JPH10326980A - Board-containing case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce working manhour and the number of components. SOLUTION: A case is provided with a plurality of boards 2, 3 on which electronic components 1, 11 are mounted, a case main body 4 in which the respective boards 2, 3 are accommodated in a laminated state, a lid member 6 of the case main body 4, and a fixing means 7 which fixes the lid member 6 to the case main body 4. A plurality of step wire structures 43, 44, 45, 46 on which the boards 2, 3 are independently mounted are installed in the case main body 4. Holding protrusions 61, 62, 63, 64 which are independently and forcibly brought into contact with the boards 2, 3 are installed on the surface of the lid member 6 which surface faces the case main body 4. Penetrating holes 23, 24 into which the holding protrusions 63, 64 for the board 3 arranged below the board 2 are inserted are installed on the board 2 except the board 3 arranged in the lowermost part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case with a built-in board, and more particularly to a case with a built-in board suitable as a controller for a vehicle or a controller for a two-wheel electric vehicle.

[0002]

2. Description of the Related Art A conventional case 50 with a built-in substrate is shown in FIG. This conventional example is composed of two substrates 52 on which electronic components 51 are mounted, and a resin case body 53 which is opened upward and each of the substrates 52 is stored in a vertically stacked state.
And a lid 54 for closing the opening 53a of the case body 53.
And a case 50 with a built-in board including a set screw 55 for fixing the lid 54 to the case main body 53.

[0003] The case main body 53 is a housing having a U-shaped cross section, and its upper surface is uniformly opened. A screw hole is formed in the upper end surface of the side wall 53b of the case main body 53 to be screwed with a set screw 55 for fixing the lid 54.
Further, a step structure is formed in a stepwise manner inside two opposing side walls 53b, and each substrate 52 is placed on each step 53c formed on each side wall 53b.

[0004] Further, each substrate 52 is fixedly mounted on a set step 53c with a set screw 52a.

[0005]

However, in the above-described board-containing case 50, each board 52 is placed on each step 53c formed on the side wall 53b of the case body 53 and fixed by the set screw 52a. As a result, the number of parts increases due to each set screw 52a, and the number of assembly steps increases due to screw hole processing and screwing work for each substrate 52 and each step portion 53c.
0 productivity was reduced.

In addition, it is necessary to secure a screw hole for a set screw for each step portion, which increases the width of the step portion and the thickness of the side wall increases as the step portion is disposed. Has a disadvantage that the disposition area becomes narrow.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a case with a built-in board which solves the disadvantages of the prior art and eliminates the need for a set screw for fixing each board.

[0008]

According to the present invention, there are provided a plurality of substrates on which electronic components are mounted, a case body in which an upper part is opened and each substrate is sequentially housed in a vertically stacked state therein, In a case with a built-in substrate including a lid for closing an opening of the main body and fixing means for fixing the lid to the case main body, a plurality of step structures in which the respective substrates are individually placed inside the case main body are formed. In addition to the above, on the surface of the lid body facing the case body, holding projections are provided which individually press-contact each of the substrates. Also has a configuration in which a through hole is provided through which a holding projection for another substrate disposed at a lower level is inserted.

In the above configuration, each substrate is placed on each step constituting the step structure in the case main body, and a plurality of substrates are arranged in a stacked state inside the case main body. And
When the lid is mounted on the case body, the holding projections provided on the lid are pressed against the substrates, and the substrates are sandwiched between the steps.

At this time, each holding projection has a structure in which a lower substrate is inserted into a through hole provided in the upper substrate and reaches a predetermined substrate. In this state, the lid is fixed to the case main body by the fixing means, and the substrate built-in case is assembled.

The present invention aims to achieve the above-mentioned object by the above configuration.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG. This embodiment shows a board built-in case 10 provided with boards 2 and 3 on which circuits constituting an electronic control controller mounted on an automobile or the like are formed.

