JPH10303481A - Bonding method for solid laser oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise the output as compared with a conventional bonding method. SOLUTION: A laser diode 23, a solid laser oscillator 26 fitted with a reflecting surface, and an output mirror 28 are bonded to a substrate 2. To begin with, the laser diode 23 is fixed to the substrate 2, and the light radiated by the light emission of the laser diode 23 is measured with a measuring device 18, and the measuring device is positioned in the position where the maximum output is obtained. Next, in the condition that the laser diode 23 emits light, the output of the light having passed a solid laser oscillating element 26 fitted with a reflecting face is measured with the measuring device 18, and the element 26 is fixed in the position where the maximum output is obtained. Furthermore, the laser diode 23 is made to emit light to excite the element 26, and resonate light between the reflecting face and an output mirror 28. Then, the output of the laser beam of the element 26 having passed the output mirror 28 is measured with the measuring device 18, and the output mirror is fixed in the position where the maximum output is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state laser oscillator bonding method.

[0002]

2. Description of the Related Art Heretofore, there has been known a solid-state laser in which a laser diode, a reflecting mirror, a solid-state laser oscillation element, and an output mirror are arranged in this order. Although the laser diode itself can emit laser light, in the case of the solid-state laser oscillator having the above configuration, the laser light of the laser diode excites the solid-state laser oscillation element and emits laser light from the solid-state laser oscillation element. Used to make it. The laser light of the laser diode and the laser light of the solid-state laser oscillation element have different wavelengths, and the reflecting mirror disposed between the laser diode and the solid-state laser oscillation element has the laser light of the laser diode that emits most of the light. Although the laser beam is transmitted, most of the laser light of the solid-state laser oscillation element is reflected, so that the solid-state laser oscillation element is efficiently excited by the laser light of the laser diode transmitted through the reflecting mirror, and The laser light of the solid-state laser oscillator is resonated by the reflecting mirror and the output mirror.

When a laser diode is used alone, the following method is used to fix the laser diode to a substrate. First, the laser diode is energized to emit light while the laser diode is temporarily movably placed on the fixed substrate. Then, the optical axis of the laser beam is measured by a measuring instrument, and based on the measurement result, the laser diode is adjusted in position so that the optical axis coincides with a preset reference axis. Fixed (Japanese Patent Publication No. 7-46747, Japanese Patent Publication No.
-105575). As another method, the laser diode is fixed at a predetermined position, and while the substrate is movably supported, the laser diode is energized to emit light, and a light emitting point is measured by a measuring instrument in that state. There is also a method of adjusting the position of the substrate so that the reference point of the substrate matches the measured light emitting point, and then fixing the laser diode to the substrate (JP-A-8-18164).

In each of the above-described methods, the laser diode is used alone, that is, the laser light of the laser diode is used as it is. Therefore, the optical axis of the laser light emitted from the laser diode is used. Orientation is important. On the other hand, in addition to the laser diode, in a solid-state laser oscillator in which a reflecting mirror, a solid-state laser oscillator, and an output mirror are arranged in that order, the laser diode is excluded or the laser diode, the reflecting mirror and the solid-state laser oscillator, In addition, the output mirror and the camera were mounted on the board while checking the position using only the camera.

[0005]

However, in mounting under position confirmation by a camera, even if the components such as the solid-state laser oscillation element and the output mirror can be accurately fixed at a predetermined position on the substrate, Since there is a slight variation in the optical axis of each component, it is difficult to accurately arrange the optical axes of all the components, and the efficiency of the solid-state laser oscillator is reduced. The present invention has been made in view of such circumstances, and provides a bonding method of a solid-state laser oscillator capable of easily and accurately arranging the optical axes of the solid-state laser oscillation element and the output mirror to improve the output. .

[0006]

That is, according to the present invention, a laser diode mounting step of fixing a laser diode on a substrate is performed to fix the laser diode at a predetermined position on the substrate and cause the laser diode to emit light. The light emitted from the laser diode was measured by a measuring device, and the measuring device was positioned by moving the measuring device to a position where the maximum output was obtained or a position where the reference position of the measuring device coincided with the optical axis of the light. Thereafter, a solid-state laser oscillation element mounting step of fixing the solid-state laser oscillation element with a reflection surface is executed, and after fixing the solid-state laser oscillation element with a reflection surface at a predetermined position on the substrate, an output mirror is further fixed. An output mirror mounting step is performed, and in the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element with the reflection surface, and Measuring the laser beam output from the measuring device, and moving the output mirror to a position where the maximum output is obtained or a position where the optical axis of the laser beam matches the reference position of the measuring device based on the measurement result. It is characterized by being fixed on the substrate. In the solid-state laser oscillation device mounting step, the laser diode fixed on the substrate emits light to measure light passing through the solid-state laser oscillation device with a reflection surface or light emitted from the solid-state laser oscillation device with a reflection surface. , And based on the measurement result, the solid-state laser oscillation device with the reflection surface is moved to a position where the maximum output is obtained or a position where the optical axis of light coincides with the reference position of the measurement device, and fixed to the substrate. Like that.

The above-mentioned invention uses a solid-state laser oscillation element with a reflecting surface. In another invention in which a reflecting mirror and a solid-state laser oscillation element are separate bodies, a laser in which a laser diode is fixed on a substrate is provided. A diode mounting process is performed to fix the laser diode at a predetermined position on the substrate, emit light from the laser diode, and measure light emitted from the laser diode using a measuring device. After moving the obtained position or the reference position of the measuring device to a position coinciding with the optical axis of the light and positioning the same, then, a reflector mounting step of fixing a reflector and a solid-state laser for fixing a solid-state laser oscillation element Performing an oscillation element mounting step, fixing the reflecting mirror and the solid-state laser oscillation element at predetermined positions on the substrate, and further fixing the output mirror. In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element, and the laser beam output from the output mirror is measured by a measuring device, and the output is determined based on the measurement result. The mirror is moved to a position where the maximum output is obtained or a position where the optical axis of the laser beam coincides with a reference position provided in the measuring device, and is fixed to the substrate.
In at least one of the reflecting mirror mounting step and the solid-state laser oscillating element mounting step, the laser diode emits light, and the light or solid passing through the reflecting mirror or the solid-state laser oscillating element is emitted. The light radiated from the laser oscillation element is measured by a measuring device, and the position or the optical axis of the light at which the maximum output is obtained for at least one of the reflecting mirror and the solid-state laser oscillation element is determined based on the measurement result. Is moved to a position corresponding to the reference position provided in and fixed.

[0008]

According to the former invention, first, in the laser diode mounting step, the laser diode emits light and the light emitted from the laser diode is measured by the measuring device. At this time, the measurement device is positioned by moving to a position where the maximum output is obtained or a reference position provided in the measurement device coincides with the optical axis of the light. In this state, the measuring device is positioned and stopped on the optical axis of the light of the laser diode. Next, in a solid-state laser diode mounting step, the laser diode fixed on the substrate emits light. At this time, the light passing through the solid-state laser oscillator with a reflective surface is measured by a measuring device, and the solid-state laser oscillator with a reflective surface is positioned at the position where the maximum output is obtained or the optical axis of the light at the reference position of the measuring device. It is moved to the corresponding position and fixed to the substrate. In this state, the solid-state laser oscillation element with the reflecting surface is positioned and fixed on the optical axis connecting the laser diode and the measuring device. Next, when the solid-state laser oscillation device with the reflection surface is fixed, in the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation device. In this state, the light of the solid-state laser oscillation element with the reflection surface comes to resonate between the reflection surface and the output mirror, and the laser light of the solid-state laser oscillation element passing through the output mirror is measured by the measurement device,
The output mirror is moved to a position where the maximum output is obtained or a position where the optical axis of the laser beam coincides with a reference position provided in the measuring device, and is fixed to the substrate. In this state, the solid-state laser oscillator with the reflecting surface and the output mirror are positioned on the optical axis connecting the laser diode and the measuring device, and therefore the optical axis of the laser diode and the light of the solid-state laser oscillator are The shaft and the optical axis of the output mirror can be easily and accurately arranged, thereby improving the output of the laser light as compared with the conventional bonding method.

