JPH10332345A - Semiconductor element mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve positioning accuracy in a semiconductor element mounting device performing positioning by obliquely observing a semiconductor element and a mark on the upper face of a substrate for aligning them. SOLUTION: This semiconductor element mounting device where a semiconductor element 105 having a mark on the upper face is located on a substrate 10 having a mark on the upper face is equipped with a relative moving mechanism between the semiconductor element 105 and the substrate 100; observing optical systems 4, 51 for outputting an oblique observation image of the substrate 100 and the semiconductor element 105; an image recognizing device 6 for recognizing the mark of the observation image; and a control device 7 for controlling the device so that the mark may be a fixed target position relation, and equipped with pattern irradiating systems 11, 12, 15 for irradiating irradiation patterns 121, 122 to the semiconductor element 105 and the substrate 100 in a direction except the observating optical systems 4, 51. The image recognizing device 6 recognizes the relative position of the irradiation pattern, and the control device 7 detects a difference in height between the upper face of the semiconductor element 105 and the upper face of the substrate 100 from the relative position of the irradiation pattern to correct fixed target position relation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting apparatus for accurately positioning a small semiconductor device on a substrate and mounting the device. The present invention relates to a semiconductor device mounting apparatus that performs mark alignment based on an image obtained by observing the mark from an oblique direction.

[0002]

2. Description of the Related Art A module is assembled by attaching a semiconductor element to a substrate or another attaching member. In such a case, the semiconductor element is accurately positioned with respect to the substrate or the mounting member and then fixed by soldering or the like. Conventionally, in order to perform accurate positioning, a mark for positioning is conventionally provided on the upper surface of the semiconductor element and the substrate or the mounting member, and the mark is aligned while observing from above with a microscope or the like. In order to automate the apparatus, the mark is usually recognized by capturing an image observed by a microscope with a TV camera and performing image processing.

[0003] When aligning the marks provided on the upper surface as described above, it is preferable to observe from a direction perpendicular to the upper surface.
However, in the case where the first semiconductor element 102 and the second semiconductor element 103 are mounted on the semiconductor substrate 100 in a predetermined positional relationship as shown in FIG. 1, for example, an element having a side of 1 mm or less is small. In some cases, there is a mounting arm in the upper space of these semiconductor elements because the mounting arm that sucks the element and transports it to the mounting position in the positioning state exists.
The top surface of the semiconductor element cannot be observed from a vertical direction. Therefore, in such a case, positioning is performed by observing from an oblique direction.

FIG. 2 shows that the semiconductor element to be mounted is small,
FIG. 9 is a diagram illustrating a configuration of a conventional semiconductor element mounting device that is observed from an oblique direction. As shown in FIG. 2, the substrate 100 is fixed to the mounting stage 1 by vacuum suction.
The mounting stage 1 has at least two axes X and Y in a horizontal plane.
It is attached to a moving mechanism that can move in the axial direction. The semiconductor element 105 to be attached is vacuum-adsorbed to the mounting arm 3 and is transferred onto the substrate 100 by the moving mechanism 2 of the mounting arm 3. The moving mechanism 2 is configured such that the mounting arm 3
When moved upward, the mounting arm 3 is lowered to bring the semiconductor element 105 into contact with the substrate 100 or to approach the state immediately before the contact. In this state, an image of the portion of the semiconductor element 105 is projected onto a TV (CCD) camera 5 from an oblique direction by the microscope 4 of the observation optical system. The image processing device 6 processes the image of the part of the semiconductor element 105 captured by the TV camera 5 and displays the processed image on the monitor 8, and also displays the semiconductor element 105 and the substrate 100
The main controller 7 recognizes the mark provided on the
Send to From the position of the sent mark, the main controller 7
The mark instructs the stage controller 9 of the required movement amount and rotation amount so that the mark has a predetermined positional relationship, that is, the semiconductor element 105 is arranged at a predetermined position with respect to the substrate 100. The stage control device 9 controls the mounting stage 1 and the mounting arm moving mechanism 2 to rotate by the designated amount. Actually, there are various modified examples such as a type in which the mounting stage 1 rotates and a type in which the mounting mechanism moving mechanism 2 moves in the directions of the X axis and the Y axis to perform positioning, in addition to the rotation. In the case of the optical module shown in FIG. 1, after positioning is completed, the heater provided on the mounting stage 1
The semiconductor element 105 is fixed to the substrate 100 by heating the solder applied to the upper surface of the substrate 100.

