JPH10303686A - Capacitor built-in piezoelectric resonator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the capacitor built-in piezoelectric resonator of which miniaturization is attained, which is high in connection reliability of a adhered part among the piezoelectric resonance element, a capacitive element and lead terminals and sealing reliability. SOLUTION: In the piezoelectric resonator, a laminate 3 where a paper-tablet piezoelectric resonator 1 and a paper-tablet capacitive element 2 are electrically connected is contained in an outer package case on the bottom side of which three funnel shaped throughholes 51, 61, 71 are made and whose one side face is open, and the opening 41 is sealed by a seal member 8. Then a conductive filling material is placed to cover connection tips 50, 60, 70 of lead terminals 5, 6, 7 into the funnel shaped throughholes 51, 61, 71 made to a bottom side of the case 4, and the lead terminals 5, 6, 7 and connection electrodes 23, 24, 25 of the laminate 3 are connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a surface-mountable piezoelectric resonator with a built-in capacitor.

[0002]

2. Description of the Related Art Conventionally, microcomputers and the like have been frequently used for communication equipment and electronic equipment, and a clock oscillation circuit and the like have been connected to such microcomputers.

In this oscillation circuit, input / output capacitance components C ₁ and C ₂ are connected between both ends of a piezoelectric resonance element R and a ground potential, as in the equivalent circuit shown in FIG. The feedback resistance component R and the inverter I were connected between both ends. In order to easily achieve this oscillation circuit,
The built-in capacitance type piezoelectric resonator has two capacitance components C ₁ ,
It is obtained by constituting the C ₂ and the piezoelectric resonant element R as one electronic component.

A built-in capacitance type piezoelectric resonator is mainly composed of a piezoelectric resonance element having vibration electrodes formed on at least both main surfaces of a piezoelectric substrate and a capacitor element having two capacitance components. They can be broadly classified into two types: surface mount types. However, in view of the current high-density mounting technology on a printed wiring board, a surface mounting type capable of performing reflow soldering together with other electronic components on the printed wiring board has become mainstream.

[0005] In view of the container structure, the surface-mounting-capacitance-incorporated piezoelectric resonator is divided into two types: a type using a split type container formed by joining an upper case and a lower case, and a type using a cap over a cylindrical container. Divided into two.

The relationship between the container and the capacitance element includes a structure in which the capacitance element is independently disposed inside the container, and a structure in which the capacitance component is constituted by a part of the container.

Here, an external terminal is always required on the outer surface of a surface-mounted piezoelectric resonator with a built-in capacitor, and in the case of a structure in which the capacitor is arranged inside a container, the capacitor and the external Connection with terminals is important.

As an example in which a piezoelectric resonance element and a capacitance element are arranged in the above-mentioned split type container, a surface-mounted piezoelectric resonator with a built-in capacitance such as Japanese Utility Model Laid-Open No. 1-77028 can be exemplified.

Further, as an example in which only a piezoelectric resonance element is disposed in a divided container and a capacitance component is formed in a part of the container, a surface-mounted piezoelectric resonator with a built-in capacitor as disclosed in Japanese Utility Model Application Laid-Open No. 62-70453 is exemplified. it can.

As an example in which a piezoelectric resonator is inserted and arranged in a cylindrical container having a capacitance component, a piezoelectric resonator with a built-in surface mount capacitor disclosed in Japanese Utility Model Application Laid-Open No. 2-8026 can be exemplified.

[0011]

In the case of the structure in which the piezoelectric resonance element and the capacitance element are arranged in the above-mentioned split type container, for example, a capacitor element and a piezoelectric resonance element are provided on a plate-like base substrate serving as a lower case. It is necessary to cover the piezoelectric resonance element with a housing-like upper case, and join the upper case to the lower case via a sealing adhesive.

That is, if the shape of the upper case is not made sufficiently large, the upper case and the piezoelectric resonance element may come into contact with each other, or the conductive paste for joining the capacitor element and the piezoelectric element to the lower case may expand the sealing area. In some cases, poor sealing may occur. Therefore, there has been a great restriction on miniaturization as a whole.

When only the piezoelectric resonance element is arranged in the above-mentioned divided container and a capacitive component is provided on the lower case (substrate) side,
The capacitance electrode is formed on the outer surface of the lower case.
As a result, the capacitor electrode was corroded, and the operation reliability was low.

