JP6502673B2 - Connection structure, wearable device and manufacturing method of connection structure - Google Patents

Description

  The present invention relates to a connection structure, a wearable device, and a connection method.

  BACKGROUND In recent years, fabrics having conductive patterns have been used as wiring members for wearable devices such as data gloves. Examples of the cloth having the conductive pattern include cloths in which a plurality of conductive bands and a plurality of nonconductive bands are alternately arranged in the width direction.

  This fabric is usually used by being electrically connected to a printed circuit board or the like. And in this connection, it is necessary to make the wiring pitch of the conductive pattern which a cloth has, and the wiring attached to a substrate correspond. However, since the fabric is easily deformed due to expansion and contraction at the time of manufacture, use, etc., it is difficult to form a conductive pattern corresponding exactly to the wiring attached to the substrate. Therefore, when the wiring pitch is miniaturized, it becomes difficult to electrically connect the conductive pattern of the fabric and the wiring provided to the substrate.

  Here, as a connection method when wiring pitches between members to be electrically connected do not match, a method of connecting a semiconductor element provided with an external terminal having plasticity and a wiring substrate has been proposed (Japanese Patent Application Laid-Open No. 8-46106). See the official gazette). In this connection method, the wiring pitch can be connected to the wiring substrate by changing the external terminal. However, in the conventional connection method, there is a possibility that the external terminal may be bent erroneously at the time of connection, and the connection is relatively time-consuming. Therefore, even if the external terminal is attached to the substrate by adopting the conventional connection method, the fabric and the substrate can not be easily connected, and it is difficult to miniaturize the wiring pitch of the conductive pattern of the fabric.

Japanese Patent Application Laid-Open No. 8-46106

  In view of the above problems, it is an object of the present invention to provide a connection structure in which a cloth having a conductive pattern and a substrate can be electrically connected easily and reliably, and the wiring pitch of the conductive pattern of the cloth can be easily miniaturized.

  The invention made in order to solve the above-mentioned subject electrically conductive the cloth in which a plurality of conductive bands and a plurality of non-conductive bands are alternately disposed in the width direction, and a substrate on which a plurality of wirings are attached The structure is characterized in that the fabric is stretched in the width direction, and the plurality of conductive bands and the plurality of wires are fixed in a state of facing each other.

  The said connection structure is being fixed to a board | substrate in the state which the cloth in which several conductive bands and several non-conductive bands are alternately arrange | positioned in the width direction extended | stretched in the width direction. As described above, since the connection structure can be formed while adjusting the wiring pitch of the conductive pattern according to the wiring attached to the substrate by stretching the fabric, the fabric having the conductive pattern and the substrate can be easily and surely electrically It can connect. Moreover, since the contact area of the part which a cloth and a board | substrate oppose increases by extending | stretching a cloth, the said connection structure is excellent in durability. Furthermore, since the connection structure does not require high precision in the conductive pattern of the fabric, the conductive pattern of the fabric can be easily miniaturized.

  The fabric is knitted or woven using a conductive yarn and a nonconductive yarn, the conductive yarn is formed by the conductive yarn, and the nonconductive belt is formed by the nonconductive yarn. It is good. Thus, by knitting or weaving using the conductive yarn and the nonconductive yarn, the conductive band and the nonconductive band are alternately disposed in the width direction, and the substrate is stretched in the width direction. It is easy to make it oppose, and the cloth which is excellent in connectivity can be formed easily and certainly.

  Another invention made in order to solve the above-mentioned subject is a wearable device provided with the connection structure concerned. By providing the connection structure, the wearable device is easy to manufacture and easily reduce the manufacturing cost. In the wearable device, the connection structure easily reduces the wiring pitch of the conductive pattern of the fabric, that is, the width of the fabric is easily reduced and the number of wires is increased, and the durability is excellent. It can be used suitably.

  Yet another invention for solving the above problems is a fabric in which a plurality of conductive bands and a plurality of non-conductive bands are alternately disposed in the width direction, and a substrate on which a plurality of wires are attached to an end portion And connecting the plurality of conductive bands with a plurality of wires, and a step of opposingly arranging the portions of the fabric and the substrate. And a fixing step.

  In the connection method, an electrical connection structure can be easily formed between the fabric having the conductive pattern and the substrate, and the wiring pitch of the conductive pattern of the fabric can be easily miniaturized.

  Here, the “width direction” of the fabric means a direction orthogonal to the non-stretched conductive band and the non-conductive band. The term "yarn" refers to a thread, and includes not only twisted yarns in which fibers are twisted but also thin wires such as metals and resins.

  Thus, the connection structure of the present invention can easily and reliably electrically connect the fabric having the conductive pattern and the substrate, and it is easy to miniaturize the wiring pitch of the conductive pattern of the fabric. Further, the wearable device of the present invention can be suitably used for various applications because it is easy to increase the number of conductive patterns of the cloth. Furthermore, according to the connection method of the present invention, the electrical connection structure can be easily formed between the fabric having the conductive pattern and the substrate, and the wiring pitch of the conductive pattern of the fabric can be easily miniaturized.

It is a schematic plan view which shows the connection structure of one Embodiment of this invention. It is a schematic cross section in the XX line of FIG. FIG. 2 is a schematic enlarged view of the conductive band and the nonconductive band of FIG. It is a schematic plan view which shows the connection structure of one Embodiment different from FIG. 1 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

First Embodiment
[Connection structure]
The connection structure 1 shown in FIGS. 1 and 2 includes a fabric 4 in which a plurality of conductive bands 2 and a plurality of non-conductive bands 3 are alternately arranged in the width direction in stripes, and a plurality of wires 5 at the end. It is a structure which connects with the board | substrate 6 attached while ensuring electroconductivity. The fabric 4 is stretched in the width direction, and the plurality of conductive bands 2 and the plurality of wires 5 are fixed in a state of facing each other. The fabric 4 and the substrate 6 of the connection structure 1 constitute a substantially rectangular opposing arrangement portion 7 arranged to be opposed to each other.

