JPH10303359A - Bump member for wiring board - Google Patents
Bump member for wiring boardInfo
- Publication number
- JPH10303359A JPH10303359A JP9117425A JP11742597A JPH10303359A JP H10303359 A JPH10303359 A JP H10303359A JP 9117425 A JP9117425 A JP 9117425A JP 11742597 A JP11742597 A JP 11742597A JP H10303359 A JPH10303359 A JP H10303359A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- wiring board
- electrode pad
- rod
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を搭載す
る配線基板に用いられるバンプ特くには、はんだ接続用
のバンプに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump used for a wiring board on which electronic components are mounted, and more particularly to a bump for solder connection.
【０００２】[0002]
【従来の技術】図４に基づいて、従来の技術を説明す
る。従来は、電子部品４０の中でも代表的な半導体素子
やＩＣフラットパッケージ等の高密度電子部品を搭載し
た配線基板３１の外部への接続端子として、つまり配線
基板の下面に外部端子として多数の電極パッド３６を２
次元の格子上交点に設け、この電極パッド３６に、はん
だ等から成る球形状バンプ（突出接点）４５、例えば、
はんだボールを加熱圧着やリフローはんだ付けで形成す
る方式はＢＧＡ（ball・grid・array）パッケージ方式
と呼ばれ、電子部品の高密度化、小型化および、はんだ
付け不良率の低減による品質の向上が望める。2. Description of the Related Art A conventional technique will be described with reference to FIG. Conventionally, among the electronic components 40, a large number of electrode pads are used as connection terminals to the outside of the wiring board 31 on which high-density electronic components such as semiconductor elements and IC flat packages are mounted, that is, external terminals are provided on the lower surface of the wiring board. 36 to 2
A spherical bump (protruding contact) 45 made of solder or the like is provided on the electrode pad 36 at an intersection on a two-dimensional lattice, for example,
The method of forming solder balls by thermocompression bonding or reflow soldering is called the BGA (ball / grid / array) package method, which improves the quality of electronic components by increasing their density, miniaturizing them, and reducing the rate of defective soldering. I can expect.
【０００３】まず、従来技術の電子部品搭載用の配線基
板３１は、この配線基板３１の上面外層導体３３と、下
面外層導体３５とは、スルーホールめっきで電気的に導
通されている。この下面外層導体３５の２次元の格子上
交点の所定箇所には多数の電極パッド３６が平面的に形
成され設定配置される。次に、外層導体３３，３５の必
要な接続ランドや電極パッド３６を除いて配線基板３１
の両面にソルダーレジスト７を施すことが一般的であ
る。その次に、前記の電極パッド３６の表面上に、クリ
ームはんだを塗布し、その上に球形状のバンプ４５、例
えば、はんだボールをのせリフローはんだ付けで球形状
バンプ４５を形成する。また、はんだ等から成る球形状
バンプ４５を直接、電極パッド３６へ加熱圧着する方法
もある。なお、はんだ接続用のバンプとして、球形状バ
ンプ４５の他に、半球形状バンプや山型形状バンプも使
用されることがある。First, in a conventional wiring board 31 for mounting electronic components, an upper outer conductor 33 and a lower outer conductor 35 of the wiring board 31 are electrically connected by through-hole plating. A large number of electrode pads 36 are planarly formed and set at predetermined positions at intersections of the lower surface outer conductor 35 on the two-dimensional lattice. Next, except for the connection lands and electrode pads 36 necessary for the outer layer conductors 33 and 35, the wiring board 31 is removed.
It is common to apply a solder resist 7 to both sides of the substrate. Next, a cream solder is applied on the surface of the electrode pad 36, and a spherical bump 45, for example, a solder ball is placed thereon to form a spherical bump 45 by reflow soldering. Alternatively, there is a method in which a spherical bump 45 made of solder or the like is directly heat-pressed to the electrode pad 36. In addition, in addition to the spherical bump 45, a hemispherical bump or a mountain-shaped bump may be used as the bump for solder connection.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の平面的
な面実装技術では、球形状、半球形状、山型形状などの
バンプを、所定箇所の電極パッド３６に取り付ける場
合、電極パッド３６の平面状の表面と球形状のバンプ４
５の先端面が球面形状となっている球面とが接するため
位置決めが非常に難しくなっていた。また、球形状のバ
ンプ４５を配線基板３１に設置されている多数の電極パ
ッド３６に正確に位置決めをし、リフローはんだ付けや
加熱圧着する作業や運搬中に球形状のバンプ４５が位置
ずれしたり、離脱する不良が発生することがある。However, in the conventional planar surface mounting technology, when bumps having a spherical shape, a hemispherical shape, a mountain shape, or the like are attached to the electrode pads 36 at predetermined positions, the planar shape of the electrode pads 36 is reduced. Surface and spherical bump 4
Positioning became very difficult because the tip surface of No. 5 was in contact with a spherical surface having a spherical shape. In addition, the spherical bumps 45 are accurately positioned on a large number of electrode pads 36 provided on the wiring board 31 so that the spherical bumps 45 may be misaligned during reflow soldering, heating / compression work, or transportation. In some cases, a defect of detachment may occur.