Also, in the latter invention in which the reflecting mirror and the solid-state laser oscillation element are separate bodies, first, in the laser diode mounting step, the laser diode emits light and the light radiated from the laser diode is measured by the measuring device. Is measured by At this time, the measurement device is positioned by moving to a position where the maximum output is obtained or a reference position provided in the measurement device coincides with the optical axis of the light. In this state, the measuring device is positioned on the optical axis of the light of the laser diode. Next, one of the reflecting mirror mounting step and the solid-state laser oscillation element mounting step is performed first,
The other step is performed later. Then, in the reflector mounting step, the laser diode fixed to the substrate emits light, and light passing through the reflector is measured by a measuring device,
The reflecting mirror is moved to a position where the maximum output is obtained or a position where the optical axis of light coincides with the reference position of the measuring device, and is fixed to the substrate. Further, in the solid-state laser oscillation element mounting step, a laser diode fixed to the substrate emits light, and light passing through or emitted from the solid-state laser oscillation element is measured by a measuring device. The oscillation element is moved to a position where the maximum output is obtained or a position where the optical axis of the light coincides with the reference position of the measuring device, and is fixed to the substrate. At the time point when the reflector mounting step and the solid-state laser oscillation element mounting step are completed, at least one of the reflection mirror and the solid-state laser oscillation element is positioned and fixed on the optical axis connecting the laser diode and the measuring device. ing. Subsequent work is the same as the work of the former invention described above, and when the output mirror mounting step is completed, at least one of the reflecting mirror and the solid-state laser oscillation element is provided on the optical axis connecting the laser diode and the output mirror. On the other hand, the output mirror is positioned and fixed. Therefore,
The optical axis of the laser diode, the optical axis of the reflecting mirror, and the optical axis of at least one of the solid-state laser oscillator and the optical axis of the output mirror can be easily and accurately arranged. The output of laser light can be improved as compared with the bonding method.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiment. In FIG. 1, reference numeral 1 denotes a bonding apparatus for bonding a rectangular solid-state laser oscillator having a side of about 2 to 3 mm. The bonding apparatus 1 includes a conventionally well-known XY table 3 on which a substrate 2 is placed and which can move in an X direction and a Y direction orthogonal to each other on a horizontal plane. A conventionally well-known bonding tool 4 for holding each component such as a solid-state laser oscillation element in a horizontal state by suction is provided above. On the upper surface of the XY table 3, a raised mounting table 5 on which the substrate 2 is mounted
And a plurality of trays 6 each on which a component separated for each type is placed, and an adhesive tank 7 in which an ultraviolet curable resin is stored. By appropriately moving in the X direction and the Y direction by the direction motor 9, the mounting table 5, the tray 6, and the bonding tank 7 can be appropriately positioned directly below the suction head 4 </ b> A of the bonding tool 4. Has become.

The bonding tool 4 is provided on an elevating mechanism 11 provided on a frame (not shown), and is moved up and down in the vertical Z direction by the elevating mechanism 11. The elevating mechanism 11 is controlled by a controller 12, and the controller 12 can raise and lower the bonding tool 4 via the elevating mechanism 11. The suction head 4A of the bonding tool 4 is rotated about a vertical Z-axis by a Z-axis rotation servomotor 13, and when the Z-axis rotation servomotor 13 is activated. The suction head 4A can be rotated in the forward and reverse directions in the horizontal plane to adjust the rotational angle position in the horizontal plane of the component held by suction at the lower end thereof. Further, the suction head 4A is connected to another servomotor 1 for Y-axis rotation.
4, the Y-axis rotation servomotor 14 is rotated about the Y-axis in the Y-direction.
When is rotated, the suction head 4A can be swung about the Y axis.

At a predetermined position above the XY table 3, a first camera 16 directed downward in the vertical direction is arranged and fixed integrally to the bonding tool 4. The first camera 16 can take an image of the mounting state of the substrate 2 on the mounting table 5 when the XY table 3 is moved and the substrate 2 on the mounting table 5 comes directly below. The captured image of the substrate 2 is input to the control device 12. The second camera 17 is mounted at a predetermined position on the upper surface of the XY table 3 so as to face upward in the vertical direction. The second camera 17 moves the XY table 3 to move the suction head 4 </ b> A of the bonding tool 4.
When it is moved to a position immediately below the head and stopped, the holding state of the component by the suction head 4A is photographed, and the image of the photographed component is input to the control device 12. .

[0013] The control device 12 determines, based on the image input from the first camera 16, the X- and Y-directions of the board 2 on which the board 2 is actually placed with respect to the reference position where the board 2 should be placed. The shift amount and the shift amount in the rotation direction in the horizontal plane are determined. On the other hand, the control device 12
From the image input from the second camera 17, the suction head 4
The amount of deviation of the component adsorbed on A from the reference rotation angle position in the original horizontal plane can be determined. Then, when the above-mentioned respective deviation amounts are obtained, the control device 12 rotates the X-direction motor 8 and the Y-direction motor 9 by the deviation between the X direction and the Y direction of the substrate 2 based on the deviation amounts. Substrate 2
Is corrected, and the Z-axis rotation servomotor 13 is rotated by the amount of displacement of the substrate 2 in the rotational direction and the amount of displacement of the component to correct the rotational angle position of the component in the horizontal plane. The part can be positioned at the position.

Further, at a predetermined position of the XY table 3, a measuring device 18 capable of measuring light intensity is integrally mounted. In the present embodiment, a photodiode having four light receiving members (not shown) of the same shape symmetrically arranged on the same plane is used as the measuring device 18, thereby not only the light intensity but also the light intensity The optical axis can also be measured. That is, the optical axis of the light can be obtained from the ratio of the measured value measured by each light receiving member. Note that the measuring device 18 is not limited to the photodiode, and a thermopile or a pyroelectric head can be used. When measuring only the output, the measuring device 18 has at least four light receiving members. It may be composed of two light receiving members. The measuring device 18 is provided with a YZ provided to be relatively movable in the Y direction and the Z direction with respect to the XY table 3.
The Y-Z direction moving table 19 is appropriately moved by a Y-direction servomotor 20 and a Z-direction servomotor 21 to provide a Y-direction moving table.
The light intensity can be measured at various positions in the direction and the Z direction.
Is entered.

The control device 12 includes a YZ-direction moving table 1.
9, a measurement value input from the measuring device 18 is stored in association with the movement amount of the servomotor 20 and the Y-direction servomotor 20 and the Z-direction servomotor 21 based on the measurement result.
Is rotated so that the measuring device 18 is moved to the position where the maximum output is obtained in the total value obtained by summing the measured values of the respective light receiving members or the position where the measured values of the respective light receiving members are the same at the same time. Has become. As a result, when the measured values of the respective light receiving members become the same, the optical axis of the light is at the center position of the respective light receiving members, and this center position is the reference position of the optical axis. It should be noted that the optical axis almost coincides with the reference position even when the maximum output is obtained. When measuring the optical axis, the measurement values measured by the light receiving members do not necessarily have to be the same, and the ratio for each light receiving member is set in advance, and the measurement ratio for each light receiving member is set to the set ratio. The measurement device can be moved on the optical axis of the laser diode by the coincidence with. On this occasion,
The optical axis of the light is at a position decentered from the center position of each light receiving member, and this position is a reference position of the optical axis.

