JPH10328818A - Automatic soldering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adjust a feed position of a solder core wire for a soldering iron, not depending on a manual operation of a worker, along the axial direction of a soldering iron. SOLUTION: A soldering head 10 holding a soldering iron 1, to a holding plate 13 mounted a robot arm of a soldering robot, is mounted displacable in the axial direction of the soldering iron, further a feed nozzle 2 to feed a solder core wire, to the robot arm, is mounted at a fixed position along the axial direction, by adjusting a pressing quantity of a tip of the soldering iron 1 pressed by an object to be soldered 22, a distance between the soldering iron and the feed nozzle 2 is automatically adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for automatically performing soldering by a soldering robot.

[0002]

2. Description of the Related Art FIG. 9 is a view showing the vicinity of a solder head of a conventional automatic soldering apparatus.

[0003] A soldering iron 100 includes a soldering head 101.
And the base of the solder head 101 is
It is attached to a robot arm of a soldering robot (not shown), and the movement of the robot arm guides the soldering iron 100 to a predetermined soldering location.

[0004] A solder core (thread solder) is
A supply nozzle 102 as a soldering core feeder that automatically supplies the tip of the 00 is attached to a support rod 104 via a supply holder 103.
It is held by a holding portion 105 of the solder head 101 that protrudes.

In such an automatic soldering apparatus, the soldering iron 100 held by the solder head 101 is guided to a predetermined soldering location, and a solder core wire is automatically supplied from a supply nozzle 102 to the tip of the soldering iron 100 at a predetermined supply angle. And soldered.

[0006]

However, in such a conventional example, the supply nozzle 102 as a solder core feeder for supplying the solder core holds the soldering iron 100 via a supply holder 103 and a support rod 104. And a distance L along the axial direction (vertical direction in FIG. 9) of the soldering iron 100 from the tip of the soldering iron 100 to the tip of the supply nozzle 102.
Is constant, and when adjusting the distance L, that is, when adjusting the position of the supply nozzle 102, it is necessary for the operator to loosen the screw 106 and the like of the supply holder 103 and perform manual adjustment.

However, such a supply nozzle 10
The manual adjustment operation 2 has many factors depending on the skill of the operator, and thus requires a long time for the adjustment operation and is not easy.

[0008] Also, depending on the place where soldering is performed,
Since there is an obstacle such as a foot of a lead component in front of the supply nozzle 102, the position of the supply nozzle 102 is
It is necessary to supply the solder core wire at a position pulled up from the tip of the soldering iron 102, or conversely, in order to obtain a good flow of solder, the position of the supply nozzle 102 is lowered to the tip of the soldering iron 102 at a position where the solder core is pulled down. Although it is necessary to supply a wire, in the conventional example, it is not easy to change the position of the supply nozzle 102 depending on the place where soldering is performed, that is, it is not easy for an operator to manually adjust the position each time. Supply nozzle 1 depending on the location where soldering is not
There is a disadvantage that it is necessary to use a plurality of automatic soldering devices having different positions 02.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned points, and enables a worker to adjust a supply position of a solder core wire along an axial direction of a soldering iron without manually adjusting the solder core one by one. The purpose is to.

[0010]

In order to achieve the above-mentioned object, the present invention is configured as follows.

That is, according to the present invention, in an automatic soldering apparatus for supplying and soldering a solder core to a solder iron, a supply position of the solder core to the solder iron can be automatically adjusted along an axial direction of the solder iron. And

Further, it is preferable that the soldering iron is configured to be displaced along the axial direction when its tip is pressed.

A solder head for holding the soldering iron is attached to a robot arm of the soldering robot so as to be displaceable along an axial direction of the soldering iron, and a solder core for supplying a solder core to the soldering iron. A feeding device, for the robot arm,
The tip of the soldering iron attached to the fixed position along the axial direction and guided to the soldering target by the robot arm is pressed by the soldering target, so that the soldering iron is displaced along the axial direction. It is preferable to configure so that

Further, it is preferable that the displacement of the soldering iron along the axial direction is set by inputting coordinates for designating the movement of the robot arm.

Further, a configuration may be provided in which there is provided a rotating means for rotating the supply position of the solder core wire to an arbitrary position in the circumferential direction around the axis of the soldering iron.

According to the automatic soldering apparatus of the present invention, since the supply position of the solder core can be automatically adjusted along the axial direction of the soldering iron, the troublesome manual adjustment operation of the supply position by the operator can be omitted. become.

