JPH10326767A - Apparatus and method for treatment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an apparatus and a method in which an electrostatic charge on the surface and the rear surface of a substrate which is lifted up from a mounting base can be removed effectively, by a method wherein an ionizer is arranged at the side of the mounting base on which the substrate such as a liquid-crystal display substrate, a semiconductor wafer or the like is placed. SOLUTION: A mounting base 42 on which a liquid-crystal display substrate G is placed is arranged inside a treatment chamber 41 which is surrounded by a casing 41a at a heating device 20. Four through holes 48 are made in the mounting base 42, and support pins 50 which are used to support the liquid- crystal display substrate G in the delivery of the liquid-crystal display substrate G are inserted into, and passed through, the through holes 48 in a free fitted state. Then, when a main conveyance arm 15 is advanced or retreated, an opening part 47 on one side of the treatment chamber 41, through which the liquid-crystal display substrate G on the support pins 50 is received or through which the liquid-crystal display substrate G is delivered onto the support pins 50, is formed, and an ionizer 70 as a static eliminator is arranged at the outside of an opening part on the other side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing method for drying a substrate such as an LCD substrate or a semiconductor wafer.

[0002]

2. Description of the Related Art In the production of liquid crystal displays (LCDs) and semiconductors, a resist film pattern is formed on the upper surface of an LCD substrate or semiconductor wafer as a substrate.
A so-called lithography process is performed. This lithography processing includes various processing steps such as cleaning of the substrate, drying of the substrate, application of a resist film on the surface of the substrate, exposure and development of the resist film. In these processing steps, for example, a heating device is used for performing the above-mentioned drying treatment. As an example of this heating device, a device configured to heat a substrate by mounting the substrate on a mounting table is known. The heating device has a plurality of pins for receiving the substrate, projecting upward from the mounting table at the time of delivery, and supporting a lower surface of the substrate, and receiving the substrate above the mounting table by elevating the pins,
It is configured to transfer the received substrate to the mounting table by lowering the pins. After the substrate is heated on the mounting table, the substrate is pushed up from below with a pin, thereby lifting the substrate above the mounting table.

[0003]

However, in particular, LC
When a substrate made of an insulating material such as a D substrate is mounted on a mounting table, static electricity is easily generated between the substrate and the upper surface of the mounting table. Therefore, when the substrate is lifted from the mounting table with the pins, the substrate may adhere to the upper surface of the mounting table and cannot be lifted smoothly. In particular, the LCD substrate and the like are formed of a thin glass plate, and are liable to bend, and are difficult to peel off from the mounting table. Further, when the substrate is lifted above the mounting table, there is a concern that charges of opposite polarities may be charged on the upper and lower surfaces of the substrate due to the polarization action.

Accordingly, it is an object of the present invention to provide an apparatus and a method capable of effectively removing charges on the upper and lower surfaces of a substrate lifted from a mounting table.

[0005]

According to a first aspect of the present invention, there is provided a processing apparatus having a mounting table for mounting a substrate thereon and pins for elevating the substrate on the mounting table, wherein an ionizer is provided on a side of the mounting table. Are arranged. In this processing apparatus, the substrate is, for example, an LCD substrate or a semiconductor wafer. Such a substrate is received at the upper ends of the pins above the mounting table, and the substrate is mounted on the mounting table by lowering the pins. Then, processing such as heating is performed on the substrate on the mounting table. After this processing, the pins are raised, and the substrate is lifted from the mounting table. When the substrate is lifted, ions are sprayed from an ionizer disposed on the side of the substrate to remove the charge on the upper and lower surfaces of the substrate.

In the processing apparatus according to the first aspect, as described in the second aspect, the ionizer can supply ions to both the upper surface and the lower surface of the substrate lifted from above the mounting table by the pins. It is preferred that they are arranged at positions. Then, the ions created by the ionizer can be sprayed on both the upper and lower surfaces of the substrate,
The charge on the upper and lower surfaces of the substrate can be effectively removed.