Next, the bonding method of the solid-state laser oscillator by the above-described bonding apparatus 1 will be described with reference to NO. 1 will be described in detail. LD in the table
Is a laser diode, the element is a solid-state laser oscillation element with a reflection surface, and the output mirror is an output mirror. First, the substrate 2 is supplied prior to bonding. As the substrate 2, a silicon substrate is generally used, but a glass substrate or a ceramic substrate may be used. In this substrate supply step, the substrate 2 is supplied from a supply device (not shown) onto the mounting table 5 of the XY table 3. The mounted state of the supplied substrate 2 is photographed by the first camera 16, and how much the substrate 2 is displaced from the reference position on the mounting table 5 is stored by the control device 12. You.

After the above substrate supply step is completed, a laser diode mounting step is performed next. In this laser diode mounting step, the XY table 3 is moved to move the tray 6 on which a predetermined laser diode 23 is placed just below the bonding tool 4, and in this state, the bonding tool 4 is lowered and the suction head is moved. 4A holds the laser diode 23 by suction. When the bonding tool 4 is lifted, the second camera 17 is moved directly below the suction head 4A by the movement of the XY table 3, and
The holding state of the laser diode 23 is photographed by the second camera 17, and the controller 12 stores how much the laser diode 23 is attracted from the reference rotation angle position in the horizontal plane. When the photographing by the second camera 17 is completed, the XY table 3 is moved to move the bonding tank 7 to a position directly below the suction head 4A. UV curable resin 24 on the end face
Is applied.

When the ultraviolet curable resin 24 is applied to the lower end surface of the laser diode 23, the XY table 3 is moved, and the substrate 2 is positioned immediately below the laser diode 23. At this time, as described above, the control device 12
The displacement of the XY table 3 and the rotation angle position of the laser diode 23 in the horizontal plane are corrected in consideration of the deviation amount of the laser diode 23 and the deviation amount of the laser diode 23, and the laser diode 23 is accurately positioned at a predetermined position with respect to the substrate 2. Position. When the laser diode 23 is positioned at a predetermined position with respect to the substrate 2 in this manner, the bonding tool 4 is lowered to a predetermined height position to bond the laser diode 23 coated with the ultraviolet curing resin 24. The surface is brought into contact with the substrate 2. Then, in this state, ultraviolet rays are irradiated from an ultraviolet irradiation device (not shown) to cure the ultraviolet curable resin 24, thereby fixing the laser diode 23 at that position. After the ultraviolet curing resin 24 is cured and the laser diode 23 is fixed to the substrate 2, the suction of the laser diode 23 by the suction head 4A is released, and the bonding tool 4 is raised. This completes the fixing of the laser diode.

After the fixing of the laser diode is completed, each terminal (not shown) of the fixed laser diode is connected to a printed wiring previously printed on the back side of the substrate 2 via a lead wire 25. . Each terminal of the laser diode 23 and the printed wiring are connected to the lead 2
In order to make the connection at 5, a known connection device (not shown) can be used. Then, when each terminal of the laser diode 23 is connected to the printed wiring via the lead wire 25, the laser diode 2 is connected via the printed wiring.
3, when the laser diode 23 emits light, the Y-direction servomotor 20 is started and the Y-direction servomotor 20 is activated.
The light output is measured by the measuring device 18 while the -Z moving table 19 and thus the measuring device 18 are reciprocated a small amount in the Y direction with respect to the laser diode 23. The control device 12 stores the magnitude of the output input from the measuring device 18 in association with the amount of movement of the YZ moving table 19, and from the stored maximum output or each light receiving member simultaneously outputs the same output. Select a new position. Then, the YZ moving table 19 and the measuring device 18 are moved to the position where the maximum output is obtained or the position where the same output is simultaneously obtained in each light receiving member, and the Y-direction servomotor 20 is stopped. As a result, the measuring device 18 is moved to a position where the maximum output in the Y direction is obtained or a position where the optical axis of light coincides with the reference position of the measuring device, that is, a position where the same output is simultaneously obtained in each light receiving member. It stops and is positioned with respect to the laser diode 23. By the way, when there is no input from the measuring device 18, the control device 12
It is determined that the laser diode 23 is a defective product that cannot emit light, the subsequent steps are stopped, the substrate 2 and the laser diode 23 are eliminated, and a new substrate 2 is restarted from the substrate supply step. Become.

Next, the control device 12 activates the Z-direction servomotor 21 to raise and lower the YZ carriage 19 and the measuring device 18 with respect to the laser diode 23 by a very small amount in the Z direction. The output of the measuring device 18 at that time is measured. Then, in the same manner as described above, the measuring device 18 is moved to a position where the maximum output is obtained or a position where the same output is simultaneously obtained in each light receiving member, and stopped and positioned at that position.

In this state, the measuring device 18 is in the position where the maximum output in the Y direction is obtained or the position where the same output is obtained simultaneously in each light receiving member, and the position where the maximum output in the Z direction is obtained or the same in each light receiving member simultaneously. It will be positioned at the position where the output is obtained. Thereby, the measuring device 18 can be positioned on the optical axis of the light of the laser diode 23. After the measurement device 18 is positioned on the optical axis of the laser diode 23 in this manner, the process proceeds to a solid-state laser oscillation element mounting step.

In this embodiment, a YAG slab having a reflection surface 27 at the rear end is used as the solid-state laser oscillation element 26. As other solid-state laser oscillation elements 26,
YAG rod, YLF slab, YLF rod, YVO ₄
Slab, it may be a YVO ₄ rod or the like. The solid-state laser oscillating device 26 with a reflecting surface is supplied to a predetermined tray 6 in advance.
In the same manner as in the laser diode mounting step, the ultraviolet light curable resin 24 is applied to the lower end surface by being sucked by the suction head 4A. When the solid-state laser oscillation element 26 is positioned at a predetermined position with respect to the substrate 2, the bonding tool 4 is lowered to a predetermined height position, and the solid-state laser oscillation element coated with the ultraviolet curing resin 24 is applied. The adhesive surface of 26 is brought into contact with the substrate 2. The processing so far is the same as the laser diode mounting step. Next, when the ultraviolet curable resin 24 applied to the adhesive surface of the solid-state laser oscillator 26 with the reflecting surface comes into contact with the substrate 2, the Y-direction motor 9 is operated to move the XY table 3 and thus the substrate. 2 and the laser diode 23 are reciprocated a small amount in the Y direction with respect to the solid-state laser oscillating device 26 with a reflection surface, and the light passing through the solid-state laser oscillating device 26 with a reflection surface or the solid-state laser oscillation with a reflection surface is used. The output of the light emitted from the element 26 is measured by the measuring device 18 positioned at a predetermined position. At this time, the ultraviolet curable resin 24 is interposed between the substrate 2 and the solid-state laser oscillation device 26 having a reflecting surface in contact with both.
The amount of movement of the solid-state laser oscillation element 26 with the reflection surface is very small, so that the ultraviolet curing resin 24 is maintained in contact with the substrate 2 and the solid-state laser oscillation element 26 with the reflection surface. The control device 12 stores the magnitude of the output input from the measuring device 18 in correspondence with the moving position of the XY table 3, and from the stored maximum output or each of the light receiving members simultaneously outputs the same output. Select a position. Then, the XY table 3, the substrate 2, and the laser diode 23 are moved to the position where the maximum output is obtained or the position where the same output is simultaneously obtained in each light receiving member, and the Y-direction motor 9 is stopped. As a result, the solid-state laser oscillation element 26 with the reflection surface is positioned at a position where the maximum output in the Y direction is obtained or at a position where the same output is simultaneously obtained in each light receiving member.