When joining the upper case and the lower case,
As described above, the shape of the upper case needs to be larger than that of the piezoelectric resonance element so that even if the conductive paste for bonding the piezoelectric element and the substrate expands the sealing area, sealing failure does not occur. was there.

In the case of a structure in which a piezoelectric resonance element is arranged inside a cylindrical container having the above-mentioned capacitance component formed thereon, an electrode for forming a capacitance component is provided on the outer surface of the cylindrical container. As a result, the capacitor electrode is corroded, and the operation reliability is low.

In connection between the piezoelectric vibrating element and the terminal electrode, when the two ends are arranged in a cylindrical capacitor and the opening at both ends is covered with a cap, the cap connects the two ends of the piezoelectric vibrating element to each other. The electrical connection with the capacitance component and the opening sealing are performed, so that there are two sealing regions, and the sealing reliability is low.

The present invention has been devised in view of the above-mentioned problems, and has as its object to reduce the size of a piezoelectric vibrating element,
The electrical connection between the capacitive element and the lead terminal is secure,
It is still another object of the present invention to provide a surface-mountable piezoelectric resonator with high sealing reliability that can be mounted on a surface.

[0018]

According to the present invention, three outwardly extending funnel-shaped through holes are formed on the bottom surface, and a housing-like case having one side open and one end side having the funnel-like shape are provided. Three lead terminals fixed to the inner wall slope of the connection through-hole and the other end led out to the outer surface of the housing-like case; and a piezoelectric resonance element in which vibration electrodes are formed on both main surfaces of a rectangular piezoelectric substrate; A conductive bonding member in which two capacitor components are formed and a capacitor element having three connection electrodes formed on one main surface of a strip-shaped dielectric substrate and disposed at both ends of opposing surfaces of each element. And a sealing member that seals an opening of the housing-shaped case, and the stack is disposed inside the housing-shaped case, and each connection electrode of the capacitor element is provided. Fill each lead terminal with each funnel-shaped through hole. As well as connected by conductive connecting member, which is embedded capacitance piezoelectric resonator, characterized in that the fixing portion between the one end tips and the housing-like casing of the lead terminal is coated with the conductive connection member.

[0019]

According to the present invention, the laminated body in which the piezoelectric resonance element and the capacitor element are integrated is inserted into the housing-like case having one side open, so that the vibration space around the piezoelectric resonator is reduced. Can be strictly defined by the shape of the internal space, and as a whole, a small-capacity built-in piezoelectric resonator is obtained.

Further, since the opening of the housing-like case is only on one side, the sealing operation is facilitated, and the sealing reliability is improved. In addition, the opening used for inserting the piezoelectric resonance element and the capacitance element does not involve electrical connection, so that the sealing operation can be facilitated.

Further, the connection between the piezoelectric resonance element, the capacitance element and the lead terminal disposed inside is filled in three connection electrodes formed on the lower surface of the capacitor element and the three funnel-shaped through holes on the bottom surface of the case. This is done by the arranged conductive connection members. Therefore, the connection through the three through holes can be processed in the same step and on the same plane, so that the connection operation is simplified, and the connection structure is also simplified, so that the connection stability is improved.

Since the shape of the through hole is funnel-shaped to spread outward, for example, when the conductive connecting member is filled through a thin tube or the like, the filling can be performed reliably and easily. Since the boundary between the end of the lead terminal and the case, which constitute the inner wall of the funnel-shaped through hole, and the case are covered with the conductive connecting member, the inside of the case and the outside air leak even if the lead terminal peels off. Because there is no
A surface mountable piezoelectric resonator element with improved sealing reliability and excellent moisture resistance is provided.

[0023]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a piezoelectric resonator with a built-in capacitor according to the present invention.

FIG. 1 is an external perspective view of a built-in capacitor type piezoelectric resonator according to the present invention, FIG. 2 is a transverse sectional view, FIG. 3 is a vertical sectional view, and FIG. 4 is an exploded perspective view. .

In the figure, 1 is a piezoelectric resonance element, 2 is a capacitor element, 3 is a laminated body including the piezoelectric resonance element 1, a capacitor element 2, etc., 4 is a housing-like case, and 5 to 7 are leads. Reference numeral 8 denotes a sealing member.

