a polymer material between the electrodes, the wiring substrate is formed by a smooth plate having a smooth surface, and a conductive electrode formed on the surface. A polymer material having fluidity is interposed between the substrates formed by patterning, and an integral body sandwiching the polymer material between the smooth plate and the substrate is pressed, and the polymer material is stretched. The substrate on which the electrodes are formed is brought into close contact with the surface of the smooth plate, and after the polymer material is cured, the substrate is formed by peeling the substrate from the smooth plate. The above-mentioned polymer material Larger than the area to be buried flat and smaller than the substrate, the range of the pressure is larger than the area of the substrate to be buried flat with the polymer material, and smaller than the substrate. It is a feature.

[0032]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 8 is a sectional view showing the structure of a liquid crystal element using a wiring board obtained by the method according to the embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a liquid crystal element. The liquid crystal element 11 includes a pair of wiring boards 10 and 10 arranged between the polarizing plates 18 and 18 so as to face each other. Numeral 10 is sandwiched between spherical spacer beads 14 at a predetermined substrate gap (for example, 1.5 μm), and a liquid crystal 12 such as a chiral smectic liquid crystal or a nematic liquid crystal is sandwiched between the substrate gaps.

The wiring substrate 10 is an insulating layer filled with a metal electrode 3 made of aluminum on a glass substrate 2 and filled between lines of the metal electrode 3.
It is flattened by a resin 5 such as a cured resin.

On the surfaces of the metal electrode 3 and the resin 5,
In order to make electrical contact with the metal electrode 3, ITO (Ind
A transparent electrode 15 made of ium tin oxide is formed, and an orientation film 17 is further formed thereon via an insulating layer 16 provided as necessary.
Numerals 5 are formed in a stripe shape in conformity with the metal electrode 3, and a matrix electrode is formed in which a pair of wiring substrates 10 formed on each other cross each other at an angle of 90 ° and face each other. Here, the transparent electrode 15 constitutes a main electrode in the element, and the metal electrode 3 functions as an auxiliary electrode for assisting the low resistance of the transparent electrode 15.

Next, a basic mode of a method of manufacturing a wiring board according to a reference example of the present invention will be described with reference to FIGS.
It is explained along.

First, as shown in FIG. 19, a metal wiring substrate having a structure in which a metal wiring (electrode) 3 of a stripe pattern made of a metal material is provided on a substrate (glass substrate) 2 made of a transparent material and a reflective material. 4 is manufactured by the method shown in FIG.

First, a metal material layer 23 is formed on the entire surface of the substrate 2 by sputtering (FIG. 20A), and a photoresist layer 24 is further formed on the metal material layer 23 by spin coating. Subsequently, after exposing (FIG. 20B) and developing the photoresist layer 24 through a photomask 25 having a line portion in the form of a wiring pattern, post-baking is performed as necessary, and the metal material layer 23 is formed.
An etching pattern (resist pattern) 24 'is obtained on the upper surface (FIG. 20C).

Subsequently, the substrate 2 having the etching pattern 24 'on the metal material layer 23 is subjected to an etching treatment by immersing the substrate 2 in an etching solution or the like, so that the metal material layer 23 not covered with the resist is removed by etching. Then, the etching pattern 24 'is peeled to obtain a pattern of the metal wiring 3 (FIG. 20D).

Here, as a material of the metal wiring 3, in addition to aluminum having a small resistance value, for example, nickel, molybdenum, chromium, tungsten, tantalum, silver, copper, conductive resin, and conductive ceramics can be used. .

Further, by forming a color filter layer (pattern) between the metal electrodes 3 in advance with a predetermined thickness by a known method such as a photolithography method, a printing method, a sublimation transfer method, an ink jet method, etc. Can be obtained.

After a color filter layer (pattern) is formed on the substrate 2, the metal wiring 3 can be formed on the color filter layer by the steps shown in FIGS. In this case, after forming a color filter pattern on the surface of the substrate 2, flattening the unevenness due to the pattern and forming a protective layer made of a resin material having a protective function, the steps shown in FIGS. ,
It is preferable to form the metal wiring 3. With such a protective layer, it is possible to prevent the color filter of the lower layer from being discolored in the etching step (particularly when using an etching solution such as an acid) when forming the metal wiring 3.

Subsequently, using the metal wiring board obtained as described above, a wiring board is manufactured through the steps shown in FIGS.

The end of the smoothing plate 1 along one side (one side perpendicular to the stripe direction of the electrodes of the metal wiring board opposed in a later step) is coated with a UV-curable resin 5 by a dispenser 6.
(FIGS. 9A and 9B).

Subsequently, the surface of the smoothing plate 1 on the side to which the resin 5 is supplied and the wiring surface 4a of the metal wiring board 4 on which a plurality of stripe-shaped metal wirings 3 having a thickness of about 1 μm are formed. The resin 5 is opposed to the metal wiring 3 so as to be perpendicular to the stripe direction, and the smooth plate 1 and the metal wiring board 4 are brought into contact with the resin 5 therebetween (FIG. 9C).

Next, the integrated body 45 sandwiching the resin 5 between the smoothing plate 1 and the metal wiring board 4 is preferably heated and passed through, for example, a pair of rotating rollers in a state where the resin 5 is caused to flow. The pressure portion is made of a resin 5 made of a smooth plate 1, a metal wiring board 4
The smooth plate 1 is moved from the end where the resin 5 is supplied along the stripe of the metal wiring 3 (in the direction of the arrow P) to the opposite side of the side where the resin 5 is supplied to the smooth plate 1 to form an integrated object. 45
Press Thus, the resin 5 is pushed and spread along the stripe direction of the metal wiring 3 (FIGS. 9D and 9E), and the resin 5 on the metal wiring 3 is eliminated by setting the pressing pressure.
The smoothing plate 1 and the metal wiring board 4 are brought into close contact with each other while filling the space between the metal wirings 3 (FIG. 9F).

FIG. 10 shows the pressing process.
Details are shown in (a) to (c). FIG. 2A is a diagram showing a planar structure at the time of a pressing operation, and FIG.
FIG. 3C is a diagram showing the structure of the side surface viewed from the side, and FIG. 4C is a diagram viewed from the side B in FIG.

The pressing step is carried out by passing the integral member 45 between the pair of rolls 7, whereby the integral member 45 moves relatively to the rolls 7, and accordingly, the pressurized portion is moved to the metal wiring 3. Move in the P direction. At this time, the moving direction P of the pressurized portion does not need to be completely parallel to the wiring 3. For example, as shown in FIGS. 11A to 11C, even when the metal wiring itself is bent at an angle at both ends of the substrate 2 at an angle compared to the center, the resin 5 is externally pressed by the pressure. What is necessary is just to operate to eliminate.

As described above, following the pressing step, FIG.
Similarly to the steps shown in (e) to (f), for example, UV light is irradiated from the side of the metal wiring substrate 4 (when the substrate 2 of the metal wiring substrate 4 is a translucent substrate), and the spread resin 5 is cured. After that, the resin 5 is filled between the metal wirings from the flat plate 1 and the integrated metal wiring board 4 is peeled off. Further, if necessary, a metal wiring board 4 in which the space between the metal wirings 3 is flatly filled with a resin 5 is provided on the metal wiring board 4 in correspondence with each metal electrode 3.
The transparent substrate 15 made of the above is provided to obtain the wiring board 10.