Next, the control device 12 activates the Y-axis rotation servomotor 14 to finely move the solid-state laser oscillation element 26 with the reflecting surface adsorbed by the adsorption head 4A in the forward and reverse directions about the Y-axis. Rotate a small amount and measure 1
8 is input. Then, in the same manner as described above, the suction head 4A is moved to the position where the maximum output is obtained or the rotation angle position where the same output is simultaneously obtained in each light receiving member.
Then, the solid-state laser oscillator 26 with the reflecting surface is moved to stop the Y-axis rotation servomotor 14. Further, the control device 12 operates the elevating mechanism 11 to elevate and lower the solid-state laser oscillator 26 with the reflecting surface by a very small amount in the vertical Z direction, and simultaneously outputs the same output at the position where the maximum output is obtained or at each light receiving member. Is moved to the position where is obtained. Subsequently, the control device 12 operates the Z-axis rotation servomotor 13 to rotate the solid-state laser oscillation element 26 with the reflection surface in a normal or reverse direction about the Z-axis by a very small amount. The solid-state laser oscillating element 26 with the reflecting surface is positioned at the rotation angle position where the same output is obtained simultaneously in the light receiving member.

In this state, the solid-state laser oscillating element 26 with the reflecting surface has the maximum output in the Y direction or the position where the same output is simultaneously obtained in each light receiving member, and the maximum output about the Y axis. The obtained position or the rotational angle position where the same output was obtained simultaneously in each light receiving member, the position where the maximum output in the Z direction was obtained or the position where the same output was obtained simultaneously in each light receiving member, and further the Z axis It is positioned at the position where the maximum output is obtained at the center or at the rotation angle position where the same output is simultaneously obtained at each light receiving member. Thereby, the solid-state laser oscillation element 26 with the reflection surface can be positioned on the optical axis of the laser diode 23. After positioning the solid-state laser oscillation element 26 with the reflection surface on the optical axis in this way, the ultraviolet curing resin 24 is irradiated with ultraviolet rays from the above-described ultraviolet irradiation device, and the ultraviolet curing resin 24 is cured to form the substrate 2 with the reflection surface. The solid-state laser oscillation element 26 is fixed. And UV curing resin 2
When the solid 4 is completely cured, the bonding tool 4 that has released the suction of the solid-state laser oscillation device 26 with the reflection surface by the suction head 4A is lifted, and the mounting process of the solid-state laser oscillation device with the reflection surface is completed. The laser diode 23 emits light also in this solid-state laser oscillation element mounting step. At this time, the light measured by the measuring device 18 is the light or laser light that has passed through the solid-state laser oscillation element 26 with the reflecting surface. This is so-called fluorescent light which is excited by the light of the diode 23 to emit the solid-state laser oscillation element 26 with a reflection surface.

In the output mirror mounting step following the solid state laser oscillation element mounting step, after the ultraviolet curable resin 24 is applied to the output mirror 28 in the same manner as in the solid state laser oscillation element mounting step, the output mirror 28 The position where the maximum output in the direction was obtained or the position where the same output was obtained simultaneously in each light receiving member, and the position around the Y axis where the maximum output was obtained or the rotation where the same output was obtained simultaneously in each light receiving member The angular position, the position where the maximum output in the Z direction was obtained or the position where the same output was simultaneously obtained in each light receiving member, and the position where the maximum output was obtained centering on the Z axis or the same in each light receiving member at the same time The ultraviolet curable resin 24 is irradiated with ultraviolet rays from an ultraviolet irradiation device in that state, and is positioned at the optimal position on the substrate 2 with the rotation angle position at which the output was obtained. It is fixed to. Although the laser diode 23 emits light also in this output mirror mounting step, what is measured by the measuring device 18 in the output mirror mounting step is not the light of the laser diode 23 but the light between the reflection surface 27 and the output mirror 28. The laser light is resonated and output from the output mirror 28. That is, in a state where the output mirror 28 is disposed after the solid-state laser oscillation element 26 with the reflection surface,
The solid-state laser oscillation element 26 with a reflection surface is excited by the light of the laser diode 23 transmitted through the reflection mirror 23,
The light of the solid-state laser oscillation device 26 with the reflection surface is reflected by the reflection surface 27.
And the output mirror 28 is resonated. When the resonance energy increases, the laser beam is output to the output mirror 28.
, And is measured by the measuring device 18. In a state where the output mirror mounting step is completed, the solid-state laser oscillation device 26 with a reflection surface and the output mirror 28 are fixed on the optical axis of the laser diode 23, respectively. 28 is
It is arranged on the optical axis of the light emitted from the laser diode, whereby the output of the laser light is improved as compared with the conventional bonding method.

In the above embodiment, in the solid-state laser oscillation element mounting step, the laser diode 23 emits light and the light of the solid-state laser oscillation element 26 having a reflecting surface is measured by the measuring device 18.
, The fixed position is searched for while measuring, but the present invention is not limited to this. As shown in FIG. 2, it may be fixed to the substrate 2 only by positioning with a camera as in the conventional case. In this case, there is a possibility that the optical axis of the light of the solid-state laser oscillation element 26 with the reflection surface does not coincide with the optical axis of the light of the laser diode 23. Even in such a method, the output can be improved as compared with the conventional bonding method. In other words, since the light absorption rate differs depending on the type of solid-state laser oscillation element, a solid-state laser oscillation element having a high absorption rate emits only light of an extremely limited frequency and absorbs the other light, so that the relative absorption is high. The light intensity is weaker. As a result, in the case of a solid-state laser oscillation device having such characteristics, it is inevitable that the device is mounted only by a camera. On the other hand, in the case of a solid-state laser oscillation element having a low absorptance, a part of the frequency of the light emitted from the laser diode 23 is absorbed, and most of the other light is passed, so that the light intensity decreases. small. Thereby, in the case of a solid-state laser oscillation element having such characteristics, measurement by a measuring device becomes possible. It is needless to say that even a solid-state laser oscillation element that can be measured by a measuring device may be intentionally mounted only by a camera. In the above embodiment, at the stage of the solid-state laser oscillation element mounting step, the laser diode 23 fixed on the substrate 2 is used.
Is emitted, the light emitted from the laser diode 23 is measured by the measuring device 18, and the measuring device 18 is moved and positioned on the optical axis of the light. However, the present invention is not limited to this. NO. As shown in FIG. 3, in the step of mounting the solid-state laser oscillation element, the laser diode 23 emits light, and the light of the solid-state laser oscillation element 26 with the reflection surface is measured by the measuring device 18. The positioning may be performed on the optical axis of the light of the laser oscillation element 26. Furthermore, in the above-described embodiment, the laser diode mounting step is performed, and then the solid-state laser oscillation element mounting step is performed, and then the output mirror mounting step is performed. However, the present invention is not limited to this. If the output mirror mounting step is the last as shown in FIG. 4, the order of the laser diode mounting step and the solid state laser oscillation element mounting step may be reversed. In this case, the measuring device 18 is positioned on the optical axis of the light of the solid-state laser oscillation device 26 with the reflecting surface. Also in such a bonding method, the output of the laser beam can be improved as compared with the conventional bonding method.