FIG. 3 is a view for explaining an image in the case of observing a mark image obliquely as shown in FIG. 2. The left side shows the positional relationship viewed from the lateral direction, and the right side shows the observed image. FIG.
As shown in (1), when the mark 111 of the substrate 100 and the mark 112 of the semiconductor element 105 are aligned,
In the observation image, the distance between a straight line perpendicular to the observation direction passing through the center of the mark 111 of the substrate 100 and the mark 112 of the semiconductor element 105 and parallel to the upper surface of the element appears to be apart by a. As shown in FIG. 3B, the marks 111 and 11
When the position of No. 2 is shifted, the above distance becomes a '. Therefore, the position adjustment is performed by moving the mounting stage 1 so that the distance becomes a predetermined value a.

[0006]

As described above, the substrate 1
Although 00 is held on the mounting stage 1, the position of the upper surface of the substrate 100 varies due to variations in the thickness of the substrate 100 and the like. Further, the semiconductor element 105 is brought into contact with or close to the substrate 100 in a state where the semiconductor element 105 is attracted to the mounting arm 3, and the position of the mark is detected in that state. , The thickness of the semiconductor element 105 or the thickness of the solder applied on the upper surface of the substrate 100, etc.
The position of the upper surface varies. When the semiconductor element 105 is stopped close to the substrate 100, the mounting arm 3
Similarly, the position of the upper surface of the semiconductor element 105 varies due to a movement error of the semiconductor element 105. If the positions of the upper surfaces of the substrate 100 and the semiconductor element 105 vary, and the difference between the upper surface positions of the substrate 100 and the semiconductor element 105 has an error with respect to the state shown in (1) of FIG. 3, (3) of FIG. As shown, even if the marks 111 and 112 match, the distance between the straight lines passing through the centers of the marks 111 and 112 differs from a by a ″
become. That is, when the difference in the upper surface position increases, the mark 1
12 is shifted to the left with respect to the mark 111, the distance between the straight lines is increased, and conversely, when the difference in the upper surface position is reduced, the mark 112 is shifted to the right with respect to the mark 111. The distance between the straight lines decreases. Therefore, if the difference between the top positions is different from the expected value, the distance between the straight lines is adjusted to be the predetermined value a, so that the marks 111 and 1
12 does not match, that is, the semiconductor element 105 is shifted with respect to the substrate 100, and there is a problem that accurate positioning cannot be performed. In the above description, when the upper surface of the substrate is a horizontal plane, the positioning in the direction perpendicular to the observation direction in the horizontal plane is not described, but the position in this direction is the distance between the substrate and the mark of the element in this direction. Positioning can be performed by setting the distance to a predetermined value. This distance does not relate to the difference between the position of the substrate and the position of the upper surface of the element.

The present invention has been made to solve such a problem, and has as its object to improve the positioning accuracy in a semiconductor device mounting apparatus.

[0008]

FIG. 4 is a diagram for explaining the principle of the present invention, and FIG. 5 is a diagram showing the principle of a semiconductor device mounting apparatus according to the present invention. As shown in FIGS. 4 and 5, in the semiconductor device mounting apparatus of the present invention, in addition to the conventional configuration, the pattern is irradiated onto the semiconductor device and the upper surface of the substrate from a direction other than the observation direction, and the image of the pattern is observed. Detecting a difference in height between the semiconductor element and the upper surface of the substrate, and correcting a target positional relationship between marks provided on the upper surface of the semiconductor element and the semiconductor device in accordance with the difference in height. .

