JPH10335789A - Manufacture of circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to enable a prescribed function and characteristics to impart to a conductive material, by a method wherein a plating or other metal layer such as an individual piece is formed on the surface of the conductive material, a laser beam is irradiated on the material and the metal layer, and, at the same time, the material and the metal layer are molten and are alloyed. SOLUTION: A conductor 1 is formed into a circuit pattern for constituting a prescribed circuit and thereafter, a plating 2 is applied to the conductor 1 or a conductor material applied with a plating 2 is formed into a circuit pattern, and the conductor 1 is formed integrally with a resin 3 to constitute a circuit board. After that, a laser beam is irradiated on the conductor 1 and the plating 2 to melt partially the conductor 1 and the plating 2, and the conductor 1 and the plating 2 are alloyed. By taking place the laser irradiation, various alloys are formed of the conductor material 1 and the plating 2, the strength of the bending part of the material 1 is enhanced by the characteristics of those alloys, and the characteristics requisite to the material 1 such as impartment of the wear resistance of the point parts of terminals can be imparted to the material 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit board constituting a circuit of an electronic device.

[0002]

2. Description of the Related Art In recent years, electronic devices have been required to have a wide variety of functions in addition to lightness and size, and circuit boards constituting electronic devices have also been required to have many characteristics. 2 (a) and 2
An example of a conventional circuit board will be described with reference to FIG.

FIG. 2A shows a conventional circuit board, 1 is a conductor, 2 is plating, and 3 is a resin. A method of manufacturing the circuit board configured as described above will be described below. First, in FIG. 2A, the conductor 1 forms a predetermined circuit by using a pressing method or an etching method.

[0004] The surface of the conductor 1 is subjected to plating 2 if necessary. As the plating method, there is a method of plating the end surface of the conductor 1 after forming a circuit, a method of plating a plate-shaped surface before processing, a clad material formed by bonding an extremely thin metal. There is also a method of using a so-called conductor. In this case, when the conductor 1 is formed, the conductor 1
A portion without plating is formed on the end face of the substrate.

A predetermined circuit board is formed by integrating the conductor 1 and the resin 3 as an insulator. further,
As another method, as shown in FIG. 2B, there is a method in which the conductor 1 after forming the circuit and the resin 3 are integrated, and then the plating 2 is applied. In any of the methods, the properties required for the conductor 1 include not only electrical continuity but also workability, economy, strength, and the like.

In order to satisfy these requirements, the required functions are determined by selecting the material and the material of the plating 2. However, the material of the conductor 1 is the same in all parts, and the material is changed within the same circuit board. It cannot be changed, the strength is changed by changing the width of the conductor 1, the solder is raised on the surface of the conductor 1, or the conductivity, strength,
A method of changing electric capacity is used.

[0007]

However, the above configuration has a problem that the functions and characteristics required of recent electronic devices cannot be sufficiently satisfied. The present invention has been made in view of the above problems, and provides a method of partially alloying a conductor 1 constituting a circuit board using a material of the conductor 1 as a base material to obtain predetermined functions and characteristics.

[0008]

In order to solve the above problems, the present invention forms another metal layer such as plating or individual pieces on the surface of a conductive material, and irradiates the conductive material and the metal layer with a laser. And
At the same time, it is provided with a structure for giving a predetermined function and characteristics to the conductive material by melt alloying.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION
In a circuit board made of conductive material and resin material, another metal layer is formed on the surface of the conductive material, and the conductive material and the metal layer are irradiated with a laser and simultaneously melt-alloyed. A method for manufacturing a circuit board, in which a conductive material and another metal are subjected to the heat and the laser by utilizing a feature capable of partially acting on the conductive material. Has the effect of forming an alloy having the properties required for

According to a second aspect of the present invention, there is provided a method of manufacturing a circuit board according to the first aspect, wherein another metal material is adhered to the surface of the conductive material by plating or vapor deposition. Another metal is attached to the conductive material by a simple method such as plating or a CVD method, and has an effect of forming an alloy only in a portion of the conductive material requiring characteristics such as abrasion resistance.

According to a third aspect of the present invention, there is provided a method of manufacturing a circuit board according to the first aspect, wherein different metal layers are formed on the front surface and the back surface of the conductive material. Alloying can be performed by melting various kinds of materials, the number of combinations of materials can be increased, and the range of required characteristics can be widened. According to a fourth aspect of the present invention, there is provided the method of manufacturing a circuit board according to the first aspect, wherein a plurality of different metal layers are formed on both surfaces or one surface of the conductive material. Has the effect of further expanding the range of selection of desired characteristics.