Next, in the above embodiment, in the laser diode mounting step, the measuring device 18 moves with respect to the laser diode 23 fixed to the substrate 2 and is positioned on the optical axis. It is not limited, and the NO. As shown in FIG. 5, in the same manner as in the solid-state laser oscillation element mounting step and the output mirror mounting step, the laser diode 23 sucked by the bonding tool 4 is moved in the Y direction to the measuring device 18 previously positioned at a predetermined position. The position where the maximum output was obtained or the position where the same output was obtained simultaneously in each light receiving member, and the position where the maximum output was obtained centering on the Y axis or the rotation angle position where the same output was obtained simultaneously in each light receiving member And the position where the maximum output in the Z direction was obtained or the position where the same output was simultaneously obtained in each light receiving member, and the position where the maximum output centered on the Z axis was obtained or the same output simultaneously in each light receiving member. With the obtained rotation angle position, the ultraviolet curable resin 24 is irradiated with ultraviolet light by an ultraviolet irradiation device in that state, and is fixed on the substrate. The measuring device 23 on the optical axis of the light diodes 23 may be allowed to position.
In this case, although not shown, a conventionally known applying means for supplying a current to the laser diode 23 on the bonding tool 4 side is required. Thus, even in such a laser diode mounting step, the same effect as in the above embodiment can be obtained.

Also, in the bonding method employing the laser diode mounting step, the laser diode 23 emits light and the solid-state laser
Is searched for a fixed position while measuring the light with the measuring device 18, but the present invention is not limited to this.
As shown in FIG. 6, it may be fixed to the substrate 2 only by positioning with a camera. The order in which the output mirror mounting step is performed after the solid-state laser oscillation element mounting step is performed from the laser diode mounting step is not limited.
O. 7, NO. If the output mirror mounting step is the last as shown in FIG. 9, the order of the laser diode mounting step and the solid-state laser oscillation element mounting step may be reversed. In this case, the laser diode 23 or the solid-state laser oscillation device 26 with the reflection surface moves to the position where the light of the solid-state laser oscillation device 26 with the reflection surface becomes maximum or the position where the same output is simultaneously obtained in each light receiving member. It is fixed. In addition, N in the table
O. As shown in FIGS. 8 and 10, after both the laser diode 23 and the solid-state laser oscillation device 26 with the reflecting surface are fixed on the substrate 2 only by positioning with a camera, the laser diode 23 is caused to emit light at the stage of the output mirror mounting process. Alternatively, the output mirror may be moved to a position where the maximum output is obtained or a position where the same output is simultaneously obtained in each light receiving member and fixed.
In this case, the dispersion of the output is the largest among the above-described bonding methods. However, even in such a bonding method, the output of the laser beam can be improved as compared with the conventional bonding method.

Next, in the above embodiment, the solid-state laser oscillator 2
6 is provided integrally with the reflection surface 27, but is not limited to this, and may be a solid-state laser oscillation element 26 without the reflection surface 27. In this case, separately from the solid-state laser oscillation element mounting step, NO. A reflector mounting step of mounting the reflector on a substrate may be provided as shown in FIG. At this time, the NO. As shown in FIG. 12, either of the solid-state laser oscillation element mounting step and the reflector mounting step may be performed first. In each of these bonding methods, the same effect as in the above embodiment can be obtained. In the table, the NO. 13 to NO. As shown in FIG. 18, at least one of the reflection mirror and the solid-state laser oscillation element may be fixedly fixed on the substrate 2 by positioning only with a camera. In each of such bonding methods, the output of laser light can be improved as compared with the conventional bonding method.

Next, in the table of FIG. 19 to NO. 22
As shown in, the reflector mounting process is performed first, then one of the laser diode mounting process and the solid-state laser oscillation device mounting process is performed first, and the other process is performed thereafter to perform the laser diode mounting process. Each of the solid-state laser oscillation elements is fixed on a substrate. At this stage, the light emitted from the laser diode and passing through the reflecting mirror or the light passing through the reflecting mirror and the solid-state laser oscillator or the light emitted from the solid-state laser oscillator passing through the reflecting mirror is measured by the measuring device. Then, the measuring device is moved to a position where the maximum output is obtained or a position where the same output is obtained simultaneously in each light receiving member, and positioned with respect to the reflecting mirror or the solid-state laser oscillation element. And in the output mirror mounting process that follows,
The laser diode emits light, excites the solid-state laser oscillation element, and the light output from the output mirror is measured by the measuring device, and the output mirror obtains the same output simultaneously at the position where the maximum output is obtained or at each light receiving member. Is moved and fixed. In each of such bonding methods, the output of laser light can be improved as compared with the conventional bonding method.

Next, in the table of FIG. 23 to NO. 26
As shown in, the solid-state laser oscillation element mounting step is performed first, then one of the laser diode mounting step and the reflecting mirror mounting step is performed first, and the other step is performed thereafter, and the laser diode is mounted. Each of the solid-state laser oscillation elements is fixed on a substrate. At this stage, the laser diode emits light and passes through the solid-state laser oscillator, or light emitted from the solid-state laser oscillator or a reflecting mirror, and light that passes through the solid-state laser oscillator or the reflector passes through the solid-state laser. The light radiated from the laser oscillation element is measured by the measuring device, and the measuring device is moved to the position where the maximum output is obtained or the position where the same output is obtained simultaneously in each light receiving member, and the solid laser oscillation device is moved. Position.
In the subsequent output mirror mounting step, the laser diode emits light, the solid-state laser oscillation element is excited, and the light output from the output mirror is measured by the measuring device, and the output mirror is at the position where the maximum output is obtained or Each light receiving member is moved and fixed to a position where the same output is obtained at the same time. In each of such bonding methods, the output of laser light can be improved as compared with the conventional bonding method.

Next, in the table of FIG. 27 to NO.
As shown in 34, in the laser diode mounting step, the laser diode 23 adsorbed to the bonding tool 4 with respect to the measuring device 18 previously positioned at a predetermined position is moved to the position where the maximum output in the Y direction is obtained or The position where the same output was obtained simultaneously on the light receiving member, the position where the maximum output centered on the Y axis was obtained or the rotational angle position where the same output was obtained simultaneously on each light receiving member, and the maximum output in the Z direction were obtained At the given position or the position where the same output was obtained simultaneously at each light receiving member, and further at the position where the maximum output around the Z axis was obtained or the rotational angle position where the same output was obtained simultaneously at each light receiving member In this state, the ultraviolet curable resin 24 is irradiated with ultraviolet light by an ultraviolet irradiation device and fixed on the substrate 2. The measuring device 23 on the axis may be allowed to position. In the table of FIG. 35-N
O. As shown at 42, in the laser diode mounting step, the laser diode 23 may be fixed on the substrate 2 by positioning with a camera. The order of the subsequent steps is the same as that of the above NO. 27 to NO. 34. In each of the bonding methods described above, the output of laser light can be improved as compared with the conventional bonding method.

Next, in the table of FIG. 43 to NO. 48
As shown in, the reflector mounting process is performed first, then one of the laser diode mounting process and the solid-state laser oscillation device mounting process is performed first, and the other process is performed thereafter to perform the laser diode mounting process. Each of the solid-state laser oscillation elements is fixed on a substrate. At this stage, the light emitted from the laser diode and passing through the reflecting mirror or the light passing through the reflecting mirror and the solid-state laser oscillator or the light emitted from the solid-state laser oscillator passing through the reflecting mirror is measured by the measuring device. Then, the measuring device is moved to a position where the maximum output is obtained or a position where the same output is obtained simultaneously in each light receiving member, and positioned with respect to the reflecting mirror or the solid-state laser oscillation element. And in the output mirror mounting process that follows,
The laser diode emits light, excites the solid-state laser oscillation element, and the light output from the output mirror is measured by the measuring device, and the output mirror obtains the same output simultaneously at the position where the maximum output is obtained or at each light receiving member. Is moved and fixed. In each of such bonding methods, the output of laser light can be improved as compared with the conventional bonding method.