【０００５】さらに、球形状のバンプ４５の大きさのバ
ラツキ、配線基板３１の反りやねじれ、クリームはんだ
の塗布量などにより球形状バンプ４５の先端面の高さの
バラツキＲが生じることにより、このバンプ４５の形成
された配線基板３１を親配線基板の接続ランドにリフロ
ーはんだ付けする際に配線基板３１の球形状バンプ４５
と、親配線基板の接続ランドとの接続不良が生じて、接
続品質が不安定となり、接続信頼性の確保が課題となっ
ていた。Further, the height R of the tip surface of the spherical bump 45 varies due to variations in the size of the spherical bump 45, warpage and twist of the wiring board 31, application amount of cream solder, and the like. When reflow soldering the wiring board 31 on which the bumps 45 are formed to the connection lands of the parent wiring board, the spherical bumps 45 of the wiring board 31 are used.
In addition, poor connection with the connection land of the parent wiring board occurs, and the connection quality becomes unstable, and securing of connection reliability has been a problem.
【０００６】[0006]
【課題を解決するための手段】上記の課題を解決するた
め本発明においては、電子部品４０を搭載する配線基板
３１のバンプ接続側にある下面外層導体３５上に形成さ
れている平面的な電極パッド３６を、図１に示すように
配線基板１のバンプ接続側の表面５Ａから基材側内部
に、レーザー加工により所定の深さの非貫通穴を穿孔
し、めっきを施こし、その電極パッドの表面中央部を凹
形状にへこませて凹形状の電極パッド６を形成し、この
凹形状の電極パッド６の内部へ棒形状のバンプ４５Ｂを
はめ込むことにより、正しい電極パッドの位置に容易に
位置決めをすることができる。According to the present invention, there is provided a planar electrode formed on a lower surface outer layer conductor on a bump connection side of a wiring board on which an electronic component is mounted. As shown in FIG. 1, a non-through hole having a predetermined depth is formed by laser processing from the surface 5A on the bump connection side of the wiring board 1 to the inside of the substrate as shown in FIG. A concave electrode pad 6 is formed by recessing the center of the surface of the electrode pad into a concave shape, and a rod-shaped bump 45B is fitted into the concave electrode pad 6 so that the correct electrode pad position can be easily obtained. Positioning can be done.
【０００７】さらに、前記の凹形状の電極パッド６の内
径は、挿入する棒形状のバンプ４５Ｂの外径ｄ1より若
干大きくし、挿入時の間隙を少なくして２次元（平面
的）の位置決め精度を高くする。また、配線基板１の凹
形状の電極パッド６のバンプ接続側の表面５Ａから凹設
穴の底面までの深さＳより、棒形状のバンプ４５Ｂの長
さＬは、若干長くしてバンプ接続側の表面５Ａから、棒
形状のバンプ４５Ｂの先端部分までの高さＨが突出する
ように、棒形状のバンプ４５Ｂの長さを選定する。Further, the inner diameter of the concave electrode pad 6 is made slightly larger than the outer diameter d 1 of the rod-shaped bump 45B to be inserted, and the gap at the time of insertion is reduced to achieve two-dimensional (planar) positioning. Increase accuracy. The length L of the rod-shaped bump 45B is slightly longer than the depth S from the surface 5A of the concave electrode pad 6 of the wiring substrate 1 on the bump connection side to the bottom surface of the recessed hole. The length of the rod-shaped bump 45B is selected such that the height H from the surface 5A of the above to the tip of the rod-shaped bump 45B protrudes.
【０００８】このように、凹形状の電極パッド６の内部
に、凸形状となっている棒形状のバンプ４５Ｂの嵌合部
をはめ込み、リフローはんだ付けなどでバンプを形成す
るため、接続品質が安定する。なお、バンプ接続側の表
面５Ａから突出している棒形状のバンプ４５Ｂの先端部
分までの高さＨは、高さ方向の位置決め用治具で棒形状
のバンプ４５Ｂの突出する先端面の高さレベルを平坦化
することができ、このバンプ４５Ｂの先端部分と親配線
基板の接続ランドの間隔が一定となり、電子部品搭載用
配線基板と親配線基板との多数のバンプ接続による実装
を、簡単な構成によって容易に確実に行うことができ
る。As described above, the fitting portion of the projecting rod-shaped bump 45B is fitted into the recessed electrode pad 6, and the bump is formed by reflow soldering or the like, so that the connection quality is stable. I do. The height H from the surface 5A on the bump connection side to the tip of the rod-shaped bump 45B protruding from the surface 5A is the height level of the tip end surface of the rod-shaped bump 45B protruding by a positioning jig in the height direction. The distance between the tip of the bump 45B and the connection land of the parent wiring substrate becomes constant, and mounting of the electronic component mounting wiring substrate and the parent wiring substrate by connecting a large number of bumps can be simplified. Can be easily and reliably performed.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。本発明において、電子部品搭載用の
配線基板１はガラスエポキシ基材，フェノール基材，合
成樹脂基材と呼ばれるＣＥＭ材，テフロン含有基材，ポ
リイミド樹脂基材，ＢＴレジン（ビスマレィミド−トリ
アジン樹脂）基材，変性ＢＴレジン基材またはセラミッ
ク基材などの基材から最適なものを選択して使用する。
また、配線基板１の構造として、片面配線基板，両面配
線基板，多層配線基板のどれでもよく、導体パターンの
形成はサブトラクティブ法でもアクティブ法でも限定さ
れるものではない。さらに、本発明で用いられるバンプ
の材質は、はんだの他に、銅，黄銅，軟銅，リン青銅，
鋼材あるいは前記材質に金属めっきしたものや樹脂に金
属めっきしたものの中から最適な材質を選択して用い
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. In the present invention, a wiring board 1 for mounting electronic components is made of a glass epoxy base material, a phenol base material, a CEM material called a synthetic resin base material, a Teflon-containing base material, a polyimide resin base material, a BT resin (bismaleimide-triazine resin) base. The most suitable material is selected from materials, modified BT resin substrates or ceramic substrates and used.