According to a fifth aspect of the present invention, there is provided the method of manufacturing a circuit board according to the first aspect, wherein another metal material is provided on the surface of the conductive material in individual pieces. By disposing another metal piece in a portion where required characteristics are required, it has an effect of forming an alloy having required characteristics. In particular, plating is effective when it is difficult to secure a sufficient amount as a metal material.

According to a sixth aspect of the present invention, in a circuit board formed using a conductive material and a resin material, a metal layer that does not fuse with the conductive material is formed on the surface of the conductive material, A method of manufacturing a circuit board, comprising irradiating a layer with a laser and simultaneously melting the same to form a metal layer that is not alloyed in the conductive material, wherein a material that does not fuse with the conductive material is melted together with the conductive material. However, by taking in the conductive material, the conductive material has an effect of providing two characteristics, that is, a characteristic of the conductive material and a material characteristic that does not fuse with the conductive material.

According to a seventh aspect of the present invention, in a circuit board made of a conductive material and a resin material, a paint-like film made of a metal powder or a material other than a metal is formed on the surface of the conductive material. A method for manufacturing a circuit board, characterized in that a conductive material and a paint-like film are irradiated with a laser and heated and reacted at the same time, and cannot be attached to a conductor surface by a powdery material, a plating method, a CVD method, or the like, or A material which is difficult to adhere is finished into a paint by using a predetermined solvent or an adhesive, has an action of attaching to the surface of the conductive material and causing a heat reaction by a laser to impart predetermined characteristics to the conductive material.

The invention according to claim 8 is characterized in that a metal powder or a paint-like film of a material other than metal is formed on the surface of the conductive material and then dried to form individual pieces. The method for producing a circuit board according to the above, wherein the paint-like material used in claim 7 is dried and solidified to a certain size, and has an effect of imparting required characteristics to the conductive material.

According to a ninth aspect of the present invention, a material such as an antioxidant, an activator, or a metal ionic agent at the time of melting of a metal by a laser is mixed with a metal powder or a material for converting a material other than a metal into a paint. 8. The method for manufacturing a circuit board according to claim 7, wherein the method has a function of preventing oxidation of a metal, promoting alloying, and supplying a trace amount of metal in the form of ions during a molten alloy. .

According to a tenth aspect of the present invention, in a circuit board composed of a conductive material and a resin material, a portion having a small cross-sectional area is partially formed in the conductive material, and another metal is formed in the portion. In addition, it is a method of manufacturing a circuit board characterized by irradiating a laser and simultaneously forming a molten alloy.It is possible to set the melting temperature in addition to the current capacity and resistance value, and to form a more accurate pattern fuse. Has a function that can be.

According to an eleventh aspect of the present invention, there is provided a circuit board made of a conductive material and a resin material, wherein the thickness of the conductive material and plating, the thickness of the paint, the thickness of the conductive material and the metal piece, The method of manufacturing a circuit board according to any one of claims 1 to 10, wherein a property of the alloy is changed by changing a thickness of the piece or a volume ratio.
By controlling the thickness or volume of the paint, metal pieces, and dry paint pieces, the mixing ratio required for alloying is changed, and an effect of obtaining a stable quality alloy can be obtained.

According to a twelfth aspect of the present invention, the laser irradiation time and the amount of heat are controlled in a circuit board made of a conductive material and a resin material.
11. The method for manufacturing a circuit board according to any one of items 10, wherein the method is performed according to characteristics required by the conductive material, such as a case where the entire thickness of the conductive material is alloyed and a case where only a part of the conductive material is alloyed. Alloying, and has the effect of diversifying the characteristics.

According to a thirteenth aspect of the present invention, in a circuit board made of a conductive material and a resin material, an arbitrary portion of the conductive material is irradiated with a laser, and the conductive material is heated. This is a method of manufacturing a circuit board characterized by changing the characteristics of the material.It is necessary for conductive materials by partially heating and cooling under predetermined conditions, utilizing the structural change due to heating and cooling of metal. It has the effect of imparting various characteristics.

Hereinafter, a circuit board according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a first embodiment of the present invention.
It is sectional drawing of the circuit board in embodiment. FIG.
In (a) to (d), 1 is a conductor, 2 is plating, 3 is a resin, 4 is an alloy, 5 is a laser, 6 is a terminal, 7 is a metal piece,
Reference numeral 8 denotes a small cross section, and 9 denotes a metal piece. First, FIG.
Is to form a circuit pattern by forming a conductor 1 into a circuit pattern constituting a predetermined circuit and then applying plating 2 or forming a conductor material plated with 2 into a circuit pattern and integrating with a resin 3 to form a circuit board After that, irradiate the laser, conductor 1 and plating 2
Is partially melted and alloyed.

