JPH10502486A - Micromechanical structural elements and fabrication methods - Google Patents

Micromechanical structural elements and fabrication methods

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Publication number
JPH10502486A
JPH10502486A JP8503622A JP50362296A JPH10502486A JP H10502486 A JPH10502486 A JP H10502486A JP 8503622 A JP8503622 A JP 8503622A JP 50362296 A JP50362296 A JP 50362296A JP H10502486 A JPH10502486 A JP H10502486A
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layer
substrate
movable section
structural
spacer
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JP3830511B2 (en
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コツロフスキー フランク
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Siemens AG
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Siemens AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24405—Polymer or resin [e.g., natural or synthetic rubber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24562—Interlaminar spaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
  • Push-Button Switches (AREA)
  • Weting (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

(57)【要約】 基板（１）の上方に可動区分（２）を有している構造要素であって，有利にはフルオロカーボンから成るスペーサ（３）が該基板の表面上に存在しており，該スペーサは可動区分が支持体上に付着することを阻止する。 Abstract: A structural element having a movable section (2) above a substrate (1), wherein a spacer (3), preferably made of fluorocarbon, is present on the surface of the substrate. , The spacer prevents the movable section from adhering to the support.

Description

【発明の詳細な説明】 マイクロメカニック構造要素及び製作法 マイクロメカニック構造要素，例えばセンサ又はアクチュエータ，の可動素子 は，マイクロメカニック構造要素を使用する場合にも，また製作する場合にも， 支持体に付着したままになるという問題がある。このいわゆる「スティッキング 」は製作の際には，エッチング中及びエッチング後に，使用される液体を乾燥さ せる間の強い毛管作用によって生ずる。構造要素を使用する際には，可動部分が 基板に向かって過度に強くふれる場合に，この可動部分と基板表面との間に非常 に密な接触が生じ，可動部分が基板表面からもはや離れなくなる。 Ｄ．小林ほかによる文献“Photoresist-Assisted Release of Movable Micros tructures”（可動なマイクロ構造体のフォトレジストで補助された解放）［Jpn ．J．Appl．Phys．32，L1642−L1644（１９９３年）］には，フォトレジストか ら成る付加的な層を使用して，マイクロメカニック構造要素のための可動部分を 固定し，ウェットケミカル式のエッチングプロセスを行っても，可動部分が支持 体に付着したままにならないようにする方法が記載されている。フォトレジスト は次いで酸素プラズマ内で灰化させて，取り除か れる。 本発明の課題は，表面構造体の可動区分の基板への付着が防止されているマイ クロメカニック構造要素並びにこのマイクロメカニック構造要素の製作方法を提 供することである。 この課題は，請求項１の特徴を有する構造要素並びに請求項３の特徴を有する 製作方法によって解決された。本発明の実施の形態は従属項に記載したとおりで ある。 本発明による構造要素においては，基板とマイクロメカニック構造体との間で ，基板の表面に，別個に取り付けられた材料から成る小さなスペーサが設けられ ている。このスペーサによって，基板の表面が平らでなくなり，可動区分，つま り構造要素の可動素子が単にわずかな箇所でこれらのスペーサと接触するように なり，したがって支持体上への付着が阻止されている。 これらのスペーサは有利には次のようにして製作される。すなわち，犠牲層及 び可動部分を製作するための構造層を基板上にたい積させた後に，構造層を製作 すべき可動区分に合わせて構造化し，犠牲層を，少なくともスペーサのための範 囲において少なくとも部分的に取り除くのである。有利には，犠牲層の残部は， スペーサの製作段階が実施される間，可動部分のための支持部として構造層と基 板との間に残る。次いで， スペーサのための材料から成る層がたい積せしめられ，その一部は構造層の可動 区分の範囲と基板との間に達する。このようにして，既にウェットケミカル式に 取り除かれている犠牲層の部分は少なくとも部分的に埋められる。まだ残ってい る犠牲層部分を後から取り除かなければならない場合には，スペーサのためにた い積せしめられる材料は，後からの犠牲層部分のエッチングプロセスに耐えるも のが選ばれる。スペーサのための層のたい積の条件が，可動区分のための構造層 部分の下側の層厚が構造層のマスク作用に基づいて，露出している箇所における 層厚よりもわずかであるように，選ばれている場合には，マイクロメカニック構 造体，特に可動区分は，過剰の層部分を取り除いた後に，単に点状に支持体と接 触するに過ぎない。マイクロメカニック要素が既に完全に犠牲層を除去されてい て，構造層の当該の区分が自由に可動である場合には，スペーサのためにたい積 される層は犠牲層のエッチング剤に耐える必要はない。有利にはスペーサのため の層は，例えばプラズマ反応器内で電界の作用でたい積させることができるフル オロカーボンが使用される。 以下においては図１〜図４に基づいて，本発明を詳細に説明する。 図１〜図３は本発明による構造要素の種々の製作段階における中間製品の横断 面を示す。 図４は本発明による構造要素の代替製作段階における中間製品を示す。 図１において，半導体板，半導体層構造体などである基板１の上方に，可動区 分２，つまりマイクロメカニック構造要素の可動部分がこの基板１から間隔をお いて示されている。図面を簡単にするために，この区分２の懸架機構及び図平面 よりも奥に配置されている構造要素部分は取り除いてある。この構造体は例えば 前述のようにして製作され，基板１上に犠牲層が，次いでその上に可動部分のた めの材料から成る構造層が取り付けられる。構造層は当該の構造要素に合わせて 構造化される。次いで犠牲層が取り除かれる。次いで，ほぼ，図１に示した複線 矢印５の方向にスペーサのための材料が層として取り付けられる。この場合たい 積は完全に異方性には行われず，拡散性に行われ，したがって，取り付けられた 層６の一部は，図２に示すように，可動区分２の下側にも取り付けられている。 プラズマ反応器内でたい積を行う場合には，例えば図１において単線矢印で示し た基体１に向いた電界によって，たい積を補助することができる。 たい積した層６は例えばフルオロカーボンであるのがよい。図２に示したよう に，この層はわずかに拡散性のたい積によって，第１の平らでない層部分の形で 基板１上に，かつ第２の層部分の形で可動区分２上に沈着する。たい積条件が次 のように，すなわち可動区 分２の下側の層厚が，可動区分２のマスク作用によって，自由に接近可能な箇所 における層厚よりも薄くなるように，選ばれている場合には，可動区分は単にわ ずかな箇所で（点状に）支持体と接触することになる。図２に示した状態のとき に，たい積段階を終了させることが可能である。なぜなら既にこの場合，マイク ロメカニック構造体の可動区分の支持体への付着が回避されているからである。 可動区分の表面上の第２の層部分が障害となる場合には，この層６に強く異方性 のエッチングを実施すると，図３に示した小さなスペーサ３だけが残される。 図３は本発明による構造要素の１実施例の横断面を示す。可動区分２が運動す る場合，スペーサ３は可動区分が基板と接触することを阻止する。スペーサは極 めて小さくて，スペーサと可動区分との間の可能な接触面はわずかであり，構造 要素の運転中に可動区分がスペーサに付着したままになることはない。スペーサ によって，可動区分と基板との間の接触も防止される。 図４はスペーサを製作した後の本発明による構造要素の中間製品の横断面を示 す。この実施例では，犠牲層残部４が構造層と基板との間に残されている。