Further, since the tip of the soldering iron is displaced in the axial direction when the tip of the soldering iron is pressed, the supply position of the solder core to the soldering iron is adjusted by the amount of pressing to push the tip of the soldering iron. You can do it.

Further, a solder head for holding the soldering iron is attached to a robot arm of the soldering robot so as to be displaceable along the axial direction of the soldering iron, and the solder core feeding device is attached to the robot arm. On the other hand, the tip of the soldering iron attached to the fixed position along the axial direction and guided to the soldering target object by the robot arm is pressed against the soldering target object, so that the soldering iron moves in the axial direction. Since it is displaced along the soldering iron, the supply position of the solder core to the soldering iron can be adjusted by the pressing amount of the soldering iron by the robot arm.

Further, since the displacement of the soldering iron along the axial direction is set by inputting coordinates for designating the movement of the robot arm, the input of the coordinates to the robot controller for controlling the soldering robot is performed by the input of the coordinates. The supply position can be adjusted.

In addition, since there is provided a rotating means for rotating the supply position of the solder core wire to an arbitrary position in the circumferential direction around the axis of the soldering iron, the optimum supply direction is determined according to the soldering position. Can supply solder core.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a configuration diagram of a system using an automatic soldering apparatus according to this embodiment.

This soldering system comprises a soldering iron 1
And a soldering robot 3 provided with a supply nozzle 2 for supplying a solder core to the soldering iron 1 and the like as described later.
A robot controller 4 for controlling the movement of the robot 3 and a soldering controller 5 for controlling the temperature of the soldering iron 1 based on the supply of a solder core and the output of a temperature sensor (not shown) for detecting the temperature of the soldering iron 1. ,
A sequencer 6 for controlling the controllers 4 and 5 in a predetermined procedure, and a CCD camera 7 for imaging a soldering target.
Image processing of the imaging signal from the CCD camera 7, and matching processing between the image processing information and CAD information of the soldering target, that is, design position information of the soldering target. And a computer 8 for calculating a correction value for correcting the attachment position and providing the correction value to the robot controller 4.

FIG. 2 is a partial cross-sectional view of the vicinity of a solder head as a main part of the present invention.

The automatic soldering device of this embodiment is
A soldering iron 1 having a small-diameter heat-generating portion 9 at its tip, a soldering head 10 for holding the soldering iron 1, and an axial direction of the soldering iron 1 within a certain range (vertical direction in FIG. ), And holding the solder core wire to the holding plate 13 connected to the tip end of the robot arm 11 of the soldering robot 3 via the connecting shaft 12 and the like, and to the heat generating portion 9 of the soldering iron 1. Supply nozzle 2 as solder wire feeder for supply
And a holding member 16 for holding the supply holder 14 for holding the supply nozzle 2 via the support rod 15, and turning the holding member 16 to an arbitrary position in the circumferential direction around the axis P of the soldering iron 1. And a rotating mechanism 17 for moving the
The soldering iron 1 held by the solder head 10 is guided to a predetermined soldering position by the movement of the robot arm 11.

In this embodiment, the operator manually adjusts the position of the supply nozzle 2 with respect to the soldering iron 1, that is, the supply position of the solder core by loosening the screw 18 and the like of the supply holder 14 as in the conventional example. Without soldering iron 1
It can be automatically adjusted along the axial direction.

That is, in this embodiment, the soldering iron 1 is held on a holding plate 13 which is fixedly attached to the distal end of the robot arm 11 of the soldering robot 3 via the connecting shaft 12 or the like. The solder head 10 is attached so as to be displaceable within a certain range W in the axial direction of the soldering iron 1. The solder head 10 is supported by a pair of guide shafts 19 integrated with the holding plate 13, and is externally fitted to the guide shaft 19 inside an insertion hole 20 of the solder head 10 through which these guide shafts 19 pass. A spring 21 is housed, and the tip of the soldering iron 1 is pressed against a soldering target 22, whereby the solder head 1 is pressed against the urging force of the spring 21.
0 is the range W until the end comes into contact with the end face of the holding plate 13.
It is configured to be able to be displaced over the range.

On the other hand, a supply nozzle 2 for supplying a solder core
Is held at a fixed position along the axial direction of the soldering iron 1 via a supply holder 14, a support rod 15, and a holding member 16, and an operator loosens a screw 18 or the like of the supply holder 14 as in the related art. Unless manually adjusted, solder iron 3
Are constant along the axial direction.