Further, the structure of the wiring board 1 may be any of a single-sided wiring board, a double-sided wiring board, and a multilayer wiring board, and the formation of the conductor pattern is not limited to the subtractive method or the active method. Further, the material of the bumps used in the present invention is copper, brass, soft copper, phosphor bronze,
The most suitable material is selected from steel or metal-plated material or metal-plated resin.
【００１０】まず、図１の本発明の実施例を説明する電
子部品搭載状態の配線基板の断面図において、半導体素
子やＩＣフラットパッケージ等の電子部品４０を搭載す
る配線基板１の電子部品搭載面の表面外層導体３と、バ
ンプ接続側の表面外層導体５を印刷法や写真法により、
所定箇所に所定の導体を形成し、次いで、バンプ接続側
の表面５Ａから基材側内部にレーザー加工により所定の
深さの非貫通穴を穿孔し、無電解めっき、電解めっきを
施こし非貫通穴内のスルーホールめっき４を形成する。
このようにして、バンプ接続側の表面外層導体５に、電
極パッドの表面中央部が凹形状にへこませた凹形状の電
極パッド６を、２次元の多数の格子上交点の所定箇所
に、立体的（３次元的）に形成し、設定配置する。First, in FIG. 1, a sectional view of a wiring board in a state where electronic parts are mounted, illustrating an embodiment of the present invention, an electronic component mounting surface of a wiring board 1 on which an electronic part 40 such as a semiconductor element or an IC flat package is mounted. The surface outer layer conductor 3 of the above and the surface outer layer conductor 5 on the bump connection side are printed by a printing method or a photographic method.
A predetermined conductor is formed at a predetermined location, and then a non-through hole of a predetermined depth is formed by laser processing from the surface 5A on the bump connection side to the inside of the base material side, and subjected to electroless plating and electrolytic plating to perform non-penetration. A through-hole plating 4 in the hole is formed.
In this way, the concave electrode pad 6 in which the center of the surface of the electrode pad is dented into the concave outer surface conductor 5 on the bump connection side is placed at a predetermined position of the intersections on the two-dimensional grid. It is formed three-dimensionally (three-dimensionally) and set and arranged.
【００１１】次に、電子部品搭載面の表面外層導体３
と、バンプ接続側の表面外層体５の必要な接続ランドや
凹形状の電極パッド６を除いて配線基板１の両面にソル
ダーレジスト７を施こす。Next, the surface outer layer conductor 3 on the electronic component mounting surface
Then, solder resists 7 are applied to both surfaces of the wiring board 1 except for necessary connection lands and concave electrode pads 6 of the surface outer layer body 5 on the bump connection side.
【００１２】その次に、配線基板１のバンプ接続側に形
成した凹形状の電極パッド６の内部に、導電性ペースト
８を塗布あるいは充填し、そこに、棒形状のバンプ４５
Ｂの嵌合部をはめ込み、リフローはんだ付けをするか、
または凹形状の電極パッド６の内部に、はんだ付用フラ
ックスを塗布し、棒形状のバンプ４５Ｂの嵌合部をはめ
込み乾燥させて接着し、仮固定する。導電性ペースト８
としては、銀ペースト，銅ペースト，はんだペースト，
クリームはんだ，銀−銅合金系ペースト，銀パラジウム
合金ペースト，カーボンペーストなどがある。Next, a conductive paste 8 is applied or filled into the concave electrode pads 6 formed on the bump connection side of the wiring board 1, and the rod-shaped bumps 45 are formed thereon.
Insert the fitting part of B and do reflow soldering,
Alternatively, a flux for soldering is applied to the inside of the concave electrode pad 6, the fitting portion of the rod-shaped bump 45B is fitted, dried and adhered, and temporarily fixed. Conductive paste 8
Silver paste, copper paste, solder paste,
There are cream solder, silver-copper alloy paste, silver palladium alloy paste, carbon paste and the like.
【００１３】さらに、本発明における棒形状のバンプ４
５Ｂとして、図２、図３に示すように円柱形状バンプ４
５Ｃ，角柱形状バンプ４５Ｄ，変形の棒形状バンプであ
る突起付き棒形状バンプ４５Ｅ，ストッパー付き棒形状
バンプ４５Ｆなどの種類があるが、図２（ａ）に示すよ
うに棒形状バンプ４５Ｂの一つである単純な形状の円柱
形状バンプ４５Ｃにおいて、このバンプの外径ｄ1は凹
形状の電極パッド６の内径Ｄより若干小さくし、嵌合時
に必要以上の間隙が生じないようにする。また、両端面
のコーナー端部は位置決め挿入がしやすいように面取り
加工をする。また、棒形状のバンプ４５Ｂを凹形状の電
極パッド６へはめ込む作業の効率向上や嵌合状態の安定
化を図るため、棒形状バンプ４５Ｂの一つである角柱形
状のバンプ４５Ｄを凹形状の電極パッド６の非貫通穴の
内部に圧入することができる。このことにより非貫通穴
へ導電性ペースト８や、はんだ付用フラックスを塗布す
る必要がなくなる。例えば、角柱形状のバンプ４５Ｄと
しては、図２（ｂ）の正面図、平面図で示してあるよう
に、角柱形状バンプ４５Ｄの多角形の角に接する外接径
ｄ2を、配線基板１に形成されている凹形状の電極パッ
ド６の非貫通穴の内径Ｄより若干大きくして、非貫通穴
の内部に角柱形状バンプ４５Ｄを圧入し、固定すること
により嵌合状態を安定化することができる。この角柱形
状のバンプ４５Ｄには、四角柱形状，六角柱形状，八角
柱形状のように線対称となる多角柱形状のバンプが嵌合
状態が安定し良好である。Further, according to the present invention, a rod-shaped bump 4 is provided.