Next, in the table of FIG. 49 to NO. 54
As shown in, the solid-state laser oscillation element mounting step is performed first, then one of the laser diode mounting step and the reflecting mirror mounting step is performed first, and the other step is performed thereafter, and the laser diode is mounted. Each of the solid-state laser oscillation elements is fixed on a substrate. At this stage, the laser diode emits light and passes through the solid-state laser oscillator, or light emitted from the solid-state laser oscillator or a reflecting mirror, and light that passes through the solid-state laser oscillator or the reflector passes through the solid-state laser. The light radiated from the laser oscillation element is measured by the measuring device, and the measuring device is moved to the position where the maximum output is obtained or the position where the same output is obtained simultaneously in each light receiving member, and the solid laser oscillation device is moved. Position.
In the subsequent output mirror mounting step, the laser diode emits light, the solid-state laser oscillation element is excited, and the light output from the output mirror is measured by the measuring device, and the output mirror is at the position where the maximum output is obtained or Each light receiving member is moved and fixed to a position where the same output is obtained at the same time. In each of such bonding methods, the output of laser light can be improved as compared with the conventional bonding method.

In the above embodiment, an ultraviolet curable resin is used as the adhesive, but the present invention is not limited to this.
For example, it is also possible to use a thermosetting adhesive and cure it by heating.

Further, a nonlinear optical crystal for converting the wavelength of the laser beam of the solid-state laser oscillator between the solid-state laser oscillator and the output mirror, specifically, BBO, LBO,
A nonlinear optical crystal such as KTP may be provided. In addition, between the solid-state laser oscillation element and the output mirror or between the nonlinear optical crystal and the output mirror, Q
A switch may be provided. When this Q switch is provided, it is necessary to provide an appropriate voltage applying means on the side of the bonding tool, and to apply the high frequency voltage to the Q switch by the voltage applying means. The step of attaching the nonlinear optical crystal to the substrate 2 and the step of attaching the Q switch to the substrate 2 may be performed in substantially the same manner as the output mirror mounting step, and may be performed first. .
However, these steps need to be executed at least after the output mirror mounting step, that is, after the output mirror 28 is irradiated with laser light.

[0037]

As described above, according to the present invention, a reflecting mirror, a solid-state laser oscillator with a reflecting surface, and an output mirror can be easily and accurately arranged on the optical axis of a laser diode. As a result, the effect that the output can be improved as compared with the conventional bonding method is obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a bonding apparatus 1 used in the present invention.

FIG. 2 is a perspective view for explaining a bonding method of the present invention.

FIG. 3 is a variation table showing a procedure of a bonding method including a laser diode mounting step, a solid-state laser oscillation element mounting step, and an output mirror mounting step.

FIG. 4 is a variation table showing a procedure of a bonding method including a laser diode mounting step, a reflecting mirror mounting step, a solid-state laser oscillation element mounting step, and an output mirror mounting step.

FIG. 5 is a variation table showing another procedure of a bonding method including a laser diode mounting step, a reflector mounting step, a solid-state laser oscillation element mounting step, and an output mirror mounting step.

FIG. 6 is a variation table showing still another procedure of a bonding method including a laser diode mounting step, a reflecting mirror mounting step, a solid-state laser oscillation element mounting step, and an output mirror mounting step.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Bonding apparatus 2 ... Substrate 3 ... XY table 4 ... Bonding tool 12 ... Control apparatus 18 ... Measuring apparatus 19 ... YZ movable table 23 ... Laser diode 24 ... Ultraviolet curing resin 26 ... Solid state laser oscillation element with reflection surface 27: Reflecting surface 28: Output mirror

Claims (30)