The piezoelectric resonance element 1 includes PT (lead titanate),
Piezoelectric ceramic materials such as PZT (lead zirconate titanate), quartz, lithium tantalate, lithium niobate,
It comprises a strip-shaped piezoelectric substrate 10 made of a single crystal material such as lithium tetra-shearate, and vibrating electrodes 11 and 12. The vibration electrodes 11 and 12 are formed on both main surfaces of the piezoelectric substrate 10 so as to face each other. A vibration electrode 11 extending from the center to one end of the piezoelectric substrate 10 is formed on the upper main surface thereof, and a lead electrode 14 is formed on the other end. A vibrating electrode 12 extending from the center to the other end of the piezoelectric substrate 10 is formed on the lower main surface, and a lead electrode 13 is formed on one end of the piezoelectric substrate 10. And the vibration electrode 11
The piezoelectric substrate 10 is connected to the extraction electrode 13 via a conductor film 17 on one end side of the piezoelectric substrate 10. The vibration electrode 12 is connected to the extraction electrode 14 via the conductor film 18 on the other end side of the piezoelectric substrate 10.
The vibrating electrodes 11 and 12 and the extraction electrodes 13 and 14 are formed of, for example, a thin-film conductor film mainly containing an Ag-based material, and the conductor films 17 and 18 are printed with a conductive paste mainly containing an Ag-based material, for example. , Formed by thermosetting.

The capacitor element 2 is made of PT (lead titanate), PZT (lead zirconate titanate), BaTiO ₃
A strip-shaped dielectric substrate 20 made of a dielectric ceramic material such as (barium titanate) and a plurality of capacitance electrodes for forming two capacitance components are formed. In the figure, two electrodes 21 and 22 are provided on an upper surface side of a dielectric substrate 20.
Is a connection electrode (hereinafter simply referred to as an electrode) 2 for forming a capacitance component on the lower surface side which is one main surface of the dielectric substrate 20 and at the same time achieving connection with the outside (lead terminals 5 to 7).
3, 24 and 25 are formed. The upper electrode 21 and the lower electrode 23 are connected via a conductor film 26 on one end surface of the dielectric substrate 20, and the upper electrode 22 and the lower electrode 25 are electrically connected to each other. It is connected via a conductor film 27 on the other end surface of the body substrate 20. Further, the electrodes 21 and 22 on the upper surface of the dielectric substrate 20 partially face the electrodes 24 on the lower surface of the dielectric substrate 20.

That is, the electrode 24 on the lower surface side of the dielectric substrate 20
When viewed from the center, a predetermined capacitance component is formed between the dielectric substrate 20 and the electrode 21 on the upper surface side via the thickness of the dielectric substrate 20. Further, a predetermined capacitance component is formed between the electrode 23 and the lower surface of the dielectric substrate 20 in the planar direction. capacitance is formed, the first capacitive component both capacitive component is formed (corresponding to C ₁ in FIG. 5). When the electrode 24 on the lower surface side of the dielectric substrate 20 is viewed as a center, a predetermined capacitance component is formed between the electrode 22 on the upper surface side and the thickness of the dielectric substrate 20. predetermined volume between the electrodes 25 on the lower surface direction is formed, and both capacitive component is formed by a second capacitive component (corresponding to the C ₂ in FIG. 5).

The electrodes 21 to 25 are formed by selectively printing and baking a conductive paste mainly composed of Ag or the like, so that the conductive films 26 and 27 are made of an epoxy resin mixed with a conductive material such as Ag. Formed by selective printing of a conductive resin paste made of

The above-described piezoelectric resonance element 1 and capacitor element 2
Means that the conductive bonding members 15 and 16 interposed in the vicinity of both ends of both substrates are electrically connected and mechanically bonded to each other with a predetermined gap therebetween to form the laminate 3 Have been. The conductive bonding member 15 allows, for example, the vibration electrode 11 of the piezoelectric resonance element 1 to move away from the piezoelectric substrate 10.
The extraction electrode 13 extending to the main surface on the lower surface side of the piezoelectric element 1 and the electrode 21 on the upper surface side of the dielectric substrate 20 of the capacitor element 2 are electrically connected to each other. The vibrating electrode 12 is electrically connected to the electrode 22 on the upper main surface of the dielectric substrate 20 of the capacitor element 2. The conductive bonding members 15 and 16 may be conductive adhesive sheets in a temporarily cured state, or may be members to which a conductive resin paste has been applied and cured.