That is, the semiconductor element mounting apparatus of the present invention is a semiconductor element mounting apparatus which positions and mounts the semiconductor element 105 having the marks 112a and 112b on the upper surface to the substrate 100 having the marks 111a and 111b on the upper surface, A movement mechanism for moving the semiconductor element 105 relative to the substrate 100, and observing the substrate 100 and the semiconductor element 105 at a first predetermined angle other than perpendicular to the upper surface of the substrate 100, and outputting an observation image thereof Observation optical systems 4 and 51; an image recognition device 6 that performs image processing on an observation image output from the observation optical system to recognize the mark; and marks 111a, 111b, 112a, and 1a that are recognized by the image recognition device.
A control device 7 for controlling the moving mechanism so that the observation device 12b has a predetermined target positional relationship in the observation image, wherein the semiconductor device is mounted at a second predetermined angle from a direction other than the observation direction of the observation optical system. Upper surface 105 and substrate 1
And pattern irradiation systems 11, 12 and 15 for irradiating irradiation patterns 121 and 122 on the upper surface of
Recognizes the relative positions of the irradiation patterns 121 and 122 illuminated on the upper surface of the semiconductor element 105 and the upper surface of the substrate 100. The control device 7 calculates the relative positions of the irradiation patterns 121 and 122 based on the recognized relative positions of the irradiation patterns. Is detected, and a predetermined target positional relationship is corrected.

The irradiation direction of the pattern irradiation system is desirably the direction opposite to the observation direction of the observation optical system as shown in FIG. As shown in FIG. 4, positioning marks 111a and 111b are provided on the substrate 100, and positioning marks 112a and 112b are also provided on the element 105. Irradiation irradiates two marks 121 and 122 on the substrate 100 and the element 105, respectively. FIG. 5 is a side view of this state. As shown in FIG.
Irradiates the aperture 12. A pattern corresponding to a mark is provided on the aperture 12, and the pattern of the aperture 12 is projected on the surface of the substrate 100 and the element 105 by the projection lens 15. It has a projection lens 4 and an image sensor 51 that constitute an observation optical system. The projection lens 4 projects the image of the element 105 and the portion of the substrate 100 onto the image sensor 51, and the image sensor 51 sends the projected observation image to the image processing device 6. The image processing device 6 detects the position of the mark from the observation image and sends it to the main control device 7. The main controller 7 is provided with an element surface position detecting section 71 for detecting the height of the element surface with respect to the substrate surface from the position of the mark.

As shown in FIG. 5, when the upper surface of the element 105 moves upward, the position of the mark 121 does not change, but the position of the mark 122 moves to the position indicated by 122 'on the left side. Accordingly, the projection position of the mark 122 on the image sensor 51 moves as shown. When the upper surface of the element 105 moves downward, the projection position of the mark 122 on the image sensor 51 moves in the opposite direction. Thus, mark 1
The projection position of 22 on the image sensor 51 changes according to the upper surface position of the device 105. Therefore, if the projection position of the mark 122 on the image sensor 51 is detected, the upper surface position of the element 105 can be detected. When the position of the top surface of the element 105 moves while the alignment marks 111 and 112 are aligned, the position of the mark 112 moves to the position of 112 ′ as shown in FIG. Since the position is changed, if the position on the image sensor 51 where the mark 112 is projected is changed according to the upper surface position of the element 105 detected as described above, the alignment marks 111 and 1 are changed.
12 is in a state of matching. Actually, since the upper surface position of the substrate 100 also changes, the projection position of the marks 111 and 121 on the image sensor 51 also changes. So, in practice,
The difference between the heights of the upper surfaces of the substrate 100 and the element 105 is detected based on the difference between the projection positions of the marks 121 and 122 on the imaging element 51,
The adjustment target value of the difference between the projection positions of the marks 111 and 112 is changed accordingly.

The upper surface of the semiconductor element is radiated with two or more marks on the upper surface of the semiconductor element as an irradiation pattern, and the two upper marks on the substrate are also radiated on the upper surface of the substrate. From the mutual position of the mark on the two substrates,
The inclination of the upper surface of the semiconductor element with respect to the upper surface of the substrate may be detected. In the present invention, the position of the upper surface of the semiconductor element which causes an error when observing from a slant is detected and corrected. For detecting the position of the upper surface of the semiconductor element, there are various methods such as a method of contacting a stylus and a capacitance method.In the present invention, a mark is applied to the upper surface of the substrate and the element by applying a light cutting method. The irradiation position is observed by an observation optical system for observing a positioning mark. Thus, the observation optical system and the image processing apparatus can be used as they are, so that the position of the upper surface of the semiconductor element can be detected at low cost. The method of irradiating such a pattern does not require the use of the space above the semiconductor element, and has many advantages in terms of the arrangement of the device.