In the above embodiment, a UV-curable resin is used as the resin material. However, a material that can be cured by a process other than irradiation with UV light, such as an infrared-curable resin material or a thermosetting resin, may be used. Can also. In this case, the processing in the step shown in FIG.

The press apparatus used in the above embodiment will be described below.

Pressure rollers 201a, 201 shown in FIG.
b corresponds to the pair of rollers 7 shown in FIGS. 10 and 11, and the size thereof is set by the size resin of the substrate or the like.

Next, the load applied to the rollers 201a and 201b is such that two air cylinders 204a and 204b are used to push both ends of the roller shaft.
a, 201b bearings on the centering roller bearings 205a, 205b
By using b, 205c and 205d, the pressing force applied to the integrated body 45 of the smoothing plate 1 and the metal wiring board 4 and the roll press toy 207 containing them is equalized.

Next, as shown in FIG. 13 which is a view taken in the direction of the arrow A in FIG. 12, the upper and lower rollers 201a and 201b are driven by a servo motor shaft 206 'in order to rotate the upper and lower rollers at the same speed. One of them is driven by a split shaft 210 having two sprockets.
1 to the lower roller shaft 201b 'and the other to the rotating shaft 214 by the chain 212. At this time, a tension adjuster 213 is provided so that the slack of the chain 212 can be adjusted.

On the other hand, the driving force transmitted to the rotating shaft 214 is
A tension adjuster 217 is provided so that the rotation is transmitted to the rotation shaft 216 via the chain 215 and the slack of the chain 215 can be adjusted at this time. Here, the rotation shaft 216
The transmission of the driving force from the coaxial gear 219 to the gear 22
0 to the rotating shaft 201a '.

The upper roller 201a must rotate at the same speed as the lower roller 201b, and must be able to move up and down. Therefore, the rotating shafts of the rotating shafts 214 and 216 and the tension adjuster 217 are integrated by the swing arm 218, and the swing arm 21
Numeral 8 allows the robot to swing coaxially with the rotation shaft 214.

Further, the rotating shafts 216 and 201a 'are connected by a connecting member 221 which can be moved only up and down by a linear guide rail, so that the rotation of the upper roller 201a and the vertical movement are compatible. However, when the swing arm 218 moves, the rotation shaft 216 also moves slightly in the horizontal direction.
Supports the rotating shaft 216 with a long hole.

Next, a method of manufacturing the above-described liquid crystal element 11 will be described with reference to FIGS.

The steps from forming a metal wiring (electrode) 3 made of aluminum or the like on the substrate 2 to embedding the resin 5 between the lines of the metal wiring 3 and flattening the same are described in FIGS. This is the same as the method of manufacturing the wiring board shown by 11, and the description is omitted here.

Next, ITO (Indium Tin Oxide) forming a transparent electrode on the metal wiring 3 and the resin 5
The layer 30 is formed with a thickness of, for example, about 700 ° by a sputtering method (see FIG. 21A).

Next, this ITO (Indium Tin)
A photoresist 31 is coated on the Oxide) layer 30 by a spin coating method to a thickness of about 2 μm, and after exposing through a photomask 32 on which a wiring pattern is drawn, the photoresist 31 is developed and post-baked to form an etching pattern. It is formed (see FIGS. 21B and 21C).

Next, the substrate 2 on which the photoresist 31 is formed is immersed in an etching solution, for example, hydroiodic acid, and the portion of the ITO layer 30 not covered with the photoresist 31 is immersed.
Then, the photoresist 31 is peeled off, and the transparent electrode 15 is subjected to wiring patterning with respect to the metal wiring 3 (see FIG. 21D).

Next, if necessary, Ta is formed on the transparent electrode 15.
After forming the insulating layer 16 of Ox or the like, for example, polyamic acid (for example, manufactured by Hitachi Chemical Co., Ltd .; trade name: LQ180)
0) was diluted with NMP / nBC = 1/1 solution to 1.5 wt% and spin-coated at 2000 rpm for 20 sec.
Then, a heating and baking treatment is performed at 270 ° C. for about 1 hour to form an alignment film 17 having a thickness of about 200 ° (see FIG. 21E). Then, a rubbing process is performed on the alignment film 17.

Next, spherical spacer beads 14 (see FIG. 8) are arranged on the surface of one of the pair of substrates 2 and a sealing material 13 such as epoxy resin (see FIG. 8) is provided around the surface of the other substrate. ) Is applied by a flexographic printing method, and the pair of substrates 2 is bonded at a predetermined cell gap such that the rubbing directions of the pair of alignment films 17 are, for example, parallel or have a cross angle of several degrees and are in the same direction. By injecting the liquid crystal 12 between the substrate gaps as shown in FIG.
Was obtained.

By the way, in the above-described embodiment, in the pressing step shown in FIG. 9D or FIG. 9E, as described above, in order for the surface of the metal wiring 3 to be in close contact with the surface of the smooth plate 1,
Since the viscosity of the sandwiched resin 5 must be appropriately low, the metal wiring board 4 may reach a predetermined temperature in some cases.
In some cases, the resin 5 including the flat plate 1 and the smooth plate 1 is heated.

In the case of heating as described above, for example, first, FIG.
As shown in FIGS. 3A and 3B, a predetermined amount of resin 5 is dropped on the surface of the smoothing plate 1 with a dispenser 6 (8 points in FIG. 4), and then the wiring of the metal wiring board 4 is dropped as shown in FIG. Face 4
The heating is performed in a state where the a side is in contact with the resin 5 therebetween.
At this time, the air bubbles 21 are trapped between the integrated objects 45 as shown in FIG.

When the resin 5 is heated in this way, the viscosity of the resin 5 heated by the heating becomes excessively low depending on the conditions.
As shown in the figure, the thickness of the resin 5 spreads rapidly along the stripe of the metal wiring 3 and becomes thinner at the same time. However, the thickness of the resin 5 at that time changes due to the deflection and inclination of the metal wiring board 4. FIGS. 14B and 14C show the case where the area around the right side becomes thinnest. In this case, the spreading speed of the resin 5 decreases rapidly toward the right side. In addition, since the resin 5 does not spread under its own weight, the resin 5 spreads thereafter by a capillary phenomenon due to the surface tension of the resin 5.

For this reason, the difference in the size of the gap between the surface of the metal wiring 3 and the surface of the metal wiring board 4 before pressing with respect to the surface of the smoothing plate 1 increases as the thickness of the entire resin 5 decreases. Initially, for example, as shown in FIG. 15A, which is an enlarged view of the predetermined portion S1 in FIG. 14A, the resin 5 spreads uniformly, but gradually the resin 5 gradually spreads as shown in FIG.
As shown in FIG. 14, the resin 5a on the wiring 3 precedes, and thereafter, the preceding resin 5a is irregularly connected, and eventually an enlarged view of the predetermined portion S2 in FIG. A bubble 21 'is formed as shown in FIG.