The above-mentioned conductor films 17, 18, 26, 27
In practice, after the piezoelectric resonance element 1 and the capacitor element 2 are stacked, they are collectively formed on the end face of the multilayer body 3.

After the piezoelectric resonance element 1 and the capacitor element 2 are stacked, the laminate 3 is housed and arranged in a housing-like case 4 having an open side.

The housing case 4 is made of a resin material having excellent heat resistance, such as a liquid crystal polymer, and has a laminated body storage area (internal space) 40 formed therein. Is formed. The inner periphery of the opening 41 is a tapered surface 42 that spreads outward. The tapered opening 41 allows the stack 3 composed of the piezoelectric resonance element 1 and the capacitor element 2 to be stored and arranged smoothly.

On the bottom surface of the case 4, three lead terminals 5, 6, 7 made of a metal member made of nickel silver, phosphor bronze, or the like are integrally formed by fixing. Connection tips 50, 6 which are one ends of the lead terminals 5, 6, 7
Reference numerals 0 and 70 constitute part or all of the inner wall portions of the funnel-shaped through holes 51, 61 and 71, which penetrate the thickness of the bottom surface of the housing-like case 4 and extend outward. In the figure, the connection tip portions 50, 60, 70 extend to a part of the inner wall of the through holes 51, 61, 71, and a part of the inner wall on the outer side of the through holes 51, 61, 71 is formed. Make up. The other ends of the lead terminals 5, 6, and 7 are divided into two directions on the bottom surface of the case 4, and are led out to both side surfaces of the case via the bottom surface of the case 4.

The lead terminals 5, 6, 7 and the funnel-shaped through holes 51, 61, 71 are formed by insert molding of a resin when forming the case 4. That is, in a state where a metal hoop material of a predetermined shape to be the lead terminals 5, 6, 7 is sandwiched between the inner die and the outer die having the projections for determining the formation of the through holes, the resin of the case 4 is held. Insert material
It is formed by curing and releasing both molds.

The internal space 40 of the case 4 has a shape that is slightly larger than the outer dimensions of the laminate 3 substantially, and the interval due to the difference in the shape ensures the resonance operation of the piezoelectric resonance element 1. It is a gap for That is, the upper surface of the piezoelectric substrate 10 of the piezoelectric resonator element 1, a predetermined distance D ₁ is formed, a predetermined distance D ₂ is formed on a side surface side of the longitudinal direction, on the lower surface side of the piezoelectric substrate 10, a conductive Sex bonding member 15,
A gap corresponding to a thickness of 16 is formed.

A predetermined distance D ₃ is formed between the lower surface of the dielectric substrate 20 and a bottom surface inside the case 4 (hereinafter referred to as an inner bottom surface). Each of the gaps D ₁ , D ₂ , D ₄ is formed by protrusions 43, 44, 45 protruding into the internal space 40.

As described above, the three lead terminals 5, 6, 7 are integrally formed on the bottom surface of the case 4. A connection tip 50 which is a part of the lead terminals 5, 6, 7;
Funnel-shaped through holes 51, 61, 71 penetrating through the thickness of the bottom surface of the case 4 are formed in 60, 70. Then, the connection tips 50, 60, 70 of the lead terminals 5, 6, 7 are
A part of the inner wall of the through holes 51, 61, 71 on the outer side is formed. In addition, from the openings of the through holes 51, 61, 71 on the bottom surface of the case 4, the electrodes 2 located on the lower surface side of the capacitor element 2 constituting the multilayer body 3 housed and arranged inside the case 4.
3, 24, and 25, respectively.

In the through holes 51, 61, and 71, a conductive resin paste obtained by mixing a conductive metal powder such as Ag with an epoxy adhesive is supplied and cured.
2, 62 and 72 are arranged. The through holes 51, 61, 71 are hermetically sealed by the conductive connection members 52, 62, 72, and the laminate 3 in the case 4 is fixed.

The conductive connecting members 52, 62, 72
Is filled so as to reach the connection tips 50, 60, 70 of the electrodes 23, 24, 25 on the lower surface of the capacitor element 2 and the lead terminals 5, 6, 7 in the through holes 51, 61, 71. Thus, electrical connection between the electrode 23 and the lead terminal 5, between the electrode 24 and the lead terminal 6, and between the electrode 25 and the lead terminal 7 can be achieved.