[0013]

FIG. 6 is a diagram showing an overall configuration of a semiconductor device mounting apparatus according to a first embodiment of the present invention. As shown, the semiconductor device mounting apparatus of the first embodiment has a configuration similar to that of the conventional apparatus shown in FIG. 2, and a pattern irradiation system 10 for irradiating a pattern for height detection is newly provided. The image processing device 6 recognizes a pattern for height detection, and the main control device 7 detects the height of the element surface with respect to the substrate surface from the pattern for height detection, and The difference is that the adjustment target position of the mark is changed. Therefore, only different points will be described, and description of other parts will be omitted.

As shown in FIG. 6, the pattern irradiation system 10
Is composed of a lens barrel 13, a light source unit 14, and an objective lens 15 of a microscope. FIG. 7 shows the pattern irradiation system 10.
FIG. 3 is a detailed view of a portion of an observation optical system. The microscope optical system 4 of the observation optical system has an optical axis of 45 degrees with respect to the upper surface of the substrate 100.
° are arranged. The microscope optical system 4 guides the illumination light from the lamp 41 provided in the light source unit 44 to the lens barrel 43 with a condenser lens 47 efficiently. The illumination light that has passed through the condenser lens 47 is applied to the substrate 100 and the element 105 by the beam splitter 46.
It is reflected to go to. Light that has passed through the beam splitter 46 is absorbed by the surface of the lens barrel 43. The illumination light from the beam splitter 46 is projected onto the element 105 and the substrate 100 via the objective lens 45 of about five times. Thus, the upper surfaces of the element 105 and the substrate 100 are illuminated and can be observed. This is the same as epi-illumination of a normal microscope. The objective lens 45 projects the image of the element 105 and the substrate 100 thus illuminated on the surface of the CCD element 51. The CCD element 51 outputs the projected image of the element 105 and the substrate 100 to the image processing device 6. The above configuration is the same as the conventional one.

The pattern irradiation system 10 is arranged on the opposite side of the observation optical system so that the optical axis makes an angle of 45 ° with the upper surface of the substrate 100. In the pattern irradiation system 10, illumination light from a lamp 11 provided in a light source unit 14 is efficiently guided to a lens barrel 13 by a condenser lens 17. The illumination light having passed through the condenser lens 17 is reflected by the beam splitter 16 toward the upper left side. The transmitted light is absorbed by the surface of the lens barrel.
The illumination light reflected toward the upper left side by the beam splitter 16 enters the aperture 12. Aperture 12
The mark portion reflects the illumination light and the other portion allows the illumination light to pass, or the mark portion passes the illumination light and the other portion reflects the illumination light. Since the light that has passed through the aperture 12 is absorbed by the upper part of the lens barrel 13, when the mark portion reflects the illumination light and the other portions allow the illumination light to pass, a bright mark is projected and the mark portion is reflected. If the light passes through the illumination light and other parts reflect the illumination light, a dark mark will be projected. Which one to use is determined according to the alignment mark. The objective lens 15 converts the image of the aperture 12 into an element 10
5 and onto the substrate 100.

FIG. 8 shows an aperture 1 in the first embodiment.
2 is a diagram showing a pattern 2 and an irradiation pattern, and (1)
Indicates an aperture pattern, and (2) indicates an irradiation pattern. As shown, two marks 111a and 111b are provided on the upper surface of the substrate 100, and two marks 112a and 112b are provided on the upper surface of the element 105. These alignment marks are marks that do not shine when the surfaces of the substrate and the element reflect the illumination light well, and marks such as metal that reflect the light well when the illumination light is difficult to reflect. As shown in (1) of FIG.
8, two irradiation marks 122a and 122b are provided on the upper surface of the element 105, and two irradiation marks 1 are provided on the upper surface of the substrate 100, as shown in FIG.
21a and 121b are irradiated.

A process for aligning the element 105 with respect to the substrate 100 from the alignment mark and the irradiation mark as shown in FIG. FIG. 9 is a top view and a side view when the element 105 is rotated around the X axis and tilted. As shown in (1) of FIG.
5 is parallel to the upper surface of the substrate 100, a straight line connecting the marks 121a and 121b in the observed image and the mark 1
The straight line connecting 22a and 122b is parallel, and the distance between them changes according to the height of the upper surface of the element 105 with respect to the upper surface of the substrate 100. Here, as shown in FIG. 9B, assuming that the upper surface of the element 105 is rotated about the Y axis and inclined with respect to the upper surface of the substrate 100, the projection positions of the marks 122a and 122b on the upper surface of the element 105 are changed. Change. Therefore, the marks 122a and 122
The straight line connecting b is inclined with respect to the straight line connecting the marks 121a and 121b. Therefore, if the inclination of the straight line connecting the marks 122a and 122b with respect to the straight line connecting the marks 121a and 121b is detected, the inclination of the upper surface of the element can be detected.