Therefore, by changing the amount of pressing the tip of the soldering iron 1 against the soldering target 22, it is possible to change the amount of displacement of the solder head 10, that is, the soldering iron 1 along the guide shaft 19. 3A and 3B, for example.
As shown in the figure, the distance D along the axial direction of the soldering iron 1 from the tip of the soldering iron 1 to the tip of the supply nozzle 2, that is, the supply position of the supply nozzle 2 to the soldering iron 1 is variable along the axial direction of the soldering iron 1. You can do it.

Therefore, in this embodiment, when the coordinate position of the robot arm 11 for designating the movement of the robot arm 11 of the soldering robot 3 is input as a numerical value by the robot controller 4, the soldering iron 1 is soldered. The displacement amount for pressing the target 22 and displacing the soldering iron 1 along the axial direction is input so that the desired displacement amount, and therefore the position of the supply nozzle 2 with respect to the soldering iron 1, becomes the desired supply position. is there.

For example, when it is desired to increase the distance D along the axial direction from the tip of the soldering iron 1 to the tip of the supply nozzle 2, the coordinate position of the robot arm 11 is adjusted so that the amount of pressing on the soldering target 22 is reduced. By inputting, the displacement of the solder head 10 due to the soldering iron 1 abutting on the soldering target 22 is reduced, and the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is reduced as shown in FIG. In contrast, when the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is to be reduced, the coordinate position of the robot arm 11 is increased and the amount of pressing on the soldering target object 22 is increased. The object 2 to be soldered
2, the displacement of the solder head 10 due to the pressing of the soldering iron 1 is increased, and the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is reduced as shown in FIG.

As described above, by inputting the coordinates specifying the movement of the robot arm 11 as numerical values, that is, by the program for the robot controller 4, the position of the supply nozzle 2 with respect to the soldering iron 1 can be variably set. As shown in the figure, the operator does not need to perform any troublesome operation such as loosening the screws of the supply holder and manually adjusting the position of the supply nozzle. A core wire can be supplied.

That is, it is possible to quickly cope with various kinds of soldering positions, and it is possible to omit a troublesome manual operation of changing a supply position by an operator, and the soldering quality is stable, always smoothly and efficiently. Soldering can be performed.

Further, in this embodiment, when there is an obstacle in front of the soldering portion or when there is a restriction on the supply angle of the solder core, the soldering can be performed by avoiding them. For this purpose, a rotation mechanism 17 for rotating the supply nozzle 2 for supplying the solder core to an arbitrary position in the circumferential direction about the axis P of the soldering iron 1 is provided.

As shown in FIG. 2, the rotation mechanism 17 is a stepping motor 24 that rotates forward and reverse and is supported by a support arm 23 attached to a connecting portion of the robot arm 11, and is driven to rotate by the stepping motor 24. Driven pulley 25, a driven pulley 27, a timing belt 26 is wound around the driven pulley 25, and driven by the driven pulley 25 to rotate.
A rotary pulley 27 that rotates integrally with the rotary member 7 and has a holding member 16 that holds the supply nozzle 2 attached thereto; and a rotation position detection sensor 29 that detects the rotation position of the rotary body 28. A bearing 3 is provided between the connecting shaft 12 to which the solder head 10 is attached.
0 is interposed, and the connecting shaft 12 is configured not to rotate.

In the rotating mechanism 17, the drive pulley 25 is driven to rotate by the forward or reverse rotation of the stepping motor 24. The driven pulley 27 is rotated by the rotation of the drive pulley 25, and the driven pulley 27 is rotated by the rotation of the driven pulley 25. The rotating body 28 integrated with the pulley 27 rotates to supply the holder 1.
2 and the supply nozzle 2 held by the holder 14 rotate around the axis P of the soldering iron 1 as shown by the imaginary line in FIG. Is controlled by the sequencer 6.

The rotation mechanism 17 allows the supply nozzle 2
Is rotated to an optimal position in the circumferential direction around the soldering iron 1 to supply a solder core and perform soldering.

An example of the soldering work process will be described. First, the iron tip of the soldering iron 1 is cleaned by blowing air with an air blow nozzle or the like, which will be described later, and immediately before the soldering iron 1 is applied to a portion to be soldered. By supplying the primary solder to wet the iron tip, transmitting heat through the solder and preheating as it is, then supplying the secondary solder and applying the soldering iron 1 to the place where the soldering is to be performed and heating. And soldering.