By conducting laser irradiation, the conductive material 1
And plating 2 to form various alloys, and the characteristics of the alloys can provide necessary characteristics such as improvement in the strength of the bent portion and abrasion resistance at the terminal tip. For example, when the material of the conductor 1 is copper and the material of the plating 2 is selected, the alloy formed and its characteristics are copper + tin = bronze (abrasion resistance), copper + tin + phosphorus = phosphor bronze ( Spring +), copper + beryllium = beryllium copper (springiness), etc., and the plating material is appropriately selected according to the characteristics required for the conductor.

Of course, in this case, it is needless to say that the composition of each material should be considered as necessary. FIG. 1B is a cross-sectional view of the case where the alloy 1 is formed by performing the plating 2 on the conductor 1. By irradiating the laser 5 from left to right with a predetermined intensity, an alloy is formed by the conductor 1 and the plating 2.

Therefore, it is possible to form an alloy having necessary characteristics only in necessary portions. In addition, by changing the material of the surface treatment of the surface of the conductor and the back surface and melting and alloying with a laser, three types of materials including the conductor can be melted and alloyed, and the number of combinations of materials increases and demands The range of characteristics can be expanded. Further, by forming the surface treatment on both sides or one side of the conductor in a plurality of layers with different materials, it is possible to further widen a range of selection of desired characteristics.

At this time, by adjusting the irradiation intensity and time of the laser 5, it is possible to freely alloy the entire thickness of the conductor 1 or alloy the conductor 1 while partially retaining the characteristics of the conductor 1. . This is the same in the following embodiments. FIG. 1C shows a method of forming an alloy without plating 2 on a conductor 1 when forming a circuit pattern.

At a predetermined position of the conductor 1, a metal piece 7 having a predetermined size or volume of a material required for the alloy 4 is set, and laser irradiation is performed. The conductor 1 and the metal piece 7 that have been melted by the laser are alloyed, so that the conductor 1 can be given necessary characteristics.
In FIG. 1D, a small cross-section 8 is formed in a part of the conductor 1 by using a pressing method and an etching method so as to be narrower than the other conductors so that the conduction resistance is increased. Further, another metal is added to the portion 8 and the conductor 1 is irradiated with a laser together with the conductor 1 to form a molten alloy, thereby imparting characteristics required for a predetermined pattern fuse.

Of course, it is possible to select whether or not to form the small cross section 8 depending on the conductor material, the conductor width, and the thickness of the conductor. If the characteristics can be obtained by alloying, it is not necessary to form the small cross section 8. . In FIG. 1E, a metal piece 9 that does not melt with the conductor 1 is overlapped with the conductor 1 and simultaneously melted by a laser. The two melted metals mix with each other and do not alloy, so that the metal pieces 9 are present in the conductor 1. At this time, if the specific gravity of the metal piece 9 is larger than the conductor 1, the metal piece 9 is located in the conductor 1 as shown in the figure. Conversely, if the specific gravity is small, the metal piece 9 is located closer to the surface of the conductor 1. become.

When the specific gravity of the metal piece 9 is larger than that of the conductor 1, the melting state of the conductor 1 is controlled, that is, the metal piece 9 starts melting from the surface of the conductor 1 and descends sequentially in the conductor. By controlling the melting of the metal piece 1 in the thickness direction, the position of the metal piece 9 in the thickness direction of the conductor 1 can be freely obtained. In addition, after forming a paint-like film with a metal powder or a material other than metal on the surface of the conductor, the laser is irradiated and heated and reacted to partially change the characteristics of the conductor, thereby making the powder-like material or Plating method, C
Even a material that cannot be adhered to the conductor surface by the VD method or the like can be formed into a paint using a solvent or an adhesive, adhered to the surface of the conductor, and heated and reacted by laser to impart predetermined characteristics to the conductor.

Further, after a paint-like film is formed on the surface of the conductor with a metal powder or a material other than a metal, the conductor is dried, solidified, irradiated with a laser, and heated and reacted to partially change the characteristics of the conductor. Thereby, a predetermined characteristic can be given to a required portion of the conductor. Also, metal powder, or in the material used when making a material other than metal paint,
By simultaneously mixing and forming materials such as an antioxidant, an activator, and a metal ionic agent during melting by a laser, it prevents oxidation of the metal, promotes alloying during the molten alloy, and reduces a trace amount of ions into ions. Can be supplied in the form.