5B, as shown in FIG. 2 and FIG.
5C, a prismatic bump 45D, a deformable rod-shaped bump 45E with a projection, and a stopper-shaped rod-shaped bump 45F. One of the rod-shaped bumps 45B is shown in FIG. 2A. in cylindrical bumps 45C of simple shape is, the outer diameter d 1 of the bump is slightly smaller than the inner diameter D of the concave of the electrode pads 6, so as not to cause undue clearance during fitting. The corners of both end faces are chamfered to facilitate positioning and insertion. Further, in order to improve the efficiency of fitting the rod-shaped bump 45B into the concave electrode pad 6 and stabilize the fitting state, the prismatic bump 45D which is one of the rod-shaped bumps 45B is replaced with the concave electrode pad 6. It can be press-fit into the non-through hole of the pad 6. This eliminates the need to apply the conductive paste 8 or the soldering flux to the non-through holes. For example, the bump 45D prismatic, front view of FIG. 2 (b), as is shown in plan view, a circumscribed diameter d 2 which is in contact with the corners of the polygonal prismatic bumps 45D, formed on the wiring board 1 The fitting state can be stabilized by slightly increasing the inner diameter D of the non-through hole of the concave electrode pad 6 and press-fitting and fixing the prismatic bump 45D inside the non-through hole. . Polygonal bumps that are line-symmetric such as a quadrangular prism, a hexagonal prism, and an octagonal prism are stably fitted to the prismatic bumps 45D.
【００１４】この他に、変形の棒形状バンプとして、図
３（ａ）に示すように突起付き棒形状バンプ４５Ｅがあ
る。これは棒形状のバンプ４５Ｂのバンプ本体４１の嵌
合部分に複数の突起４２を、この突起の外径ｄ3が凹形
状の電極パッド６の内径Ｄより若干大きくし、円周上に
複数列と、嵌合部の深さ方向にあたる円周面に複数段の
突起４２を設け、この突起付き棒形状バンプ４５Ｅを凹
形状の電極パッド６の非貫通穴へ圧入し、固定する。ま
た、図３（ｂ）に示すような、ストッパー付き棒形状バ
ンプ４５Ｆは複数の突起４２の他に、棒形状のバンプ４
５Ｂを凹形状の電極パッド６部にはめ込む際、挿入の深
さを一定にするためのストッパー４３を設けた、ストッ
パー付き棒形状バンプ４５Ｆを、凹形状の電極パッド６
の非貫通穴へ圧入し、配線基板１のバンプ接続側の表面
５Ａから棒形状のバンプの先端部分までの高さＨが均一
になるようにするストッパー付き棒形状バンプ４５Ｆを
使用することもできる。In addition, as a modified rod-shaped bump, there is a rod-shaped bump 45E with a projection as shown in FIG. It a plurality of projections 42 to the fitting portion of the bump body 41 of the rod shape of the bumps 45B, the outer diameter d 3 of the projection is slightly larger than the inner diameter D of the concave of the electrode pads 6, a plurality on a circumference column Then, a plurality of projections 42 are provided on the circumferential surface in the depth direction of the fitting portion, and the bar-shaped bumps 45E with the projections are pressed into the non-through holes of the concave electrode pads 6 and fixed. In addition, as shown in FIG. 3B, a rod-shaped bump 45F with a stopper has a plurality of protrusions 42 and a rod-shaped bump 4F.
When fitting 5B into the concave electrode pad 6, the rod-shaped bump 45F with the stopper provided with the stopper 43 for keeping the insertion depth constant is attached to the concave electrode pad 6.
The bumps 45F with stoppers can be used to press-fit into the non-through holes of the wiring board 1 and to make the height H from the surface 5A on the bump connection side of the wiring board 1 to the tip of the rod-shaped bumps uniform. .
【００１５】[0015]
【実施例】本発明における実施例として、配線基板１は
板厚０．５mmのＢＴレジン基材を使用し、ＢＧＡの端子
ピッチ０．６５mmで２次元のマトリクス状に配列できる
凹形状の電極パッド６の非貫通穴の穴径０．３５mmを短
パルスＣＯ2ガスレーザーで穿孔し、銅めっきを施こ
し、仕上がり径０．２８〜０．３１mmの非貫通スルーホ
ール穴とした。上記の非貫通穴の深さは、電子部品搭載
面の表面外層導体３に達するまで穿孔し、非貫通導通ス
ルーホール穴とした。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the present invention, a wiring substrate 1 is made of a BT resin base material having a thickness of 0.5 mm, and has concave electrode pads which can be arranged in a two-dimensional matrix at a BGA terminal pitch of 0.65 mm. The hole diameter of 0.35 mm of the non-through hole of No. 6 was pierced by a short pulse CO 2 gas laser, and copper plating was performed to obtain a non-through through hole having a finished diameter of 0.28 to 0.31 mm. The depth of the non-through hole was set to reach the outer layer conductor 3 on the electronic component mounting surface to form a non-through conductive through-hole.