[Claims] A laser diode mounting step of fixing a laser diode at a predetermined position on a substrate is performed to fix the laser diode at a predetermined position on the substrate, emit light from the laser diode, and emit light from the laser diode. The measured light is measured by a measuring device, the measuring device is moved to a position where the maximum output is obtained or a reference position of the measuring device is moved to a position coincident with the optical axis of the light, and then positioned. After performing the solid-state laser oscillation element mounting step of fixing the solid-state laser oscillation element with, after fixing the solid-state laser oscillation element with a reflective surface at a predetermined position on the substrate,
Further, an output mirror mounting step of fixing the output mirror is performed. In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element with the reflection surface, and the laser light output from the output mirror is measured by a measuring device. The output mirror was moved to a position where the maximum output was obtained or a position where the optical axis of the laser beam coincided with the reference position of the measuring device based on the measurement result, and was fixed on the substrate. A bonding method for a solid-state laser oscillator, characterized in that: 2. The method of mounting a solid-state laser oscillation device according to claim 1, wherein
The laser diode fixed on the substrate emits light, and the light passing through the solid-state laser oscillator with a reflective surface or the light radiated from the solid-state laser oscillator with a reflective surface is measured by a measuring device. 2. The device according to claim 1, wherein the surface-mounted solid-state laser oscillator is moved to a position where the maximum output is obtained or a position where the optical axis of the light coincides with a reference position provided in the measuring device, and is fixed to the substrate. 3. The bonding method for a solid-state laser oscillator according to item 1. 3. A solid state laser oscillating device mounting step of fixing the solid state oscillating device with a reflecting surface is performed to fix the solid state oscillating device with a reflecting surface at a predetermined position on a substrate.
Next, a laser diode mounting step of fixing a laser diode is performed. In the laser diode mounting step, the laser diode is fixed at a predetermined position on the substrate, and the laser diode emits light to emit the solid-state laser with the reflection surface. Measure the light passing through the element or the light emitted from the solid-state laser oscillation element with the reflecting surface by a measuring device,
After moving the measuring device to a position at which the maximum output is obtained or a reference position provided by the measuring device to a position coinciding with the optical axis of light and positioning the same, further execute an output mirror mounting step of fixing an output mirror, In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillator with the reflecting surface, and the laser beam output from the output mirror is measured by a measuring device. Wherein the laser beam is moved to a position where the laser beam is obtained or a position where the optical axis of the laser beam coincides with a reference position provided in the measuring apparatus, and is fixed on the substrate. 4. Performing a laser diode mounting step,
After fixing the laser diode at a predetermined position on the substrate, a solid-state laser oscillation element mounting step of fixing the solid-state laser oscillation element with a reflection surface is next performed, and in the solid-state laser oscillation element mounting step, The solid-state laser device with a reflective surface is fixed to the device, and the laser diode is emitted in this state, and the light passing through the solid-state laser device with a reflective surface or the light emitted from the solid-state laser device with a reflective surface is measured. An output mirror mounting step of measuring by a device, moving the measuring device to a position at which the maximum output is obtained or a reference position provided in the measuring device to a position that coincides with the optical axis of light, and then further fixing an output mirror. In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation device with the reflecting surface, and the laser light output from the output mirror is measured. The output mirror was moved to a position where the maximum output was obtained or a position where the optical axis of the laser beam coincided with the reference position of the measuring device, and was fixed to the substrate based on the measurement result. A bonding method for a solid-state laser oscillator, characterized in that: 5. A laser diode mounting step for fixing a laser diode and a solid laser oscillation element mounting step for fixing a solid-state laser oscillation element with a reflection surface, wherein the laser diode and the solid with reflection surface are placed at predetermined positions on the substrate. After fixing each of the laser oscillation elements, an output mirror mounting step of fixing the output mirror is next performed, and in the output mirror mounting step,
The laser diode emits light to excite the solid-state laser oscillation element with a reflection surface, and measures the laser light output from the output mirror by a measuring device.Based on the measurement result, the position where the maximum output is obtained from the output mirror or A bonding method for a solid-state laser oscillator, wherein an optical axis of a laser beam is moved to a position corresponding to a reference position provided in a measuring device and fixed to the substrate. 6. The laser diode mounting step is performed prior to the solid-state laser oscillation element mounting step, and after the laser diode is fixed at a predetermined position on the substrate, the solid-state laser oscillation element mounting step is followed by the solid-state laser oscillation element mounting step. The laser diode emits light, and the light passing through the solid-state laser oscillator with a reflective surface or the light emitted from the solid-state laser oscillator with a reflective surface is measured by a measuring device, and based on the measurement result, the solid-state laser with the reflective surface is measured. 6. The solid-state laser according to claim 5, wherein the element is moved to a position where a maximum output is obtained or a position where an optical axis of light coincides with a reference position provided in the measuring device, and fixed to the substrate. Oscillator bonding method. 7. In the laser diode mounting step, the laser diode emits light, and the light radiated from the laser diode is measured by a measuring device. Based on the measurement result, the position of the laser diode where the maximum output is obtained or 7. The bonding of the solid-state laser oscillator according to claim 5, wherein the optical axis of the light is moved to a position corresponding to a reference position provided in the measuring device and fixed to the substrate. Method. 8. After the solid-state laser oscillation element mounting step is performed before the laser diode mounting step, and the solid-state laser oscillation element with the reflection surface is fixed at a predetermined position on the substrate,
Next, in the laser diode mounting step, a laser diode is caused to emit light, and light passing through the solid-state laser oscillation device with a reflection surface or light emitted from the solid-state laser oscillation device with a reflection surface is measured by a measuring device. 6. The solid-state laser according to claim 5, wherein the diode is moved to a position where the maximum output is obtained or a position where the optical axis of light coincides with a reference position provided in the measuring device, and the diode is fixed to the substrate. Oscillator bonding method. 9. A laser diode mounting step of fixing a laser diode at a predetermined position on a substrate, fixing the laser diode at a predetermined position on the substrate, causing the laser diode to emit light, and radiating from the laser diode. The measured light is measured by a measuring device, and the measuring device is moved to a position where the maximum output is obtained or a reference position of the measuring device coincides with the optical axis of the light, and is positioned. After performing the reflector mounting process for fixing the solid-state laser oscillator and the solid-state laser oscillator mounting process for fixing the solid-state laser oscillator, the reflector and the solid-state laser oscillator are respectively fixed at predetermined positions on the substrate, and then the output mirror is further mounted. An output mirror mounting step for fixing the solid state laser is performed.In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element, and the output mirror is mounted. Measuring the laser light outputted from the measuring device, and moving the output mirror to a position where the maximum output is obtained or a position where the optical axis of the laser light matches the reference position of the measuring device based on the measurement result. A bonding method for a solid-state laser oscillator, wherein the bonding method is fixed to the substrate. 10. In at least one of the reflector mounting step and the solid-state laser oscillation element mounting step,
The laser diode emits light, and light passing through the reflecting mirror or light passing through the solid-state laser oscillation element or light emitted from the solid-state laser oscillation element is measured by a measuring device,
Based on the measurement result, at least one of the reflecting mirror and the solid-state laser oscillation element is moved and fixed to a position where the maximum output is obtained or a position where the optical axis of light coincides with the reference position provided in the measuring device. The method for bonding a solid-state laser oscillator according to claim 9, wherein: 11. A reflector mounting process for fixing the reflector, and after fixing the reflector at a predetermined position on the substrate, a laser diode mounting process is then performed. A laser diode is fixed at a predetermined position on the substrate, the laser diode emits light, and light passing through the reflecting mirror is measured by a measuring device.
After moving the measuring device to a position at which the maximum output is obtained or a reference position included in the measuring device to a position coinciding with the optical axis of the light and positioning the same, then executing a solid-state laser oscillation element mounting step, After fixing the solid-state laser oscillator at a predetermined position on the substrate, an output mirror mounting step is further performed.In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillator, and the output from the output mirror is output. The measured laser light is measured by a measuring device, and the output mirror is moved to a position where the maximum output is obtained or a position where the optical axis of the laser light coincides with a reference position provided in the measuring device based on the measurement result. A bonding method for a solid-state laser oscillator, wherein 12. In the solid-state laser oscillation element mounting step, the laser diode emits light, and light passing through the solid-state laser oscillation element or light emitted from the solid-state laser oscillation element is measured by a measuring device. 2. The solid-state laser oscillator is moved to a position at which a maximum output is obtained or a position coincident with a reference position provided in the measuring device, and is fixed on the substrate, based on the condition (1).