That is, the first lead terminal 5 is connected to the electrode (connection electrode) 23 formed on the lower surface side main surface of the capacitor element 2.
To the electrode 21 via the electrode 23 and the conductor film 26, and further, the conductive bonding member 15, the extraction electrode 13,
14. Connected to the vibrating electrode 11 via the conductor film 17.

The second lead terminal 6 is connected to an electrode (connection electrode) 24 formed on the main surface on the lower surface side of the capacitor element 2.
Connect to

Further, the third lead terminal 7 is connected to an electrode (connection electrode) 2 formed on the lower main surface of the capacitor element 2.
5 through the electrode 25 and the conductor film 27.
And further connected to the vibration electrode 12 via the conductive bonding member 16.

Therefore, as shown in the equivalent circuit of FIG. 5, the first lead terminal 5 is connected to the vibrating electrode 11 of the piezoelectric resonance element 1 (R) and, at the same time, one of the two capacitance components C ₁ operates as a terminal to connect
Lead terminal 6 operates as a terminal for grounding two capacitance components, and a third lead terminal 7 is connected to the vibration electrode 12 of the piezoelectric resonance element 1 (R) and It operates as a terminal for connecting the other capacitive component C ₂ of the capacitance component.

The opening 41 of the case 4 is hermetically sealed by the sealing member 8. The sealing member 8 has a thickness of 20 to
A sealing plate 82 made of a stainless steel plate or a resin sheet plate having a thickness of about 100 μm and sealing the opening 41 of the case 4, and an external sealing resin member 83 filled and cured on the outside of the sealing plate 82. It is configured. Note that the inner sealing resin member 81 is inserted into the gap around the inner surface of the laminate 3 and the case 4 so as not to enter the internal space 40 through the gap between the outer sealing resin member 83 or the sealing plate 82 and the case 4. It may be filled.

Since the above structure mainly comprises the housing-like case 4 having one side open, the laminated body 3 in which the piezoelectric resonance element 1 and the capacitor element 2 are integrated, and the sealing member 8, The number of parts is small and the manufacturing process is simplified.

The piezoelectric resonance element 1 and the capacitor element 2
Is achieved before the housing 4 is placed in the case 4, so that the connection between the piezoelectric resonance element 1 and the capacitor element 2, that is, the connection processing by the conductive bonding members 15 and 16,
The lamination processing of both elements can be performed very reliably.

Further, the internal space 40 of the case 4 in which the laminated body 3 is housed and arranged is spaced from the shape of the laminated body 3 such that a vibration space is secured on the four longitudinal surfaces of the piezoelectric resonance element 1. Can be set to very small case 4.
As a whole, a very small-capacity built-in piezoelectric resonator is obtained.

Further, since the opening 41 for accommodating the laminated body 3 in the case 4 is formed only on one side, the sealing operation by the sealing member 8 is simplified, and reliable sealing is achieved. Will be.

Further, since the laminate 2 composed entirely of the piezoelectric resonance element 1 and the capacitor element 2 is housed inside the case 4, the vibration electrodes 11 and 12 of the piezoelectric resonance element 1 and the respective electrodes 21 to 21 of the capacitor element are provided. 25 and stable characteristics can be maintained for a long period of time.

In particular, three lead terminals 5, 6, 7 are integrally formed on the bottom surface of the case 4, and the electrical connection between the lead terminals 5, 6, 7 and the capacitor element 2 is determined by the connection of the lead terminals. This is achieved by the through holes 51, 61, 71 formed in the connection tips 50, 60, 70, and the conductive connection members 52, 62, 72 filled therein.
Stable electrical connection between the laminate 3 and the lead terminals 5, 6, 7 can be achieved.

The connection structure between the lead terminals 5, 6, 7 and the electrodes 23, 24, 25 formed on the bottom surface of the capacitor element 2 will be described in detail with reference to FIG. In addition, lead terminal 5,
Since the connection structures of 6 and 7 are the same, only the connection structure of the lead terminal 6 will be described here.