According to a third aspect of the present invention, there is provided a processing apparatus comprising: a mounting table on which a substrate is mounted; pins for raising and lowering the substrate on the mounting table; and a casing for accommodating the mounting table. In addition, there is provided a processing apparatus including a static eliminator that discharges ionized gas toward at least the upper surface of the mounting table.

According to the third aspect of the present invention, the processing apparatus includes a static eliminator for discharging ionized gas from the outside of the casing toward the upper surface of the mounting table. Can be removed. Here, the term “discharge toward the upper surface of the mounting table” means that the discharge is performed from the side of the upper surface and obliquely from above.

According to a fourth aspect of the present invention, there is provided a processing apparatus comprising a mounting table on which a substrate is mounted, pins for elevating the substrate on the mounting table, and a casing accommodating the mounting table. In addition, a static eliminator for discharging ionized gas toward at least a portion between the upper surface of the mounting table and the lower surface of the mounted substrate is provided. Also in this case, similarly to the case of the third aspect, the charge of the substrate is removed to facilitate the detachment of the substrate from the mounting table by the pins.

[0010] The static elimination device is as described in claim 5.
It can be proposed to include a discharge electrode for ionizing gas and gas supply means for supplying gas to the discharge electrode. Furthermore, it can be proposed that this discharge electrode is arranged at a position along the longitudinal direction of the substrate, and in the case of an LCD substrate,
It is possible to effectively perform static elimination. Further, if the discharge electrodes are alternately arranged up and down as viewed from the mounting table side, an ionized gas can be supplied without bias.

According to the present invention, when the substrate is lifted from the mounting table, the supply of ions is started from the side of the substrate before the operation of lifting the substrate from the mounting table is started, and at least a part of the substrate is started. Lifts the substrate at a first speed while the substrate is in contact with the upper surface of the mounting table, and after the substrate is completely separated from the upper surface of the mounting table, moves the substrate at a second speed higher than the first speed. It is a processing method of lifting. In this processing method, as described in claim 9, after the substrate is completely separated from the upper surface of the mounting table, the operation of lifting the substrate from the mounting table is stopped for a certain period, and thereafter, the substrate is removed from the mounting table. May be configured to be lifted at the second speed. In this case, it is preferable that the fixed period be a time until the vibration of the substrate stops.

[0012]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG.
1 is a perspective view of a coating and developing processing system 1 for processing an LCD substrate (glass substrate) using photolithography technology. The coating and developing processing system 1 includes a heating device 20 as a processing device according to the first embodiment. It has.

The coating and developing system 1 includes a loader unit 2 for loading and unloading, for example, a rectangular LCD substrate G;
A first processing unit 3 for processing the CD substrate G, and a second processing unit 3 connected to the first processing unit 3 via the interface unit 4
Processing unit 5 and the second processing unit 5 and, for example, the exposure apparatus 6
And an interface unit 7 for exchanging the LCD substrate G with the other devices.

The loader unit 2 includes a cassette station 1
The cassette station 10 is provided with a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. The loader unit 2 is provided with a sub-transport arm 13 for loading or unloading an unprocessed LCD substrate G. Note that the sub-transfer arm 1
Reference numeral 3 is configured to be movable in the Y and Z directions and rotatable in the θ direction.

In the first processing section 3, various processing devices for performing predetermined processing on the LCD substrate G are arranged on both sides of the transport path 16 of the main transport arm 15. On one side of the transport path 16, the L
A brush cleaning device 17 for cleaning the CD substrate G and a developing device 18 are arranged side by side, and an adhesion device 19 for performing a hydrophobic treatment on the LCD substrate G, a heating device 20, and an LCD on the opposite side across the transport path 16. Cooling devices 21 for cooling the substrate G to a predetermined temperature are appropriately arranged in multiple stages.