Therefore, when performing position adjustment, first, the image processing device 6 recognizes the position of each mark by pattern matching processing. Then, the inclination of the straight line connecting the irradiation marks 122a and 122b with respect to the straight line connecting the marks 121a and 121b is detected. When the element is held in a state of not contacting the substrate and the inclination of the element with respect to the substrate can be changed by the moving mechanism of the mounting arm 3 or the rotating mechanism of the mounting stage, these straight lines become parallel. That is, the element 105 is
Adjust so that it is parallel to 0. If there is no mechanism to adjust the relative tilt, or if the element is held in contact with the surface of the substrate and the tilt cannot be adjusted, hold it as it is and correct the tilt later For this purpose, the inclination amount is stored. Here, the inclination is not adjusted, and the irradiation mark 122a is used instead of storing the amount of inclination.
The distance between the straight line connecting the straight marks 121a and 121b connecting the irradiation marks 122a and 122b
, And a difference from a predetermined reference value is stored as a correction value. this is,
This is because the positions of the irradiation marks 122a and 122b in the X-axis direction are the same as the positions of the alignment marks 112a and 112b, and if the heights at the respective positions are corrected, substantially the same correction can be performed.

Next, the positions of the alignment marks 112a and 112b on the element 105 are corrected. This correction is performed at the positions of the marks 112a and 112b by の of the above correction value.
By multiplying by. This is because, as shown in FIG. 5, since the optical axes of the projection optical system and the pattern irradiation system are inclined by α (45 °) with respect to the vertical direction, the irradiation marks 122a and 122b respond to the change in the position of the upper surface of the element 105.
Changes in the positions of the marks 112a and 112b
This is because if the angles of the projection optical system and the pattern irradiation system are the same, the other angles will be doubled. With respect to the value after such correction, the mark 111a
And the straight line connecting the marks 112a and 112b and the straight line connecting the marks 112a and 112b are calculated. If not parallel, it means that the element is rotating around the Z-axis with respect to the substrate, so the mounting arm 3 is rotated so as to be parallel. After the rotation, the position of the mark is similarly recognized by pattern matching. In the case of inclination, the position of the irradiation pattern changes by a small amount due to this rotation. Therefore, the same processing is performed to calculate the correction amount, and the mark 112 a
And 112b are corrected. In this state, mark 11
The mounting stage 1 is moved so that the straight line connecting 1a and 11b and the straight line connecting marks 112a and 112b have a predetermined interval.
The positioning is completed by moving in the axial direction and the Y-axis direction.
In this state, the heater provided on the mounting stage 1 is operated to melt the solder applied to the
5 is fixed.

In the first embodiment, only the tilt due to the rotation about the Y axis is considered. The inclination in this direction appears as a difference between the height of the element surface at the position of the alignment mark and the height of the element surface at the position where the irradiation mark is irradiated. If the correction is made by this, there arises a problem that accurate correction cannot be performed when the element is rotating around the Z axis. In the second embodiment, the correction is also performed by detecting the inclination due to the rotation around the X axis.

The irradiation pattern of the semiconductor device mounting apparatus of the second embodiment is different from that of the first embodiment. FIG. 10 is a view showing an irradiation pattern in the second embodiment. (1) shows an aperture pattern, and (2) shows an irradiation pattern. FIG.
As shown in FIG. 10 (1), in the aperture, in addition to the four marks arranged on one straight line in the first embodiment, two marks are provided at upper and lower positions which are not on this straight line. As shown in 2), these two marks are projected on the upper surface of the element 105 as marks 122c and 122d.