First, the piezoelectric resonance element 1 and the capacitor element 2
Is laminated and integrated into the case 4. At this time, the capacitor element 2 of the multilayer body 3 is arranged so as to be on the bottom side of the case 4. After that, the case 4 is inverted so that the openings of the through holes 51, 61, 71 formed on the bottom surface of the case 4 are on the upper surface side. FIG. 6A is an enlarged cross-sectional view of the funnel-shaped through hole 61 in this state.
In the figure, S is a connection tip 60 of the lead terminal 6,
This is a slope that forms an inner wall on the opening surface side of the funnel-shaped through holes 51, 61, and 71.

Next, a thin tube 63 serving as a supply means of the conductive filling member 62 'is inserted into the funnel-shaped through hole 61. The outer diameter of the thin tube 63 is smaller than the opening diameter on the outer surface side of the funnel-shaped through-hole 61 and larger than the inner opening diameter of the funnel-shaped through-hole 61. Preferably, the tip of the thin tube 63 is
It is to be brought into contact with the inclined surface S of the connection distal end portion 60 of the lead terminal 6 extending halfway through the inner wall surface of the funnel-shaped through hole 61.

Thereafter, the through-hole 61 is passed through the thin tube 63.
The inside is filled with a conductive connection member 62 ′ of a resin paste mixed with a conductive material such as Ag. This state is shown in FIG.
It is.

As shown in FIG. 6 (b), the tip of the thin tube 63 comes into contact with the inclined surface S of the connection tip 60 of the lead terminal 6, and the conductive connection member 62 'is supplied. The position where the member 62 'is to be supplied can be accurately positioned,
The conductive resin member 62 ′ is reliably guided to the electrode 24 formed on the lower surface of the capacitor element 2. In addition, the material of the case 4 of the funnel-shaped through-hole 61 is attached to the inner inner wall surface where the material of the funnel-shaped through-hole 61 is exposed and the slope S of the lead terminal 6 which becomes the outer inner wall surface of the funnel-shaped through-hole 61.

Moreover, even if an excessive amount of the conductive filling member 62 ′ is filled from a thin tube, the conductive filling member 62 ′ rises from the external opening of the through hole 61 and does not overflow to the outside of the case 4. This is because when connecting the surface mount type piezoelectric resonator to the printed wiring board via solder, the surface of the lead terminal to which the solder adheres is not stained by the conductive connection member to which the solder is not attached. Thereby, stable surface mounting becomes possible.

Thereafter, the thin tube 63 is separated from the case 4, and the filled and arranged conductive filling member 62 ′ is cured to form the conductive filling member 62.

What is important here is that the connection tip 60 of the lead terminal 6 does not reach the inner opening of the funnel-shaped through hole 61, and the connection tip 60 is connected to the funnel-shaped through hole 6
The conductive connection member 62 extends only partway along the inner wall of the case 1, and furthermore, the fixed portion between the end of the connection end 60 of the lead terminal 6 and the case 4.

The lead terminals 6 are fixed by insert molding of resin when the case 4 is formed. This fixed portion is formed between the lead terminal 6 and the case 4 by thermal shock during reflow processing for surface mounting. The bonding strength at the interface may decrease. In an extreme case, the interface may be peeled off and a minute gap may be formed.

However, the tip of the connection tip 60 of the lead terminal 6 does not reach the inside of the case 4, and the fixed portion between the tip of the connection tip 60 of the lead terminal 6 and the case 4 is a conductive connecting member. Since it is covered with 62, even if separation occurs at the interface between the case 4 and the lead terminal 6, the outside air on the bottom side of the case 4 does not communicate with the inside of the case 4 at all.

Therefore, the sealing state at the funnel-shaped through-hole 61 does not deteriorate at all during the long-term use as well as at the time of filling, and the sealing reliability is greatly improved. Become.

FIG. 7 shows that the connection end portions 50, 60, 70 of the three lead terminals 5, 6, 7 have funnel-shaped through holes 51, 6, respectively.
In the case where the entire inner wall portions 1 and 71 are configured, that is, the connection portions in the state where the connection tip portions 50, 60 and 70 of the lead terminals 5, 6 and 7 reach the inside of the case 4. It is sectional drawing. Note that only the connection tip 60 of the lead terminal 6 will be described.