The bubbles 21 ′ thus formed may not easily flow even in the case of the resin 5 in the pressing step, and the bubbles 21 ′ are formed in the resin in the steps shown in FIGS. 9A to 9 C. Along with the air bubbles, they may be left between the lines of the metal wiring 3 even after the pressing step.

The above-described problem occurs not only when the resin 5 is dropped on the edge of the substrate as shown in FIGS.
Even if it is dropped on any area of the metal wiring board 4, it may occur in common. Next, a first embodiment, which is a reference example made especially in view of the above-described problem, will be described with reference to FIG.

First, as shown in FIG.
The wiring of the metal wiring board 4 having a configuration in which the stripe-shaped metal wiring 3 having a thickness of about 1 μm is formed on the surface of the substrate 2 in the process shown in FIG. For example, a predetermined amount of a resin 5 as a polymer material is dropped on one end (an end along a side perpendicular to the metal wiring 3) of the surface 4a using a dispenser 6 or the like.

Here, in the step of supplying the polymer material, it is preferable that the amount of the resin 5 to be dropped is about 10 to 50 times the minimum amount required for embedding between the metal wirings 3. In addition, by setting such a dropping amount, as described later, the gap between the metal wiring board 4 and the smooth plate 1 is made as thick as possible so that a large amount of resin flows in the pre-pressing step and is filled. A region wider than a region between metal wirings to be covered can be covered with the resin 5.

Next, as shown in (b) and (c), the smooth plate 1 having a smooth surface is brought into contact with the metal wiring substrate 4 with the resin 5 interposed therebetween, so that the metal wiring substrate 4 and the smooth plate 1 are brought into contact with each other. Paste. At this time, if the smooth plate 1 is brought into rapid contact, the possibility that the air bubbles 21 are caught increases, so it is desirable that the contact be made as slowly as possible.

Preferably, the metal wiring board 4 shown in FIG.
The distance H1 between the substrate surface having the metal wiring 3 and the smooth plate 1 is set to be 50 to 200 times the thickness of the metal wiring.

Then, after the step of bonding the metal wiring board 4 and the smoothing board 1 to each other is completed, as shown in FIG. Is inserted in the direction of arrow a between a pair of first pressing rollers 8 which are pre-pressurizing means disposed opposite to each other, and preferably, the resin 5 is not heated, and the integrated member 45 is rotated.
Press

However, this press is not for pressing the smooth plate 1 against the surface of the metal wiring 3, but for keeping the gap 41 between the metal wiring substrate 4 and the smooth plate 1 at a predetermined width H2 while maintaining the resin 5 at a predetermined width H2. This is for widening the space between the metal wirings 3 more than the region R1 to be filled with the resin 5, and this first pressing step is referred to as a preliminary pressing step (preliminary pressing step). Preferably, H2 is 4 to 10 times the thickness of the metal wiring.
Double it.

Here, by using this pre-pressing step, even if air bubbles 21 are caught in the resin 5 in the bonding step (c) performed earlier, the substrates 1, 4 Due to the flow of the resin 5 that occurs during the process of reducing the width H1 of the gap 41 between the gaps to H2 by the preliminary press, the bubbles 21 can be moved in the direction of the arrow opposite to the direction of movement of the integrated object 45 shown by the arrow a. it can.

As a result, the bubbles 21 are discharged together with the extra resin 5 from the rear end of the transport of the smooth plate 1 and the metal wiring board 4, or at least the metal wiring 3 is not discharged.
Can be moved outside the region R1 to be filled with the resin 5. By moving the bubbles 21 at least between the metal wirings 3 and outside the region R1 to be filled with the resin 5, the influence of the bubbles 21 can be prevented.

Incidentally, even if it is necessary to lower the viscosity of the resin 5 in the subsequent pressing step, and if it is to be performed in a high temperature environment, the region R1 to be filled between the metal wirings 3 is already covered with the resin 5. As a result, no bubbles are generated due to the capillary phenomenon.

Various conditions can be considered for the pre-pressing conditions depending on the viscosity of the resin 5 and the capacity of the pre-press roller 8, but the pressing force is the minimum pressing force necessary to spread the dropped resin 5. It is desirable to keep the width H2 of the gap 41 as large as possible so as to maintain the pressure and secure the flow path of the resin 5 in the subsequent main pressing step.

As the pre-press roller 8 used in the pre-press step, basically the same roller as the main press roller 7 in the main press step described later may be used with various conditions changed. However, if the necessary pressure, temperature, rotation speed and the like are known in advance, it may be possible to prepare the device at a lower cost by preparing a dedicated device.

Next, after this pre-pressing step is completed,
The integrated material 45 ′ pre-pressed as shown in (e) is inserted between the pair of rotating pressing rollers 7 in the direction of arrow b,
The one piece 45 'is pressed from one side and brought into close contact. In the second pressing step (main pressing step), the resin 5 is removed from the surface of the metal wiring 3, and the metal wiring board 4 and the smooth plate 1 are strongly and uniformly adhered to the entire surface of the metal wiring board 4.

At this time, if the viscosity of the resin 5 is relatively high and it is difficult to remove the resin 5 on the surface of the metal wiring 3, this step is performed in an environment where the resin 5 is maintained at a high temperature in advance and heated. A method of reducing the viscosity of the resin 5 to facilitate the exclusion can be adopted.

The steps of the preliminary press and the main press are as follows.
It is preferable that the pressing be performed in the relationship between the metal wiring 3 and the pressing direction as shown in FIGS. 10, 11, and 16 (d).
An apparatus having the structure shown in FIGS.

After that, similarly to the above-described conventional technique, the resin 5 is cured by irradiating UV light as resin curing light from the side of the metal wiring board 4 (see FIG. 1E). Next, after the resin curing step is completed, the smooth plate 1 is peeled off from the integrated body of the metal wiring board 4 and the resin 5 by a release jig (not shown) (see FIG. 1F).

After the peeling step is completed, finally, the metal wiring 3 is filled with the resin 5 so as to be flat, that is, the metal wiring substrate 4 on which the flattening layer is formed. Then, a transparent electrode 15 such as an ITO film is formed to form the wiring substrate 10 (see FIG. 1G).

After forming the wiring substrate 10 by performing the steps up to the transparent electrode forming step, a liquid crystal element is manufactured through the steps shown in FIG. That is, the wiring board 10
An insulating layer 16 and an alignment film 17 are formed on the transparent substrate 15 as necessary, and then rubbing is performed on the alignment film 17. Next, as shown in FIG. 8, the wiring substrate 10 is opposed to another wiring substrate 10 formed in the same manner via a spacer 14, and finally, a liquid crystal 12 is sealed between both substrates 10 with a sealing material 13. To form a gap. Finally, the liquid crystal 12 is sealed in this gap, and the liquid crystal element 1
1 is completed.

Next, an example of the first embodiment as a reference example will be described.

