JPH10326665A - Manufacture of connecting terminal sheet for electric part item - Google Patents

Manufacture of connecting terminal sheet for electric part item

Info

Publication number
JPH10326665A
JPH10326665A JP15156897A JP15156897A JPH10326665A JP H10326665 A JPH10326665 A JP H10326665A JP 15156897 A JP15156897 A JP 15156897A JP 15156897 A JP15156897 A JP 15156897A JP H10326665 A JPH10326665 A JP H10326665A
Authority
JP
Japan
Prior art keywords
thickness
insulated
sheet
thread
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP15156897A
Other languages
Japanese (ja)
Inventor
Koki Matsumoto
弘毅 松本
Tadashi Araki
正 荒木
Yuji Hanaoka
裕二 花岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
N B C KOGYO KK
Fujikura Composites Inc
Original Assignee
N B C KOGYO KK
Fujikura Rubber Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by N B C KOGYO KK, Fujikura Rubber Ltd filed Critical N B C KOGYO KK
Priority to JP15156897A priority Critical patent/JPH10326665A/en
Publication of JPH10326665A publication Critical patent/JPH10326665A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PROBLEM TO BE SOLVED: To continuously and efficiently provide sheets of specified dimension without alternately and multiply laminating woven sheets and insulated films by laminating insulated films on a long woven sheet using a conductive thread for weft and an insulated thread for warp and rounding this laminated body to integrally slice it. SOLUTION: A woven sheet 1 woven to be flat is manufactured by using a conductive thread 11 for weft and an insulated thread 12 for warp. Insulated films 2 are stacked on this woven sheet 1. After adhesive 4 is coated on a laminated body 3 dipping or the like, the laminate body is made round sequentially from one end part until a specified diameter is obtained. By slicing this round article to have a specified thickness in a direction vertical to the extending direction of the conductive thread 11, a connecting terminal sheet is obtained. The thickness of each insulated film 2 is preferably set in the range of 5 to 30 μm, and a film not softened by the reaction temperature of the adhesive 4 and made of PET having good strength, polyimide, polyamide is used. The coating thickness of the adhesive 4 is preferably set in the range of plus 10 μm of this diameter from the thickness of the conductive thread or the insulated thread.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は電子部品の接続用端子シ
ートの製造方法、さらに詳細には半導体LSIなど電子
部品あるいは回路基板の電極パッドを互いに向かい合わ
せて接続するための接続用端子の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a terminal sheet for connecting electronic components, and more particularly to a method of manufacturing a terminal for connecting electronic components such as a semiconductor LSI or electrode pads of a circuit board to face each other. About the method.

【0002】[0002]

【従来技術及び問題点】電子部品の小型化、薄形化にと
もない半導体LSIなどの電子部品あるいは回路基板の
電極パッド部はより一層狭ピッチ化され、電気的な信頼
性の高い接触接続が必要とされている。
2. Description of the Related Art As electronic components become smaller and thinner, electronic components such as semiconductor LSIs or electrode pads on a circuit board are further narrowed in pitch, and highly reliable electrical connection is required. It has been.

【0003】近年電子部品と回路基板の電極パッドを互
いに向かい合わせて接触接続を行う場合、両者の電極パ
ッド間にシートの厚み方向にのみ導電性を有する接続用
端子シートを介在させて、両者を固定する方法が用いら
れている。
In recent years, when an electronic component and an electrode pad of a circuit board face each other to perform contact connection, a connection terminal sheet having conductivity only in the thickness direction of the sheet is interposed between the two electrode pads to connect the two. A method of fixing is used.