The case 10 incorporates two substrates 2 and 3 on which the electronic components 1 and the like are mounted, and the upper side is opened, and the substrates 2 and 3 are accommodated therein in a vertically stacked state. The case body 4 includes a cover 6 that closes the opening 48 of the case body 4, and a set screw 7 as fixing means for fixing the cover 6 to the case body 4.

The case body 4 is formed of a resin, and is a housing having a U-shaped cross section and an upper opening which is constituted by a bottom plate and side walls rising from four sides thereof. On the inner side, an inner space for accommodating each of the substrates 2 and 3 is provided. Of the side walls surrounding the inner space, upper ends of the two side walls 41 and 42 facing each other have lids respectively. A screw hole for screwing with a set screw 7 for fixing the screw 6 is formed.

Further, the inside of each of the side walls 41, 42 has a step-like stepped portion 43, 44,
45 and 46 are formed. These steps 43, 44,
The substrate 2 is placed on the upper step portions 43 and 44 of the side walls 41 and 42 of the side walls 45 and 46, and the substrate 3 is placed on the lower step portions 45 and 46.

Further, flanges protruding outward are provided at both ends at the bottom of the case body 4, and are mounted at predetermined positions of an automobile or the like via each of the flanges (for example, A through hole is provided in the flange state, and the through hole is fixed at a predetermined arrangement position with a bolt or the like through this hole.

Circuit patterns are wired on each of the substrates 2 and 3, and these circuit patterns are communicated by a jumper 21. In addition, each of the substrates 2 and 3 is connected to each of the connectors 22 and 32 extending from the external connection port 47 formed on the outer surface of the side wall 41 of the case body 4 to the outside.

Each of the substrates 2 and 3 is provided with a plurality of electronic components 1 described above on surfaces facing each other, and the upper substrate 2 is pressed against the lower substrate 3 to be described later. The through hole 23 through which the holding projections 63 and 64 are inserted,
24 are formed.

The above-mentioned holding projection is provided on the case body 4 side of the cover body 6 for closing the open portion of the case body 4. When the cover body 6 is mounted on the case body 4 by the set screw 7, each of the holding protrusions is provided. It is individually pressed against the substrates 2 and 3. That is, when the lid 6 is mounted on the case main body 4, the holding projections 61 and 62 are set to have a length that is pressed against the upper surface side of the substrate 2 placed on each of the steps 43 and 44. Step 45, 4
The cover 6 is provided with holding projections 63 and 64 each having a length set so as to be pressed against the substrate 3 via the electronic component 11 mounted on the upper surface of the substrate 3 placed on the substrate 6. Each of the holding projections 61, 62, 63, 64 allows each substrate 2,
3 is held between the steps 43, 44, 45, 46 in a fixed state inside the case body 4.

On the substrate 3, the electronic component 11 (aluminum capacitor) which is mounted on the upper surface of the substrate 3 and whose upper end surface is flat and whose upper end surface is close to the upper substrate 2 is provided. , Relay, etc.), and the holding projections 63 and 64 have the same effect as the case where they are directly pressed against the upper surface of the substrate 3 by being pressed against the upper end surface of the electronic component 11.

In this case, the holding projection 6 is directly provided on the upper surface of the substrate 3.
3, 64 are already in contact with each other.
Since the space occupied by the substrate 3 is used, there is no need to secure a press-contact area for the holding projections 63 and 64 on the upper surface of the substrate 3, and it is possible to save space and reduce the size of the substrate 3 due to this. Further, it is possible to reduce the size of the holding projections 63 and 64 in the projecting direction.

Here, as described above, through holes 23 and 24 through which holding projections 63 and 64 for the lower substrate 3 are inserted are formed in the upper substrate 2.
As shown in FIG. 3, it may be used in combination with one for inserting a tall electronic component 11 in order to reduce the interval between the substrates 2 and 3. In this case, the through hole is not a through hole through which the holding protrusion 63 is inserted, but has substantially the same function as a through hole to be pressed against the substrate 3.

