JPH10335773A - Mounting structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount various kinds of electronic components having different dimensions by abutting respectively on fitting faces. SOLUTION: A heat radiating plate 5 on which electronic component 1 is abutted is assembled perpendicular to a circuit substrate 3. A through hole 4 into which a lead terminal 2 is inserted extends long toward the heat radiating plate 5, and when the lead terminal 2 is inserted into the through hole 4, a fitting position of the electronic component 1 can be regulated with respect to the heat radiating plate 5 by sliding the electronic component 1 in a longitudinal direction to the heat radiating plate 5. For this reason, various kinds of electronic component 1 having dimensionally no compatibility can be mounted in a state that they are abutted on the heat radiating plate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an electronic component, and more particularly, to a mounting structure of an electronic component in which the electronic component is mounted in contact with a mounting surface orthogonal to a circuit board.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is mounted on a circuit board, a lead terminal of the electronic component is inserted into a through hole formed in the circuit board, and the lead terminal is soldered, so that the electronic component is connected to the circuit. The board is electrically connected, and at the same time, the electronic components are fixed to the circuit board.

In recent years, various electronic devices have been reduced in size and weight, and there has been a demand for miniaturization of circuit boards to be incorporated in various electronic devices. Electronic components tend to be mounted densely in close proximity to one another. When mounting electronic components in close proximity to each other, it is essential to solve heat generation from the electronic components. As a countermeasure against the heat of the electronic component, a heat radiating structure in which the electronic component is brought into contact with a heat radiating plate made of aluminum or the like so as to dissipate the heat of the electronic component to the outside by the heat radiating plate is conventionally known.

In such a heat radiating structure, since the electronic component is brought into contact with the heat radiating plate, the heat radiating plate serving as the mounting surface of the electronic component is mounted on the circuit board at right angles to the circuit board. By the way, usually, the through hole formed in the circuit board is formed in the shape of a round hole slightly larger than the lead terminal. However, when the electronic component is mounted on the circuit board and brought into contact with the heat sink, the lead terminal of the electronic component is used. Need to be formed with reference to the heat sink. That is, the distance between the heat sink and the through hole is in contact with the heat sink. For example, the distance between the back surface of the electronic component and the lead terminal vertically attached to the electronic component is adjusted, and the position of the electronic component with respect to the heat sink is accurately positioned. It is necessary to match.

[0005] However, for electronic components such as diodes, there is no uniform standard for the dimensions of the entire electronic component including the lead terminals, and it differs slightly depending on the manufacturer. For this reason, even for diodes with the same specifications,
There is no dimensional compatibility of diodes between manufacturers. For this reason, the distance from the rear surface to the heat sink to the lead terminal is variously different, and if the distance between the heat sink and the through hole is set according to the diode of a specific manufacturer, the diode of another manufacturer is mounted. In this case, a gap may be formed between the diode and the heat sink, or conversely, a gap between the through hole and the heat sink may be too small to make it difficult to assemble the diode. For this reason, conventionally, when there is a dimensional error between the distance between the through hole and the heat sink and the actually mounted diode, the lead terminal is bent by adjusting the actual product. As described above, the operation of adjusting the lead terminals and bringing the electronic component into contact with the heat radiating plate is troublesome and troublesome, and is extremely inefficient.

SUMMARY OF THE INVENTION The present invention is intended to solve such a problem, and an electronic component capable of mounting various electronic components which are not dimensionally compatible with each other, accurately contacting the mounting surface. It is intended to provide a mounting structure.

[0007]

An electronic component mounting structure according to the present invention is an electronic component mounting structure for mounting an electronic component in contact with a mounting surface orthogonal to a circuit board. A through hole for inserting a lead terminal is formed in a long hole shape toward the mounting surface.