In the present embodiment, aluminum is sputtered to a thickness of 2 μm on the surface of a soda-lime glass 2 having a size of 300 × 350 × 1.1 (mm) and polished on both sides in accordance with the process shown in FIG. After forming the film, the pitch is 320 μm and the wiring width is 20 μm by photolithography.
A metal wiring board 4 having a metal electrode 3 which is a stripe-shaped aluminum wiring pattern was prepared. further,
A-174 is used as a silane coupling agent on the surface.
A coupling treatment agent consisting of 1 part by weight (manufactured by Nippon Unicar Co., Ltd.) and 40 parts by weight of ethyl alcohol was spin-coated, and subjected to a heat treatment at 100 ° C. for 20 minutes to perform an adhesion treatment.

Next, a UV-curable resin composition as a resin 5 consisting of 50 parts by weight of pentaerythryl triacrylate, 50 parts by weight of neopentyl glycol diacrylate, and 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone was used to prepare a metal wiring. Using a dispenser 6 at one end on the wiring surface 4a side of the substrate 4, a total of 5 g was dropped at equal intervals at 10 points in a row in the direction perpendicular to the stripe direction of the metal wiring (see FIG. 16A). Separately, a smooth plate 1 was prepared by finishing a soda lime glass having a size of 300 × 340 × 1.1 (mm) to a flatness of 5 μm by double-side polishing.

Then, the smooth plate 1 is superimposed on the metal wiring board 4 on which the resin 5 has been dropped so that the resin 5 is in contact with the metal wiring board 4.
The width H1 of the gap 41 between the substrate and the metal wiring board 4 was about 200 μm. Also, as described above, the smooth plate 1 and the resin 5
When the bubbles 2 come into contact with each other, bubbles 2 having a diameter of 0.5 to 5 mm
Approximately 10 were confirmed visually (FIG. 16 (b),
(C)).

Thereafter, the width 40 of the structure shown in FIGS.
A set load provided with two upper and lower pre-press rollers 201a and 201b (corresponding to the roller 8 in FIG. 16 (d)) provided on a mandrel having a diameter of 0 mm and a diameter of 100 mm and silicon rubber having a thickness of 10 mm and a rubber hardness of 60 degrees Using a roll laminator machine of 100 kg, the end of the integrated body 45 of the smooth plate 1 and the metal wiring board 4 is sandwiched between the upper and lower pre-press rollers, and then the roller speed is 40 cm / min and the press pressure is about 1 kg / cm ^2. , 25 ° C.

By this preliminary pressing, the resin 5 was able to cover the entire region R1 in which the space between the metal wirings 3 should be filled with the resin 5 while maintaining the gap 41 having a width H2 of about 10 μm. In addition, during this pre-pressing, two bubbles 21 that had been caught in the resin 5 remained, but these bubbles 21
Since the gap was moved outside the region R1 to be filled with the resin 5, no problem occurred (see FIG. 16D).

Thereafter, in order to enhance the exclusion of the resin 5 in the subsequent main pressing step, the integrated body 45 of the smooth plate 1 and the metal wiring board 4 was heated at 60 ° C. for 20 minutes using an oven (preliminary heating). At this time, the resin 5 during heating did not cause a capillary phenomenon, and no generation of bubbles was confirmed.

Next, a roll laminator machine using the main press roller 7 having the same specifications as the preliminary press roller 8 (having the same structure as the apparatus having the structure shown in FIGS. 12 and 13; (Equivalent to 201a, 201b)
The roller speed is 20 cm / min and the pressing pressure is about 5 kg / min.
cm ² and a roller temperature of 60 ° C. (FIG. 16E)
reference).

Thereafter, 100 W from the metal wiring board 4 side
UV irradiation was performed for 2 minutes by using four high-pressure mercury lamps, and then the smoothing plate 1 was peeled off from the integrated body of the metal wiring substrate 4 and the cured resin 5 by a release jig. Finally, the transparent electrode 15 was formed on the metal wiring board 4 in which the space between the metal wirings 3 was filled with the resin 5 so as to be flat, thereby forming the wiring board 10.

Prior to the transparent electrode forming step, in order to measure the contact resistance value with the metal wiring 3, an IT having a pitch of 320 μm and a film width of 300 μm was adjusted in accordance with the metal wiring 3.
An O film was formed on the metal wiring substrate 4 and re-patterned by a photolithography / etching method. When the resistance value of a 120 mm pattern length was measured, all the electrode wirings showed a low resistance value of 800Ω or less. It was confirmed that a low-resistance metal wiring board 4 having no defect was formed.

As described above, by the preliminary pressurizing step added before the main pressurizing step, by moving at least bubbles generated at the time of manufacturing the wiring board to the outside of the metal electrode formation region before performing the main pressurizing step. , The adverse effects of air bubbles can be prevented. By preventing the bad influence of the bubbles in this way, the production yield of the wiring board can be improved, and the unit cost of the board can be reduced.

In the above description, the resin 5 is dropped on one end of a side perpendicular to the metal wiring stripe, and the pressurized portion is moved along the metal wiring stripe in the pre-pressing step and the main pressing step. However, the resin 5 is
It may be dropped on an arbitrary area above and moved in a direction having a predetermined angle with the metal wiring stripe in the pre-pressing step or the main pressing step.

In particular, the resin 5 is applied to the metal wiring board 4 and the smooth plate 1
The resin 5 is pushed along the metal wiring stripe direction by a pressing operation in which the resin 5 is supplied to one end of the metal wiring 3 and the pressing part moves along the stripe direction of the metal wiring 3. Along with the stripe direction, the final pressure end of the metal wiring board 4 and the smooth plate 1 (FIG. 9D,
(E), it is more preferable because it is quickly discharged from the right end of FIGS. 16 (d) and (e).

Next, a description will be given of a method of manufacturing a wiring board according to Embodiment 2 which is a reference example.

In the present embodiment, in the pre-pressing step in Embodiment 1 which is the reference example described above, these steps are performed before, during, or after in a low-temperature environment. In the environment of the resin 5
Can be increased.

By increasing the viscosity of the resin 5 in this way, the effect of making it easier to remove the bubbles 21 mixed in the pre-pressing step is obtained, and the width H2 of the gap 41 after the pre-pressing (FIG. 16 ( Since d)) also increases, the flow path of the resin 5 in the subsequent main pressing step can be secured wider, and the removal of the resin 5 can be performed more easily.

Next, an example of the second embodiment as a reference example will be described.

In this embodiment, after the bonding step is completed, the integrated body 45 of the metal wiring board 4 and the cured resin 5 is left in an environment of 5 ° C. for 30 minutes to increase the viscosity of the resin 5. The preliminary press shown in FIG. 16D was performed at room temperature.

As a result, the resin 5 was able to cover the entire region R1 to be filled with the resin 5 between the metal wires 3 while maintaining the gap 41 having a width H2 of about 15 μm. In addition, one bubble 21 that has been entrained in the resin 5 remains after the pre-pressing.
There was no problem because it was moving outside of 1. Further, the resin 5 during the preheating did not cause the capillary phenomenon, and the generation of bubbles was not confirmed.

Next, a description will be given of a method of manufacturing a wiring board according to Embodiment 3 which is a reference example.