これ らの犠牲層残部４は構造層の可動区分２のための部分を，スペーサ３が製作され るまで，支えている。犠牲層残部４は，犠牲層の取り除きのために使用されたウ ェットケミカルのエッチング溶液を乾燥させる際に，構造層が基板の表面に付着 したままになることを阻止する。更に，スペーサの製作中の構造化された区分の 運動が阻止される。これらの犠牲層残部４は，小さなスペーサの製作のため及び 構造層上にたい積された層６の部分の取り除きのための異方性エッチングが行わ れる前に，又は行われた後に，取り除くことができる。犠牲層残部の代わりに， 例えば最初に述べた小林氏の文献に記載されているようにして，フォトレジスト ，ＰＭＭＡ又はポリマー，有利には例えばポリスチロールから成る仮のスペーサ を使用することができる。有利には本発明による構造要素はケイ素を使用して製 作される。DETAILED DESCRIPTION OF THE INVENTION Micromechanical Structural Elements and Methods of Fabrication The movable elements of a micromechanical structural element, such as a sensor or actuator, are supported on a support when using and manufacturing the micromechanical structural element. There is a problem that it remains attached. This so-called "sticking" occurs during fabrication due to strong capillary action during and after etching, during drying of the liquid used. When using a structural element, if the moving part touches the substrate too hard, very close contact will occur between the moving part and the substrate surface and the moving part will no longer leave the substrate surface . D. Kobayashi et al., “Photoresist-Assisted Release of Movable Microstructures” (Photoresist-assisted release of movable microstructures) [Jpn. J. Appl. Phys. 32 , L1642-L1644 (1993)], using an additional layer of photoresist to secure the moving parts for the micromechanical structural elements and to perform a wet chemical etching process. A method is described for preventing moving parts from remaining attached to a support. The photoresist is then ashed in an oxygen plasma and removed. SUMMARY OF THE INVENTION It is an object of the present invention to provide a micromechanical structural element in which the movable sections of the surface structure are prevented from adhering to the substrate and a method for producing the micromechanical structural element. This object has been achieved by a structural element having the features of claim 1 and a manufacturing method having the features of claim 3. Embodiments of the present invention are as described in the dependent claims. In the structural element according to the invention, between the substrate and the micromechanical structure, a small spacer made of a separately mounted material is provided on the surface of the substrate. These spacers make the surface of the substrate non-planar, so that the movable sections, i.e. the movable elements of the structural element, come into contact with these spacers only in a few places, thus preventing their adhesion on the support. These spacers are advantageously manufactured as follows. That is, after the sacrificial layer and the structural layer for producing the movable part are deposited on the substrate, the structural layer is structured for the movable section to be produced, and the sacrificial layer is at least partially in the area for the spacer. Remove it. Advantageously, the remainder of the sacrificial layer remains between the structural layer and the substrate as a support for the movable part during the step of fabricating the spacer. Then, a layer of material for the spacers is deposited, part of which extends between the area of the movable section of the structural layer and the substrate. In this way, the portion of the sacrificial layer that has already been removed in a wet chemical manner is at least partially filled. If the remaining sacrificial layer must be removed later, the material deposited for the spacer is chosen to withstand the subsequent sacrificial layer etching process. The condition of the layer deposition for the spacers is such that the layer thickness under the structural layer part for the movable section is less than the layer thickness at the exposed points, based on the masking action of the structural layer. If selected, the micromechanical structure, in particular the movable section, only contacts the support in a point-like manner after removing the excess layer parts. If the micromechanical element has already been completely removed of the sacrificial layer and the relevant section of the structural layer is free to move, the layer deposited for the spacer does not have to withstand the sacrificial layer etchant . The layer for the spacer is preferably a fluorocarbon which can be deposited, for example, by the action of an electric field in a plasma reactor. Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 3 show cross sections of an intermediate product at various stages of the production of a structural element according to the invention. FIG. 4 shows an intermediate product in an alternative manufacturing stage of a structural element according to the invention. In FIG. 1, above a substrate 1, which is a semiconductor plate, a semiconductor layer structure, etc., a movable section 2, ie a movable part of a micromechanical structural element, is shown spaced from this substrate 1. For the sake of simplicity of the drawing, the suspension mechanism of this section 2 and the structural elements which are located further away from the plane of the drawing have been removed. This structure is produced, for example, as described above, on which a sacrificial layer is mounted on a substrate 1 and then a structural layer made of the material for the movable parts. The structural layer is structured according to the structural element concerned. Then the sacrificial layer is removed. The material for the spacer is then applied as a layer, substantially in the direction of the double-headed arrow 5 shown in FIG. In this case, the deposition does not take place completely anisotropic, but takes place in a diffusive manner, so that a part of the applied layer 6 is also mounted below the movable section 2 as shown in FIG. I have. When the deposition is performed in the plasma reactor, the deposition can be assisted by, for example, an electric field directed to the substrate 1 indicated by a single arrow in FIG. The deposited layer 6 may be, for example, a fluorocarbon. As shown in FIG. 2, this layer is deposited on the substrate 1 in the form of a first uneven layer part and on the movable section 2 in the form of a second layer part by a slightly diffusive deposit. . When the deposition conditions are selected as follows, ie the thickness of the layer below the movable section 2 is smaller than the layer thickness at a location that is freely accessible by the masking action of the movable section 2 In other words, the movable section will only come into contact with the support at a few points (point-like). In the state shown in FIG. 2, it is possible to end the deposition phase. This is because, in this case, the adhesion of the movable section of the micromechanical structure to the support is already avoided. If the second layer part on the surface of the movable section is obstructive, a strong anisotropic etching of this layer 6 leaves only the small spacers 3 shown in FIG. FIG. 3 shows a cross section of one embodiment of a structural element according to the invention. When the movable section 2 moves, the spacer 3 prevents the movable section from contacting the substrate. The spacer is very small, the possible contact surfaces between the spacer and the movable section are small and the movable section does not remain attached to the spacer during operation of the structural element. The spacer also prevents contact between the movable section and the substrate. FIG. 4 shows a cross section of an intermediate product of a structural element according to the invention after the spacer has been produced. In this embodiment, the remaining sacrificial layer 4 is left between the structural layer and the substrate. These rests of the sacrificial layer 4 support the part of the structural layer for the movable section 2 until the spacer 3 is manufactured. The remaining sacrificial layer 4 prevents the structural layer from remaining on the surface of the substrate when the wet chemical etching solution used to remove the sacrificial layer is dried. Furthermore, movement of the structured section during fabrication of the spacer is prevented. These sacrificial layer remnants 4 may be removed before or after anisotropic etching has been performed for the fabrication of small spacers and for removing portions of layer 6 deposited on the structural layer. it can. Instead of a sacrificial layer, temporary spacers made of photoresist, PMMA or a polymer, preferably for example polystyrene, can be used, for example, as described in Kobayashi, cited above. Advantageously, the structural element according to the invention is made using silicon.