【0004】上述のような接続用端子シートを製造する
方法としては、たとえば特開平3−254083号に記
載されている方法がある。すなわち、緯糸に導電糸11
を用い、経糸として絶縁糸12を使用して織った織布シ
ート1(図1参照)と絶縁フィルム2を交互に積層し
て、接着一体化するとともに、導電糸11の伸長方向と
垂直な方向からスライスして接続用端子シート3を製造
する方法である(図4参照)。
[0004] As a method of manufacturing the connection terminal sheet as described above, for example, there is a method described in JP-A-3-254083. That is, the conductive yarn 11 is used as the weft.
, A woven fabric sheet 1 (see FIG. 1) woven using an insulating yarn 12 as a warp and an insulating film 2 are alternately laminated, bonded and integrated, and in a direction perpendicular to the direction in which the conductive yarn 11 extends. This is a method of manufacturing the connection terminal sheet 3 by slicing (see FIG. 4).

【0005】このように製造された接続端子シートはシ
ートの厚み方向に導電性を形成しているため、ほぼ等ピ
ッチの接続用端子シートになるという利点を有してい
る。しかしながら、上述のような織布シート1と絶縁フ
ィルム2を、たとえば4cm厚まで多数積層するのは、
手間がかかり効率的に製造できないという欠点を有して
いた。
[0005] Since the connection terminal sheet manufactured in this manner has conductivity in the thickness direction of the sheet, it has the advantage of being a connection terminal sheet having a substantially equal pitch. However, the lamination of the woven fabric sheet 1 and the insulating film 2 as described above to a large thickness of, for example, 4 cm is
It had the disadvantage that it was troublesome and could not be manufactured efficiently.

【0006】本発明は上述の問題点に鑑みなされたもの
であり、織布シート1と絶縁フィルム2を交互に多数積
層することなく、同様な接続用端子シートが製造可能な
方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and provides a method capable of manufacturing similar connection terminal sheets without alternately laminating a large number of woven sheets 1 and insulating films 2. With the goal.

【0007】[0007]

【問題点を解決するための手段】上記問題点を解決する
ため、本発明による電子部品の接続用端子シートは、緯
糸として導電糸を有し、経糸として絶縁糸を使用した長
尺の織布シートと、同様に長尺の絶縁フィルムを積層す
ると共に、前記積層体を一方の端部より丸めて所定径に
形成した後、接着一体化し、次いで緯糸の伸長方向に垂
直にスライスすることを特徴とする。
Means for Solving the Problems In order to solve the above problems, a connection terminal sheet for an electronic component according to the present invention has a long woven fabric having a conductive yarn as a weft and an insulating yarn as a warp. In addition to laminating a sheet and a long insulating film, the laminated body is rolled from one end to form a predetermined diameter, bonded and integrated, and then sliced perpendicular to the direction of elongation of the weft. And

【0008】本発明によれば、緯糸として導電糸を有
し、経糸として絶縁糸を使用した長尺の織布シートと、
同様に長尺の絶縁フィルムを積層した積層体を、丸める
と共に一体化し、スライスするため、積層体を多数積層
することなく、所定寸法の接続用端子シートを製造でき
るという利点がある。また、円柱形であるため回転させ
ながら効率的にスライスできるという利点も生じる。ま
た、絶縁フィルムを有するため、圧力による変形(押キ
ズ)等が入っても、上下の導線部が導通しない。
According to the present invention, there is provided a long woven fabric sheet having a conductive yarn as a weft and an insulating yarn as a warp;
Similarly, since a laminate in which long insulating films are laminated is rounded, integrated, and sliced, there is an advantage that a terminal sheet for connection having a predetermined dimension can be manufactured without laminating a large number of laminates. In addition, there is an advantage that the slice can be efficiently sliced while being rotated because of the cylindrical shape. In addition, because of the presence of the insulating film, the upper and lower conductor portions do not conduct even if deformation (pressing flaws) or the like due to pressure enters.

【0009】[0009]

【実施例】図1から図3は本発明による製造方法の製造
工程を順次示した図であるが、この図より明らかなよう
に、まず、緯糸として導電糸11を使用すると共に、経
糸として絶縁糸12を用いて平織りにした織布シート1
を製造する。
1 to 3 are diagrams sequentially showing the manufacturing steps of the manufacturing method according to the present invention. As is apparent from FIG. 1, first, a conductive yarn 11 is used as a weft and an insulating yarn is used as a warp. Woven fabric sheet 1 plain woven using yarn 12
To manufacture.