As another embodiment of the present invention, the rotating mechanism 17 may be omitted, and the supply nozzle 2 may be provided at a fixed position as in the conventional case.

Further, as another embodiment of the present invention, the supply nozzle 2 may be rotated only in one direction, the forward direction or the reverse direction.

Further, the rotating mechanism 17 may be constituted by a cylinder, a gear, or the like instead of the motor or the pulley.

(Embodiment 2) FIG. 4 is a partial sectional view of a main part of another embodiment of the present invention, and portions corresponding to FIG. 2 are denoted by the same reference numerals.

In this embodiment, in addition to the supply nozzle 2 for supplying the solder core, the support rod 15 held by the rotating body 28 of the rotating mechanism 17 via the holding member 16 and the soldering iron 1 First, an air blow nozzle 31 for cleaning by blowing air is provided. At the time of cleaning, the air blow nozzle 3 is rotated while rotating the rotating body 28.
The cleaning is performed by blowing air onto the entire peripheral surface of the soldering iron tip of the soldering iron 1 to 1. As described above, since the single air blow nozzle 31 is rotated around the axis P of the soldering iron 1 to blow the air to clean the iron tip, the cleaning is performed securely over the entire peripheral surface of the iron tip to remove the deposits. It can be removed and the soldering quality can be improved.

The cleaning material sprayed on the iron tip is not limited to air, but may be other gas or fine particles.

Other configurations are the same as those of the above-described embodiment.

(Embodiment 3) FIG. 5 is a partial cross-sectional view of a main portion of still another embodiment of the present invention, and portions corresponding to FIG. 2 are denoted by the same reference numerals.

In this embodiment, the position of the supply nozzle 2 for supplying the solder core is automatically retracted to a position where it does not interfere with the cleaning of the soldering tip of the soldering iron 1 or the replacement of the soldering iron 1, while the cleaning is performed. After the replacement is completed, it can be automatically returned to the original position again.

That is, in this embodiment, the supply nozzle 2 is swung between a supply position inclined with respect to the axis P of the soldering iron 1 and a retracted position parallel to the axis P of the soldering iron 1. The swing mechanism 32 is provided. The supply position is a position where the solder core can be supplied to the soldering iron 1 at a predetermined supply angle, and the retreat position is
This is a position where the soldering iron 1 can be cleaned and replaced without the supply nozzle 2 being in the way.

The swing mechanism 32 includes a pinion 3 provided on a supply holder 14 for holding the supply nozzle 2 in a swingable manner.
3, a rack 34 that meshes with the pinion 33, and an air cylinder 35 that drives the rack 34 forward and backward along a support rod 15 that supports the supply holder 14. The air cylinder 35 Fixedly attached to

In the swing mechanism 32, the air cylinder 3
The feed nozzle 2 is moved through the rack 34 and the pinion 33 by moving the piston rod 36 of
Supply position inclined with respect to soldering iron 1 and soldering iron 1
Swinging between a retracted position and a retracted position which is parallel to.

Since the supply nozzle 2 is oscillated by the oscillating mechanism 32 as described above, when the soldering iron 1 is cleaned or the soldering iron 1 is replaced, the sequencer 6 causes the oscillating mechanism 3 to swing.
2 and the piston rod 36 of the air cylinder 35
And the cleaning or replacement operation is performed by swinging the supply nozzle 2 to the retracted position.
Is retracted to return the supply nozzle 2 to the supply position.

Thus, when cleaning the iron tip of the soldering iron 1, the iron tip can be sufficiently cleaned without the supply nozzle 2 being in the way.

After the soldering iron 1 has been replaced,
The position of the supply nozzle 2 can be returned to the same position as before the replacement without a troublesome operation of manually adjusting the position of the supply nozzle 2 to the original position.

The other structure is the same as that of the embodiment shown in FIG. In the embodiment described above, the supply nozzle 2 is switched between the supply position and the retreat position by the advance and retreat of the piston rod 36 of the air cylinder 35. However, as another embodiment of the present invention, a forward / reverse rotation motor The rotational power may be transmitted to the pinion 33 to displace the supply nozzle 2 arbitrarily. In this case, the supply nozzle 2
Can be set arbitrarily.

(Embodiment 4) FIG. 6 is a partial sectional view of a main part of still another embodiment of the present invention, in which parts corresponding to FIG. 2 are denoted by the same reference numerals.

