JPH02172667A - Method and device for polishing - Google Patents

Abstract

PURPOSE:To effectively avoid a defective polishing and over-polishing accompanied by the extreme over-polishing of a polishing jig by relatively moving the fulcrum position of the polishing jig along the similar locus almost conformed to the outer peripheral shape of the polishing object face of a work. CONSTITUTION:The fulcrum position of a polishing jig 40 is relatively moved along the similar locus almost conformed to the outer peripheral shape of the polishing object face of a work 21 (e.g. panel for a Braun tube). Accordingly, the distance between this similar locus and the outer peripheral end edge of the work 21 can be made about constant and by setting the similar shaped locus in what is desired, the whole zone of the polishing object face of the work 20 can surely be polished without accompanying defective polishing and over-polishing by the polishing jig 40 in the radial dimension almost corresponding to the distance between the similar shaped locus and the outer peripheral end edge of the work 21.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method and an apparatus for rotating a workpiece such as a cathode ray tube panel and polishing a surface to be polished of the workpiece during this rotational operation. The present invention relates to a polishing method and apparatus effective for polishing a workpiece whose surface to be polished has a large long/minor axis ratio.

[Prior Art] An example of a conventional polishing device for polishing the surface of a cathode ray tube panel is the one disclosed in Japanese Patent Publication No. 40-28753. As shown in FIG. 11, a cathode ray tube panel 12 as a workpiece is positioned and mounted on a rotary table 11, and a hollow drive is provided that is inclined at a predetermined angle θ with respect to the rotation axis of the rotary table 11. A polishing jig 14 is attached to the tip of the shaft 13, and the hollow drive shaft 1
Polishing slurry is supplied between the 12 surfaces of the cathode ray tube panel and the polishing tool 14 via the polishing jig 14, and the 12 surfaces of the cathode ray tube panel are polished by the polishing jig 14.

According to this type, as shown in FIG. 12, since the eccentric path IIIl between the rotation center 01 of the cathode ray tube panel 12 and the fulcrum position o2 of the polishing jig 14 is constant, While the fulcrum position 02 of the polishing jig 14 draws a circular locus relative to the rotation of the cathode ray tube panel 12, the polishing jig 14
The entire surface is polished.

[Problems to be Solved by the Invention] However, when looking at recent cathode ray tube panels 12, there has been a shift from a spherical shape with a single curvature to an aspherical shape with a sliding curvature. The long-axis/short-axis ratio is becoming larger in panels for industrial use.

When a conventional polishing device is used for this type of polishing device, as shown in FIG.
It is necessary to uniquely set the eccentric distance l between the cathode ray tube panel 12 and the fulcrum position o1 of the cathode ray tube panel 12 so that the metal body of the cathode ray tube panel 12 can be polished.
It becomes necessary to set the polishing diameter to be thicker in consideration of the dimension between C and the corner position C, and to set the polishing diameter of the polishing jig 14 to a large degree.

In this case, since the polishing jig 14 becomes large in size,
Not only does the sliding curvature of the cathode ray tube panel 12 become difficult to adapt to the object, but also the polishing jig 14 protrudes greatly from the end of the cathode ray tube panel 12 during the polishing process. When the polishing jig 14 rides on the edge of the cathode ray tube panel 12, the polishing jig 14 comes into strong contact with the edge, which causes the edge of the cathode ray tube panel 12 to be polished too much compared to other parts. cause problems.

Furthermore, since the protruding portion of the polishing jig 14 is not effectively used for polishing, a large protruding portion not only reduces the polishing efficiency but also has the disadvantage of inhibiting uniform polishing of the cathode ray tube panel 12. .

The present invention has been made based on the above-mentioned viewpoints, and is capable of efficiently and accurately polishing large surfaces to be polished or surfaces with sliding curvature using a small polishing jig. A method and apparatus thereof are provided.

[Means for Solving the Problems] That is, in the polishing method according to the present invention, when a polishing target surface of a workpiece positioned and mounted on a rotary table and being rotated is polished with a polishing jig, polishing of the workpiece is performed. The present invention is characterized in that the fulcrum position of the polishing jig is relatively moved along a similar locus that substantially matches the outer peripheral shape of the target surface.