  As shown in FIG. 2, the fabric 4 and the substrate 6 are electrically connected to each other through the adhesive layer 8 in the facing portion 7. The main component of the adhesive layer 8 is usually a resin. The adhesive layer 8 preferably has an insulating property. The adhesive layer 8 is formed of, for example, an adhesive. Here, the “main component” is a component having the largest content, and for example, a component having a content of 50% by mass or more. Moreover, an "adhesive agent" is a substance used for adhesion | attachment of the surface of solid bodies, and contains a lamination material and a sealing material.

  Examples of the adhesive that forms the adhesive layer 8 include thermoplastic adhesives, moisture-curable adhesives, anaerobic-curable adhesives, two-component mixed adhesives, light-curable adhesives, solvent-based adhesives, water-based adhesives Agents, thermosetting adhesives and the like. As a shape of this thermoplastic adhesive, a film form etc. are mentioned, for example.

  The adhesive layer 8 may be an anisotropic conductive layer. The anisotropic conductive layer is obtained by dispersing conductive particles in a cured resin such as a thermosetting resin or a thermoplastic resin. Since the conductive particles are appropriately dispersed in the resin, they do not form an electrical connection in the surface direction, and are sandwiched between the conductive band 2 and the wiring 5 directly or through other conductive particles. Only the ones form an electrical connection in the thickness direction. Therefore, the anisotropic conductive layer has conductivity in the thickness direction while maintaining insulation in the surface direction. The anisotropic conductive layer is formed, for example, by using an anisotropic conductive film, an anisotropic conductive paste or the like as the adhesive.

  The anisotropic conductive layer is obtained by dispersing conductive particles in a cured resin such as a thermosetting resin or a thermoplastic resin. Since the conductive particles are appropriately dispersed in the resin, they do not form an electrical connection in the surface direction, and only those sandwiched between the conductive band and the wiring directly or through other conductive particles. Form an electrical connection in the thickness direction. Therefore, the anisotropic conductive layer has conductivity in the thickness direction while maintaining insulation in the surface direction.

  The resin is not particularly limited, and examples thereof include phenoxy resin, unsaturated polyester, saturated polyester, polyurethane, polybutadiene, polyimide, polyamide, polyolefin and epoxy resin.

  The conductive particles are usually substantially spherical metal particles, but the conductive particles are not particularly limited as long as they form an electrical connection when sandwiched between the conductive band 2 and the wiring 5 described above, for example, insulation broken by pressure bonding It may be metal particles having a coating on the surface, or may be in other shapes such as fibrous. When the conductive particles are substantially spherical, the lower limit of the average maximum diameter of the conductive particles is not particularly limited, but 1 μm is preferable, and 2 μm is more preferable. On the other hand, the upper limit of the average maximum diameter of the conductive particles is not particularly limited, but 50 μm is preferable, 25 μm is more preferable, and 10 μm is more preferable. The "average maximum diameter" of the conductive particles means a value obtained by averaging the diameters of the smallest spheres that can contain the conductive particles. The lower limit of the content of the conductive particles in the anisotropic conductive layer is not particularly limited, but 1% by mass is preferable, and 2% by mass is more preferable. On the other hand, the upper limit of the content of the conductive particles is not particularly limited, but 10% by mass is preferable and 8% by mass is more preferable.

  The lower limit of the average thickness of the adhesive layer 8 is not particularly limited, but is preferably 2 μm, more preferably 5 μm, and still more preferably 10 μm. On the other hand, the upper limit of the average thickness of the adhesive layer 8 is not particularly limited, and is, for example, 50 μm.

  The lower limit of the average length of the facing arrangement 7 is, for example, 0.1 cm. On the other hand, the upper limit of the average length of the facing portion 7 is, for example, 5 cm. The lower limit of the average width of the facing portion 7 is, for example, 0.5 cm. On the other hand, the upper limit of the average width of the facing portion 7 is, for example, 20 cm. Here, the “average length” and the “average width” of the facing portion 7 are the same as the mean length and the average width of the fabric 4 in the facing portion 7.

(Fabric)
In the fabric 4, the plurality of conductive bands 2 and the plurality of non-conductive bands 3 are arranged in a stripe shape. That is, the fabric 4 has a conductive pattern formed by the plurality of conductive bands 2 and the plurality of non-conductive bands 3. A nonconductive band 3 is disposed at both ends in the width direction of the fabric 4. Moreover, the fabric 4 has the branch part 9 which the electroconductive belt 2 branches in strip shape 1 each at the other edge part of a longitudinal direction. Furthermore, the fabric 4 is interposed between the facing portion 7 and the branch portion 9 and is not stretched in the width direction and the conductive band 2 is not branched, and the facing portion 7 and the non-stretched portion A widening section connecting 10 is provided. 1 and 2, although the number of conductive bands 2 disposed in the fabric 4 is eight and the number of non-conductive bands 3 is nine, the number of conductive bands 2 disposed in the fabric 4 and The number of nonconductive bands 3 is not limited to this.

  As shown in FIG. 3, the fabric 4 is knitted by weft knitting using a conductive yarn 11 and a nonconductive yarn 12, and a conductive band 2 is formed by the conductive yarn 11, and the nonconductive yarn is formed. A nonconductive band 3 is formed by 12. Therefore, the fabric 4 has extensibility in the width direction.

  The planar shape of the fabric 4 is not particularly limited, and examples thereof include a substantially square, a substantially rectangular, and the like. Among these, a substantially rectangular is preferable. The lower limit of the average length of the fabric 4 is, for example, 5 cm. On the other hand, the upper limit of the average length of the fabric 4 is, for example, 100 cm. The lower limit of the average width of the fabric 4 is, for example, 0.4 cm. On the other hand, the upper limit of the average width of the fabric 4 is, for example, 20 cm.

  As a lower limit of the average thickness of the fabric 4, 10 micrometers is preferable and 30 micrometers is more preferable. On the other hand, as an upper limit of the average thickness of the fabric 4, 5 mm is preferable and 1 mm is more preferable. If the average thickness of the fabric 4 is smaller than the lower limit, the strength of the fabric 4 may be reduced. On the other hand, when the average thickness of the fabric 4 exceeds the upper limit, stretching in the width direction may be difficult.

  The lower limit of the ratio of the average width of the facing portion 7 to the average width of the non-stretched portion 10 is preferably 110%, and more preferably 120%. On the other hand, the upper limit of the ratio is preferably 200%, more preferably 150%. If the ratio is smaller than the lower limit, adjustment of the wiring pitch of the conductive pattern by stretching in the width direction may be difficult. On the other hand, when the ratio exceeds the upper limit, the electrical resistance change due to the expansion of the conductive band 2 may easily occur.

  As a minimum of wiring pitch of a conductive pattern in non-drawing part 10, 0.2 mm is preferred and 0.6 mm is more preferred. On the other hand, as a maximum of wiring pitch of a conductive pattern in non-drawing part 10, 20 mm is preferred and 10 mm is more preferred. If the conductive pattern in the non-stretched portion 10 is smaller than the above lower limit, there is a possibility that a short circuit may easily occur. Conversely, when the wiring pitch of the conductive pattern in the non-stretched portion 10 exceeds the upper limit, the number of conductive bands 2 and the number of wires 5 may be reduced, and the application of the connection structure 1 may be limited. Here, the “wiring pitch” of the conductive pattern refers to the average distance between the centers in the width direction of adjacent wires.

  The lower limit of the wiring pitch of the conductive patterns in the facing portion 7 is preferably 0.3 mm, and more preferably 0.8 mm. On the other hand, as an upper limit of the wiring pitch of the conductive pattern in the opposing arrangement | positioning part 7, 28 mm is preferable and 14 mm is more preferable. When the wiring pitch of the conductive pattern in the facing portion 7 is smaller than the lower limit, there is a possibility that the connection with the wiring 5 provided to the substrate 6 may be difficult. Conversely, when the wiring pitch of the conductive patterns in the facing arrangement 7 exceeds the upper limit, the number of the conductive bands 2 and the number of the wirings 5 may be reduced, and the application of the connection structure 1 may be limited.

[Conductive band]
The conductive band 2 is formed by the conductive yarn 11. The conductive band 2 is electrically connected to the wiring 5 attached to the substrate 6. As a lower limit of the number of conductive belts 2 in the fabric 4, 3 is preferable, 5 is more preferable, and 8 is more preferable. On the other hand, as an upper limit of the number of conductive bands 2, 30 is preferred, 25 is more preferred, and 20 is more preferred. If the number of conductive bands 2 is smaller than the lower limit, the application of the connection structure 1 may be limited. On the other hand, when the number of conductive bands 2 exceeds the upper limit, the average width of the conductive bands 2 may be reduced, and the electrical resistance may be increased.

  The lower limit of the average width of the conductive band 2 in the non-stretched portion 10 is preferably 0.1 mm, and more preferably 0.3 mm. On the other hand, as a maximum of average width of conductive belt 2 in non-drawing part 10, 10 mm is preferred and 5 mm is more preferred. If the average width of the conductive band 2 of the non-stretched portion 10 is smaller than the lower limit, the electrical resistance may increase. On the other hand, when the average width of the conductive band 2 in the non-stretched portion 10 exceeds the upper limit, the number of the conductive band 2 and the number of wires 5 may be reduced, and the application of the connection structure 1 may be limited. The average widths of the plurality of conductive bands 2 in the non-stretched portion 10 may be the same or different.

  The lower limit of the average width of the conductive bands 2 in the facing portion 7 is preferably 0.14 mm, and more preferably 0.4 mm. On the other hand, as a maximum of average width of conductive belt 2 in counter arrangement part 7, 14 mm is preferred and 7 mm is more preferred. If the average width of the conductive band 2 in the facing portion 7 is smaller than the lower limit, the connection with the wiring 5 formed on the substrate 6 may be difficult. On the other hand, when the average width of the conductive band 2 in the facing portion 7 exceeds the upper limit, the number of the conductive band 2 and the number of wires 5 may be reduced, and the application of the connection structure 1 may be limited. The average widths of the plurality of conductive bands 2 in the extending portion 10 may be the same or different.

[Conductive yarn]
Examples of the conductive yarn 11 include metal conductive yarns such as stainless steel, carbon conductive yarns, plated yarns of metal or alloy (insulation fibers having a plated layer), yarns formed of conductive resin fibers, and the like. . Among them, a plated yarn capable of forming a conductive band 2 which is excellent in durability, can be reduced in weight and excellent in slipperiness, and can be easily expanded and contracted in the longitudinal direction is preferable. Moreover, it does not specifically limit as a metal used for such a plated thread, For example, gold | metal | money with low electrical resistance, silver, etc. are mentioned.

  The lower limit of the average fineness of the conductive yarn 11 is preferably 3 dtex, more preferably 7 dtex. On the other hand, the upper limit of the average fineness of the conductive yarn 11 is preferably 500 dtex, and more preferably 200 dtex. If the average fineness of the conductive yarn 11 is smaller than the lower limit, the strength of the fabric 4 may be insufficient. On the other hand, when the average fineness of the conductive yarn 11 exceeds the upper limit, there is a possibility that the stretching in the width direction of the fabric 4 becomes difficult. Here, "dtex (decitex)" is a unit of fineness and is defined as the number of grams per 10,000 m in length.

  As a maximum of electric resistance per 10 cm of conductive yarn 11, 100 ohms is preferred and 50 ohms are more preferred. By making the electrical resistance smaller than the upper limit, the electrical resistance of the conductive band 2 can be reduced. In addition, "the electrical resistance per 10 cm" is a resistance value between 10 cm of thread | yarns measured by applying the voltage of 5 V, and it can measure using a general purpose tester.

[Non-conductive band]
The nonconductive band 3 is formed by the nonconductive yarn 12. The non-conductive band 3 located other than the widthwise end portions of the fabric 4 is bifurcated into two at a branch portion 9 substantially at the center in the width direction. The lower limit of the number of non-conductive bands 3 disposed in the fabric 4 is preferably 3, more preferably 5, and still more preferably 8. On the other hand, the upper limit of the number of nonconductive bands 3 is preferably 30, more preferably 25, and still more preferably 20. If the number of non-conductive bands 3 is smaller than the lower limit, the number of conductive bands 2 is also reduced, and the application of the connection structure 1 may be limited. On the other hand, when the number of non-conductive bands 3 exceeds the upper limit, the average width of the conductive bands 2 may be reduced, and the electrical resistance may be increased.

  The lower limit of the average width of the nonconductive band 3 in the non-stretched portion 10 is preferably 0.1 mm, and more preferably 0.3 mm. On the other hand, as an upper limit of the average width of the nonconductive zone 3 in the non-stretched part 10, 10 mm is preferable and 5 mm is more preferable. When the average width of the nonconductive band 3 of the non-stretched portion 10 is smaller than the lower limit, the insulation between the plurality of conductive bands 2 may be insufficient, and a short circuit may easily occur. On the other hand, when the average width of the nonconductive band 3 in the non-stretched portion 10 exceeds the upper limit, the number of the conductive bands 2 and the wires 5 may be reduced, and the application of the connection structure 1 may be limited. The average widths of the plurality of nonconductive bands 3 in the non-stretched portion 10 may be the same or different.

  The lower limit of the average width of the nonconductive bands 3 in the facing portion 7 is preferably 0.14 mm, and more preferably 0.4 mm. On the other hand, as an upper limit of the average width of the nonconductive zone 3 in the opposing arrangement | positioning part 7, 14 mm is preferable and 7 mm is more preferable. If the average width of the nonconductive band 3 in the facing portion 7 is smaller than the lower limit, there is a possibility that the connection between the conductive band 2 and the wiring 5 formed on the substrate 6 may be difficult. On the other hand, when the average width of the nonconductive band 3 in the facing portion 7 exceeds the upper limit, the number of the conductive bands 2 and the wires 5 may be reduced, and the application of the connection structure 1 may be limited. The average widths of the plurality of nonconductive bands 3 in the facing arrangement 7 may be the same or different.

[Non-conductive yarn]
The non-conductive yarn 12 is not particularly limited, and examples thereof include twisted yarns of insulating fibers. As the insulating fiber, polyolefin fiber such as polyethylene fiber and polypropylene fiber, polyethylene terephthalate fiber, polytrimethylene terephthalate fiber, polybutylene terephthalate fiber, polyester fiber such as polylactic acid fiber, polycarbonate fiber, polystyrene fiber, polyphenylene sulfide fiber, fluorine type Resin fiber etc. are mentioned.

  As a lower limit of the average fineness of the nonconductive yarn 12, 3 dtex is preferable, and 7 dtex is more preferable. On the other hand, the upper limit of the average fineness of the nonconductive yarn 12 is preferably 500 dtex, and more preferably 200 dtex. When the average fineness of the nonconductive yarn 12 is smaller than the above lower limit, the strength of the fabric 4 may be insufficient. On the other hand, when the average fineness of the nonconductive yarn 12 exceeds the upper limit, stretching in the width direction of the fabric 4 may be difficult.

  The lower limit of the ratio of the average width of the conductive band 2 to the average width of the nonconductive band 3 in the non-stretched portion 10 is, for example, 80%. On the other hand, the upper limit of the ratio is, for example, 120%. The lower limit of the ratio of the average width of the conductive band 2 to the average width of the nonconductive band 3 in the facing portion 7 is, for example, 80%. On the other hand, the upper limit of the ratio is, for example, 120%.

  Examples of the method for forming the branches in the non-conductive band 3 include a method of providing a water-soluble band described later, dissolving this water-soluble band with water, a method of shearing with a knife, etc. The preferred method is to dissolve the sexual zone with water. Moreover, when forming the said branch in the non-electroconductive zone 3, you may form before forming the said connection structure 1, and may form after forming the said connection structure 1. As shown in FIG.

(substrate)
A plurality of wires 5 are attached to the end of the substrate 6. The substrate 6 includes a base film 13 and a conductive pattern laminated on one surface of the base film 13, and the wiring 5 is included as a part of the conductive pattern. Although it does not specifically limit as a kind of board | substrate 6, For example, a printed circuit board, a flexible printed circuit board, a rigid flexible circuit board etc. are mentioned. In FIGS. 1 and 2, the planar shape of the substrate 6 is such that a substantially rectangular opposing portion 7, a substantially rectangular large portion, a substantially trapezoidal reduced width portion and a substantially rectangular small width portion are arranged in this order. The planar shape of the substrate 6 is not limited to this, and may be, for example, a substantially square, a substantially rectangular, or the like.

  The material of the base film 13 is not particularly limited, and examples thereof include synthetic resins, rubbers, metals, metal compounds, and ceramics. The material of the base film 13 is preferably one having flexibility.

〔wiring〕
The wiring 5 is attached to the end of the substrate 6 and forms a part of the conductive pattern of the substrate 6. The number of wires 5 attached to the end of the substrate 6 generally matches the number of conductive bands 2 provided on the fabric 4. In FIGS. 1 and 2, the number of the wirings 5 attached to the substrate 6 is eight, but the number of the wirings 5 attached to the substrate 6 is not limited to this. The material of the wiring 5 is not particularly limited, and examples thereof include copper, silver, aluminum, alloys thereof, and the like, and copper is preferable from the viewpoint of the balance between the conductivity and the cost. The wiring 5 is preferably coated on the surface with a metal having high corrosion resistance such as gold and platinum.

  The lower limit of the average width of the wires 5 in the facing portion 7 is preferably 0.1 mm, and more preferably 0.3 mm. On the other hand, as an upper limit of the average width of the wiring 5 in the opposing arrangement | positioning part 7, 10 mm is preferable and 5 mm is more preferable. When the average width of the wires 5 in the facing portion 7 is smaller than the lower limit, there is a possibility that the connection with the conductive band 2 formed on the fabric 4 may be difficult. On the other hand, when the average width of the wires 5 in the facing portion 7 exceeds the upper limit, the number of conductive bands 2 and wires 5 may be reduced, and the application of the connection structure 1 may be limited.

  As a minimum of wiring pitch of wiring 5 in countering arrangement part 7, 0.3 mm is preferred and 0.8 mm is more preferred. On the other hand, as an upper limit of the wiring pitch of the wiring 5 in the opposing arrangement | positioning part 7, 28 mm is preferable and 14 mm is more preferable. When the wiring pitch of the wiring 5 in the opposing arrangement part 7 is smaller than the said minimum, there exists a possibility that a connection with the conductive band 2 arrange | positioned by the cloth 4 may become difficult. On the contrary, when the wiring pitch of the wiring 5 in the opposing installation part 7 exceeds the said upper limit, the number of the conductive bands 2 and the wiring 5 may reduce, and there exists a possibility that the use of the said connection structure 1 may be limited.

[Connection method]
The connection method of the present invention secures the conductivity of the fabric 4 on which the plurality of conductive bands 2 and the plurality of nonconductive bands 3 are disposed in a stripe, and the substrate 6 on which the plurality of wirings 5 are attached to the end. It is a method of connecting while doing. In the connection method, the cloth 4 is stretched in the width direction, and the plurality of conductive bands 2 and the plurality of wires 5 are disposed opposite to each other via an adhesive (faced arrangement step); And a step of fixing the facing arrangement portion 7 (fixing step).

(Opposing arrangement process)
In this step, the fabric 4 is stretched in the width direction, and the plurality of conductive bands 2 and the plurality of wires 5 are disposed opposite to each other through an adhesive. This adhesive forms the adhesive layer 8 of the connection structure 1. As a method of extending | stretching the fabric 4 in the width direction, the method etc. of each holding the width direction both ends of the area | region which forms the opposing arrangement | positioning arrangement part 7 of the fabric 4 each side are drawn outside. As a method of opposingly arranging the plurality of conductive bands 2 and the plurality of wirings 5 via an adhesive, for example, after applying or arranging the adhesive on a region including the wirings 5 in the surface of the substrate 6, the conductive band A method of arranging to face 2 and a method of applying an adhesive to a region of the surface of the fabric 4 including the conductive band 2 and then arranging the adhesive to face the wiring 5 may be mentioned. In this step, the wiring pitch of the conductive pattern of the fabric 4 in the facing portion 7 is increased by the stretching in the width direction of the fabric 4. Therefore, before or at the same time as being disposed oppositely, the tensile force for the above-mentioned stretching is increased or decreased, and the wiring pitch is made to coincide with the wiring pitch of the wiring 5 attached to the substrate 6 Is preferred.

  Examples of the adhesive include a thermoplastic adhesive, a moisture-curable adhesive, an anaerobic-curable adhesive, a two-component mixed adhesive, a photocurable adhesive, a solvent-based adhesive, a water-based adhesive, and a thermosetting adhesive. Adhesive etc. are mentioned. As said adhesive agent, what can be pressure-bonded is preferable. Examples of the pressure-bondable adhesive include a moisture-curable adhesive, a thermosetting adhesive, and the like.

  The adhesive may be a liquid adhesive or a solid adhesive. Examples of the form of the solid adhesive include a film form. The lower limit of the average thickness of the film-like adhesive is, for example, 10 μm. On the other hand, the upper limit of the average thickness is, for example, 100 μm. As a film-like adhesive, a film-like thermoplastic adhesive is preferable. The film-like thermoplastic adhesive does not soften when it is not heated but softens when it is heated, thereby improving the workability in matching the wiring pitch between the conductive pattern of the fabric 4 and the wiring 5 attached to the substrate 6 it can.

  As a thermoplastic adhesive, for example, polyurethane adhesive, polyolefin adhesive, polyester adhesive, polyamide adhesive, styrene resin adhesive, acrylic resin adhesive, EVA resin adhesive, vinyl acetate resin Adhesives, polyvinyl alcohol adhesives, polyvinyl acetal adhesives, vinyl chloride resin adhesives, cellulose resin adhesives, polyvinyl butyral adhesives, polymethacrylate adhesives, etc. may be mentioned. Examples of the moisture-curable adhesive include urethane resin adhesives, silicone resin adhesives, cyanoacrylate resin adhesives and the like. Examples of the anaerobic curable adhesive include modified acrylic resin adhesives and the like. Examples of the two-component mixed adhesive include an epoxy resin adhesive, an acrylic resin adhesive, and a silicone resin adhesive. As a photocurable adhesive agent, an epoxy resin adhesive, an acrylic resin adhesive, etc. are mentioned, for example. As a solvent type adhesive, for example, chloroprene rubber adhesive, nitrile rubber adhesive, styrene / butadiene copolymer rubber adhesive, styrene / butadiene block polymer rubber adhesive, styrene / isoprene block polymer rubber adhesive, Butyl rubber based adhesives, polysulfide based adhesives, silicone rubber based adhesives, acrylic resin based adhesives, polyester based adhesives, chlorinated polyethylene based adhesives, polychloroprene / acrylic graft based adhesives, natural rubber based adhesives etc. It can be mentioned. As the aqueous type adhesive, for example, urea resin adhesive, melamine resin adhesive, phenol resin adhesive, resorcinol resin adhesive, aqueous polymer-isocyanate adhesive, α-olefin maleic anhydride resin adhesive Agent, vinyl acetate resin emulsion adhesive, EVA resin emulsion adhesive, acrylic resin emulsion adhesive, urethane resin emulsion adhesive, epoxy resin emulsion adhesive, chloroprene rubber latex adhesive And nitrile rubber latex adhesives, natural rubber latex adhesives and the like. As a thermosetting adhesive, for example, urea based adhesives, resorcinol based adhesives, melamine based adhesives, phenol based adhesives, epoxy based adhesives, polyurethane based adhesives, polyester based adhesives, polyimide based adhesives, poly Aromatic adhesive etc. are raised.

  In addition, when connecting the fabric 4 and the board | substrate 6 via an anisotropic conductive layer, as said adhesive agent, an anisotropic conductive film, an anisotropic conductive paste etc. can be used, for example, Among these, Anisotropic conductive film is preferred. The anisotropic conductive film does not exhibit adhesiveness at normal temperature even in a state of being in contact with the fabric 4 and the substrate 6. Therefore, by connecting the fabric 4 and the substrate 6 using an anisotropic conductive film, the workability at the time of adjusting the wiring pitch is improved while the fabric 4 and the substrate 6 stretched in the width direction are disposed to face each other. Do. In addition, since the fabric 4 and the substrate 6 can be connected by pressure bonding under relatively weak pressure while heating, the adjusted wiring pitch is unlikely to shift, and the connectivity is improved. Further, since the fabric 4 and the substrate 6 can be easily connected even if the wiring pitch of the conductive pattern of the fabric 4 is fine due to the improvement of the workability, the wiring pitch of the conductive pattern of the fabric 4 is further refined. easy.

(Fixing process)
At this process, the opposing arrangement | positioning part 7 of the cloth 4 and the board | substrate 6 is fixed. As a method of fixing the facing disposition portion 7 of the fabric 4 and the substrate 6, a method of pressing the facing disposition portion 7 can be applied. As a method of pressure-bonding the opposing arrangement | positioning part 7, the method of pressure-bonding at room temperature, the method of pressure-bonding, heating etc. is mentioned, for example. The lower limit of the pressure bonding time is, for example, 3 seconds. On the other hand, the upper limit of the pressure bonding time is, for example, 20 seconds. Moreover, when heating at the time of pressure bonding, the lower limit of the heating temperature is, for example, 120 ° C. On the other hand, the upper limit of the heating temperature is, for example, 220 ° C.

<Advantage>
The connection structure 1 is fixed to the substrate 6 in a state where the cloth 4 in which the plurality of conductive bands 2 and the plurality of non-conductive bands 3 are arranged in the form of stripes is stretched in the width direction. As described above, the connection structure 1 is formed by attaching the wiring pitch of the conductive pattern formed by the conductive band 2 and the nonconductive band 3 disposed on the cloth 4 by stretching the cloth 4 to the wiring 5 attached to the substrate 6. As it can be formed while adjusting together, the fabric 4 and the substrate 6 can be electrically connected easily and reliably. Moreover, since the area of the opposing arrangement | positioning part 7 of the cloth 4 and the board | substrate 6 increases by extending | stretching the cloth 4, the said connection structure 1 is excellent in durability. Furthermore, since the connection structure 1 does not require the conductive pattern of the fabric 4 to have high precision, the conductive pattern of the fabric 4 can be easily miniaturized.

  Further, in the connection method, the connection structure 1 can be easily formed between the fabric 4 having the conductive pattern and the substrate 6, and the wiring pitch of the conductive pattern of the fabric 4 can be easily miniaturized.

  In addition, the fabric 4 has irregularities on the surface, and the space between the yarn and the yarn can be impregnated with the resin. Therefore, by connecting the fabric 4 and the substrate 6 using an adhesive, it is possible to form an electrical connection by contact between the convex portion of the conductive band 2 and the wiring 5 by pressure bonding under a relatively weak pressure. It is possible to suppress the deviation of the wiring pitch of the conductive pattern adjusted by the stretching of Furthermore, by impregnating the inside of the fabric 4 with the adhesive, the connection between the fabric 4 and the substrate 6 can be made stronger.

Second Embodiment
The connection structure 21 shown in FIG. 4 is conductive on a fabric 41 on which a plurality of conductive bands 2 and a plurality of non-conductive bands 3 are arranged in stripes, and a substrate 6 on which a plurality of wirings 5 are attached at the end. The cloth 41 is stretched in the width direction, and the plurality of conductive bands 2 and the plurality of wires 5 are fixed in a state of facing each other. The parts other than the cloth 41 are the same as in the first embodiment, and thus the description thereof is omitted.

(Fabric)
In the fabric 41, the plurality of conductive bands 2 and the plurality of nonconductive bands 3 are arranged in a stripe. That is, the fabric 41 has a conductive pattern formed by the plurality of conductive bands 2 and the plurality of non-conductive bands 3. The nonconductive band 3 is disposed at both ends in the width direction of the fabric 41. The fabric 41 has, at one end in the longitudinal direction, an oppositely disposed portion 7 which is stretched in the width direction and which is disposed to face the substrate 6. Moreover, the fabric 41 has the branch formation part 15 which has the water-soluble zone 14 which the non-conductive zone 3 mentions later in the other edge part of a longitudinal direction. Furthermore, the fabric 41 is interposed between the facing portion 7 and the branch forming portion 15, and is not stretched in the width direction and does not have the water-soluble band 14, and the facing portion 7 and the non-stretching portion. The widening part which connects the extending part 10 is provided.

  The non-conductive bands 3 located other than the widthwise end portions of the fabric 41 each have a water-soluble band 14 extending substantially to the center in the width direction to one end portion in the longitudinal direction.

(Water soluble zone)
The water soluble zone 14 is composed of a water soluble yarn. Examples of the water-soluble yarn include yarns formed of water-soluble polyvinyl alcohol, water-soluble polyester, water-soluble polyamide, water-soluble ethylene-vinyl alcohol copolymer and the like.

  The water-soluble zone 14 is soluble in water because it is composed of a water-soluble yarn. That is, the water-soluble zone 14 is dissolved in the non-conductive zone 3 of the branch forming portion 15 by immersion in water, and the non-conductive zone 3 bifurcates in the approximate center in the width direction. Therefore, the cloth 41 can easily form the plurality of branched conductive bands 2 by immersing the branch forming portion 15 in water.

  As a minimum of average width of water-soluble zone 14, 0.05 mm is preferred and 0.15 mm is more preferred. On the other hand, the upper limit of the average width of the water-soluble zone 14 is preferably 5 mm, more preferably 2.5 mm. When the average width of the water-soluble zone 14 is smaller than the lower limit, the formation of the water-soluble zone 14 may be difficult. On the other hand, when the average width of the water-soluble zone 14 exceeds the upper limit, the strength of the plurality of branched conductive zones 2 may decrease. Moreover, as a minimum of the average length of the water-soluble zone 14, it is 5 cm, for example. On the other hand, the upper limit of the average length of the water-soluble zone 14 is, for example, 50 cm. The average widths of the plurality of water-soluble bands 14 may be the same or different. Further, the average lengths of the plurality of water-soluble zones 14 may be the same or different.

  The lower limit of the ratio of the average width of the water-soluble zone 14 to the average width of the nonconductive zone 3 is preferably 30%, and more preferably 40%. On the other hand, the upper limit of the ratio is preferably 70%, more preferably 60%. If the ratio is smaller than the lower limit, the formation of the water-soluble zone 14 may be difficult. On the other hand, when the ratio exceeds the upper limit, the average width of the nonconductive bands 3 sandwiching the plurality of branched conductive bands 2 may be reduced, and a short circuit may easily occur.

  The lower limit of the average fineness of the water-soluble yarn is preferably 3 dtex, more preferably 7 dtex. On the other hand, the upper limit of the average fineness of the water-soluble yarn is preferably 500 dtex, and more preferably 200 dtex. When the average fineness of the water-soluble yarn is smaller than the lower limit, the strength of the fabric 41 may be insufficient. On the other hand, when the average fineness of the water-soluble yarn exceeds the upper limit, there is a possibility that the dissolution in water becomes difficult.

<Advantage>
The connection structure 21 can dissolve the water-soluble zone 14 by immersion in the non-conductive zone 3 water, and as a result, the plurality of branched conductive zones 2 can be easily formed. Thereby, the branched conductive bands 2 can be used in different places and applications.

Third Embodiment
[Wearable device]
The wearable device of the present invention includes the connection structure. The wearable device further comprises one or more sensors that typically have an electrical connection with the conductive band of the connection structure. As this sensor, a distortion sensor etc. are mentioned, for example.

  As an application of the wearable device, a wearable device in which a sensor is disposed on clothes is preferable. As a specific example, there can be mentioned a data glove in which a plurality of sensors are provided on a glove in order to detect the movement of a finger of a human hand.

  As a manufacturing method of the said wearable device, the method of arrange | positioning the cloth of the said connection structure, etc. is mentioned, for example. Examples of the method of arranging the fabric on the clothes include a method using an adhesive, a method using a support such as a tape, and a method of sewing.

<Advantage>
By providing the connection structure, the wearable device is easy to manufacture and easily reduce the manufacturing cost. In the wearable device, the connection structure easily reduces the wiring pitch of the conductive pattern of the fabric, that is, the width of the fabric is easily reduced and the number of wires is increased, and the durability is excellent. It can be used suitably.

Other Embodiments
The embodiment does not limit the configuration of the present invention. Therefore, the embodiment can omit, substitute, or add the components of each part of the embodiment based on the description of the present specification and common technical knowledge, and all of them can be construed as belonging to the scope of the present invention. It should.

  The fabric and the substrate may be connected while securing conductivity without interposing an adhesive layer. As a method of connecting the fabric and the substrate without an adhesive layer, for example, a connector is used which electrically connects the conductive pattern of the fabric and the wiring provided on the substrate by sandwiching the fabric. Methods etc. When the fabric and the substrate are connected by the connector in the connection method, the plurality of conductive bands and the plurality of wires are disposed opposite to each other without using an adhesive in the facing arrangement step.

  Also, the plurality of conductive bands and the plurality of nonconductive bands of the fabric are not limited to those disposed in a stripe shape. That is, the width of the conductive band and the width of the nonconductive band may be substantially the same from one end to the other end, or may be increased or decreased. When the width of the conductive band or the nonconductive band increases and decreases from one end to the other end, the lower limit of the ratio of the maximum width to the minimum width is, for example, 150%. On the other hand, the upper limit of the ratio is, for example, 500%.

  The planar shape of the facing portion may not be substantially rectangular. Examples of other planar shapes of the facing portion include, for example, a substantially square, a substantially semicircular shape, and the like.

  Both widthwise end portions of the fabric may not be non-conductive bands. That is, one end in the width direction of the fabric may be a conductive band, and both ends may be a conductive band. However, from the viewpoint of suppressing a short circuit, it is preferable to dispose non-conductive bands at both ends in the width direction of the fabric.

  The substrate is not particularly limited as long as a plurality of wires are attached to the end, and may be, for example, a substrate in which wires are formed on both sides of a base film, or a substrate on which other films other than the base film are laminated.

  The branch part and branch formation part of the said fabric may be abbreviate | omitted. That is, in the entire fabric, the nonconductive band and the conductive band may be integrated to form a stripe. Moreover, in the said connection structure, the non-stretching part of a fabric is also an arbitrary structure. Furthermore, in the connection structure, the fabric may have opposing disposition portions at both end portions in the longitudinal direction, and may have opposing disposition portions in regions other than the end portions.

  When the nonconductive zone has a water soluble zone, the position of the water soluble zone is not limited to the widthwise approximate center of the nonconductive zone. That is, the position of the water-soluble zone may be near the widthwise end of the nonconductive zone. In addition, one end of the water-soluble band in the longitudinal direction may not extend to one end of the fabric in the longitudinal direction. That is, the water-soluble zone may be surrounded by the non-conductive zone. Furthermore, the non-conductive bands located at both ends in the width direction of the fabric may have water-soluble bands.

  The method of forming a fabric in which a plurality of conductive bands and a plurality of nonconductive bands are disposed in a stripe shape using a conductive yarn and a nonconductive yarn is not limited to the knitting by weft knitting. Examples of the method of forming the fabric include knitting by weft knitting, knitting by circular knitting, weaving, etc. Among them, knitting is preferable from the viewpoint of enhancing the stretchability, and knitting by weft knitting and circular knitting is More preferable. In addition, when forming the said fabric by weaving, it is preferable to use the electroconductive thread which has elasticity in a warp yarn and / or a weft, or the nonelectroconductive yarn which has elasticity. Moreover, the said fabric is not limited to what was knitted or woven using electroconductive yarn and nonelectroconductive yarn. As the cloth, for example, a metal foil, an electric wire, a belt-like conductive cloth or the like may be attached to an insulating and stretchable cloth.

  The connection structure of the present invention can easily and reliably electrically connect the fabric having the conductive pattern and the substrate, and easily make the wiring pitch of the conductive pattern of the fabric finer. Further, the wearable device of the present invention can be suitably used for various applications because it is easy to increase the number of conductive patterns of the cloth. Furthermore, according to the connection method of the present invention, the electrical connection structure can be easily formed between the fabric having the conductive pattern and the substrate, and the wiring pitch of the conductive pattern of the fabric can be easily miniaturized.

1, 21 connection structure 2 conductive band 3 nonconductive band 4 41 fabric 5 wiring 6 substrate 7 facing arrangement part 8 adhesive layer 9 branched part 10 non-stretched part 11 conductive yarn 12 nonconductive yarn 13 base film 14 water solubility Band 15 branch formation part

Claims (4)

A fabric in which a plurality of conductive bands and a plurality of nonconductive bands are alternately disposed in the width direction;
A structure in which a plurality of wires are connected to a substrate attached to an end while securing conductivity,
The fabric is stretched in the width direction, and the plurality of conductive bands are fixed in a state in which the plurality of wires face each other,
The connection structure, wherein the plurality of non-conductive bands have a water-soluble band .   The fabric is knitted or woven using a conductive yarn and a nonconductive yarn, the conductive yarn is formed by the conductive yarn, and the nonconductive belt is formed by the nonconductive yarn. The connection structure according to claim 1.   A wearable device comprising the connection structure according to claim 1 or 2. A fabric in which a plurality of conductive bands and a plurality of nonconductive bands are alternately disposed in the width direction;
A method of manufacturing a structure in which a plurality of wires are connected to a substrate attached to an end while securing conductivity.
Stretching the fabric in the width direction, and opposingly arranging the plurality of conductive bands and the plurality of wires;
Fixing the facing portion of the fabric and the substrate ;
Immersing the plurality of non-conductive bands in water ;
Method of manufacturing a connection structure in which the plurality of non-conductive band and said Rukoto which have a water solubility range.

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