【0010】このような導電糸11としては、たとえば
数ミクロンから数千ミクロンの径の銅、ベリウム−銅な
どの銅合金、ステンレス、ケイ素鋼、ハンダ、スズ、パ
ラジウム合金、金合金、42ニッケル合金、パーマロイ
などのニッケル合金、モリブデン、タングステン、炭素
繊維などの各種導電材料を使用することができる。また
必要に応じ表面にニッケル、金、ロジウムなどの金属メ
ッキをしたものであってよい。このような導電糸は、円
形、楕円形、帯状などの形状であってよい。
Examples of the conductive yarn 11 include copper having a diameter of several microns to several thousand microns, copper alloy such as beryllium-copper, stainless steel, silicon steel, solder, tin, palladium alloy, gold alloy, and 42 nickel alloy. And various conductive materials such as nickel alloys such as permalloy, molybdenum, tungsten, and carbon fibers. If necessary, the surface may be plated with a metal such as nickel, gold, or rhodium. Such a conductive yarn may have a shape such as a circle, an ellipse, and a band.

【0011】上述のような導電糸11と共に織られる絶
縁糸としては、たとえば、数ミクロンから数千ミクロン
の径のシリコーンゴム、ポリブチル、ポリエステル、P
MMA、PE、NA、PP、ポリイミド、木綿、ガラス
ファイバーなどの絶縁性材料からなるものが使用でき
る。このような絶縁糸は、同様に円形、楕円形、帯状な
どの形状であってよい。
The insulating yarn woven together with the conductive yarn 11 as described above includes, for example, silicone rubber, polybutyl, polyester, P
Materials made of an insulating material such as MMA, PE, NA, PP, polyimide, cotton, and glass fiber can be used. Such insulating yarns may also be circular, elliptical, band-like and the like.

【0012】このような織布フィルム1に積層される絶
縁フィルム2としては、後述の接着剤の反応温度で軟化
せず、薄く、強度の良好なものが好ましく、たとえばP
ET、ポリイミド、ポリアミドフィルムなどを使用する
ことができる。
As the insulating film 2 laminated on such a woven fabric film 1, a film which does not soften at the reaction temperature of an adhesive described later, is thin and has good strength is preferable.
ET, polyimide, polyamide films and the like can be used.

【0013】このような絶縁フィルム2は、好ましくは
5〜30μmの厚さであるのがよい。5μm未満である
と、絶縁性が確保できない恐れがあり、一方30μmを
越えると、導電糸12の間隔が広くなり過ぎて、導通路
のピッチが大きくなり過ぎるからである。
The insulating film 2 preferably has a thickness of 5 to 30 μm. If the thickness is less than 5 μm, insulation may not be ensured. On the other hand, if the thickness is more than 30 μm, the interval between the conductive yarns 12 becomes too large, and the pitch of the conductive paths becomes too large.

【0014】上述のような積層体3を接着一体化した
後、この積層体3にディッピングなどにより接着剤4を
塗布する(図2参照)。このような接着剤4としては、
後述の積層体3を丸めて接着できるようなものであれば
いかなるものでもよい。また電子部品を接続するときに
接続用端子シートは、ある程度弾性を有することが好ま
しいことから、接着剤もある程度弾性を有しているのが
よい。たとえば シリコーンゴム系、ふっ素樹脂系、ポ
リウレタン樹脂系、エポキシ樹脂系接着剤を使用するこ
とができる。
After the above-described laminate 3 is bonded and integrated, an adhesive 4 is applied to the laminate 3 by dipping or the like (see FIG. 2). As such an adhesive 4,
Any material may be used as long as it can be rolled and bonded to a laminate 3 described later. Further, it is preferable that the connection terminal sheet has some elasticity when connecting the electronic components. Therefore, it is preferable that the adhesive has some elasticity. For example, a silicone rubber-based, fluororesin-based, polyurethane resin-based, or epoxy resin-based adhesive can be used.