In this case, the conductive connection member filled and supplied into the through-hole 61 up to the boundary Z of the fixed portion between the case 4 and the tip of the connection tip 60 exposed on the inner bottom surface of the case 4. 62 are coated. That is, in the step of subjecting filled with the conductive connecting member 62 in FIG. 6 (b) ', the gap D ₄
This boundary Z in (the gap between the laminate 3 and the inner bottom surface of the case 4)
Is supplied in a sufficient quantity to reach. Thereby, the inner bottom surface of the case 4 and the connection tip 60
The conductive connecting member 62 'is also attached to the tip of the substrate and is cured.

Therefore, when the lead terminals 6 are subjected to surface mounting reflow treatment, the thermal shock reduces the bonding strength at the interface between the lead terminals 6 and the case 4, causing peeling and causing a gap in the bonding surface of the lead terminals 6. Is formed, the inside of the case 4 can be shut off from the outside air by the conductive connecting member 62 which has adhered to the inner bottom surface of the case 4 and has been hardened, and the airtightness of the inside of the case 4 can be maintained.

[0066]

According to the present invention, since a laminated body of a piezoelectric resonance element and a capacitor element is inserted and arranged in a housing-like case having one side opened, a small-sized built-in capacitance type piezoelectric resonance In addition, since the housing-shaped case has only one side surface, the sealing operation is facilitated and the sealing reliability is improved.

Further, since the connection between the connection electrode on the lower surface of the capacitor element and the lead terminal is made through a funnel-shaped through hole formed on the bottom surface of the case, the connection is performed in the same step and in the same plane. The connection structure can be simplified, and the connection stability is improved.

Further, since the conductive connecting member covers the boundary between the case and the end of the connection end of the lead terminal, even if it is peeled off by a thermal shock or the like at the fixed interface between the lead terminal and the case, Since the inside and the outside air do not leak, the reliability of sealing is improved, and the surface-mountable piezoelectric resonator element with excellent moisture resistance is provided.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a built-in capacitance type piezoelectric resonance element of the present invention.

FIG. 2 is a longitudinal sectional view of the built-in capacitive piezoelectric resonance element of the present invention.

FIG. 3 is a cross-sectional view of the built-in capacitive piezoelectric resonance element of the present invention.

FIG. 4 is an exploded perspective view of the built-in capacitance type piezoelectric resonance element of the present invention.

FIG. 5 is an equivalent circuit diagram of the built-in capacitance type piezoelectric resonance element of the present invention.

6 (a) to 6 (c) are cross-sectional structural views of a connection portion between a laminated body of the present invention and a lead terminal.

FIG. 7 is a sectional structural view of another connection portion of the present invention.

[Explanation of symbols]

 1 piezoelectric resonator element 10 piezoelectric substrate 11, 12 vibrating electrode 2 capacitor element 20 dielectric substrate 21 26 ... electrode 3 ... laminate 4 ... case 5-7 ... lead terminal 51,61,71 ... through hole 52,62,72 ... conductive Sex connection member

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hidehiko Nishimura 1-1-1, Yamashita-cho, Kokubu-shi, Kagoshima Kyocera Corporation Inside Kagoshima Kokubu Plant (72) Inventor Eizo Otsuka 1-1, Yamashita-cho, Kokubu-shi, Kagoshima Kyocera Corporation Kagoshima Kokubu Plant

Claims (1)

[Claims] 1. A funnel-shaped case having three funnel-shaped through holes formed on the bottom surface and having one side open, and one end side is fixed to an inner wall slope of the funnel-shaped connection through hole. Three lead terminals, the other ends of which are led out to the outer surface of the housing-like case, a piezoelectric resonator element having vibration electrodes formed on both main surfaces of a strip-shaped piezoelectric substrate, and two strips forming two capacitive components A capacitor element in which three connection electrodes are formed on one main surface of a dielectric substrate in the shape of a capacitor, and a laminated body electrically connected via conductive joining members disposed at both ends of opposing surfaces of each element. A sealing member that seals an opening of the housing-shaped case, wherein the stacked body is disposed inside the housing-shaped case, and each connection electrode and each lead terminal of the capacitor element is penetrated in a funnel shape. When connecting with the conductive connecting member filled in the hole Moni, embedded capacitance piezoelectric resonator, characterized in that the fixing portion between the one end tips and the housing-like casing of the lead terminal is coated with the conductive connection member.