In such a method invention, in order to relatively move the fulcrum position of the polishing jig, the fulcrum position of the polishing jig may be moved, or the rotation center position of the workpiece may be moved. Alternatively, both may be moved at the same time, and the design of the drive system in each case may be appropriately changed as long as it performs the above-mentioned operation.

Further, in this invention, the fulcrum position of the polishing jig is relatively moved along a similar locus that approximately matches the outer peripheral shape of the surface to be polished of the workpiece, but the polishing jig can be made smaller. From the viewpoint of polishing, the fulcrum position of the polishing jig is relatively moved along a similar shape locus that approximately matches the outer circumferential shape of the surface to be polished, and the surface to be polished is moved closer to the outer circumference of the workpiece. A first polishing process of intensive polishing,
It is preferable to fix the fulcrum position of the polishing jig and combine this with a second rllI polishing step in which the polishing target surface of the workpiece is polished intensively near the center.

In addition, one device invention for realizing the above-mentioned method invention includes a rotary table on which a workpiece to be polished is positioned and rotated around a fixed rotation axis, and a polishing jig for polishing the surface of the workpiece to be polished. a jig supporting means for swingably supporting the polishing jig along the surface to be polished; and a fulcrum position of the polishing jig along a similar locus that approximately matches the outer peripheral shape of the surface to be polished of the workpiece. and a jig drive system that swings the polishing jig to move the polishing jig.

In such an apparatus invention, if the jig drive system is one that moves the fulcrum position of the polishing jig along a similar locus that approximately matches the outer peripheral shape of the surface to be polished of the workpiece, for example, The jig supporting means may be appropriately oscillated by controlling a hydraulic servo mechanism or the like based on a predetermined drive control signal, or the drive transmission member may be forced to move along a predetermined cam trajectory. The design may be changed as appropriate, such as by moving the jig and swinging the jig support means as appropriate.

Further, in such an apparatus according to the invention, by fixing the fulcrum position of the polishing jig, it is possible to realize a polishing process using a conventional polishing method.

[Operation] According to the above-mentioned technical means, the fulcrum position of the polishing jig is relatively moved along a similar locus that approximately matches the outer peripheral shape of the surface to be polished of the workpiece. The distance between the similar locus and the outer peripheral edge of the workpiece can be made substantially constant.

Therefore, by setting the above-mentioned similar locus to a desired value, a polishing jig with a radius approximately corresponding to the distance between the similar locus and the outer peripheral edge of the workpiece can reliably cover the entire surface to be polished. Can be polished to

[Embodiments] Hereinafter, the present invention will be described in detail based on embodiments shown in the accompanying drawings.

Figure 1 is a schematic diagram of an embodiment in which the present invention is applied to a polishing device for a cathode ray tube panel surface.

In this embodiment, the basic configuration of the polishing apparatus is as follows: A polishing jig 4o for polishing the surface of the panel 21, a jig support means 5o for swingably supporting the polishing jig 40 along the surface of the cathode ray tube panel 21, and a polishing jig 4o for polishing the polishing jig 40 based on a predetermined drive control signal. It includes a jig drive system 70 that swings the tool 4o.

More specifically, the rotary table 20 has a mounting base 22 as shown in FIGS. 2, 3, and 5.
A guide rail 23 is laid above the guide rail 23, and a movable base 24 is disposed via a guide roller 25 that slides along the guide rail 23. Furthermore, a driving air cylinder 26 for advancing and retracting is provided on the movable base 24. At the same time, a movable base 24 is provided between the set position where the polishing operation is performed and the non-set position.
On the other hand, a rotary shaft 28 is installed upright on the movable base 24 via a reduction gear unit 27, and a support base 29 is attached to the tip of the rotary shaft 28 to facilitate the removal of the workpiece. AC servo motor 3 for
0, the rotary shaft 28 is rotated at a predetermined speed. Note that the reference numeral 31 supports the rotary table 20, and the reference numeral 32 indicates a stopper at the set position of the movable base 24.

