JPH10308642A - Container for surface mounted crystal oscillator - Google Patents

Container for surface mounted crystal oscillator

Info

Publication number
JPH10308642A
JPH10308642A JP13604497A JP13604497A JPH10308642A JP H10308642 A JPH10308642 A JP H10308642A JP 13604497 A JP13604497 A JP 13604497A JP 13604497 A JP13604497 A JP 13604497A JP H10308642 A JPH10308642 A JP H10308642A
Authority
JP
Japan
Prior art keywords
mounting
container
electrodes
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13604497A
Other languages
Japanese (ja)
Inventor
Masaaki Arai
井 政 昭 新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP13604497A priority Critical patent/JPH10308642A/en
Publication of JPH10308642A publication Critical patent/JPH10308642A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce man-hour and cost not only at the time of mounting but also in packing at assembly, inspection and shipping and to prevent defect occurrence caused by a directional error at the time of mounting by respectively commonly connecting the mounting electrode positioned diagonally. SOLUTION: For example, an outside base 11 of the ceramic container is a mounting face for mounting on a printed circuit board and made square, and corresponding to the respective corner parts, four square mounting electrodes 12a-12d are formed. Then, the diagonals of the mounting face, namely, the mounting electrodes 12a and 12c positioned at both the terminal parts of diagonal lines on the mounting face, are connected in common and besides, the mounting electrodes 12b and 12d are connected in common. Then, a crystal oscillator 13 is housed in the container. In this case, the container is sealed by a lid body and the main body of components are protected or the air-tightly sealed container is kept in the atmosphere of vacuum or inactive gas. Thus, proper electric connection is enabled in the case of mounting on the printed circuit board in spite of vertical or horizontal direction.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、方向性を考慮する
ことなく実装を行うことができる表面実装型の水晶振動
子の容器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type crystal resonator container which can be mounted without considering the directionality.

【0002】[0002]

【従来の技術】近時、種々の電子機器等では小型、軽量
化及び組立工程の自動化のために表面実装型の部品を使
用する傾向にある。このため3個以上の実装電極を有す
る複合部品、回路モジュールにおいても表面実装型のも
のが使用される傾向にある。
2. Description of the Related Art In recent years, there has been a tendency to use surface-mounted components in various electronic devices for miniaturization, weight reduction and automation of an assembling process. For this reason, surface mount type components also tend to be used in composite components and circuit modules having three or more mounting electrodes.

【0003】しかしながら、3個以上の実装電極を有す
る電子部品では、設計時のパターン・レイアウト、組立
工程における部品の実装、検査工程、さらに出荷のため
のテーピング等の各工程で部品の方向性を考慮する必要
がある。また、出荷時には実装電極の方向を揃えるよう
に整列させて梱包しなければならない。
However, in the case of an electronic component having three or more mounting electrodes, the directionality of the component is determined in each of the steps such as pattern layout at the time of design, component mounting in an assembly process, inspection process, and taping for shipping. It needs to be considered. Further, at the time of shipment, the packaging electrodes must be packed so that the mounting electrodes are aligned in the same direction.

【0004】このため本来の製品の組立作業に加えて、
製品の実装電極の方向を揃えたり、整列させたりする付
帯作業の増加によってコストも上昇し、電気的、機械的
には何ら問題の無い良品であっても、実装電極の方向が
違っているだけで不良品となってしまう問題もあった。
For this reason, in addition to the original product assembly work,
The cost also rises due to the additional work of aligning and arranging the mounting electrodes of the product, and even if it is a good product that does not have any electrical and mechanical problems, only the mounting electrode direction is different There was also a problem that it became a defective product.

【0005】図3は従来の表面実装型の水晶振動子の実
装面の実装電極の配置の一例を示す底面図である。たと
えば、セラミックの小型容器の底面1に4個の実装電極
2a、2b、2c、2dを形成している。この実装電極
2a〜2dは、たとえば金属薄板を折り曲げて整形した
り、あるいはメタライズ処理によって金属薄膜を成形す
るようにしてもよい。
FIG. 3 is a bottom view showing an example of an arrangement of mounting electrodes on a mounting surface of a conventional surface mount type crystal unit. For example, four mounting electrodes 2a, 2b, 2c, 2d are formed on the bottom surface 1 of a small ceramic container. The mounting electrodes 2a to 2d may be formed by, for example, bending a thin metal plate or forming a thin metal film by metallizing.