The second processing unit 5 includes a main transfer arm 2
The coating / periphery removing device 24 according to the present embodiment is disposed on one side of the second transport path 23, and the heating device 20 and the cooling device 21 are appropriately arranged in multiple stages on the opposite side across the transport path 22. Are located.

The interface section 7 includes an LCD substrate G
, A sub-transfer arm 26 for moving the LCD substrate G in and out of the cassette 25, and a transfer table 27 for the LCD substrate G. The configurations of the first processing unit 3 and the second processing unit 5, the arrangement of various devices, and the like can be appropriately changed.

The configuration of the heating device 20 according to the first embodiment, which is incorporated in the coating and developing system 1 configured as described above, will be described. In the processing chamber 41 surrounded by the casing 41a of the heating device 20, L
A mounting table 42 on which the CD substrate G is mounted is arranged. Inside the mounting table 42, the LCD substrate G is mounted via the mounting table 42.
Is provided with a heater 43 as heating means for heating the heater 43. The mounting table 42 is made of, for example, an aluminum alloy, and a temperature sensor (not shown) is attached to the mounting table 42.
The temperature can be set to a predetermined heating temperature such as.

At the top of the processing chamber 41, a processing chamber upper wall 45, which is a cover member that covers the processing chamber 41 and forms a processing space 44 with the mounting table 42, is disposed. An exhaust port 45a is provided at the center of the processing chamber upper wall 45. The processing chamber upper wall 45 is attached to an opening / closing door 46 that is a shutter member via a spacing setting protrusion described later. By raising and lowering the opening / closing door 46, the opening 47 between the processing chamber 41 and the processing chamber upper wall 45 can be opened and closed to form and open the processing space 44.

The mounting table 42 is provided with, for example, four through holes 48.
In order to support the LCD substrate G at the time of delivery of the CD substrate, support pins 50 are inserted in a loosely fitted state. That is, the through hole 48 has a size that allows the support pin 50 to move horizontally. The support pin 50 includes a stainless steel pin body 50b having a leg 50a at a lower end, and a pin body 50b.
For example, PEEK (polyet)
Her-ether-ketone (corrosion-resistant pin auxiliary body), and the leg portion 50a can be moved in the horizontal direction by a cylindrical support member 52 protruding from the upper surface of the holding member 51. Supported.

As described above, the holding member 51 for holding the four support pins 50 is connected to the elevating mechanism 53 so as to be able to move up and down, that is, the support pins 50 are inserted upward through the through holes 48 of the mounting table 42. It is configured to be protrudable. In this case, the lifting mechanism 53 includes a stepping motor 5 serving as a driving motor.
4, a driving pulley 55 driven by the stepping motor 54, a driven pulley 56 disposed above the driving pulley 55, and the holding member 51 is connected to the driving pulley 55 and the driven pulley 56 so as to span the driving pulley 55 and the driven pulley 56. And a timing belt 57. Therefore, the support pin 50 and the mounting table 42 can be relatively vertically moved by the forward / reverse rotation of the stepping motor 54.

The opening / closing door 46 has a rectangular cylindrical main body 46a.
An inward horizontal piece 46b is provided at the upper end of the inward horizontal piece 46b facing the lower surface of the processing chamber upper wall 44.
b, a predetermined height dimension h, for example, 1 to 5 m
An interval setting protrusion 60 of m is protruded. The opening / closing door 46 is provided with a bracket 46 protruding from a lower end of the main body 46a.
An elevating mechanism, for example, a piston rod 61a of an air cylinder 61 is connected to c, and is moved up and down by driving the air cylinder 61 to open and close the opening 47 of the processing chamber 41 and to form and release the processing space 44. It has become.