In the present embodiment, the rotational speed of the pre-press roller 8 is set to a high speed of 80 cm / min or more in the pre-press step in the second embodiment which is the reference example described above. By rotating the pre-press roller 8 at a high speed, the flow speed of the resin 5 during the pre-press can be increased, and the bubbles 21 mixed during the liquid contact can be more easily removed.

Further, since the width H2 of the gap 41 after the pre-press can be increased, the flow path of the resin 5 in the subsequent main press step can be secured wider, and the removal of the resin 5 can be more easily performed. It can be carried out.

Next, an example of Embodiment 3 as a reference example will be described.

In this embodiment, the preliminary pressing step was performed at a rotation speed of the roller 8 of 100 cm / min.

As a result, the resin 5 was able to cover the entire region R1 to be filled with the resin 5 between the metal wires 3 while maintaining the gap 41 having a width H2 of about 20 μm. In addition, all of the air bubbles 21 entrained in the resin 5 were completely removed by the pre-press. Further, the resin during the preheating did not cause a capillary phenomenon, and generation of bubbles was not confirmed.

Next, a description will be given of a method of manufacturing a wiring board according to Embodiment 4 which is a reference example.

In this embodiment, as shown in FIG. 17, the interval D1 between the pre-press rollers 8 is fixed in the pre-press step in the first embodiment which is the reference example described above. By fixing the distance D1 between the preliminary press rollers 8 in this manner, the width H2 of the gap 41 after the preliminary press is kept constant regardless of the environmental temperature during the preliminary press and the rotation speed of the preliminary press roller 8. be able to. Thereby, the flow path of the resin 5 in the subsequent pressing step can be secured more widely, and the removal of the resin 5 can be performed more easily.

In order to further increase the effect of eliminating the bubbles 21 mixed during the liquid contact, the amount of the resin 5 to be dropped is increased in advance, and the width H2 of the gap 41 in FIG. Good. That is, by increasing the amount of the resin 5 to be dropped as much as possible, and by arbitrarily setting the interval between the pre-press rollers 8, the ability to remove the bubbles 21 mixed during the liquid contact and the resin on the metal wiring 3 during the press 5 can be arbitrarily controlled.

Next, an example of the fourth embodiment as a reference example will be described.

In the present embodiment, the interval D1 between the pre-press rollers 8 in the pre-press step is fixed so that the thickness H2 of the resin 5 is constant at about 10 μm in the pre-press step, and the space between the metal wires 3 is fixed. The entire region R1 to be completely filled was covered with the resin 5.

As a result, the bubbles 2 entrapped in the resin 5
No. 1 was completely removed by the pre-press. Further, the resin 5 during the preheating did not cause the capillary phenomenon, and the generation of bubbles was not confirmed.

By the way, as described above,
If a large amount of the resin 5 is dropped, the shape of the dropped resin 5 does not become spherical but expands by its own weight, and the contact with the smooth plate 1 becomes surface contact instead of point contact. Is more likely to be involved. For this reason, in such a case, it is preferable to divide the resin 5 at several points.

As another method, if the resin 5 does not droop, the resin 5 is dropped as shown in FIG. 18A, and then the dropped metal wiring board 4 is dropped as shown in FIG. The shape of the resin 5 is sharpened by inversion. By sharpening the shape of the resin 5 in this way, it is possible to make a point contact when the resin 5 comes into contact with the smooth plate 1 and to make it difficult for bubbles to be involved.

In any case, since the air bubbles are almost completely removed in the pre-pressing step, it is not always necessary to keep the air bubbles at zero. However, in order to improve the product yield, the resin 5 must It is desirable to set the dropping conditions and the like so as to prevent air bubbles from being caught as much as possible when contacting the surface. Also, the substrate to be brought into contact with the substrate to be dropped is:
The method does not necessarily have to be as shown in FIGS. 16 and 18, but may be a method in which the metal wiring board 4 is brought into contact with the smoothing plate 1 by dropping it.

Hereinafter, a method for manufacturing a wiring board according to an embodiment of the present invention will be described.

First, for example, the dimensions are 300 × 340 mm,
A metal wiring (electrode) 3 made of aluminum is provided on one surface of a (glass) substrate 2 having both sides polished to a thickness of 1.1 mm.
20 (see FIG. 19).
It is manufactured according to the process shown in FIG.

Here, the metal wiring 3 is formed, for example, as follows. First, for example, a film thickness of 2 μm forming a metal electrode is formed on the entire surface of the substrate 2 by sputtering.
Aluminum layer 23 is formed (see FIG. 20A), and a photoresist 24 is formed on this aluminum layer 23.
Is applied with a thickness of about 2 μm by a spin coating method, and is exposed through a photomask 25 on which a wiring pattern is drawn. Then, the photoresist 24 is developed and post-baked to form an etching pattern on the aluminum layer 23. (See FIGS. 20 (b) and 20 (c)).

Next, the substrate 2 having the photoresist 24 formed on the aluminum layer 23 is immersed in an etching solution.
The portion of the aluminum layer 3 not covered with the photoresist 24 was etched, and then the etching pattern was peeled off to form a metal wiring 3 made of aluminum on the substrate 2 (see FIG. 20D). The metal wiring 3 is patterned in a stripe shape having a width of 20 μm and a pitch of 300 μm, for example.

Subsequently, the manufacturing process of the wiring board will be described along the steps shown in FIG.

A coupling agent consisting of 1 part by weight of a silane coupling agent (for example, manufactured by Nippon Unicar Co., Ltd .; trade name: A-174) and 40 parts by weight of ethyl alcohol is provided on the metal wiring 3 side of the substrate 2. Is spin-coated, and then subjected to a heat treatment at 100 ° C. for 20 minutes to perform an adhesion treatment.

Next, for example, a liquid UV curable resin 5 is dropped in a fixed amount (for example, 800 mg in total) by a dispenser 6 on the surface of the substrate 2 on which the metal wiring 3 is formed (see FIG. 22A). . Here, the dispenser 6
For example, a nozzle diameter of 0.5 mm, a discharge pressure of 1 kg / cm ² ,
The ejection time was set to 1.2 seconds, and the number of drops was set to 5 points (in the figure, 1 point was dropped, but actually the substrate size is large, so it is divided into 5 points).

The amount of drop at one point was 160 mg so that 800 mg of resin was dropped. The time required for dropping was 6 seconds (1.2 seconds × 5). As the UV-curable resin 5, for example, a composition comprising 50 parts by weight of pentaerythryl triacrylate, 50 parts by weight of neopentyl glycol diacrylate, and 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone is used.

Here, the resin 5 dropped under these conditions
Is far more than the amount of resin necessary to bury the space between all of the metal wirings 3, but when the resin 5 is stretched by applying pressure in a later step, air bubbles mixed in the resin 5 are discharged. To do so, this amount of resin is required.

The manufacturing apparatus according to the present embodiment has a positioning jig 5 for positioning the smoothing plate 1 used for pressurizing the resin 5 in an area to be buried flat with the resin 5 on the substrate 2.
9a, 59b.
59b are arranged on the end face side of the substrate 2 (FIG. 22).
(B)).