【0006】上記小型容器の内部には水晶振動子3を収
納し、その端子を、たとえば図示下側の実装電極2b、
2cに接続している。したがって、このようなものでは
上記実装電極2a〜2dに対応して導電パターンを形成
したプリント基板に実装する場合に方向性を生じ、設計
意図と異なる方向で電極に接続して検査したり、あるい
はプリント基板に実装した場合は電気的な接続がなされ
ないことになる。
A quartz oscillator 3 is housed inside the small container, and its terminals are connected to, for example, the mounting electrodes 2b,
2c. Therefore, in such a case, when mounting on a printed circuit board on which a conductive pattern is formed corresponding to the mounting electrodes 2a to 2d, directivity is generated, and connection to the electrode is performed in a direction different from the design intention for inspection, or When mounted on a printed circuit board, no electrical connection is made.

【0007】[0007]

【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたもので、部品の方向に係わらず電気的に
適正な接続を行うことができる表面実装型の水晶振動子
の容器を提供することを目的とするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and provides a surface-mount type crystal resonator container capable of making an appropriate electrical connection regardless of the direction of components. It is intended to provide.

【0008】[0008]

【課題を解決するための手段】本発明は、矩形の実装面
の各角部に対応して4個の実装電極を配置した表面実装
型の水晶振動子の容器において、対角に位置する実装電
極をそれぞれ共通に接続したことを特徴とするものであ
る。
SUMMARY OF THE INVENTION The present invention relates to a surface-mount type crystal unit in which four mounting electrodes are arranged corresponding to each corner of a rectangular mounting surface. The electrode is connected in common.

【0009】[0009]

【発明の実施の形態】以下、図面に示す実装面の平面図
を参照して、本発明の実施の形態を説明する。図中11
は、たとえばセラミックの容器の外側底面である。この
底面は図示しないプリント基板に実装する実装面であ
り、正方形で各角部に対応して4個の正方形の実装電極
12a、12b、12c、12dを形成している。
Embodiments of the present invention will be described below with reference to plan views of mounting surfaces shown in the drawings. 11 in the figure
Is the outer bottom surface of, for example, a ceramic container. This bottom surface is a mounting surface to be mounted on a printed circuit board (not shown), and has four square mounting electrodes 12a, 12b, 12c, and 12d corresponding to each corner.

【0010】そして、実装面の対角、すなわち実装面の
対角線の両端部に位置する実装電極12a、12cを共
通に接続し、また実装電極12b、12dを共通に接続
している。そして13は容器内に収納した水晶振動子で
ある。なお容器は図示しない蓋体で封止し部品本体を保
護し、あるいは気密に封止して容器内を真空、不活性ガ
スの雰囲気に維持するようにしている。
[0010] The mounting electrodes 12a and 12c located at both ends of a diagonal line of the mounting surface, that is, diagonal lines of the mounting surface are commonly connected, and the mounting electrodes 12b and 12d are commonly connected. Reference numeral 13 denotes a crystal oscillator housed in a container. The container is sealed with a lid (not shown) to protect the component body, or airtightly sealed to maintain the inside of the container in a vacuum and an atmosphere of an inert gas.

【0011】なお、上記実施例の電示部品を実装するプ
リント基板の導電パターンの設計では、部品本体の2個
の端子に対して接続すべき回路を、上記実施例の表面実
装型の電示部品の実装面に配設した4個の端子の隣りあ
う端子に、それぞれ接続しておく必要がある。
In designing the conductive pattern of the printed circuit board on which the electronic component of the above embodiment is mounted, the circuit to be connected to the two terminals of the component body is replaced by the surface mount type electronic component of the above embodiment. It is necessary to connect each of the four terminals arranged on the component mounting surface to adjacent terminals.

【0012】このような構成であれば、プリント基板に
実装する際に上下、左右いずれの方向であっても適正な
電気的接続を行うことができる。また、組立工程、検査
工程、出荷時の梱包の際にも部品の方向に配慮しなくと
も良い。したがって実装電極の方向を揃えたり整列させ
たりする付帯的な作業も不要となり工数の減少によるコ
ストの低減を図ることができる。
With such a configuration, proper electrical connection can be made in any of up, down, left, and right directions when mounting on a printed circuit board. Also, it is not necessary to consider the direction of the parts during the assembling process, the inspection process, and the packing at the time of shipping. Accordingly, it is not necessary to perform an additional operation of aligning and aligning the mounting electrodes, and the cost can be reduced by reducing the number of steps.