When these effects are not required, the holding projections 63 and 64 may be set to be relatively long, and may be directly pressed against the upper surface of the substrate 3.

The operation of the above embodiment will be described. In the case 10 with a built-in substrate, the lower substrate 3 is first placed on each of the steps 45 and 46, and then the upper substrate 2 is placed on each of the steps 43 and 44. In such a state,
The lid 6 is mounted on each side wall 41, 42 of the case body 4 with each set screw 7.

At this time, the holding projections 63 and 64 are
The through-holes 23 and 24 formed in the substrate 3 are pressed against the upper end surface of the electronic component 11 on the substrate 3, and the holding projections 61 and 62 are directly pressed against the upper surface of the substrate 2. Thereby, each substrate 2, 3
Correspond to the step portions 43, 44, 45, 46 and the holding projections 61, 6
2, 63, 64 and held in a fixed state inside the case body 4.

According to the above-described embodiment, since the respective substrates 2 and 3 are held by the respective holding projections 61, 62, 63 and 64, the fixing of the respective substrates 2 and 3 by the provision of the lid 6 is performed. It can be performed, and a set screw for fixing each of the substrates 2 and 3 inside the case main body 4 becomes unnecessary, so that the number of parts can be reduced, and the number of work steps such as screw hole processing and screw fixing work can be reduced. It becomes possible to improve the production of the case with a built-in substrate.

Further, since a set screw is not required, it is not necessary to secure a space for providing a screw hole in the case main body 4, and it is possible to avoid an increase in the thickness of each of the side walls 41 and 42 of the case main body 4. The size and weight of the case body 4 can be reduced.

In addition, since it is not necessary to secure the screw holes for the set screws, the steps 43, 44, 45, and 46 can be reduced in size as far as the substrate can be placed. It is possible to secure a wider area for disposing the substrate 3 on the side than before.

As described above, it is possible to provide an excellent case 10 with a built-in substrate, which has not been achieved conventionally.

[0030]

According to the invention of the present application, each substrate can be fixed by the provision of the lid, since each substrate is sandwiched and held by the step structure and each holding projection. A set screw for fixing inside is unnecessary,
It is possible to reduce the number of parts and to reduce the number of man-hours such as screw hole processing and screw fastening work, and it is possible to improve the productivity of the case with a built-in board.

Further, since a set screw is not required, it is not necessary to secure a space for providing a screw hole in the case main body, and it is possible to avoid an increase in the thickness of each side wall of the case main body, and to downsize the case main body. In addition, it is possible to reduce the weight.

In addition, since it is not necessary to secure the screw holes of the set screws, the width of the step portion on which the substrate constituting the step structure is placed can be reduced as far as the substrate can be placed. Since it is possible, it is possible to secure a wider area for disposing the lower substrate than before.

Since the present invention is constructed and functions as described above, according to the present invention, it is possible to provide an excellent case with a built-in substrate, which has not been achieved conventionally.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional example.

[Explanation of symbols]

 Reference Signs List 1, 11 Electronic component 2 Upper board 3 Lower board 4 Case body 6 Lid 7 Set screw (fixing means) 10 Board built-in case 23, 24 Through hole 43, 44, 45, 46 Step (step structure) 48 Open Part 61, 62, 63, 64 Holding projection

Claims (1)

[Claims] 1. A plurality of substrates on which electronic components are mounted, a case body in which an upper part is opened and the respective substrates are sequentially stacked in a vertical state therein, and a lid for closing an open part of the case body. A case having a body and a fixing means for fixing the lid to the case main body, wherein the case main body has a plurality of step structures in which the respective substrates are individually placed inside the case main body; On the surface of the lid facing the case body, holding projections are provided for individually pressing against the respective substrates, and for each of the other substrates except for the substrate disposed at the lowest level, the lower level than the respective substrates is provided. A through-hole through which the holding protrusion for another substrate to be disposed is inserted.