【００１６】[0016]
【実施例１】円柱形状バンプ４５Ｃ。 材質＝はんだ，Ｌ＝０．８０mm，ｄ1＝０．２５mm。Embodiment 1 A cylindrical bump 45C. Material = solder, L = 0.80mm, d 1 = 0.25mm.
【００１７】[0017]
【実施例２】角柱形状バンプ４５Ｄで六角柱形状とす
る。材質＝黄銅にスズめっき１０μｍ，Ｌ＝０．８０m
m，ｄ2＝０．３２mm。[Embodiment 2] A hexagonal prism-shaped bump 45D is used. Material = Tin plating on brass 10μm, L = 0.80m
m, d 2 = 0.32 mm.
【００１８】[0018]
【実施例３】突起付き棒形状バンプ４５Ｅ。 材質＝リン青銅線にはんだめっき１０μｍ，Ｌ＝０．８
０mm，ｄ1＝０．２５mm，ｄ3＝０．３２mm。Embodiment 3 A rod-shaped bump 45E with a projection. Material = Solder plating on phosphor bronze wire 10μm, L = 0.8
0 mm, d 1 = 0.25 mm, d 3 = 0.32 mm.
【００１９】[0019]
【実施例４】ストッパー付き棒形状バンプ４５Ｆ。 材質＝軟銅線にスズめっき７μｍ，Ｌ＝０．８０mm，ｄ
1＝０．２５mm，ｄ3＝０．３０mm，ストッパー径＝０．
４０mm。Embodiment 4 A rod-shaped bump 45F with a stopper. Material = Tin plating on mild copper wire, 7μm, L = 0.80mm, d
1 = 0.25 mm, d 3 = 0.30 mm, stopper diameter = 0.
40mm.
【００２０】[0020]
【発明の効果】以上説明したように、従来の球形状バン
プ４５や半球形状バンプ，山型形状バンプなどのバンプ
を平面的（２次元的）な電極パッド３６に仮固定した
後、次の工程以後の作業や運搬中に、バンプが位置ずれ
したり、離脱する不良が生じていたが、本発明の棒形状
のバンプ４５Ｂである円柱形状バンプ４５Ｃ，角柱形状
バンプ４５Ｄ，突起付き棒形状バンプ４５Ｅ，ストッパ
ー付き棒形状バンプ４５Ｆなどを立体的（３次元）に形
成された凹形状の電極パッド６の非貫通穴の内部に、は
め込み固定したことにより、作業中や運搬中のバンプが
位置ずれしたり、離脱する不良が大幅に低減（従来の１
／３０以下に低減）し、バンプによる、はんだ接続品質
が安定化する。As described above, after the bumps such as the conventional spherical bumps 45, hemispherical bumps, and mountain-shaped bumps are temporarily fixed to the planar (two-dimensional) electrode pads 36, the following steps are performed. During the subsequent work or transportation, the bumps were displaced or failed to separate. However, the rod-shaped bumps 45B of the present invention, ie, the column-shaped bumps 45C, the prism-shaped bumps 45D, and the rod-shaped bumps 45E with projections. The bumps 45F and the like with stoppers are fitted and fixed inside the non-through holes of the concave electrode pads 6 formed three-dimensionally (three-dimensionally). And the number of failures to separate
/ 30 or less), and the solder connection quality due to the bumps is stabilized.
【図１】本発明の実施例を説明する電子部品搭載状態の
配線基板断面図。FIG. 1 is a sectional view of a wiring board in a state where electronic components are mounted, illustrating an embodiment of the present invention.
【図２】本発明による棒形状のバンプの一例を示す正面
図と平面図。FIG. 2 is a front view and a plan view showing an example of a rod-shaped bump according to the present invention.
【図３】本発明による変形の棒形状バンプの一例を示す
正面図と平面図。FIG. 3 is a front view and a plan view showing an example of a deformed rod-shaped bump according to the present invention.
【図４】従来の電子部品搭載用の配線基板断面図。FIG. 4 is a sectional view of a conventional wiring board for mounting electronic components.