The opening / closing door 46 is raised and the interval setting projection 60 is provided.
Abuts on the lower surface of the processing chamber upper wall 45, thereby forming an air introduction port 62 set and maintained at a predetermined dimension h between the lower surface of the processing chamber upper wall 45 and the upper surface of the opening / closing door 46. Therefore, during the heat treatment of the LCD substrate G, constant external air flows into the processing space 44 via the air introduction port 62, and the flow rate of air exhausted from the exhaust port 45a can be made uniform. The heating temperature of G can be made uniform.

The opening 47 on one side of the processing chamber 41 receives the LCD substrate G on the support pins 50 when the main transfer arm 15 enters and exits, and
Give the D board G. Outside the opening 47a on the other side, an ionizer 70 as a static eliminator is arranged. The ionizer 70 includes a main body 71 having one end closed, and nozzles 72 and 73 arranged on one side of the main body 71 in two upper and lower stages.
have. The nozzles 72 and 73 are arranged at an equal pitch (for example, at intervals of about 90 mm), and the upper nozzle 72 and the lower nozzle 73 are arranged so as not to overlap when viewed from above. The nozzle 72 of the ionizer 70,
The reference numeral 73 is arranged along the long side of the LCD substrate G as shown in FIG.

A gas inlet 74 is provided at the other end of the main body 71. When fresh air, nitrogen gas or other inert gas is supplied to the gas inlet 74, the nozzle 7
Discharged from 2, 73. Each of the nozzles 72 and 73 is provided with a needle-shaped discharge electrode 75. Power cable 76
When power is supplied from the discharge electrode 75, the discharge electrode 75 is discharged, and the fresh air, nitrogen gas, and other inert gas discharged from the nozzles 72 and 73 are ionized, riding on the flow of the discharged gas, and Discharged in the blowing direction. Electric power is supplied from the power supply 77,
It is supplied from a gas supply source 78.

The supply of power and gas, that is, the operation of the ionizer 70 is controlled by the controller 81. The controller 81 operates valves 82 and 83 for operating the air cylinder 61 that drives the door 46.
The opening and closing of the is also controlled. When the valve 82 is opened, gas from the gas supply source 84 is supplied into the air cylinder 61 to push up the piston rod 61a. As a result, the opening / closing door 46 rises, and the opening 62 is closed. When the valve 83 is opened, the gas from the gas supply source 84 is supplied to another space in the air cylinder 61, and pushes down the piston rod 61a. Thereby, the opening / closing door 46 descends, and the opening 62 is opened.

The controller operates the ionizer 70 when opening the door 46. Therefore, the ionized gas is released from the nozzles 72 and 73 toward the upper surface of the mounting table 42 in the processing chamber 41 and the rear surface of the LCD substrate G as shown in FIG. Thereby, the charge on the LCD substrate G is neutralized and removed. Therefore, the support pin 5
By raising 0, the LCD substrate G can be lifted from the upper surface of the mounting table 42 smoothly.

The nozzle 72 discharges ionized gas toward the main transfer arm 18 on the LCD substrate G, and the nozzle 73 discharges ionized gas toward the near side of the LCD substrate G. Therefore,
The ions can be supplied evenly to the entire LCD substrate G, and the charge on the LCD substrate G is effectively removed.

Next, a second embodiment of the present invention will be described. The resist processing system 101 shown in FIG. 7 includes a cassette station 103 at one end.
In the cassette station 103, a plurality of cassettes 2 containing LCD substrates G are placed. An LCD is provided on the front side of the cassette 102 in the cassette station 103.
While carrying and positioning the substrate G, the LCD substrate G
And an auxiliary arm 105 for holding and transferring the main arm 104 to and from the main arm 104. Two main arms 104 are arranged in series so as to be able to move in the center of the processing system 101 in the longitudinal direction, and a developing device 106 and other various processing devices are arranged on both sides of the transfer path.