2. The method for bonding a solid-state laser oscillator according to item 1. 13. A reflector mounting step for fixing the reflector, and after fixing the reflector at a predetermined position on the substrate, a laser diode mounting step for fixing the laser diode and fixing the solid-state laser oscillation element are performed next. Performing a solid-state laser oscillation element mounting step. In the laser diode mounting step and the solid-state laser oscillation element mounting step, the laser diode and the solid-state laser oscillation element are fixed at predetermined positions on the substrate, respectively. Was emitted, and the light passing through the reflecting mirror and the solid-state laser oscillation element or the light emitted from the solid-state laser oscillation element passing through the reflecting mirror was measured by a measuring device, and the maximum output of the measuring device was obtained. An output mirror that further fixes the output mirror after moving to a position where the position or the reference position of the measuring device coincides with the optical axis of the light and positioning the position. In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element, and the laser light output from the output mirror is measured by a measuring device, and the output is performed based on the measurement result. A method for bonding a solid-state laser oscillator, wherein a mirror is moved to a position where a maximum output is obtained or a position where an optical axis of a laser beam coincides with a reference position provided in a measuring device, and fixed to the substrate. 14. A solid-state laser oscillating device mounting step of fixing the solid-state laser oscillating device, and after the solid-state laser oscillating device is fixed at a predetermined position on the substrate, a laser diode mounting step of fixing the laser diode is performed. In the laser diode mounting step, the laser diode is made to emit light, and light passing through the solid-state laser oscillation element or light emitted from the solid-state laser oscillation element is measured by a measuring device. After moving and positioning the obtained position or the reference position of the measuring device to coincide with the optical axis of the light, a reflector mounting step of fixing the reflector is then performed, and the predetermined position on the substrate is determined. After the reflector is fixed at the position, an output mirror mounting step is further performed. In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element. The laser beam output from the output mirror is measured by a measuring device, and the position where the maximum output is obtained or the position where the optical axis of the laser beam coincides with the reference position of the measuring device is measured based on the measurement result. And bonding the solid-state laser to the substrate. 15. In the reflector mounting step, the laser diode is caused to emit light, and light passing through the reflector is measured by a measuring device. 15. The bonding method for a solid-state laser oscillator according to claim 14, wherein the device is moved to a position corresponding to a reference position provided in the device and fixed on the substrate. 16. A solid-state laser oscillating device mounting step of fixing a solid-state laser oscillating device, the solid-state laser oscillating device is fixed at a predetermined position on a substrate, and then a laser diode mounting step of fixing a laser diode. Performing a reflecting mirror mounting step of fixing the reflecting mirror; in the laser diode mounting step and the reflecting mirror mounting step, the laser diode and the reflecting mirror are respectively fixed at predetermined positions on the substrate, and the laser diode emits light. The light passing through the reflecting mirror and the solid-state laser oscillation element or the light emitted from the solid-state laser oscillator passing through the reflecting mirror is measured by a measuring device, and the position at which the maximum output is obtained or the reference position of the measuring device is determined. After moving to a position corresponding to the optical axis of the light and positioning, an output mirror mounting step of further fixing the output mirror is performed,
In the output mirror mounting step, the laser diode emits light to excite the solid-state laser oscillation element, and the laser beam output from the output mirror is measured by a measuring device, and the maximum output of the output mirror is obtained based on the measurement result. A method for bonding a solid-state laser oscillator, characterized in that the fixed position is moved to a set position or a position where the optical axis of the laser light coincides with a reference position provided in the measuring device, and fixed to the substrate. 17. A laser diode mounting step for fixing a laser diode, a reflecting mirror mounting step for fixing a reflecting mirror, and a solid laser oscillation element mounting step for fixing a solid state laser oscillation element, wherein the laser diode mounting step is performed at a predetermined position on the substrate. After fixing the laser diode, the reflecting mirror, and the solid-state laser oscillation element, respectively, an output mirror mounting step of fixing the output mirror is performed. In the output mirror mounting step, the solid-state laser oscillation element is caused to emit light by the laser diode. Is excited, and the laser beam output from the output mirror is measured by a measuring device. Based on the measurement result, the position of the output mirror at which the maximum output is obtained or the optical axis of the laser beam matches the reference position of the measuring device. A solid-state laser oscillator bonding method, wherein the solid-state laser oscillator is moved to a position to be fixed to the substrate. 18. The laser diode mounting step is performed prior to the reflector mounting step and the solid-state laser oscillation element mounting step, and the laser diode is fixed at a predetermined position on the substrate. In at least one step of the solid-state laser oscillation element mounting step, the laser diode emits light and passes through a reflector or light passing through a solid-state laser oscillation element or light emitted from a fixed laser oscillation element. The substrate is measured by measuring with a measuring device, and at least one of the reflecting mirror and the solid-state laser oscillation element is moved to a position where the maximum output is obtained or a position where the optical axis of light coincides with a reference position provided in the measuring device. 18. The bonding method for a solid-state laser oscillator according to claim 17, wherein the bonding method is fixed on the upper side. 19. In the laser diode mounting step,
The laser diode emits light, the light emitted from the laser diode is measured by a measuring device, and based on the measurement result, the laser diode is moved to the position where the maximum output is obtained or the optical axis of the light to the reference position of the measuring device. 19. The bonding method for a solid-state laser oscillator according to claim 17, wherein the bonding method is performed by moving the semiconductor laser to a coincident position and fixing the semiconductor laser to the substrate. 20. A reflecting mirror mounting step for fixing the reflecting mirror is performed prior to the laser diode mounting step and the solid-state laser oscillation element mounting step, and after the reflecting mirror is fixed at a predetermined position on the substrate, the laser is mounted. Performing a diode mounting step and a solid-state laser oscillation element mounting step, and in at least one of the laser diode mounting step and the solid-state laser oscillation element mounting step, causes the laser diode to emit light or light passing through the reflecting mirror or The light passing through the reflecting mirror and the solid-state laser oscillation element or the light emitted from the solid-state laser oscillation element passing through the reflecting mirror is measured by a measuring device, and the laser diode and the solid-state laser oscillation element are measured based on the measurement result. Move at least one of them to the position where the maximum output was obtained or to the position where the optical axis of the light coincides with the reference position of the measuring device. 18. The method for bonding a solid-state laser oscillator according to claim 17, wherein the bonding method is fixed to a substrate. 21. A solid-state laser oscillation element mounting step of fixing the solid-state laser oscillation element, fixing the solid-state laser oscillation element at a predetermined position on the substrate, and then fixing the laser diode. A reflector mounting step of fixing the reflector is performed, and in at least one of the laser diode mounting step and the reflector mounting step, a laser diode is made to emit light or light or a light passing through the solid-state laser oscillation element. The light emitted from the solid-state laser oscillation element or the light passing through the reflector and the solid-state laser oscillation element or the light emitted from the solid-state laser oscillation element passing through the reflection mirror is measured by a measuring device, and the measurement result is obtained. At least one of the laser diode and the reflecting mirror is positioned at the position where the maximum output is obtained or the optical axis of the light or the optical axis of the laser light of the measuring device. 2. The apparatus according to claim 1, wherein the movable part is moved to a position corresponding to the reference position and fixed.
8. The method for bonding a solid-state laser oscillator according to item 7. 22. The apparatus according to claim 22, wherein the measuring device includes at least three or more light receiving members symmetrically arranged on the same plane, and a center between the light receiving members is the reference position. 22. The bonding method for a solid-state laser oscillator according to any one of 1 to 21. 23. The output mirror is movably adhered to the substrate via a pre-applied adhesive, and is moved to a position at which the maximum output is obtained or a position corresponding to a reference position provided in the measuring device. 22. The bonding method of a solid-state laser oscillator according to claim 1, wherein the adhesive is cured and fixed to the substrate. 24. The solid-state laser oscillator having a reflective surface is movably adhered to a substrate via a pre-applied adhesive, and coincides with a position where a maximum output is obtained or a reference position provided in a measuring device. 8. The bonding method of a solid-state laser oscillator according to claim 2, wherein the adhesive is cured and fixed to the substrate when the adhesive is moved to a position where the bonding is performed. 25. The reflecting mirror is movably adhered to the substrate via a pre-applied adhesive, and is moved to a position where the maximum output is obtained or a position corresponding to a reference position provided in the measuring device. 2. The method according to claim 1, wherein the adhesive is cured and fixed to the substrate.
0, Claim 15, Claim 18 or Claim 19, Claim 2
2. The method for bonding a solid-state laser oscillator according to item 1. 26. The solid-state laser oscillation element is movably adhered to a substrate via a pre-applied adhesive, and moves to a position where a maximum output is obtained or a position corresponding to a reference position provided in a measuring device. 20. The moving device according to claim 19, wherein the adhesive is cured and fixed to the substrate when moved.
21. The method for bonding a solid-state laser oscillator according to claim 9 and claim 20. 27. The laser diode is movably adhered to a substrate via a pre-applied adhesive,
8. The method according to claim 7, wherein the adhesive is cured and fixed to the substrate when moved to a position at which the maximum output is obtained or a position corresponding to a reference position of the measuring device. 22. The bonding method for a solid-state laser oscillator according to claim 8, 19, 20, or 21. 28. The solid-state laser oscillator includes a non-linear optical crystal for converting a wavelength of a laser beam of the solid-state laser oscillation element, wherein the non-linear optical crystal is a laser of the solid-state laser oscillation element passing through the non-linear optical crystal. The light was measured by the measuring device, and the nonlinear optical crystal obtained the same ratio as the preset ratio in which the maximum output was obtained or the mutual ratio of each measurement value measured by each light receiving member of the measuring device. 22. The bonding method for a solid-state laser oscillator according to claim 1, wherein the bonding method is moved to a position and fixed to the substrate. 29. The solid-state laser oscillator includes a Q switch including an acousto-optic element or an electro-optic element,
The Q switch measures the laser light of the solid-state laser oscillation element passing through the Q switch by a measuring device, and the Q switch determines the position where the maximum output is obtained or the measured value of each measurement value measured at each light receiving member of the measuring device. 22. Bonding of the solid-state laser oscillator according to claim 1, wherein the mutual ratio is moved to a position where the same ratio as a preset ratio is obtained and fixed to the substrate. Method. 30. The bonding method for a solid-state laser oscillator according to claim 1, wherein the solid-state laser oscillator includes one of a nonlinear optical crystal and a Q switch.