１…配線基板 ３…電子部品搭載面の表面外層導体 ４…非貫通穴内のスルーホールめっき ５…バンプ接続
側の表面外層導体 ５Ａ…バンプ接続側の表面 ６…凹形状の電極パッド
７…ソルダーレジスト ８…導電性ペースト Ｒ…球形状バンプの先端面の高
さバラツキ ３１…配線基板 ３３…上面外層導体 ３４…スルーホ
ールめっき ３５…下面外層導体 ３６…電極パッド ４０…電子部
品 ４１…バンプ本体 ４２…突起 ４３…ストッパー ４５…球形状バンプ ４５Ｂ…棒形状のバンプ ４５Ｃ…円柱形状バンプ ４
５Ｄ…角柱形状バンプ ４５Ｅ…突起付き棒形状バンプ ４５Ｆ…ストッパー付
き棒形状バンプ Ｓ…バンプ接続側の表面から凹設穴底面までの深さ Ｈ…バンプ接続側の表面からバンプの先端面のレベルま
での高さDESCRIPTION OF SYMBOLS 1 ... Wiring board 3 ... Surface outer layer conductor on electronic component mounting surface 4 ... Through-hole plating in non-through hole 5 ... Surface outer layer conductor on bump connection side 5A ... Surface on bump connection side 6 ... Recessed electrode pad
7: Solder resist 8: Conductive paste R: Variation of the height of the tip surface of the spherical bump 31: Wiring board 33: Upper surface outer layer conductor 34: Through hole plating 35: Lower surface outer layer conductor 36: Electrode pad 40: Electronic component 41: Bump body 42 ... Protrusion 43 ... Stopper 45 ... Spherical bump 45B ... Rod-shaped bump 45C ... Cylindrical bump 4
5D: prismatic bump 45E: rod-shaped bump with projection 45F: rod-shaped bump with stopper S: depth from the surface on the bump connection side to the bottom of the recessed hole H: from the surface on the bump connection side to the level of the tip surface of the bump Height
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年４月２５日[Submission date] April 25, 1997
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】全文[Correction target item name] Full text
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【書類名】 明細書[Document Name] Statement
【発明の名称】 配線基板用のバンプ部材[Title of the Invention] Bump member for wiring board
【特許請求の範囲】[Claims]
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を搭載す
る配線基板に用いられるバンプ部材、特くには、はんだ
接続用のバンプ部材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump member used for a wiring board on which electronic components are mounted, and more particularly to a bump member for solder connection.
【０００２】[0002]
【従来の技術】図４に基づいて、従来の技術を説明す
る。従来は、電子部品４０の中でも代表的な半導体素子
やＩＣフラットパッケージ等の高密度電子部品を搭載し
た配線基板３１の外部への接続端子として、つまり配線
基板の下面に外部端子として多数の電極パッド３６を２
次元の格子上交点に設け、この電極パッド３６に、はん
だ等から成る球形状バンプ（突出接点）部材４５、例え
ば、はんだボールを加熱圧着やリフローはんだ付けで形
成する方式はＢＧＡ（ｂａｌｌ・ｇｒｉｄ・ａｒｒａ
ｙ）パッケージ方式と呼ばれ、電子部品の高密度化、小
型化および、はんだ付け不良率の低減による品質の向上
が望める。2. Description of the Related Art A conventional technique will be described with reference to FIG. Conventionally, among the electronic components 40, a large number of electrode pads are used as connection terminals to the outside of the wiring board 31 on which high-density electronic components such as semiconductor elements and IC flat packages are mounted, that is, external terminals are provided on the lower surface of the wiring board. 36 to 2
A method of forming a spherical bump (projecting contact) member 45 made of solder or the like, for example, a solder ball on the electrode pad 36 by heat compression bonding or reflow soldering is provided on the electrode pad 36 at a point of intersection on a two-dimensional lattice. arra
y) It is called a package method, and it is expected that the quality of electronic components can be improved by increasing the density and miniaturizing them and by reducing the rate of defective soldering.
【０００３】まず、従来技術の電子部品搭載用の配線基
板３１は、この配線基板３１の上面外層導体３３と、下
面外層導体３５とは、スルーホールめっきで電気的に導
通されている。この下面外層導体３５の２次元の格子上
交点の所定箇所には多数の電極パッド３６が平面的に形
成され設定配置される。次に、外層導体３３，３５の必
要な接続ランドや電極パッド３６を除いて配線基板３１
の両面にソルダーレジスト７を施すことが一般的であ
る。その次に、前記の電極パッド３６の表面上に、クリ
ームはんだを塗布し、その上に球形状のバンプ部材４
５、例えば、はんだボールをのせリフローはんだ付けで
球形状バンプを形成する。また、はんだ等から成る球形
状バンプ部材４５を直接、電極パッド３６へ加熱圧着す
る方法もある。なお、はんだ接続用のバンプ部材とし
て、球形状バンプ部材４５の他に、半球形状バンプ部材
や山型形状バンプ部材も使用されることがある。First, in a conventional wiring board 31 for mounting electronic components, an upper outer conductor 33 and a lower outer conductor 35 of the wiring board 31 are electrically connected by through-hole plating. A large number of electrode pads 36 are planarly formed and set at predetermined positions at intersections of the lower surface outer conductor 35 on the two-dimensional lattice. Next, except for the connection lands and electrode pads 36 necessary for the outer layer conductors 33 and 35, the wiring board 31 is removed.
It is common to apply a solder resist 7 to both sides of the substrate. Next, cream solder is applied on the surface of the electrode pad 36, and a spherical bump member 4 is formed thereon.
5, for example, a solder ball is placed and a spherical bump is formed by reflow soldering. Alternatively, there is a method in which a spherical bump member 45 made of solder or the like is directly heated and pressed to the electrode pad 36. In addition, in addition to the spherical bump member 45, a hemispherical bump member or a mountain-shaped bump member may be used as the solder connecting bump member.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の平面的
な面実装技術では、球形状、半球形状、山型形状などの
バンプ部材を、所定箇所の電極パッド３６に取り付ける
場合、電極パッド３６の平面状の表面と球形状のバンプ
部材４５の先端面が球面形状となっている球面とが接す
るため位置決めが非常に難しくなっていた。また、球形
状のバンプ部材４５を配線基板３１に設置されている多
数の電極パッド３６に正確に位置決めをし、リフローは
んだ付けや加熱圧着する作業中や運搬中に球形状のバン
プ部材４５が位置ずれしたり、離脱して不良が発生する
ことがある。However, in the conventional planar surface mounting technology, when a bump member having a spherical shape, a hemispherical shape, a mountain shape or the like is attached to the electrode pad 36 at a predetermined position, the electrode pad 36 is not provided. Positioning is very difficult because the flat surface and the spherical surface of the spherical bump member 45 whose distal end surface is spherical are in contact with each other. In addition, the spherical bump member 45 is accurately positioned on the large number of electrode pads 36 provided on the wiring board 31, and the spherical bump member 45 is positioned during reflow soldering, thermocompression work, or transportation. In some cases, it may shift or come off, causing a defect.