In the illustrated processing system 1, a brush scrubber 107 for brush cleaning the LCD substrate G and a high-pressure jet cleaning machine 10 for cleaning with high-pressure jet water are provided on the side of the cassette station 103.
8 etc. are juxtaposed. Further, two developing devices 106 are provided in parallel on opposite sides of the transfer path of the main arm 104,
Two heating devices 109 are stacked next to each other.

An adhesion device 111 for hydrophobically treating the LCD substrate G before applying a resist film to the LCD substrate G is provided on a side of each of these devices via a connection interface unit 110. A cooling cooling device 112 is arranged below the cooling device 112. In addition, these adhesion devices 111
In addition, two heating devices 113 are arranged side by side in the cooling device 112 in two rows. Main arm 10
On the other side of the transfer path 4, two resist film coating devices 114 for forming a resist film (photosensitive film) on the surface of the LCD substrate G by applying a resist liquid to the LCD substrate G are provided in parallel. . Although not shown, an exposure device or the like for exposing a predetermined fine pattern to a resist film formed on the LCD substrate G is provided on a side portion of the resist film coating device 114.

The main arm 104 has an X-axis driving mechanism, a Y-axis driving mechanism, and a Z-axis driving mechanism (X-axis, Y-axis driving mechanism).
Each direction of the axis and the Z axis is shown in FIG. 1), and further, a θ rotation drive mechanism that rotates about the Z axis is provided. The main arm 104 appropriately travels along the central passage of the resist processing system 101, and
9, the LCD substrate G is conveyed between 111-113. The main arm 104 is connected to each of the processing devices 106, 10
9, 111-113, the unprocessed LCD substrate G is loaded into each of the processing devices 106, 109, 111-113.
It has a function to carry out the processed LCD substrate G from inside.

Among these devices, the heating device 10
Since the heating device 9 and the heating device 113 have the same configuration, the heating device 109 will be described below as a representative. As shown in FIG. 8, the heating device 109 includes a mounting table 121 for mounting the LCD substrate G inside a casing 120. Although not shown, the mounting table 121 has a built-in heater, and the LC mounted on the mounting table 121 is not shown.
By heating the D substrate G, the LCD substrate G can be dried.

A plurality of pins 122, for example, four pins 122, which protrude upward from the upper surface of the mounting table 121 and push up the lower surface of the LCD substrate G at the time of receiving and transferring the LCD substrate G, are inserted into the mounting table 121 in a vertically movable manner. ing. These pins 1
The lower end of 22 is supported by a lifting mechanism 124 having a built-in stepping motor via a lifting frame 123.

The main arm 10 of the casing 120
4, a window 125 for carrying in and out the LCD substrate G is formed on the side surface facing the transfer path.
Are opened and closed by a shutter 126. Although not shown, a sensor for detecting the opening / closing operation by the shutter 126 is provided. Through the window 25 opened by raising the shutter 126,
As shown in FIG. 9, the LCD substrate G is
Is carried into the casing 120. Then, the LCD board G thus carried in is received from the main arm 104 by pushing up with the pins 122,
After the main arm 104 moves out of the casing 120 and the pins 122 descend, the LCD substrate G is mounted on the mounting table 121.

As shown in FIG. 8, above the casing 120, an exhaust duct 127 for exhausting gas generated when the LCD substrate G is heated on the mounting table 121 is provided.
Is connected.

On the side of the LCD substrate G mounted on the mounting table 121 inside the casing 120, an ionizer 130 characteristic of the present invention is disposed.
The operation of the ionizer 130 and the operation of the elevating mechanism 124 are controlled by the controller 131. A discharge electrode and a counter electrode are provided inside the ionizer 130, and an AC voltage is applied to the discharge electrode, and a DC voltage is applied to the counter electrode, so that a corona discharge is generated between both electrodes. By supplying clean air, it is possible to release ions in the airflow. As will be described later, when the LCD substrate G is lifted from the mounting table 121 by the pins 122, ions are emitted from the ionizer 130,
The configuration is such that ions are supplied to both the upper and lower surfaces of the LCD substrate G.