The polishing jig 40 also has a hollow spindle 41 with a rotation axis 02 inclined at a predetermined angle θ with respect to the rotation axis o1 of the rotation table 20, as shown in FIGS. 2 and 5. A lap member 43 is fixed to a lap holder 42 which is rotated by this spindle 41, and slurry as an abrasive is supplied to the lap member 43 using the hollow part of the spindle 41. be. The drive system of the spindle 41 of the polishing jig 4o includes a driving induction motor 44, and a driving force transmission mechanism 45 consisting of a pulley and a belt that transmits the driving force from the driving induction motor 44 to the spindle 41. It is made up of.

Furthermore, the jig supporting means 50 is particularly
As shown in the figure, a first support 51 is swingably supported on the installation base 22 via a pivot 52, and one end of the first support 51 is A position adjustment mechanism 53 is attached to the first column 51, and a buffer damper 54 is attached to the other end of the first column 51.
A second support 55 is attached to the second support 55 so as to be able to rise and fall freely, and a pivot 56 and a jig support 57 are attached to the upper end of the second support 55. A hydraulic cylinder 58 is interposed to change the posture of the jig support base 57 as appropriate, and the jig support base 57 is further provided with a swing arm 59 that swings in a substantially horizontal direction
A bearing holder 6 is attached to the tip of this 1 working arm 59.
0 is attached, and the spindle 41 of the polishing jig 40 is rotatably supported by this bearing holder 60. Note that reference numeral 61 is an arm guide rail that guides and supports the swing arm 59.

Furthermore, as particularly shown in FIGS. 2 to 4, the jig drive system 70 includes a support bracket 71 attached to a part of the jig support stand 57, and a guide rail 72 laid on the support bracket 71. In addition to covering this guide rail 72
A sliding stand 73 is installed to slide along the
The cylinder main body 74a of the driving hydraulic cylinder 74 is fixed to the cylinder body 74a, and one end of the piston door 4b is fixed to a part of the support bracket 71.
3 and the middle part of the swing arm 59 is connected by the connecting rod 7.
5, the connecting rod 75 is moved forward and backward in the direction of the arrow in response to the drive of the hydraulic cylinder 74, and the swinging arm 59 is appropriately swung in the direction of the arrow.

In this embodiment, the drive system for the hydraulic cylinder 74 is particularly as shown in FIGS. 3 and 6.
An AC servo motor 76 to which a drive control signal is applied is disposed on the support bracket 71, while a servo valve 77 is disposed on the sliding table 73, and a ball nut 79 is attached to one end of a spool 77a of the servo valve 77. A transmission belt 80b is passed between the shaft of the AC servo motor 76 and the ball screw 78 via a pulley 80a, and the sleeve 7 of the servo valve 77 is
For example, four boats a (specifically, A1 to A4) communicating with the valve chamber 81 are provided in 7b, and two of them a
l, a3 has a discharge pipe leading to the tank 82 and a pump 8
The oil supply pipe leading to the discharge boat No. 3 is connected, and the other two a2 and a4 are connected to the pressure boats bl and b2 located at both ends of the cylinder body 74a of the hydraulic cylinder 74, and the above-mentioned AC servo motor As the spool 76 rotates, the spool 77a is moved back and forth as appropriate, and the boat a2
．． Adjust the orifice of a4 appropriately: R, pressurize boat bl,
E) It is designed to control Rm to 2. Furthermore, the third
In the figure, reference numerals 84 and 85 turn on and off following the movement of the pole nut 79, and the spool 77a! It is Mituto Inchi that regulates jeffi.

Furthermore, the basic υfill system accompanying the polishing operation of the polishing apparatus according to this embodiment is constructed as shown in FIG.

In the same figure, reference numeral 90 is a main controller, and 91 is an AC servo motor 30 that drives the rotary table 20.
92 is an NC device for the AC servo motor 76; 93 is an encoder attached to the AC servo motor 30 and sends a feedback signal to the NC device 92; 94 is an induction motor 44 for driving the spindle 41; This is an inverter for

Incidentally, reference numerals 30a and 76a are encoders for sending rotational position information of the servo motor 30.76 to the NC device 91.92.