【０００５】さらに、球形状のバンプ部材４５の大きさ
のばらつき、配線基板３１の反りやねじれ、クリームは
んだの塗布量などにより球形状バンプの先端面の高さの
差Ｒが生じることにより、この球形状のバンプの形成さ
れた配線基板３１を親配線基板の接続ランドにリフロー
はんだ付けする際に配線基板３１の球形状バンプと、親
配線基板の接続ランドとの接続不良が生じて、接続によ
る品質が不安定となり、接続による信頼性の確保が課題
となっていた。Further, a difference R in the height of the tip surface of the spherical bump occurs due to variations in the size of the spherical bump member 45, warpage and twist of the wiring board 31, application amount of cream solder, and the like. When the wiring board 31 on which the spherical bumps are formed is reflow-soldered to the connection lands of the parent wiring board, a connection failure occurs between the spherical bumps of the wiring board 31 and the connection lands of the parent wiring board, and the connection failure occurs. Quality has become unstable, and securing reliability through connection has been an issue.
【０００６】[0006]
【課題を解決するための手段】上記の課題を解決するた
め本発明においては、電子部品４０を搭載する配線基板
３１のバンプ接続側にある下面外層導体３５上に形成さ
れている平面的な電極パッド３６を、図１に示すように
配線基板１のバンプ接続側の表面５Ａから基材側内部
に、レーザー加工により所定の深さの非貫通穴を穿孔
し、めっきを施こし、その電極パッドの表面中央部を凹
形状にへこませて凹形状の電極パッド６を形成し、この
凹形状の電極パッド６の内へ棒形状のバンプ部材４５Ｂ
をはめ込むことにより、正しい電極パッドの位置に容易
に位置決めをすることができる。According to the present invention, there is provided a planar electrode formed on a lower surface outer layer conductor on a bump connection side of a wiring board on which an electronic component is mounted. As shown in FIG. 1, a non-through hole having a predetermined depth is formed by laser processing from the surface 5A on the bump connection side of the wiring board 1 to the inside of the substrate as shown in FIG. A concave electrode pad 6 is formed by denting the center of the surface of the electrode into a concave shape, and a rod-shaped bump member 45B is inserted into the concave electrode pad 6.
Can be easily positioned at the correct electrode pad position.
【０００７】さらに、前記の凹形状の電極パッド６の内
径は、挿入する棒形状のバンプ部材４５Ｂの外径ｄ１よ
り若干大きくし、挿入時の間隙を少なくして２次元（平
面的）の位置決め精度を高くする。また、配線基板１の
凹形状の電極パッド６のバンプ接続側の表面５Ａから凹
設穴の底面までの深さＳより、棒形状のバンプ部材４５
Ｂの長さＬは、若干長くしてバンプ接続側の表面５Ａか
ら、棒形状のバンプ部材４５Ｂの先端部までの高さＨが
突出するように、棒形状のバンプ部材４５Ｂの長さを選
定する。Furthermore, the inner diameter of the concave of the electrode pads 6, the bump member 45B of the inserted rod-shaped slightly larger than the outer diameter d 1, 2-dimensional with less clearance upon insertion of (planar) Increase positioning accuracy. The rod-shaped bump member 45 is determined from the depth S from the surface 5A on the bump connection side of the concave electrode pad 6 of the wiring board 1 to the bottom surface of the concave hole.
The length L of B is slightly increased, and the length of the rod-shaped bump member 45B is selected so that the height H from the surface 5A on the bump connection side to the tip of the rod-shaped bump member 45B protrudes. I do.