FIG. 11 is a diagram for explaining the detection of the inclination by the rotation about the X axis by the two marks.
FIG. 3 is a diagram illustrating an optical path of an irradiation mark in a plane perpendicular to an axis.
As shown, when the upper surface of the element 105 rotates around the X axis and tilts, the projection positions of the marks 122c and 122d on the element surface change, and the marks 122c and 122d viewed from the observation direction are correspondingly changed. The interval changes from D to d. Therefore, if the interval between the marks 122c and 122d is detected, the inclination due to the rotation around the X axis can be detected. By multiplying the inclination due to rotation about the X axis by the distance from the marks 122a and 122b to the alignment marks 112a and 112b, the marks 122a and 122b and the marks 112a and 112 can be obtained.
The height difference between 2b can be calculated. Therefore, if this difference is added to the difference between the reference heights at the positions of the marks 122a and 122b calculated in the same manner as described above, the difference between the reference heights of the alignment marks 112a and 112b can be obtained.
The marks 111a and 111 are set in accordance with the difference from the reference height.
If the difference from the straight line connecting b is corrected, the tilt due to the rotation around the X axis can be corrected.

[0023]

As described above, according to the present invention,
In the semiconductor device mounting apparatus, positioning is performed with higher accuracy when positioning marks are provided on the upper surfaces of the semiconductor device and the substrate, the marks are observed from an oblique direction, and alignment is performed based on the image. It becomes possible to do.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a semiconductor element and a substrate assembled by applying the present invention.

FIG. 2 is a diagram showing a configuration of a conventional semiconductor device mounting apparatus.

FIG. 3 is a diagram showing a problem of a conventional example.

FIG. 4 is a diagram illustrating the principle of the present invention.

FIG. 5 is a view showing the principle configuration of a semiconductor device mounting apparatus according to the present invention.

FIG. 6 is a diagram showing the overall configuration of the semiconductor device mounting apparatus according to the first embodiment of the present invention.

FIG. 7 is a diagram illustrating a configuration of an illumination optical system of the semiconductor device mounting apparatus according to the first embodiment.

FIG. 8 is a diagram showing an illumination pattern of the first embodiment.

FIG. 9 is a diagram showing a detection amount in the first embodiment.

FIG. 10 is a diagram showing an illumination pattern according to a second embodiment of the present invention.

FIG. 11 is a diagram illustrating a principle of detecting a rotation component in a plane including an optical axis in the second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Mounting stage 2 ... Mounting arm moving mechanism 3 ... Mounting arm 4 ... Microscope optical system 5 ... TV camera 6 ... Image processing device 7 ... Main control device 8 ... Display device 9 ... Stage control device 100 ... Substrates 102 and 103 ... Semiconductor element

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hitoshi Komoriya 4-1-1 Kamikadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Akihiko Yabuki 4-1-1 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture No. 1 Fujitsu Co., Ltd. (72) Inventor Takao Hirahara 4-1-1 Kamikodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Fujitsu Co., Ltd.

Claims (3)

[Claims] 1. A semiconductor device mounting apparatus for positioning and mounting a semiconductor element having a mark on an upper surface to a substrate having a mark on an upper surface, and a moving mechanism for relatively moving the semiconductor element with respect to the substrate. An observation optical system that observes the substrate and the semiconductor element at a first predetermined angle other than perpendicular to the upper surface of the substrate, and outputs an observation image thereof, and an image of the observation image output by the observation optical system. A semiconductor device comprising: an image recognition device that processes and recognizes the mark; and a control device that controls the moving mechanism so that the mark recognized by the image recognition device has a predetermined target positional relationship in the observation image. In the mounting apparatus, a pattern for irradiating an irradiation pattern on the upper surface of the semiconductor element and the upper surface of the substrate at a second predetermined angle from a direction other than the observation direction of the observation optical system A projection system, the image recognition device recognizes the relative position of the irradiation pattern irradiated on the upper surface of the semiconductor element and the upper surface of the substrate, the control device, from the relative position of the recognized irradiation pattern A semiconductor device mounting apparatus for detecting a difference in height between an upper surface of the semiconductor element and an upper surface of the substrate to correct the predetermined target positional relationship. 2. The semiconductor device mounting apparatus according to claim 1, wherein an irradiation direction of the pattern irradiation system is a direction opposite to an observation direction of the observation optical system. 3. The semiconductor device mounting apparatus according to claim 2, wherein the irradiation pattern is irradiated on two or more element-on-marks irradiated on an upper surface of the semiconductor element and on an upper surface of the substrate. Two on-substrate marks, wherein the control device includes the two or more element marks and
A semiconductor element mounting apparatus for detecting an inclination of an upper surface of the semiconductor element with respect to an upper surface of the substrate from mutual positions of the marks on the substrate.