【0015】このような接着剤3の塗布厚は、好ましく
は繊維(導電糸、絶縁糸)の厚さと同じかこの径プラス
10μmまでの厚さであるのがよい。繊維の厚さ未満で
あると、接着が十分でない恐れがあり、一方径プラス1
0μmを越えると、同様に導通路のピッチが大きくなり
過ぎる恐れがある。
The coating thickness of the adhesive 3 is preferably the same as the thickness of the fiber (conductive yarn, insulating yarn) or a thickness up to this diameter plus 10 μm. If the thickness is less than the fiber thickness, the adhesion may not be sufficient.
If it exceeds 0 μm, the pitch of the conduction path may be too large.

【0016】このように接着剤を塗布した後、図3に示
すように積層体の一方の端部より順次所定径になるまで
丸めていく。このように所定径に丸めた後、この巻物の
導電糸11の伸長方向に垂直な方向に所定厚にスライス
することによって接続用端子シートを製造することがで
きる。このとき、回転しながら、スライスができるので
極めて効率的に製造が可能である。
After the adhesive is applied as described above, the laminate is sequentially rounded from one end to a predetermined diameter as shown in FIG. After being rounded to a predetermined diameter in this way, the connection terminal sheet can be manufactured by slicing the roll to a predetermined thickness in a direction perpendicular to the direction in which the conductive yarn 11 extends. At this time, slicing can be performed while rotating, so that manufacturing can be performed very efficiently.

【0017】このような接続用端子シートは厚さ方向に
導電性を有し、しかも等ピッチであるという利点があ
る。また、スライスした導電糸の面に、必要に応じて耐
食性、導電性向上のためニッケル、金、ロジウムなどの
金属メッキを施してもよい。
Such a connection terminal sheet has an advantage that it has conductivity in the thickness direction and has an equal pitch. In addition, the surface of the sliced conductive yarn may be plated with a metal such as nickel, gold, or rhodium as needed to improve corrosion resistance and conductivity.

【0018】[0018]

【発明の効果】以上説明したように本発明による電子部
品の製造方法によれば、緯糸として導電糸を有し、経糸
として絶縁糸を使用した長尺の織布シートと同様に長尺
の絶縁フィルムを積層した積層体を、丸めると共に一体
化し、スライスするため、積層体を多数積層することな
く、所定寸法の接続用端子シートを連続的に製造できる
という利点がある。また、円柱形であるため回転させな
がら効率的にスライスできるという利点も生じる。
As described above, according to the method of manufacturing an electronic component according to the present invention, a long insulating sheet having a conductive yarn as a weft and an insulating yarn as a warp is used. Since the laminated body obtained by laminating the films is rolled, integrated, and sliced, there is an advantage that a terminal sheet for connection having a predetermined dimension can be continuously manufactured without laminating a large number of laminated bodies. In addition, there is an advantage that the slice can be efficiently sliced while being rotated because of the cylindrical shape.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電子部品の接続用端子シートの製造方
法を説明するための図。
FIG. 1 is a view for explaining a method for manufacturing a terminal sheet for connection of an electronic component according to the present invention.

【図2】本発明の電子部品の接続用端子シートの製造方
法を説明するための図。
FIG. 2 is a diagram for explaining a method for manufacturing a terminal sheet for connection of an electronic component according to the present invention.

【図3】本発明の電子部品の接続用端子シートの製造方
法を説明するための図。
FIG. 3 is a view for explaining a method for manufacturing a terminal sheet for connection of an electronic component according to the present invention.

【図4】従来の電子部品の接続用端子シートの製造方法
を説明するための図。
FIG. 4 is a view for explaining a conventional method for manufacturing a connection terminal sheet for electronic components.