Further, in the manufacturing method of the above embodiment,
By changing the thickness of the conductor, the plating, the thickness of the paint, the thickness of the conductor, the thickness of the metal piece, the thickness of the dry paint piece, or the volume ratio, the mixing ratio of the metal required for alloying can be specified. , A stable quality alloy can be obtained.
In addition, by irradiating an arbitrary portion of the conductor with a laser and heating the conductor, it is possible to impart necessary characteristics to the conductor by utilizing a structural change due to heating and cooling of the metal.

As described above, according to the present embodiment, by selecting the conductor 1 and the plating material and irradiating them with the laser 5, it is possible to obtain partially necessary metal characteristics within the same substrate. Can be.

[0032]

As described above, according to the present invention, a conductive material is subjected to a surface treatment (plating, bonding, painting, etc.), a metal layer is formed on the surface of the conductive material, and a partial layer is formed by using heat of a laser. By performing melting and alloying, various characteristics required for the conductive material in the substrate can be obtained. Further, in the case of metals that are not alloyed with each other, necessary properties can be obtained by allowing the metals to exist in a conductive material.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of a substrate obtained by integrating a conductor and a resin and partially alloying the conductor. (B) It is a partial sectional view of a conductor at the time of alloying by plating. FIG. 3C is a partial cross-sectional view when a metal piece is placed on a conductor surface and alloyed. FIG. 4D is a partial cross-sectional view when a metal and a conductor that are not alloyed are melted.

2A and 2B are cross-sectional views of a conventional substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductor 2 Plating 3 Resin 4 Alloy 5 Laser 6 Terminal part 7 Metal piece 8 Small cross section 9 Metal piece

Claims (13)

[Claims] In a circuit board formed using a conductive material and a resin material, another metal layer is formed on a surface of the conductive material, and the conductive material and the metal layer are irradiated with a laser, A method for manufacturing a circuit board, comprising: 2. The method according to claim 1, wherein another metal material is attached to the surface of the conductive material by plating or vapor deposition. 3. The method for manufacturing a circuit board according to claim 1, wherein different metal layers are formed on the front surface and the back surface of the conductive material. 4. The method for manufacturing a circuit board according to claim 1, wherein a plurality of different metal layers are formed on both surfaces or one surface of the conductive material. 5. The method for manufacturing a circuit board according to claim 1, wherein another metal material is separately provided on the surface of the conductive material. 6. A circuit board including a conductive material and a resin material, wherein a metal layer which does not fuse with the conductive material is formed on a surface of the conductive material, and the conductive material and the metal layer are irradiated with a laser. A method of forming a metal layer that is simultaneously melted and not alloyed in a conductive material. 7. In a circuit board formed using a conductive material and a resin material, a paint-like film made of metal powder or a material other than metal is formed on the surface of the conductive material, and the conductive material and the paint-like film are formed. A method for manufacturing a circuit board, comprising: irradiating a laser beam on the substrate; 8. The method for manufacturing a circuit board according to claim 7, wherein a metal powder or a paint-like film made of a material other than metal is formed on the surface of the conductive material, and then dried to form individual pieces. . 9. The method according to claim 7, wherein a material such as an antioxidant, an activator, or a metal ionic agent at the time of melting by laser is mixed with the metal powder or the material for converting a material other than metal into a paint. The method for manufacturing the circuit board described in the above. 10. In a circuit board formed using a conductive material and a resin material, a portion having a small cross-sectional area is partially formed in the conductive material, and another metal is added to the portion, and laser irradiation is performed. A method for manufacturing a circuit board, comprising simultaneously performing a melt alloying. 11. A circuit board comprising a conductive material and a resin material, wherein the thickness of the conductive material and the thickness of plating, paint, etc., the thickness of the conductive material and the thickness of metal pieces, the thickness of dry paint pieces, or The method for manufacturing a circuit board according to any one of claims 1 to 10, wherein a characteristic of the alloy is changed by changing a volume ratio. 12. A circuit board comprising a conductive material and a resin material, wherein a laser irradiation time and a heat amount are controlled.
Item 13. The method for manufacturing a circuit board according to item 1. 13. A method of changing the characteristics of a conductive material by irradiating an arbitrary portion of the conductive material with a laser and heating the conductive material in a circuit board formed using the conductive material and a resin material. A method for manufacturing a circuit board, comprising: