JPH10321989A - Conductive sheet with formed conductive pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a conductive pattern at low cost within the short period of time using a mesh sheet having many fine holes provided through both surfaces. SOLUTION: In a mesh sheet having many fine holes provided through both surfaces which is formed by knitting the chemical fiber or natural fiber of about 30 μ ϕ with a pitch of 100 μ, a transmitting pattern in the width of 40 μis formed by coating a photosensitive agent 2 and then exposing and developing it, a conductive pattern 3 is formed by the plating method or burying method to this transmitting pattern in order to form a conductive sheet 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a mesh sheet or a porous sheet having a large number of fine pores by using a photosensitive agent on a mesh sheet knitted with various kinds of fibers and exposing and developing an extremely fine sheet (30 .mu.
(50μ width) Conductive sheet on which conductive pattern is formed and use of the conductive sheet in various applications

[0002]

2. Description of the Related Art In a conventional conductive printed wiring board, a thin copper plate is adhered to the surface of a resin substrate, a photosensitive agent is applied to the surface, and exposure and development are performed to form a conductive pattern. The inside was plated, and the inside and outside were electrically connected.

[0003]

At present, the width of a conductive pattern of a conductive wiring board is required to be 30 to 50 .mu. With the high performance, small size and light weight of electronic equipment. With a conventional etching method, a pattern width of 100 μm or less is extremely difficult to form a pattern due to rebound of an etching solution, etc. Therefore, in recent years, there has been a shift to an additive method of forming by plating, but this method is more accurate than the etching method. Although it can be somewhat improved, there is a problem that it takes too much time and money.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems by applying a photosensitive agent to a porous sheet having a large number of fine holes penetrating both sides, and forming a conductive pattern by exposure and development. The formed conductive sheet. A porous sheet having a large number of fine holes penetrating on both sides is made conductive by plating or conductive coating, a transmission pattern is formed by a photosensitive agent resist, and a conductive pattern is formed by plating or conductive coating on the transmission pattern. A conductive sheet having a conductive pattern formed by stripping a resist and a plating or conductive coating thereunder. A conductive sheet in which a pattern is formed with a photosensitive agent on a porous sheet having a large number of fine holes penetrating both sides, and the surface of the photosensitive agent is plated to form a conductive pattern. A conductive pattern is formed on a porous sheet having a large number of fine holes penetrating both sides with a photosensitive agent resist, and a conductive pattern such as an ink paste, a conductive paste, or a metal powder-containing paste is embedded in the transparent pattern to form a conductive pattern. Sheet. A conductive sheet in which a conductive pattern is formed by printing a conductive member on a porous sheet having a large number of fine holes penetrating on both sides by screen printing. It is characterized by.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2 show a first embodiment of the present invention. 1 is a mesh sheet having a large number of fine holes penetrating both sides of a fiber such as a 30 [mu] [phi] chemical fiber or a natural fiber at a pitch of 100 [mu]. The photosensitive agent 2 is applied, exposed and developed to form a 40 [mu] wide transmission pattern. Forming
The conductive pattern 3 is formed on the transmission pattern by plating or embedding, and a conductive sheet 4 is formed.

FIGS. 3 to 5 show a second embodiment of the present invention. A plating 5 is applied to the entire mesh sheet 1, a photosensitive agent 2 is applied, and exposure and development are performed to form a transmission pattern 6. The transmission pattern 6 is electroplated to form a conductive pattern 7, and the photosensitive agent 2 is peeled off. Then, the plating 5 other than the conductive pattern 7 is removed by etching. Conductive pattern 7
May be plated with gold.

FIGS. 6 and 7 show a third embodiment of the present invention.
A photosensitive agent or a photosensitive agent 8 containing metal powder is applied to the mesh sheet 1, a pattern 9 is formed by exposure and development, and a metal plating 10 is applied to the pattern 9 to form a conductive pattern 11.

FIGS. 8 to 10 show a fourth embodiment of the present invention. A photosensitive agent 2 is applied to the mesh sheet 1, exposed and developed to form a transmission pattern 12, and a conductive member 13 such as a metal paste or a conductive adhesive is embedded therein.
To form the conductive pattern 15. Molten solder may be coated thereon. Conductive pattern 15
Other parts are removed by etching

FIGS. 11 and 12 show a fifth embodiment of the present invention. Reference numeral 17 denotes a screen plate on which a transmission pattern 18 is formed. A mesh sheet 19 is arranged on the back surface, and a conductive member 21 is printed by a screen printing method using a squeegee 20 to form a conductive pattern 22 on the mesh sheet 19. The plating and molten metal 23 is coated thereon.

FIGS. 13 to 15 show a sixth embodiment of the present invention. FIG. 13 shows a chemical fiber sheet 30 and a metal fiber sheet 31.
The transparent pattern 33 is formed with the resist 32, the conductive pattern 34 is formed by plating, the resist 32 is peeled off, and the metal fiber sheet 31 other than the conductive pattern 34 is removed by etching.

FIG. 16 shows a seventh embodiment of the present invention. When plating the conductive sheet described above, the stainless plate 35 may be used as a single pole, and the stainless plate 35 may be peeled off after plating.

FIGS. 17 and 18 show an eighth embodiment of the present invention.
A mesh sheet is formed by the metal fibers 40 and the chemical fibers 41, a photosensitive agent is applied to form a conductive pattern 42, and the metal fibers 40 other than the conductive pattern 42 are melted and removed by etching.

FIGS. 19 and 20 show a ninth embodiment of the present invention.
The conductive pattern 51 is formed using the metal fiber mesh sheet 50, and the metal fiber mesh sheet 50 other than the conductive pattern 51 is melted and removed by etching.

FIGS. 21 and 22 show a tenth embodiment of the present invention, in which a conductive sheet 6 having conductive patterns 60 and 61 is formed.
2 and 63 are superimposed on the conductive substrate 64, and plating 66 is applied to the penetrating portion 65, so that the conductive patterns 60 and 61 and the conductive substrate 64
Are electrically connected to each other.

FIG. 23 shows an eleventh embodiment of the present invention. In the eleventh embodiment, for example, four holes of conductive sheets 70, 71, 72, 73 are aligned with round holes 74, and plating 75 is applied. Conduction of the conductive sheets 70, 71, 72, 73 can be achieved without drilling round holes in the upper and lower printed boards and the inner layer board.

FIG. 24 shows a twelfth embodiment of the present invention,
The upper and lower conductive patterns 81 of the first conductive pattern 81, the second conductive pattern 82 made of a mesh sheet, and the third conductive pattern 83 are joined by ultrasonic waves.

FIG. 25 shows a thirteenth embodiment of the present invention, in which a grid array electrode 91 similar to the BGA of the conductive sheet 90 is formed, and a wiring pattern 92 from the grid array electrode 91 to various components is formed.

FIG. 26 shows a fourteenth embodiment of the present invention. In the above embodiment, the first layer is a conductive pattern for connection (joining) in order to increase the wiring density, and the second layer is a conductive pattern to establish conduction with the first layer. I have.

FIG. 27 shows a fifteenth embodiment of the present invention. S. A multi-contact electronic component 101 such as I is joined by a conductive sheet 102. Used as TAB tape.

FIGS. 28 and 29 show a sixteenth embodiment of the present invention. S. Each contact 11 of the multi-contact electronic component 110 such as I
1, a conductive sheet 114 on which a conductive pattern 113 is formed by connecting a ponting wire and a conductive pattern of a substrate 112.
Are electrically connected to each other.

FIG. 30 shows a seventeenth embodiment of the present invention, in which a conductive sheet 122 on which a conductive pattern 121 is formed is pasted on a glass, ceramics, phenol substrate or glass epoxy substrate 120 to form an electrode for a liquid crystal panel or a large television. Wiring, fax reading wiring, L. S. It is used for the in-chip wiring such as I and the ITO wiring.

Conventionally, a printed circuit board 125 as shown in FIG.
A and B, C and D, E and F are not broken,
When conducting a current test to determine whether or not there is contact with an adjacent pattern, pins are provided on A, B, C, D, E, and F. However, if the pattern is a dense pattern, 2,000 to 500 pins are formed on one substrate.
There is a need to set up 0 pins and inspect, there is a scratch on the pattern at the tip of the pin, and there is a printed circuit board so dense that there is no place to set the pin. FIG. 32 shows an eighteenth embodiment of the present invention. And B, C and D,
By superposing the conductive sheet 127 on which the conductive pattern 126 for conducting E and F is formed on the printed circuit board 125 as shown in FIG. 32, disconnection and contact with the adjacent pattern can be inspected very easily.

FIG. 33 shows a nineteenth embodiment of the present invention, in which a conductive sheet 131 on which a comb electrode 130 of a solar cell is formed is adhered to silicon 132 and used as a comb electrode of the solar cell. The amorphous type is attached in the form of a film.

FIGS. 34 and 35 show a twentieth embodiment of the present invention, in which a conductive sheet 141 on which a linear parallel conductive pattern 140 is formed as shown in FIG. 34 is wound as shown in FIG.
2, a motor coil that conducts electricity in the same direction from one end to the other end of the linear parallel conductive pattern 140 to generate a magnetic force.

FIG. 36 shows a twenty-first embodiment of the present invention, in which a plurality of conductive sheets 151 on which conductive patterns 150 are formed in a spiral shape are laminated, and the same from one end of the conductive pattern 150 to the other end. It is a motor coil that energizes in the direction and generates a magnetic force.

FIG. 37 shows a twenty-second embodiment of the present invention in which a conductive sheet 164 is provided between a wiring pattern 161 of an upper substrate 160 and a wiring pattern 163 of a lower substrate 162.
The upper and lower wiring patterns 161 and 163 are electrically connected.

FIG. 38 shows a twenty-third embodiment of the present invention, in which the lower conductive pattern 1 of the upper conductive sheet 170 and the lower substrate 171 is shown.
A random type conductive sheet 173 for anisotropic bonding is provided between the upper and lower wiring patterns 72 and the upper and lower wiring patterns are conductively bonded.

FIGS. 39 and 40 show a twenty-fourth embodiment of the present invention, in which the present invention is applied to a push switch for a keyboard, a telephone, a computer, and a game, and a conductive pattern 182 is provided between the push button 180 and the wiring board 181. When using, as shown in FIG. 40, the push button 180 is pressed, the mesh tension is used for the same function as the spring, and when released, the mesh returns to the original state by the mesh tension.

Conventionally, as shown in FIGS.
Although the structure was complicated because of using 84, it can be manufactured at low cost by the present invention.

[0030]

According to the present invention, since a porous sheet having a large number of fine holes penetrating both sides is used, the developing solution does not come off on the opposite side during pattern formation development, so that there is no undercut. A vertical edge is obtained. The same applies to the case of etching. Accordingly, a conductive pattern having a width of 40 μ can be formed on a mesh sheet having a thickness of 50 μ using fibers of 30 μφ. In addition, according to the present invention, when a conductive member is embedded in a transmission pattern such as a paste or the like, since there is no substrate underneath, the conductive member can be smoothly embedded into all corners and penetrated into a minute portion. And because there is a support called a mesh, the transmission pattern becomes reinforcement of the embedded conductive member even in a large area,
This is an epoch-making method for forming an electrically conductive sheet, since it can be embedded reliably, a fine pattern which cannot be obtained by the etching method is obtained, and the process is short and simple, so that the cost is extremely low.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a mesh sheet before a conductive agent is formed after a photosensitive agent is applied thereto in a first embodiment of the present invention.

FIG. 2 is an external perspective view of a conductive sheet in which a conductive portion is formed on the mesh sheet of FIG.

FIG. 3 is a front cross-sectional view of a second embodiment of the present invention when a mesh sheet is plated to form a transmission pattern.

FIG. 4 is a front cross-sectional view when electroplating is performed on the transmission pattern of FIG. 3;

FIG. 5 is a front cross-sectional view in which the photosensitive agent of FIG. 4 is peeled off and plating other than a conductive pattern is removed.

FIG. 6 is a front sectional view showing a pattern formed on a photosensitive agent of a mesh sheet according to a third embodiment of the present invention.

FIG. 7 is a front sectional view in which a metal pattern is applied to the pattern portion of FIG. 6 to form a conductive pattern.

FIG. 8 is a front cross-sectional view illustrating a transmission pattern formed on a mesh sheet according to a fourth embodiment of the present invention.

FIG. 9 is a front sectional view in which a conductive pattern is formed by embedding a conductive member in the transmission pattern of FIG. 8;

FIG. 10 is a front sectional view in which a portion other than the conductive pattern portion in FIG. 8 is removed.

FIG. 11 is a front sectional view of a fifth embodiment of the present invention in which a conductive member is printed on a mesh sheet by a screen printing method to form a conductive pattern.

FIG. 12 is a front view of the conductive pattern shown in FIG. 11 after plating.

FIG. 13 is a front sectional view of a sixth embodiment of the present invention in which chemical fibers and metal fibers are overlapped to form a transmission pattern.

FIG. 14 is a front cross-sectional view in which a conductive pattern obtained by plating the transmission pattern of FIG. 13 is formed;

FIG. 15 is a front sectional view in which parts other than the conductive pattern of FIG. 14 are removed.

FIG. 16 is a front sectional view of a seventh embodiment of the present invention using a stainless steel plate when plating a conductive sheet.

FIG. 17 is a front sectional view of a conductive sheet using a mesh sheet formed of metal fibers and chemical fibers according to an eighth embodiment of the present invention.

FIG. 18 is a front cross-sectional view in which metal fibers other than the conductive parts in FIG. 17 are removed.

FIG. 19 is a front sectional view of a ninth embodiment of the present invention in which a conductive pattern is formed using a mesh sheet of metal fibers.

FIG. 20 is a front sectional view in which metal fibers other than the conductive parts in FIG. 19 are removed.

FIG. 21 is a front sectional view of a tenth embodiment of the present invention in which conductive sheets are stacked in multiple layers on a substrate.

FIG. 22 is a front sectional view of the through portion of FIG. 21 plated with plating.

FIG. 23 is a front sectional view showing a multi-layer conductive sheet subjected to through-hole plating in an eleventh embodiment of the present invention.

FIG. 24 is a front sectional view of each superposed conductive sheet and a substrate joined by ultrasonic waves in the twelfth embodiment of the present invention.

FIG. 25 is a plan view of a conductive sheet in which a grid array electrode and a wiring pattern are integrally formed on a mesh sheet according to a thirteenth embodiment of the present invention.

FIG. 26 is a front cross-sectional view of a fourteenth embodiment of the present invention, in which the conductive sheet of FIG. 25 is multi-layered.

FIG. 27 shows a fifteenth embodiment of the present invention; S. It is the front view which joined the multi-contact electronic components, such as I, with the conductive sheet.

FIG. 28 is a block diagram of a sixteenth embodiment of the present invention; S. FIG. 3 is a plan view of a conductive sheet that electrically connects each contact of a multi-contact electronic component such as I, a bonding wire, and a substrate with a conductive sheet.

FIG. 29 is a front sectional view when the conductive sheet of FIG. 28 is used.

FIG. 30 is a front sectional view of a liquid crystal panel or the like in which a conductive sheet is adhered to glass or the like in a seventeenth embodiment of the present invention.

FIG. 31 is an external perspective view of a printed circuit board to be subjected to a conduction test.

FIG. 32 is a front sectional view of the eighteenth embodiment of the present invention when the printed circuit board shown in FIG.

FIG. 33 is a front sectional view of a nineteenth embodiment of the present invention in which a conductive sheet on which a comb-shaped electrode of a solar cell is formed is attached to silicon.

FIG. 34 is a plan view of a conductive sheet when used as a motor coil having a linear parallel conductive pattern according to a twentieth embodiment of the present invention.

35 is an external perspective view in which the conductive sheet of FIG. 34 is wound.

FIG. 36 is a plan view of a conductive sheet used as a motor coil having a spiral conductive pattern according to a twenty-first embodiment of the present invention.

FIG. 37 is a front sectional view of the case in which the wiring patterns of the upper substrate and the lower substrate are joined by a conductive sheet in the twenty-second embodiment of the present invention.

FIG. 38 is a front sectional view in the case where the upper conductive sheet and the lower substrate are joined by the conductive sheet in the twenty-third embodiment of the present invention.

FIG. 39 is a front sectional view of a push-type switch using a conductive sheet on which a conductive pattern of a switch is formed according to a twenty-fourth embodiment of the present invention.

FIG. 40 is an explanatory diagram of the switch operation of FIG. 39.

FIG. 41 is a front sectional view of a conventional push-type switch.

FIG. 42 is an operation explanatory view of FIG. 41.

[Explanation of symbols]

1 mesh sheet 2 photosensitizer
3 Conductive pattern 4 Conductive sheet 5 Plating
6 Transmission pattern 7 Conductive pattern 8 Photosensitizer
9 pattern 10 metal plating 11 conductive pattern
12 Transmission pattern 13 Conductive member 14 Plating
Reference Signs List 15 conductive pattern 17 screen plate 18 transmission pattern 19 mesh sheet 20 squeegee
21 conductive member 22 conductive pattern 23 molten metal
Reference Signs List 30 synthetic fiber sheet 31 metal fiber sheet 32 resist
33 Transmission pattern 34 Conductive pattern 35 Stainless steel plate
40 metal fiber 41 chemical fiber 42 conductive pattern
Reference Signs List 50 mesh sheet 51 conductive pattern 60, 61 conductive pattern 62, 63 conductive sheet 64 conductive substrate
67 conductive pattern 70, 71, 72, 73 conductive sheet
74 Round hole 75 Plating 80 Base material 81, 82, 83 Conductive pattern
90 conductive sheet 91 grid array electrode
92 Wiring pattern 100 LCD panel 101 Multi-contact electronic component 102 Conductive sheet 110 Multi-contact electronic component 111 Multi-contact 112 Substrate 113 Conductive pattern 114 Conductive sheet 120 Glass 121 Conductive pattern 125 Printed board 126 Conductive pattern 130 Comb electrode 131 Conductive sheet 132 Silicon 140 linear parallel conductive pattern 141 conductive sheet 142 coil 150 spiral conductive pattern 151 conductive sheet 160 upper substrate 161 wiring pattern 162 lower substrate 163 wiring pattern 170 upper conductive sheet 171 lower substrate 172 lower wiring pattern 173 conductive sheet 180 push button 181 wiring substrate 182 conductive pattern 183 conductive sheet

Claims (24)