【符号の説明】[Explanation of symbols]

1 織布シート 11 導電糸 12 絶縁糸 2 絶縁フィルム 3 積層体 4 接着剤 DESCRIPTION OF SYMBOLS 1 Woven fabric sheet 11 Conductive thread 12 Insulating thread 2 Insulating film 3 Laminate 4 Adhesive

───────────────────────────────────────────────────── フロントページの続き (72)発明者 花岡 裕二 東京都日野市豊田2丁目50番地の3 エ ヌ・ビー・シー工業株式会社内 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yuji Hanaoka 2-50-50 Toyota, Hino-shi, Tokyo Inside NBC Industry Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】緯糸として導電糸を有し、経糸として絶縁
糸を使用した長尺の織布シートと同様に長尺の絶縁フィ
ルムを積層すると共に、前記積層体を一方の端部より丸
めて所定径に形成した後、接着一体化し、次いで緯糸の
伸長方向に垂直にスライスすることを特徴とする電子部
品の接続用端子シートの製造方法。
A long insulating film is laminated in the same manner as a long woven fabric sheet having a conductive yarn as a weft and an insulating yarn as a warp, and the laminate is rolled from one end. A method for manufacturing a terminal sheet for connection of electronic components, comprising forming a predetermined diameter, bonding and integrating, and then slicing perpendicular to the direction of elongation of the weft.
【請求項2】前記絶縁フィルムの厚さは5〜30μmで
あり、接着剤の厚さは、導電糸ないし絶縁糸の厚さから
導電糸ないし絶縁糸の厚さプラス10μmであることを
特徴とする請求項1記載の電子部品の接続用端子シート
の製造方法。
2. The thickness of the insulating film is 5 to 30 μm, and the thickness of the adhesive is from the thickness of the conductive yarn or the insulating yarn to the thickness of the conductive yarn or the insulating yarn plus 10 μm. The method for producing a terminal sheet for connection of an electronic component according to claim 1.
JP15156897A 1997-05-26 1997-05-26 Manufacture of connecting terminal sheet for electric part item Withdrawn JPH10326665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15156897A JPH10326665A (en) 1997-05-26 1997-05-26 Manufacture of connecting terminal sheet for electric part item

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15156897A JPH10326665A (en) 1997-05-26 1997-05-26 Manufacture of connecting terminal sheet for electric part item

Publications (1)

Publication Number Publication Date
JPH10326665A true JPH10326665A (en) 1998-12-08

Family

ID=15521384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15156897A Withdrawn JPH10326665A (en) 1997-05-26 1997-05-26 Manufacture of connecting terminal sheet for electric part item

Country Status (1)

Country Link
JP (1) JPH10326665A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7231706B2 (en) 2000-04-18 2007-06-19 Nitto Denko Corporation Method of manufacturing an anisotropic conductive film
JP2009276346A (en) * 2008-05-13 2009-11-26 Ind Technol Res Inst Conductive film structure, its manufacturing method, and conductive film type integrated circuit probe device
JP2010156675A (en) * 2008-12-29 2010-07-15 Ind Technol Res Inst Method for manufacturing thin film structure conductor, the thin film structure conductor acquired by using the same method, and probe device for integrated circuit test using the same conductor
JP2016098904A (en) * 2014-11-21 2016-05-30 公益財団法人鉄道総合技術研究所 Superconductive magnetic bearing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7231706B2 (en) 2000-04-18 2007-06-19 Nitto Denko Corporation Method of manufacturing an anisotropic conductive film
JP2009276346A (en) * 2008-05-13 2009-11-26 Ind Technol Res Inst Conductive film structure, its manufacturing method, and conductive film type integrated circuit probe device
US20110169519A1 (en) * 2008-05-13 2011-07-14 Industrial Technology Research Institute Conductive film structure, fabrication method thereof, and conductive film type probe device for ic
JP2010156675A (en) * 2008-12-29 2010-07-15 Ind Technol Res Inst Method for manufacturing thin film structure conductor, the thin film structure conductor acquired by using the same method, and probe device for integrated circuit test using the same conductor
JP2016098904A (en) * 2014-11-21 2016-05-30 公益財団法人鉄道総合技術研究所 Superconductive magnetic bearing

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20040803