By forming the through hole into which the lead terminal is inserted into a long hole extending in a direction perpendicular to the mounting surface, the lead terminal inserted into the through hole can slide in the front-rear direction with respect to the mounting surface. it can. By adjusting the mounting position of the electronic component with respect to the mounting surface in this way, it is possible to mount the electronic component that is not dimensionally compatible with the mounting surface in contact with the mounting surface.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 3 show an embodiment of the present invention. In the drawings, reference numeral 1 denotes an electronic component such as a diode having a lead terminal 2, and in this embodiment, four electronic components 1 to 4 lead terminals 2 are provided. Are arranged side by side in a row.
Reference numeral 3 denotes a circuit board on which the electronic component 1 is mounted. The circuit board 3 has a through hole 4 into which the lead terminal 2 is inserted. Also, the electronic component 1 is mounted on the circuit board 3.
Is fixed by screws (not shown) or the like. The heat sink 5 is formed of a metal material having excellent heat dissipation such as aluminum.
And the back surface 1 </ b> A of the electronic component 1 so as to radiate heat generated from the electronic component 1. Also, the heat sink 5
Since the back surface 1 </ b> A of the electronic component 1 is in contact with the electronic component 1, the electronic component 1 is fixed orthogonal to the circuit board 3 so as to be parallel to the electronic component 1. The through-hole 4 is opened in the vicinity of the radiator plate 5 vertically provided on the circuit board 3. The through hole 4 is elongated toward the heat radiating plate 5 and is formed in a long hole shape extending in a direction orthogonal to the heat radiating plate 5. Therefore, when the lead terminal 2 is inserted into the through hole 4, the lead terminal 2 moves in the through hole 4, and the electronic component 1 can slide in the front-back direction with respect to the heat sink 5.

As described above, by forming the through hole 4 of the lead terminal 2 into a long hole extending in a direction orthogonal to the heat radiating plate 5, the electronic component 1 can be assembled to the circuit board 3.
The mounting position of the electronic component 1 with respect to the heat sink 5 can be adjusted back and forth within the range of the length of the through hole 4. For this reason, as shown in FIG. 3, the distance L from the back surface 1A of the electronic component 1 to the mounting surface 5A of the heat sink 5 to the lead terminal 2 is variously different, and the electronic component 1 with respect to the heat sink 5 is different. By adjusting the position in the front-rear direction, a plurality of types of electronic components 1 that are not dimensionally incompatible (one of the electronic components 1 is indicated by a dashed line in FIG. 3) is reliably brought into contact with the heat sink 5. Can be implemented in state. By forming the through-holes 4 in the shape of a long hole as described above, even if the electronic component 1 is not dimensionally compatible, the mounting surface 5 </ b> A
It can be mounted in a state where it is brought into contact with. In addition, the electronic component 1 can be easily adjusted by simply sliding the electronic component 1 back and forth along the through-hole 4 with the lead terminal 2 inserted through the through-hole 4. Can be abutted.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention. For example, the electronic component is not limited to a diode, and can be applied to various electronic components, and the number of lead terminals suspended from the electronic component may be appropriately selected. Further, in the above-described embodiment, the example in which the electronic component is brought into contact with the mounting surface of the heat sink is shown. However, the present invention is not necessarily limited to the structure in which the electronic component comes into contact with the heat sink. For example, the electronic component is brought into contact with the chassis frame of the circuit board. The chassis frame may function as a heat radiating plate by being in contact therewith. Further, the present invention can be applied to a purpose other than the purpose of bringing the electronic component into contact with the mounting surface for the purpose of heat dissipation.

[0012]

According to the present invention, in a mounting structure of an electronic component in which an electronic component is mounted in contact with a mounting surface orthogonal to a circuit board, a through hole for inserting a lead terminal of the electronic component is provided. Since it is formed in the shape of a long hole toward the mounting surface, the mounting position of the electronic component with respect to the circuit board is adjusted so that various electronic components having incompatible dimensions are brought into contact with the mounting surface. Can be implemented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

FIG. 2 is a plan view of the through hole;

FIG. 3 is a sectional view showing an assembled state of the electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Lead terminal 3 Circuit board 4 Through hole 5A Mounting surface

Claims (1)

[Claims] An electronic component mounting structure for mounting an electronic component in contact with a mounting surface orthogonal to a circuit board.
An electronic component mounting structure, wherein a through hole for inserting a lead terminal of the electronic component is formed in a long hole shape toward the mounting surface.