The positioning jigs 59a, 59b
Is made of a metal such as SUS or a resin material such as a fluororesin. Also, the positioning jig 59
A concave portion 59 is provided inside a and 59b for storing the excess resin 5 protruding from between the metal wirings 3 at both ends when the resin 5 is stretched by pressing using the smooth plate 1 in a later step.
c, 59d are respectively formed.

Further, the tips 59e, 59f of the positioning jigs 59a, 59b are located slightly outside the metal wires 3 at both ends formed on the substrate 2, and are located between the tips 59e, 59f. The smooth plate 1 is just inserted.

That is, the size of the smoothing plate 1 in the pressing direction (the left-right direction in the figure) is formed to be slightly larger than the range L in which the space between the metal wirings 3 formed on the substrate 2 is to be flatly filled with the resin 5. Further, it is formed smaller than the substrate 2. In the present embodiment, for example, the smooth plate 1 has a size of 220 (width) × 290 (length) mm and a thickness of 1.1 mm, and both surfaces thereof are formed of a blue polished glass plate that is polished smoothly. . In order to facilitate the release of the resin 5 pressurized in a later step, a release agent made of a fluorine-based or silicon-based material is thinly applied to the surface of the smooth plate 1 in contact with the resin 5. You may leave.

Next, the smoothing plate 1 is arranged between the tip portions 59e and 59f of the positioning jigs 59a and 59b, and the resin 5 dropped between the metal wirings 3 is sandwiched (see FIG. 22C). Thereafter, in order to facilitate the flow of the resin 5, the resin 5 dropped between the metal wirings 3 on the substrate 2 is positioned by positioning jigs 59 a and 5.
The integrated body 45 sandwiched between the smoothing plates 1 disposed between 9b is placed in an oven (not shown) and heated at 60 ° C. for 20 minutes.

Next, the heated unit 45 is transported in the direction of arrow A by a transport device (not shown), and the upper and lower rollers 51a, 5a of a roll press device (not shown) are rotatable.
1b to stretch the resin 5 by applying pressure (FIG. 22).
(D), (e), (f) and (g)).

The rollers 51a and 51b are, for example, a metal roller body having a diameter of 80 mm and a length of 600 mm and silicon rubber (not shown) having a width of 220 mm and a thickness of 10 mm and a rubber hardness of 60 wound thereon. The substrate 2 and the smooth plate 1 are not damaged even if foreign matter such as dust is involved during roll pressing. Further, the rollers 51a, 51
b rotates at a peripheral speed of 20 cm per minute,
A total load of 500 kgf is applied to both ends of the rotating shafts 52a and 52b of the rollers 51a and 51b by an air cylinder (not shown).

Further, the rollers 51a and 51b are previously heated to a predetermined temperature (for example, 60 ° C.) by a heater (not shown) embedded therein. Further, the rollers 51a and 51b have the roller 51
A guide member (not shown) is provided such that the wound silicone rubber is positioned on the surfaces of a and 51b. The mechanism of the rollers 51a and 51b uses a structure as shown in FIGS.

Further, in the above-described device, the integrated member 45 is used.
Before and after the rollers 51a and 51b on the conveyance path, two photoelectric sensors 53a and 53b for detecting the timing of starting pressurization and releasing pressure of the integrated object 45, and detection signals from the photoelectric sensors 53a and 53b. Roller 51 based on
A control device 54 is provided for controlling the operation of starting pressurizing and releasing pressurization of the integrated object 45 by the a and 51b.

Here, the interval between the rollers 51a and 51b and the photoelectric sensors 53a and 53b is set to be substantially the same as the length of the smooth plate 1 (for example, 290 mm in the present embodiment). And the roller 5 of this roll press device
The pressurization by 1a and 51b is performed by photoelectric sensors 53a and 53b.
Based on the detection / non-detection (ON / OFF) signal of the integrated object 45 by b, the control device 54 controls as follows.

First, as shown in FIG. 22D, when the integrated object 45 is detected by the photoelectric sensor 53a (O
N), that is, when the integrated object 45 is being conveyed to the rollers 51a and 51b, the operation of the rollers 51a and 51b is turned off.
In F, the one-piece object 45 is not pressurized.

Then, as shown in FIG. 22E, when the rear end of the unit 45 passes over the photoelectric sensor 52a (at the time of OFF), that is, the front end of the unit 45 is
When the sheet is conveyed between a and 51b, the rollers 51a and 51b are operated to press the front end side of the substrate 2 and the flat plate 1 of the integrated object 45 and pressurize the same. Then, as shown in FIGS. 22F and 22G, when the front end of the integrated body 45 passes over the photoelectric sensor 52b after being pressed to the rear end side of the smooth plate 1 by the rollers 51a and 51b. (When OFF), that is, the roller 51
When the pressing of the integrated body 45 by a and 51b is completed, the pressing of the rollers 51a and 51b is released.

As described above, the roller 51a moves while pressing between the front end and the rear end of the smooth plate 1, and the roller 51b moves while pressing on the substrate 2. That is, the moving range of the rollers 51a and 51b for applying pressure is made larger than a region (the region L shown in FIG. 22B) to be buried flat with the resin 5 of the substrate 2 and smaller than that of the substrate 2. The resin 5 is uniformly embedded between all the metal wirings 3. Then, the resin 5 is removed from the upper surface of the metal wiring 3 by this pressure, and the smooth plate 1 and the substrate 2 are strengthened, and the resin 5 is evenly adhered to the entire surface of all the metal wirings 3 of the substrate 2 and flattened. Become

In the pressurizing step of the resin 5, as shown in FIG. 23, the excess resin 5a protruding from between the metal wires 3 at the end is removed by the concave portions 59c (59d) of the positioning jig 59a (59b). ), Accumulated excess resin 5a
Is the concave portion 59c (59d) due to the surface tension of the resin itself.
It does not flow out from the inside, and the recesses 59c (,
59d).

Next, the exposure masks 55a and 55b are put on the positioning jigs 59a and 59b, and the concave portions 59c and 59d are placed.
After not exposing the excess resin 5a accumulated inside,
UV light (having a peak wavelength of 365 nm) 56 is applied by two 100 W high-pressure mercury lamps (not shown) from above the smoothing plate 1.
The resin 5 stretched between the metal wires 3 is cured by irradiating the resin 5 for minutes (see FIG. 24A).

Next, positioning jigs 59a,
After removing the smoothing plate 1 with a release jig (not shown) (see FIG. 24B), the resin 5 is cured and embedded between the metal wirings 3 of the substrate 2 to form an integrated body. The resin 5 is uniformly embedded between all the metal wirings 3 on the substrate 2 by ultrasonic cleaning with isopropyl alcohol for 2 minutes to wash off the uncured extra resin 5a outside each metal wiring 3 on both sides. Thus, the wiring substrate 10 flattened is obtained (see FIG. 24C).

Then, each metal wiring 3 of this wiring board 10
As shown in FIG.
A transparent electrode 15 such as an ITO film is formed in accordance with the steps shown in FIG.