Now, an LCD using this heating device 109 will be described.
The case of heating and drying the substrate G will be described. First, as shown in FIG.
3 from the inside of the cassette 102
Takes out the LCD substrate G and delivers it to the main arm 104. Main arm 104 is LCD board G
Into the brush scrubber 107, and the brush scrubber 10
7 brush-cleans the LCD substrate G. The LCD substrate G may be washed with high-pressure jet water in the high-pressure jet washing machine 108 according to the process. The LCD substrate G thus cleaned is transported by the main arm 104 and loaded into the heating device 109.

When the LCD substrate G is carried in, as shown in FIG.
The window 125 is opened by raising the shutter 26. Then, the main arm 4 enters the inside of the casing 120 through the opened window 125, whereby the LCD board G is carried above the mounting table 121.

After the loading, the pins 122 rise and push up the lower surface of the LCD substrate G supported by the main arm 104, and receive the LCD substrate G at the upper ends of the pins 122. Then, as shown in FIG.
5 to the outside of the casing 120.

When the main arm 104 retreats out of the casing 120 in this way, as shown in FIG. 12, the shutter 126 is lowered and the inside of the casing 120 is closed. The lowering of the shutter 126 is confirmed by a sensor (not shown). After the confirmation, the pins 122 are lowered and the LCD substrate G is mounted on the mounting table 121. The heat generated by the heater built in the mounting table 121 causes L
The CD substrate G is heated, and the LCD substrate G is dried. At the same time, the exhaust from the exhaust duct 127 is performed, and the gas generated when the LCD substrate G is heated is discharged to the outside of the casing 120.

Next, when the drying process of the LCD substrate G is completed, the pins 122 rise and protrude upward from the upper surface of the mounting table 121, and start to push up the lower surface of the LCD substrate G. Also,
When the pins 122 rise, LC from the mounting table 121 is
By the time the operation of lifting the D substrate G is started, the supply of ions from the ionizer 130 arranged on the side of the LCD substrate G is started. After the drying process of the LCD substrate G is completed, the supply of ions from the ionizer 130 may be started after a predetermined time elapses according to a predetermined sequence.

At the start of the lifting operation of the LCD substrate G, as shown in FIG.
(Particularly, the peripheral portion) is still in contact with the upper surface of the mounting table 121. In particular, the LCD substrate or the like is made of a thin glass plate and is liable to bend, and its peripheral portion is hardly peeled off by contact with the upper surface of the mounting table 121 due to static electricity. In such a case, if the LCD substrate G is pushed up at a very high speed from the beginning, the mounting table 121 has been hitherto caused by static electricity.
At the moment when the peripheral portion of the LCD substrate G that has been in contact with the upper surface is separated, there is a concern that the LCD substrate G may jump up on the pins 122 due to the recoil. Thus, the LCD substrate G is pin 1
If the LCD board G jumps over the pin 22, the position of the LCD substrate G cannot be determined when the LCD board G is transferred from the pin 122 to the main arm 104, which may cause a conveyance failure.

Therefore, when the LCD board G is lifted from the mounting table 121 by raising the pins 122 as described above, while at least a part of the LCD substrate G is in contact with the upper surface of the mounting table 121, the controller 131 is turned on. The rotation speed of the stepping motor built in the elevating mechanism 24 is controlled to be relatively low by control, and the pin 1 is rotated at the first speed.
22 is raised to prevent the LCD substrate G from jumping up at the moment when the periphery of the LCD substrate G is separated. Note that the LCD substrate G is placed on the mounting table 121 at the first speed.
The supply of ions from the ionizer 130 is continued even during the lifting. Thereby, the mounting table 1
Ions are supplied to a gap between the upper surface of the LCD substrate G and the lower surface of the LCD substrate G to perform static elimination.