[Claims] 1. A conductive sheet obtained by applying a photosensitive agent to a porous sheet having a large number of fine holes penetrating both sides and forming a conductive pattern by exposure and development. 2. A porous sheet having a large number of fine holes penetrating both sides is made conductive by plating or conductive coating, and a transmission pattern is formed by a photosensitive agent resist.
A conductive sheet in which a conductive pattern is formed by plating or conductive coating on the transmission pattern, and the photosensitive resist and the underlying plating or conductive coating are peeled off to form a conductive pattern. 3. A conductive sheet formed by forming a pattern with a photosensitive agent on a porous sheet having a large number of fine holes penetrating both sides and plating the surface of the photosensitive agent to form a conductive pattern. 4. A transmission pattern is formed with a photosensitive agent resist on a porous sheet having a large number of fine holes penetrating on both sides,
A conductive sheet in which a conductive member such as an ink paste, a conductive paste, or a paste containing metal powder is embedded in the transmission pattern to form a conductive pattern. 5. A conductive sheet in which a conductive member is printed by screen printing on a porous sheet having a large number of fine holes penetrating on both sides to form a conductive pattern. 6. The method according to claim 1, wherein the surface of the conductive pattern is coated with a molten metal.
A conductive sheet on which the conductive pattern according to 5 is formed. 7. A conductive sheet having a conductive pattern according to claim 1, wherein the entire surface or the peripheral portion is adhered to a plate made of ceramic, metal, resin, glass or the like. 8. A single or multi-layered mesh sheet formed by knitting chemical fibers, natural fibers, glass fibers, and metal fibers into a mesh, or a porous sheet having a large number of fine holes formed in resin, metal, ceramic, glass, or the like. A conductive sheet on which the conductive pattern according to claim 1, 2, 3, 4, or 5 is formed. 9. The conductive sheet according to claim 1, wherein the conductive sheets are superposed in multiple layers, and the through portions are plated to join the respective conductive sheets to form a multilayer conductive sheet. A conductive sheet on which a pattern is formed. 10. A conductive sheet having a conductive pattern according to claim 1, wherein conductive sheets are superposed in multiple layers, and the conductive sheets of each layer are joined by ultrasonic waves to form a multilayer sheet. Sheet. 11. A grid array electrode similar to BGA is formed on a conductive sheet, and a wiring pattern is formed from the grid array electrode.
A conductive sheet on which the conductive pattern according to claim 4 is formed. 12. The method according to claim 1, wherein the tape is used as a liquid crystal TCP tape or a TAB tape.
A conductive sheet on which the conductive pattern described above is formed. 13. A conductive sheet having a conductive pattern according to claim 1, wherein the conductive sheet is used for a digitizer. 14. L. S. 6. A conductive sheet having a conductive pattern according to claim 1, wherein a conductive pattern for conducting a contact between a multi-contact component such as I and a conductive substrate is formed. 15. The method according to claim 1, which is used for a grid and an aperture grill between television browns.
A conductive sheet on which the conductive pattern according to 3, 4, or 5 is formed. 16. Adhering to glass, ceramics, a phenol substrate, a glass epoxy substrate, or the like;
S. 6. A conductive sheet having a conductive pattern according to claim 1, wherein the conductive pattern is used for an in-chip wiring such as I or an ITO substitute wiring. 17. The multi-layer printed wiring board as an outer layer sheet and an inner layer sheet.
A conductive sheet on which the conductive pattern according to 3, 4, or 5 is formed. 18. The conductive sheet according to claim 1, wherein a conductive pattern similar to the wiring of the printed board is formed and used as a continuity test connector. 19. A solar cell comprising a comb-shaped electrode, a transparent electrode, and a back metal.
A conductive sheet on which the conductive pattern according to claim 4 is formed. 20. A motor coil for generating a magnetic force by winding a conductive sheet on which a conductive pattern is formed in a linearly parallel manner and supplying electricity in the same direction from one end to the other end of the conductive pattern. Claims 1, 2, 3,
A conductive sheet on which the conductive pattern according to claim 4 is formed. 21. A motor coil for generating a magnetic force by laminating a number of conductive sheets each having a spirally formed conductive pattern and energizing in the same direction from one end to the other end of the conductive pattern. Claims 1, 2,
A conductive sheet on which the conductive pattern according to 3, 4, or 5 is formed. 22. A conductive sheet is provided between the upper wiring pattern and the lower wiring pattern, and the upper and lower wiring patterns are conductively joined.
A conductive sheet on which the conductive pattern described above is formed. 23. A conductive sheet in which a random conductive pattern is formed between an upper wiring pattern and a lower wiring pattern, and the upper and lower wiring patterns are conductively joined. A conductive sheet on which the conductive pattern according to 5 is formed. 24. A conductive sheet provided between a push button and a substrate and having a conductive pattern formed thereon for conducting wiring on the substrate.
A conductive sheet on which the conductive pattern according to claim 4 is formed.