In such an AILFLL system, the drive control signal sent from the main controller 90 to the NC device 92 is a similar locus m( 9th
The encoder 93
The polishing jig 40 is rotated in synchronization with the feedback signal from
This is for swinging as appropriate. Further, as for the setting data of the similar trajectory m, any desired trajectory can be easily obtained by arbitrarily creating data on the external computer 95 and transferring it to the NC device 92 using a communication line.

Next, the operation of the polishing apparatus according to this embodiment will be explained.

Before operating the polishing device, the attitude of the first support 51 and the vertical position of the second support 55 are adjusted in advance to correspond to the cathode ray tube panel 21 to be polished.

In this state, the main controller 90 positions and places the cathode ray tube panel 21 on the rotary table 20 using a robot not shown, sets the rotary table 20 to the set position, and then rotates the spindle 41. At the same time, the piston rod of the tilting hydraulic cylinder 58 is operated to project, and the attitude of the jig support 57 is changed to bring the polishing jig 40 into contact with the initial position of the surface of the cathode ray tube panel 21.

Then, the main controller 90 controls the NC device 91.
．． 92, and the NC device 91.92 receives this drive control signal and controls the AC servo motor 30.76.
control.

At this time, the polishing jig 40, which was placed at the initial position shown in FIG. 8(a), first swings in the six directions of arrows as the cathode ray tube panel 21 rotates, and then as shown in FIG. 8(b). It reaches the position shown in Fig. 8 (
It reaches the position C), swings again in the six directions of the arrow, and returns to the initial position while the Brakun pipe panel 21 rotates once. By repeating such a polishing operation for a predetermined period of time, one polishing operation cycle is completed.

In such a polishing operation cycle, the fulcrum position 02 of the polishing jig 40 is moved along a similar locus m that approximately matches the outer peripheral shape of the cathode ray tube panel 21, as shown in FIGS. 8 and 9. Moving.

At this time, the similar locus m is set so that the distance S from the outer peripheral edge of the cathode ray tube panel 21 is approximately constant;
Distance between rotation center 01 of 1 and similar locus m! is set slightly larger than the . Then, the polishing jig 4
If a diameter dimension of 0 is selected that is slightly larger than the distance #lS, the polishing jig 40 can efficiently polish the entire surface of the cathode ray tube panel 21, and moreover, it can polish the entire surface of the cathode ray tube panel 21, and moreover, the polishing jig 40 can efficiently polish the entire surface of the cathode ray tube panel 21. Compared to CRT panel 21
The distance between the protrusion of the polishing jig 40 from the outer peripheral edge of the cathode ray tube panel 21 can also be kept sufficiently small, and thereby the situation of poor polishing or excessive polishing of the cathode ray tube panel 21 can be effectively avoided.

Embodiment 2 The basic configuration of a polishing apparatus according to this embodiment is substantially the same as that of Embodiment 1, but the polishing operation cycle by the polishing jig 40 is different from that of Embodiment 1.

That is, in the polishing operation cycle in this embodiment, as shown in FIG. 70, the fulcrum position 02 of the polishing jig 40 is moved along a similar locus m1 that approximately matches the outer peripheral shape of the surface of the cathode ray tube panel 21. , CRT panel 2
A first polishing step of intensively polishing the outer periphery of the cathode ray tube panel 21, and a first polishing step in which the fulcrum position @02 of the polishing jig 40 is polished on the cathode ray tube panel 21
A second polishing process in which the surface is fixed near the center of the surface, and a circular trajectory m2 is drawn at the fulcrum position 02 on the surface of the cathode ray tube panel 21, and then the surface of the Brass/Thin tube panel 21 is intensively polished near the center. It consists of.