By raising the pins 122 at the first speed in this way, after the LCD substrate G is completely separated from the upper surface of the mounting table 121, there is no need to worry about the LCD substrate G jumping up on the pins 122. By controlling the rotation speed of the stepping motor incorporated in the lifting mechanism 124 at a relatively high speed, the pin 122 may be raised at a second speed higher than the first speed.
However, in this case, as shown in FIG. 14, the lifting mechanism 124 is controlled by the controller 131 for a certain period immediately after the entire LCD substrate G is completely separated from the upper surface of the mounting table 121.
By suspending the rotation of the stepping motor incorporated in the mounting table, the lifting of the pin 122 is temporarily stopped, and the mounting table 1 is stopped.
It is preferable to stop the operation of lifting the LCD substrate G from above.

That is, as described above, L
By slowly raising the pins 122 at the first speed in the initial stage of lifting the CD substrate G, LC
It is possible to prevent the D substrate G from jumping. However, no matter how slowly the LCD substrate G is lifted, it is difficult to completely prevent the vibration of the LCD substrate G at the moment when the periphery of the LCD substrate G is separated. On the other hand, when the vibration of the LCD substrate G occurs, the first
When the pins 122 are immediately raised at the second speed higher than the speed of the LCD substrate G, the LCD substrate G
There remains a concern that the displacement will occur.

Therefore, as shown in FIG. 14, immediately after the entire LCD substrate G is completely separated from the upper surface of the
It is preferable that the lifting operation of the CD substrate G is temporarily stopped, and after the vibration of the LCD substrate G is eliminated, the LCD substrate G is raised again. The operation of temporarily stopping the raising operation of the LCD substrate G can be performed by temporarily stopping the rotation of a stepping motor built in the elevating mechanism 124 under the control of the controller 131.
The stop time depends on the size, shape, thickness,
It depends on various factors such as the material, and can be, for example, about 5 seconds or more. It should be noted that the supply of ions from the ionizer 130 is performed while the raising operation of the LCD substrate G is temporarily stopped and while the raising of the pins 122 is restarted to lift the LCD substrate G at the second speed. Is performed continuously, and the charge of the LCD substrate G is removed.

Thus, as shown in FIG.
2 has been lifted, and the LCD substrate G from which the charge has been removed is supported above the mounting table 121.
26 is raised and window 125 is opened. The rise of the shutter 126 and the opening of the window 125 are detected by a sensor (not shown). Then, the supply of ions from the ionizer 130 is stopped by the detection of the sensor. In addition, in order to ensure safety, by a predetermined sequence,
After a predetermined time has elapsed, the supply of ions from the ionizer 130 may be stopped. After the opening of the window 125 is confirmed by the detection of this sensor, the main arm 4 is connected to the casing 120 through the opened window 125.
Enter inside.

After the main arm 104 enters, the pin 1
22 descends, and transfers the LCD substrate G supported by the upper ends of the pins 122 to the main arm 104. And LCD
The substrate G is carried out of the casing 120 as the main arm 104 retreats.

The LCD substrate G thus completed with the drying process
Is then subjected to an adhesion process in an adhesion unit 111. Further, after cooling the LCD substrate G by the cooling unit 112, the coating unit 1
At 14, a resist is applied to the surface of the LCD substrate G. After the LCD substrate G is heated by the heating device 113, the resist film is exposed by an exposure device (not shown). Then, the exposed LCD substrate G is carried into the developing device 106, and the developing process is performed. After the completion of the developing process, the LCD substrate G is moved by the main arm 104 to the developing device 10.
6, the LCD substrate G is heated again by the heating device 109 and dried, and further stored in the cassette 102 of the cassette station 103.

[0051]

According to the present invention, since the ionizer is arranged on the side of the substrate, ions can be supplied to both the upper surface and the lower surface of the substrate, and the back surface of the substrate can be discharged. Comes. Further, according to the present invention, it is possible to prevent the substrate from jumping up or shifting when lifting the substrate from the mounting table.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall outline of a coating and developing treatment system incorporating a heating device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the heating device according to the first embodiment of the present invention.