Further, as shown in FIG. 25, the sponge-like absorber 58 is provided in the concave portions 59c (59d) of the positioning jigs 59a, 59b, so that excess resin protruding from between the smooth plate 1 and the substrate 2. 5a can be absorbed, so that extra resin 5a protruding from between the smooth plate 1 and the substrate 2
Even if there is a large amount, the excess resin 5a protruding from the absorber 58 can be absorbed to prevent the positioning jigs 59a and 59b from being soiled.

Whether or not the sponge-like absorber 58 is provided in the concave portions 59c and 59d of the positioning jigs 59a and 59b depends on the accuracy of the resin supply amount of the dispenser 6 and the amount of the resin 5 necessary for eliminating air bubbles mixed therein. It can be determined by the amount of the excess resin 5a that protrudes, which is determined by the above. That is, when an inexpensive dispenser 6 having a low resin supply amount accuracy is used, it is effective to provide the absorber 58 in the concave portions 59c and 59d.

As described above, during the pressurizing step of the resin 5, the extra resin 5 a protruding from between the smooth plate 1 and the substrate 2 is used by the rollers 51 a and 51 b of the roll press device and the positioning jig 5.
A good wiring board 10 can be manufactured with good productivity without soiling members of the manufacturing apparatus such as 9a and 59b.

Even when air bubbles are mixed in the resin 5 or when the resin 5 is dropped and the pressure is increased while eliminating the air bubbles, the extra resin 5a including the air bubbles is removed by the positioning jig 59a, Since the uncured resin can be collected in the recesses 59c and 59d of the portion 59b and washed and removed, the yield can be improved and the favorable wiring board 10 can be manufactured.

In the form shown in FIG. 22, the pressing process using a roll (in FIGS. 22 (d) to (g), the movement of the pressurized portion is set perpendicular to the stripe direction of the metal wiring 3;
By forming this along the stripe direction of the metal wiring 3 as in the above-described embodiments shown in FIGS. 10, 11, and 16 (d), particularly when the dripping amount of the resin 5 is large, it occurs between the lines of the metal wiring 3. Bubbles can be reduced.

[0154]

As described above, according to the method for manufacturing a wiring board, the method for manufacturing a liquid crystal element, and the apparatus for manufacturing a wiring board of the present invention, the polymer material is removed from between the smooth plate and the substrate when the polymer material is pressed. Even if it protrudes, it can be prevented from adhering to and contaminating the members of the manufacturing apparatus, etc.
Further, a liquid crystal element using this can be manufactured.

The liquid crystal device obtained by the manufacturing method of the present invention has a structure in which a low-resistance metal wiring is provided under a transparent electrode, particularly when a chiral smectic liquid crystal is used.
Since the liquid crystal can be driven stably by suppressing the delay of the voltage waveform, display quality can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a general method of manufacturing a first wiring board along its steps.

FIG. 2 is a cross-sectional view showing a general method for manufacturing a second wiring board along the steps;

FIG. 3 is a sectional view showing a general method of manufacturing a third wiring board along the steps;

FIG. 4 is a first diagram illustrating a problem in the general method of manufacturing a wiring board.

FIG. 5 is a second diagram illustrating a problem in the above general method for manufacturing a wiring board.

FIG. 6 is a third diagram illustrating a problem in the above general method for manufacturing a wiring board.

FIG. 7 is a fourth diagram illustrating a problem in the general method of manufacturing a wiring board.

FIG. 8 is a sectional view showing a structure of a liquid crystal element obtained by a method of manufacturing a wiring board according to a reference example of the present invention.

FIG. 9 is a sectional view showing a method of manufacturing a wiring board according to a reference example of the present invention along basic steps.

FIG. 10 is a view showing a pressing step in the method of manufacturing a wiring board according to the reference example of the present invention.

FIG. 11 is a view showing a pressing step in the method for manufacturing a wiring board according to the reference example of the present invention.

FIG. 12 is a diagram showing a mechanism of a press device used in a method of manufacturing a wiring board according to a reference example of the present invention.

FIG. 13 is a view taken in the direction of the arrow A in FIG. 12;

FIG. 14 is a diagram showing a state of generation and growth of bubbles generated in the method of manufacturing a wiring board.

FIG. 15 is another view showing a state of generation and growth of bubbles generated in the method of manufacturing a wiring board.

FIG. 16 is a sectional view showing a first mode of the method for manufacturing a wiring board according to the reference example of the present invention along the steps.

FIG. 17 is a sectional view showing a fourth embodiment of a pressing step in the method of manufacturing a wiring board according to the reference example of the present invention.

FIG. 18 is a cross-sectional view showing a liquid crystal dropping process of still another mode in a method of manufacturing a wiring board according to a reference example of the present invention.

FIG. 19 is a sectional view showing the structure of a metal wiring board used in the method of manufacturing a wiring board according to the reference example of the present invention.

FIG. 20 is a cross-sectional view showing one embodiment of a method for manufacturing a liquid crystal substrate according to a reference example of the present invention along the steps.

FIG. 21 is a cross-sectional view illustrating some steps of one embodiment of a method for manufacturing a liquid crystal element according to a reference example of the present invention.

FIG. 22 is a sectional view showing an embodiment of the method of manufacturing a wiring board of the present invention along the steps.

FIG. 23 is a diagram showing a detailed structure of a positioning jig for determining a position of a resin used in the embodiment of the wiring board manufacturing method of the present invention.

FIG. 24 is a cross-sectional view showing another process according to the embodiment of the method for manufacturing a liquid crystal element of the present invention.

FIG. 25 is a view showing another embodiment of a positioning jig for determining the position of the resin used in the embodiment of the method of manufacturing a wiring board of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Smooth board 2 Glass substrate 3 Metal wiring 4 Metal wiring board 5 Resin 7 Roller for main press 8 Roller for preliminary press 10 Wiring board 11 Liquid crystal element 12 Liquid crystal 15 Transparent electrode 18 Flattening layer 21 Bubbles 45 Integrated material 51a, 51b Roller 59a , 59b Positioning jig 59c, 59d Recess

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02F 1/1343 G02F 1/1343 5E343 H05K 3/22 H05K 3/22 B (72) Inventor Hiroyuki Tokunaga Tokyo 3-30-2 Shimomaruko, Ota-ku Canon Inc. (72) Inventor Haruo Tomino 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F-term (reference) 2H088 FA18 FA30 HA01 HA02 HA04 HA12 MA10 2H090 HA01 HB07X HC05 HC17 HC18 HD03 JA05 JC14 JD14 LA01 LA15 2H092 GA05 GA17 HA04 JB24 JB33 JB58 KB04 MA05 MA13 MA37 NA19 NA28 PA01 PA08 4F041 AA02 AA05 AB02 BA05 BA22 BA56 4F042 AA02 AA02A06BA06 DD06 BB61 BB71 DD25 DD76 ER50 GG20

Claims (28)