According to this embodiment, it is no longer necessary to polish the central part of the surface of the cathode ray tube panel 21 with high precision in the first polishing step, so the diameter k of the polishing jig 40 is made smaller than that of the first embodiment. In addition to making it possible to downsize the polishing jig 40, it is also possible to make the polishing surface of the polishing jig 40 more compatible with the surface of the cathode ray tube panel 21 having a double surface ratio. can.

[Effects of the Invention] As explained above, according to the polishing method and device according to the present invention, by devising the polishing trajectory of the polishing jig, when polishing the entire surface of the workpiece to be polished, Since the polishing jig has been made smaller and the protrusion of the polishing jig from the surface to be polished is kept to a minimum, the polishing jig can be easily used even if the surface to be polished has a multi-surface ratio. , it is possible to effectively avoid polishing defects and excessive polishing caused by extreme protrusion of the polishing jig, and the polishing accuracy of the polishing jig can be improved accordingly.

Furthermore, according to the (d) polishing method of claim 2, when polishing the entire surface of the workpiece to be polished, a step centered on the outer periphery of the surface to be polished and a step centered on the center of the surface to be polished are performed. Since the polishing jig is divided into two parts, the polishing jig can be made more compact.

Further, according to the polishing apparatus according to claim 3, the optimum polishing trajectory of the workpiece can be obtained by simply swinging the polishing jig side. There is no need to incorporate a complicated cam mechanism, etc., and it is possible to improve polishing accuracy while simplifying the device.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing one embodiment of a polishing device according to the present invention, FIG. 2 is a front view of the polishing device according to the embodiment, and FIG.
Figures 5 through 5 are arrow views seen from directions I[1, IV, and V in Figure 2, Figure 6 is an explanatory diagram showing details of the jig drive system used in the example, and Figure 7 is an illustration showing the details of the jig drive system used in the example. A block diagram showing the overall control system of the polishing apparatus used in the example, FIGS. 8(a) to d) are explanatory diagrams showing the polishing operation process of the polishing apparatus according to the example, and FIG. An explanatory diagram schematically showing the polishing range using the device, FIG. 70 is an explanatory diagram schematically showing the polishing range using another embodiment of the polishing device according to the present invention, and FIG. 11 is a conventional polishing device. An explanatory diagram showing an example, FIG. 12 is an explanatory diagram schematically showing the polishing operation of a conventional polishing device, and FIG. 13 is an explanatory diagram showing the polishing operation of a conventional polishing device when polishing a cathode ray tube panel surface with a large major axis/minor axis ratio. FIG. 3 is an explanatory diagram schematically showing a polishing operation. [Explanation of symbols] m, m? ... Similar locus 20 ... Rotary table 21 ... Braun tube panel (work) 40 ... Polishing jig 50 ... Jig support means 70 ... Jig drive system Fig. 4 Patent application Representative of Asahi Glass Co., Ltd. Patent attorney Masahiro Koizumi (3 others) z Figure 3 (a) (C) 3 (b) (d) Figure 70

Claims (1)

[Scope of Claims] 1) The polishing jig (40
), the fulcrum position of the polishing jig (40) is relatively moved along a similar locus (m) that approximately matches the outer peripheral shape of the surface to be polished of the workpiece (21). A polishing method characterized by: 2) The polishing jig (40
), the fulcrum position of the polishing jig (40) is relatively moved along a similar locus (m1) that approximately matches the outer peripheral shape of the surface to be polished of the workpiece (21), and the A first polishing step of intensively polishing the outer periphery of the target surface, and the polishing jig (40
), and a second polishing step of fixing the fulcrum position of the workpiece (21) and intensively polishing the surface of the workpiece (21) near the center. 3) A rotary table (on which the workpiece (21) to be polished is positioned and placed and rotates around a fixed rotation axis)
20) and a polishing jig (40) for polishing the surface to be polished of the workpiece (21).
), a jig support means (50) for swingably supporting the polishing jig (40) along the surface to be polished, and a similar locus that substantially matches the outer peripheral shape of the surface to be polished of the workpiece (21). (m, m1) in order to move the fulcrum position of the polishing jig (40), the polishing jig (40) is characterized by comprising a jig drive system (70) that swings the polishing jig (40). Polishing equipment.