FIG. 3 is a front view of an ionizer used in the heating device of FIG.

FIG. 4 is a plan view of an ionizer used in the heating device of FIG.

FIG. 5 is an explanatory diagram showing the arrangement of the ionizer in FIG. 3 as viewed from a plane.

FIG. 6 is a cross-sectional view of the heating device of FIG. 2 in a state where an opening / closing door is opened.

FIG. 7 is a perspective view showing an overall outline of a coating and developing system incorporating a heating device according to a second embodiment of the present invention.

FIG. 8 is a sectional view of a heating device according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing the transfer of the LCD substrate onto the mounting table by the main arm.

FIG. 10: LCD into casing by main arm
It is sectional drawing of the heating apparatus which shows the state which carried in the board | substrate.

FIG. 11 is a cross-sectional view of the heating device showing a state where an LCD substrate is received at the upper end of a pin.

FIG. 12 is a cross-sectional view of the heating device showing a state where the LCD substrate is mounted on a mounting table.

FIG. 13 is an enlarged cross-sectional view showing a state where the LCD substrate starts to be lifted from above the mounting table.

FIG. 14 is a cross-sectional view of the heating device in a state where the lifting of the LCD substrate is temporarily stopped.

FIG. 15: LC from inside of casing by main arm
It is sectional drawing of the heating apparatus which shows the state which unloads a D board.

[Explanation of symbols]

 Reference Signs List 1 processing system 20 heating device 41 processing chamber 41a casing 42 mounting table 50 support pin 70 ionizer 78 gas supply source G LCD substrate

Claims (10)

[Claims] 1. A processing apparatus comprising: a mounting table on which a substrate is mounted; and pins for lifting and lowering the substrate on the mounting table, wherein an ionizer is arranged on a side of the mounting table. 2. The ionizer according to claim 1, wherein the ionizer is arranged at a position where ions can be supplied to both the upper and lower surfaces of the substrate lifted from above the mounting table by the pins. Processing equipment. 3. A processing apparatus comprising: a mounting table on which a substrate is mounted, pins for elevating and lowering the substrate on the mounting table, and a casing for storing the mounting table, wherein at least the mounting table is provided outside the casing. A processing device comprising a static eliminator for discharging ionized gas toward an upper surface of the processing device. 4. A processing apparatus comprising: a mounting table on which a substrate is mounted, pins for elevating and lowering the substrate on the mounting table, and a casing accommodating the mounting table, wherein at least the mounting table is provided outside the casing. A discharger for discharging ionized gas toward a portion between an upper surface of the substrate and a lower surface of the mounted substrate. 5. The charge removing device according to claim 3, wherein the static eliminator includes a discharge electrode for ionizing a gas, and gas supply means for supplying the gas to the discharge electrode. Processing equipment. 6. The processing apparatus according to claim 5, wherein the discharge electrode is arranged at a position along a longitudinal direction of the substrate. 7. The processing apparatus according to claim 6, wherein the discharge electrodes are alternately arranged vertically when viewed from the mounting table side. 8. When the substrate is lifted from the mounting table, the lifting of the substrate from the mounting table must be started.
Ion supply is started from the side of the substrate, and the substrate is lifted at the first speed while the substrate is at least partially in contact with the upper surface of the mounting table, and the substrate is completely separated from the upper surface of the mounting table. Thereafter, the substrate is lifted at a second speed higher than the first speed. 9. After the substrate is completely separated from the upper surface of the mounting table, the operation of lifting the substrate from the mounting table is stopped for a certain period, and then, the substrate is lifted from the mounting table at a second speed. The processing method according to claim 8, wherein the processing method is characterized in that: 10. The processing method according to claim 9, wherein the predetermined time is a time until the vibration of the substrate stops.