[Claims] 1. A flowable polymer material is interposed between a smooth plate having a smooth surface and a substrate formed by patterning electrodes on the surface, and the polymer material is interposed between the smooth plate and the substrate. The sandwiched body is pressed, the polymer material is stretched, the substrate on which the electrodes are formed is brought into close contact with the surface of the smooth plate, and after the polymer material is cured, the substrate is separated from the smooth plate. In the method of manufacturing a wiring board for producing a wiring board in which the polymer material is flattened and embedded between the electrodes on the substrate, the size of the smooth plate is made flat with the polymer material of the substrate. A larger area than the area to be buried and smaller than the substrate, and a range of the pressurization larger than the area of the substrate to be buried flat with the polymer material and smaller than the substrate. Method of manufacturing a wiring board. 2. The method according to claim 1, wherein the smoothing plate is positioned corresponding to a region of the substrate to be buried flat with the polymer material. 3. The wiring board according to claim 1, wherein the pressing is performed by moving each surface of the substrate and the smooth plate from one side to the other side with a rotatable roller interposed therebetween. Manufacturing method. 4. The method according to claim 1, wherein the unit is transported to a position where the unit is pressurized, and the start and the release of the pressurization of the unit are controlled in accordance with an area of the substrate to be buried flat with the polymer material. 2. The method according to claim 1, wherein pressure is applied. 5. A method according to claim 5, wherein a concave portion is formed at an end portion of the substrate, and excess polymer material protruding from between the electrodes due to the pressure is stored in the concave portion so as not to leak out of the substrate. The method for manufacturing a wiring board according to claim 1, wherein: 6. The method according to claim 1, wherein the hardening of the polymer material is performed only in a region of the substrate to be buried flat with the polymer material. 7. The method for manufacturing a wiring board according to claim 1, wherein the polymer material is a UV-curable resin that is cured by irradiation of ultraviolet rays. 8. The method according to claim 7, wherein the UV curing resin is cured by irradiating ultraviolet rays from outside the smooth plate. 9. The method according to claim 7, wherein the substrate is a light-transmitting substrate, and the polymer material is cured by irradiating ultraviolet rays from the light-transmitting substrate side. 10. A smoothing plate having a smooth surface, and a polymer material dropping means for interposing a polymer material having fluidity between substrates formed by patterning conductive electrodes on the surface,
Pressing means for pressing an integrated body sandwiching the polymer material between the smooth plate and the substrate, stretching the polymer material, and bringing the substrate on which the electrodes are formed into close contact with the surface of the smooth plate; Curing means for curing the polymer material, a wiring board for peeling the substrate from the smooth plate, and flattening and embedding the polymer material between the electrodes on the substrate to produce a wiring board In the manufacturing apparatus, the size of the smooth plate is larger than a region of the substrate to be buried flat with the polymer material, and smaller than the substrate, and a pressing range of the pressing unit by the pressing unit is Positioning means for positioning the smoothing plate, which is larger than the area to be buried flat with the polymer material and smaller than the substrate, corresponds to the area of the substrate to be buried flat with the polymer material. Example was, apparatus for manufacturing a wiring substrate, characterized in that. 11. The pressurizing device according to claim 10, wherein said pressurizing means presses by moving each surface of said substrate and said smooth plate from one side to the other side with a rotatable roller interposed therebetween. Wiring board manufacturing equipment. 12. Detecting means for detecting timing of starting pressurization and release of pressurization of said integrated object by said pressurizing means, corresponding to an area of said substrate to be buried flat with said polymer material, 11. The apparatus for manufacturing a wiring board according to claim 10, further comprising: control means for controlling an operation of starting pressurization and release of pressurization of said integrated object by said pressurizing means based on a detection signal from said means. . 13. A positioning device according to claim 10, wherein said positioning means is provided with a recess for storing an excess of said polymer material protruding from a region of said substrate to be buried flat with said polymer material by pressure. The manufacturing apparatus of the wiring board according to the above. 14. The apparatus for manufacturing a wiring board according to claim 10, wherein the curing of the polymer material is performed only in a region of the substrate to be buried flat with the polymer material. 15. The apparatus for manufacturing a wiring board according to claim 10, wherein said polymer material dropping unit drops a UV curable resin which is cured by irradiation of ultraviolet rays. 16. The apparatus for manufacturing a wiring board according to claim 15, wherein said curing means irradiates ultraviolet rays from outside the smooth plate to cure the UV-curable resin. 17. The manufacturing method according to claim 15, wherein the substrate is a light-transmitting substrate, and the curing unit irradiates ultraviolet rays from the light-transmitting substrate side to cure the resin. apparatus. 18. A liquid crystal is sandwiched between a pair of wiring boards arranged to face each other and forming an electrode group, and at least one of the wiring boards is formed by patterning a conductive electrode on a translucent substrate. In a method for manufacturing a liquid crystal element, which is formed by flattening and is planarized by embedding a polymer material between the electrodes, the wiring substrate is formed by patterning a smooth plate having a smooth surface and a conductive electrode on the surface. A polymer material having fluidity is interposed between the substrates formed in the above-mentioned manner, and an integrated body sandwiching the polymer material between the smooth plate and the substrate is pressed, and the polymer material is stretched to form the smooth plate. The substrate on which the electrodes are formed is brought into close contact with the surface of the substrate, and after curing the polymer material, the substrate is formed by peeling the substrate from the smooth plate, and the size of the smooth plate is adjusted to the height of the substrate. Flat with molecular material The area to be pressed is larger than the area to be filled, and smaller than the substrate, and the range of the pressure is larger than the area of the substrate to be buried flat with the polymer material, and smaller than the substrate. Method for manufacturing a liquid crystal element. 19. The method according to claim 18, wherein the smooth plate is positioned corresponding to a region of the substrate to be buried flat with the polymer material. 20. The pressurizing method according to claim 18, wherein the pressing is performed by moving each surface of the substrate and the smooth plate from one side to the other side with a rotatable roller interposed therebetween.
The manufacturing method of the liquid crystal element of the description. 21. Conveying the integrated object to a position for pressurizing,
19. The liquid crystal device according to claim 18, wherein the pressurization is performed by controlling the timing of starting pressurization and releasing pressurization of the integrated object corresponding to a region of the substrate to be buried flat with the polymer material. Manufacturing method. 22. A concave portion is formed on each of the end portions of the substrate, and the excess polymer material protruding from between the electrodes due to the movement of the pressure is stored in the concave portion so as not to leak out of the substrate. 19. The method for manufacturing a liquid crystal device according to claim 18, wherein: 23. The method according to claim 18, wherein the curing of the polymer material is performed only in a region of the substrate to be buried flat with the polymer material. 24. The method according to claim 18, wherein the polymer material is a UV-curable resin that is cured by irradiation with ultraviolet rays. 25. The method according to claim 24, wherein the UV curing resin is cured by irradiating ultraviolet rays from outside the smooth plate. 26. The method according to claim 24, wherein the substrate is a light-transmitting substrate, and the polymer material is cured by irradiating ultraviolet light from outside the light-transmitting substrate. . 27. The method according to claim 18, wherein a transparent electrode is formed so as to be in electrical contact with at least a part of the electrode. 28. The method according to claim 18, wherein the liquid crystal is a chiral smectic liquid crystal.