In this embodiment, the holding member 16
The supply nozzle 2 is held, and a glass tube heater 37 for preheating by blowing high-temperature nitrogen gas to a portion to be soldered is held.
Is moved integrally with the soldering iron 1 in accordance with the movement of the soldering iron, and a high-temperature nitrogen gas is blown to the soldering location immediately before soldering to perform preheating.

As described above, the glass tube heater 37 is provided so as to move integrally with the soldering iron 1 and preheating is performed by blowing high-temperature nitrogen gas locally immediately before soldering. Since the resin component does not undergo thermal deformation and preheating is performed immediately before soldering, thermal efficiency is improved.

Further, since the nitrogen gas is used, the solder and the base metal are not oxidized as in the case of using air, and the soldering quality can be improved.

Since the glass tube heater 37 can be turned around the axis P of the soldering iron 1 by the turning mechanism 17, the direction in which the high-temperature nitrogen gas is blown from the glass tube heater 37 can be easily changed.

In this embodiment, nitrogen gas is used, but air or another inert gas may be used as another embodiment of the present invention.

(Other Embodiments) As another embodiment of the present invention, the above-described embodiments may be appropriately combined. For example, the embodiment of FIG. 4 and the embodiment of FIG. As shown in FIG. 7 in combination, an air blow nozzle 31 and a glass tube heater 37 may be provided.

The mounting structure of the solder head 10 is not limited to the above-described embodiment. For example, as shown in FIG. 8, a guide bush 70 in which the guide shaft 19 of the holding plate 13 slides on the solder head 10. Equipped with a compression coil spring 72 between the storage recess 71 of the solder head 10 and the holding plate 13, and pressing the tip of the soldering iron 1 against an object to be soldered, thereby reducing the urging force of the compression coil spring 72. Soldering head 10
However, it may be possible to smoothly displace along the guide shaft 19 over the range W until it comes into contact with the end face of the holding plate 13.

[0063]

As described above, according to the present invention, since the supply position of the solder core can be automatically adjusted along the axial direction of the soldering iron, a troublesome manual adjustment operation of the supply position by the operator is omitted. You can do it.

Also, the tip of the soldering iron guided to the soldering object by the robot arm is pressed by the soldering object so that the soldering iron is displaced along the axial direction. The supply position of the solder core can be adjusted by inputting the coordinates for designating the movement of the solder core.

Further, since there is provided a rotating means for rotating the supply position of the solder core wire to an arbitrary position in the circumferential direction around the axis of the soldering iron, the supply direction is determined from the optimum supply direction according to the soldering position. Can supply solder core.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a soldering system according to one embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a main part of the present invention in the vicinity of a solder head.

FIG. 3 is an enlarged view for explaining the operation.

FIG. 4 is a partial cross-sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 5 is a partial sectional view of the vicinity of a solder head according to still another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 7 is a partial sectional view of the vicinity of a solder head according to still another embodiment of the present invention.

FIG. 8 is a partial sectional view of a solder head according to still another embodiment of the present invention.

FIG. 9 is a diagram showing a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 soldering iron 2 supply nozzle 3 soldering robot 10 soldering head 11 robot arm 17 rotating mechanism 22 soldering target 24 stepping motor 25 drive pulley 27 driven pulley 28 rotating body 31 air blow nozzle 32 swing mechanism 37 glass tube heater

Claims (5)

[Claims] 1. An automatic soldering device for supplying and soldering a solder core to a soldering iron, wherein a supply position of the soldering core to the soldering iron is
An automatic soldering device, wherein the automatic adjustment is possible along the axial direction of the soldering iron. 2. The automatic soldering apparatus according to claim 1, wherein said soldering iron is displaced along said axial direction when its tip is pressed. 3. A solder core for holding a soldering iron is attached to a robot arm of a soldering robot so as to be displaceable along an axial direction of the soldering iron, and supplies a solder core to the soldering iron. A wire feeder is attached to the robot arm at a fixed position along the axial direction, and a tip of a soldering iron guided to the soldering target by the robot arm is pressed against the soldering target. The automatic soldering device according to claim 1, wherein the soldering iron is displaced along the axial direction by the operation. 4. The automatic soldering apparatus according to claim 3, wherein the displacement of the soldering iron along the axial direction is set by inputting coordinates for designating the movement of the robot arm. 5. The automatic soldering apparatus according to claim 1, further comprising a rotation unit configured to rotate a supply position of the solder core wire to an arbitrary position in a circumferential direction about the axis of the soldering iron. .