Claims (1)

【特許請求の範囲】 １．基板（１）の上方に間隔をおいて配置されているマイクロメカニック構造の 可動区分（２）を有しているマイクロメカニック構造要素であって，スペーサ（ ３）が，可動区分と基板の該可動区分に面した表面との間で，基板の該表面上に ，存在しており，これらのスペーサの寸法は，可動区分の基板又はスペーサへの 付着が阻止されるように，定められている，マイクロメカニック構造要素。 ２．スペーサがフルオロカーボンから成っている，請求項１記載の構造要素。 ３．請求項１又は２記載の構造要素の製作法であって， ア 基板上に犠牲層及び構造層を取り付け， イ 構造層を製作すべき可動区分に合わせて構造化し， ウ 犠牲層を可動区分と基板との間で少なくとも部分的に取り除き， エ 可動区分と基板との間でスペーサの材料から成る層部分をたい積させ， オ 該層部分をエッチングして，スペーサを製作する， 段階より成る，製作法。 ４．段階エにおいて，構造層の可動区分のための部分のマスク作用を利用して， スペーサの材料から成る層を平らでない層厚でたい積させる，請求項３記載の方 法。 ５．段階エにおいて，たい積を，プラズマ反応器内で，基板に向いた電界（Ｅ） の作用のもとで，フルオロカーボンの拡散性たい積として実施する，請求項２の 構造要素を製作するための，請求項３又は請求項４記載の方法。 ６．段階ウにおいて，犠牲層を，構造層の可動区分のための部分と基板との間に 残って，段階エ及び段階オが行われる間に可動区分が基板に付着することを阻止 する残部（４）を除外して，取り除き，段階オの後に別の段階カにおいて，該犠 牲層残部を取り除く，請求項３から請求項５までのいずれか１項記載の方法。[Claims] 1. Of a micromechanical structure spaced above the substrate (1) A micromechanical structural element having a movable section (2), comprising a spacer ( 3) on the surface of the substrate between the movable section and the surface of the substrate facing the movable section. Exist, and the dimensions of these spacers are A micromechanical structural element that is defined to prevent adhesion. 2. 2. The structural element according to claim 1, wherein the spacer comprises a fluorocarbon. 3. A method of manufacturing a structural element according to claim 1 or 2, A. A sacrificial layer and a structural layer are attached on the substrate, B) Structure the structural layer according to the movable section to be manufactured, C) removing the sacrificial layer at least partially between the movable section and the substrate; D. Depositing a layer portion made of a spacer material between the movable section and the substrate, (E) etching the layer to produce a spacer; A production method consisting of stages. 4. In step d, utilizing the masking action of the part for the movable section of the structural layer, 4. The method according to claim 3, wherein the layer of spacer material is deposited with an uneven layer thickness. Law. 5. In step d, the deposition is carried out in a plasma reactor by an electric field (E) facing the substrate. 3. The method according to claim 2, which is carried out under the action of A method according to claim 3 or claim 4 for producing a structural element. 6. In step c, the sacrificial layer is placed between the substrate for the movable section of the structural layer and the substrate. Remains to prevent movable sections from adhering to the substrate during steps d and e Except for the remaining part (4), remove and remove the sacrificial 6. The method according to claim 3, wherein the remaining layer is removed.
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