【0013】なお本発明は、上述の本発明の実施の形態
に記載したものに限定されるものではなく、たとえば図
3に示すような長方形の実装面の電子部品にも適用する
ことができる。ただし、このように実装面を長方形とし
た場合には上下、または左右の一方の方向についての
み、方向性をもたない構成となる。
The present invention is not limited to the above-described embodiment of the present invention, but can be applied to, for example, an electronic component having a rectangular mounting surface as shown in FIG. However, when the mounting surface is rectangular as described above, the configuration has no directivity only in one of the upper and lower directions or the left and right directions.

【0014】[0014]

【発明の効果】本発明は、以上説明したような形態で実
施され、以下に記載されるような効果を奏する。
The present invention is embodied in the form described above and has the following effects.

【0014】正方形の実装面の場合には上下、左右のい
ずれの方向についても適正な電気的接続を行うことがで
き、また長方形の実装面の場合には上下または左右の一
方について方向に関わらず適正な電気的接続を行うこと
ができる。したがって実装時のみならず組立、検査、出
荷時の梱包等の際に著しく工数を低減することができ、
コストを安価にでき、しかも実装時の方向の誤りによる
不良も発生しない利点がある。
In the case of a square mounting surface, an appropriate electrical connection can be made in any of the up, down, left, and right directions. In the case of a rectangular mounting surface, regardless of the up, down, left, or right direction, regardless of the direction. Appropriate electrical connection can be made. Therefore, man-hours can be significantly reduced not only at the time of mounting but also at the time of assembly, inspection, packing at the time of shipping, etc.
There is an advantage that the cost can be reduced and a defect due to an erroneous mounting direction does not occur.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の表面実装型の水晶振動子の容器の実装
面を示す平面図である。
FIG. 1 is a plan view showing a mounting surface of a container of a surface-mount type crystal unit of the present invention.

【図2】本発明の他の実施例の表面実装型の水晶振動子
の容器の実装面を示す平面図である。
FIG. 2 is a plan view showing a mounting surface of a container of a surface mount type crystal unit according to another embodiment of the present invention.

【図3】従来の表面実装型の水晶振動子の容器の実装面
の一例を示す平面図である。
FIG. 3 is a plan view showing an example of a mounting surface of a container of a conventional surface mount type crystal unit.

【符号の説明】[Explanation of symbols]

11 外側底面(容器) 12a、12b,12c,12d 実装電極 13 部品本体 11 outer bottom surface (container) 12a, 12b, 12c, 12d mounting electrode 13 component body

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】矩形の実装面の各角部に対応して4個の実
装電極を配置し、内部に水晶振動子を収納したものにお
いて、 対角に位置する実装電極をそれぞれ共通に接続したこと
を特徴とする表面実装型の水晶振動子の容器。
1. Four mounting electrodes are arranged corresponding to each corner of a rectangular mounting surface, and a quartz oscillator is housed therein, and mounting electrodes located diagonally are connected in common. A container for a surface-mount type crystal unit, characterized in that:
【請求項2】請求項1に記載のものにおいて、正方形の
実装面の中心に対して4個の実装電極を点対象に配置し
たことを特徴とする表面実装型の水晶振動子の容器。
2. The surface mount type crystal resonator container according to claim 1, wherein four mounting electrodes are arranged symmetrically with respect to the center of the square mounting surface.
JP13604497A 1997-05-08 1997-05-08 Container for surface mounted crystal oscillator Pending JPH10308642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13604497A JPH10308642A (en) 1997-05-08 1997-05-08 Container for surface mounted crystal oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13604497A JPH10308642A (en) 1997-05-08 1997-05-08 Container for surface mounted crystal oscillator

Publications (1)

Publication Number Publication Date
JPH10308642A true JPH10308642A (en) 1998-11-17

Family

ID=15165872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13604497A Pending JPH10308642A (en) 1997-05-08 1997-05-08 Container for surface mounted crystal oscillator

Country Status (1)

Country Link
JP (1) JPH10308642A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132737B2 (en) 2004-01-29 2006-11-07 Seiko Epson Corporation Package for electronic component and method of manufacturing piezoelectric device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132737B2 (en) 2004-01-29 2006-11-07 Seiko Epson Corporation Package for electronic component and method of manufacturing piezoelectric device

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