【０００８】このように、凹形状の電極パッド６の内
に、凸形状となっている棒形状のバンプ部材４５Ｂをは
め込み、リフローはんだ付けなどでバンプを形成するた
め、接続による品質が安定する。なお、バンプ接続側の
表面５Ａから突出している棒形状のバンプ部材４５Ｂの
先端部までの高さＨは、高さ方向の位置決め用治具で棒
形状のバンプ部材４５Ｂの突出する先端面の高さレベル
を平坦化することができ、この棒形状のバンプ部材４５
Ｂの先端部と親配線基板の接続ランドの間隔が一定とな
り、電子部品搭載用配線基板と親配線基板との多数のバ
ンプ接続による実装を、簡単な構成によって容易に確実
に行うことができる。As described above, since the bump-shaped bump member 45B having a convex shape is fitted into the concave electrode pad 6, and the bump is formed by reflow soldering or the like, the quality of the connection is stabilized. The height H from the surface 5A on the bump connection side to the tip of the rod-shaped bump member 45B protruding from the surface 5A on the bump connection side is determined by the height of the protruding tip surface of the rod-shaped bump member 45B using a positioning jig in the height direction. The rod-shaped bump member 45
The distance between the tip of B and the connection land of the parent wiring board becomes constant, and the mounting of the electronic component mounting wiring board and the parent wiring board by a large number of bump connections can be easily and reliably performed with a simple configuration.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。本発明において、配線基板１はガラ
スエポキシ基材，フェノール基材，合成樹脂基材と呼ば
れるＣＥＭ材，テフロン含有基材，ポリイミド樹脂基
材，ＢＴレジン（ビスマレィミド−トリアジン樹脂）基
材，変性ＢＴレジン基材またはセラミック基材などの基
材から最適なものを選択して使用する。また、配線基板
１として、片面配線基板，両面配線基板，多層配線基板
のどれでもよく、導体パターンの形成はサブトラクティ
ブ法でもアクティブ法でも限定されるものではない。さ
らに、本発明で用いられるバンプ部材の材質は、はんだ
の他に、銅，黄銅，軟銅，リン青銅，鋼材あるいは前記
材質に金属めっきしたものや樹脂に金属めっきしたもの
の中から最適な材質を選択して用いる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. In the present invention, the wiring board 1 is made of a glass epoxy base, a phenol base, a CEM material called a synthetic resin base, a Teflon-containing base, a polyimide resin base, a BT resin (bismaleimide-triazine resin) base, a modified BT resin. An optimal material is selected from a substrate such as a substrate or a ceramic substrate and used. The wiring board 1 may be any of a single-sided wiring board, a double-sided wiring board, and a multilayer wiring board, and the formation of the conductor pattern is not limited to the subtractive method or the active method. In addition, the material of the bump member used in the present invention is selected from copper, brass, soft copper, phosphor bronze, steel, metal-plated materials of the above-mentioned materials, and metal-plated resins, in addition to the solder, in addition to the solder. Used.
【００１０】まず、図１の本発明を説明する電子部品搭
載状態の配線基板の断面図において、半導体素子やＩＣ
フラットパッケージ等の電子部品４０を搭載する配線基
板１の電子部品搭載面の表面外層導体３と、バンプ接続
側の表面外層導体５を印刷法や写真法により、所定箇所
に所定の導体を形成し、次いで、バンプ接続側の表面５
Ａから基材側内部にレーザー加工により所定の深さの非
貫通穴を穿孔し、無電解めっき、電解めっきを施こし非
貫通穴内のスルーホールめっき層４を形成する。このよ
うにして、バンプ接続側の表面外層導体５に、電極パッ
ドの表面中央部が凹形状にへこませた凹形状の電極パッ
ド６を、２次元の多数の格子上交点の所定箇所に、立体
的（３次元的）に形成し、設定配置する。First, in FIG. 1 which is a cross-sectional view of a wiring board in a state where electronic components are mounted, a semiconductor element or an IC is described.
A predetermined conductor is formed at a predetermined location by printing or photographing a surface outer layer conductor 3 on the electronic component mounting surface of the wiring board 1 on which the electronic component 40 such as a flat package is mounted, and a surface outer layer conductor 5 on the bump connection side. Then, the surface 5 on the bump connection side
From A, a non-through hole having a predetermined depth is formed in the base material side by laser processing, and electroless plating or electrolytic plating is performed to form a through-hole plating layer 4 in the non-through hole. In this way, the concave electrode pad 6 in which the center of the surface of the electrode pad is dented into the concave outer surface conductor 5 on the bump connection side is placed at a predetermined position of the intersections on the two-dimensional grid. It is formed three-dimensionally (three-dimensionally) and set and arranged.
【００１１】次に、電子部品搭載面の表面外層導体３
と、バンプ接続側の表面外層体５の必要な接続ランドや
凹形状の電極パッド６を除いて配線基板１の両面にソル
ダーレジスト７を施こす。Next, the surface outer layer conductor 3 on the electronic component mounting surface
Then, solder resists 7 are applied to both surfaces of the wiring board 1 except for necessary connection lands and concave electrode pads 6 of the surface outer layer body 5 on the bump connection side.
【００１２】その次に、配線基板１のバンプ接続側に形
成した凹形状の電極パッド６の内に、導電性ペースト８
を塗布あるいは充填し、そこに、棒形状のバンプ部材４
５Ｂをはめ込み、リフローはんだ付けをするか、または
凹形状の電極パッド６の内に、はんだ付用フラックスを
塗布し、棒形状のバンプ部材４５Ｂをはめ込み乾燥させ
て接着し、仮固定する。導電性ペースト８としては、銀
ペースト，銅ペースト，はんだペースト，クリームはん
だ，銀−銅合金系ペースト，銀パラジウム合金ペース
ト，カーボンペーストなどがある。Next, the conductive paste 8 is placed in the concave electrode pads 6 formed on the bump connection side of the wiring board 1.
Is applied or filled, and there is a rod-shaped bump member 4
5B is inserted, and reflow soldering is performed, or a flux for soldering is applied to the concave electrode pad 6, and a rod-shaped bump member 45B is inserted, dried, adhered, and temporarily fixed. Examples of the conductive paste 8 include a silver paste, a copper paste, a solder paste, a cream solder, a silver-copper alloy paste, a silver palladium alloy paste, and a carbon paste.
【００１３】さらに、本発明における棒形状のバンプ部
材４５Ｂとして、図２、図３に示すように円柱形状バン
プ部材４５Ｃ，角柱形状バンプ部材４５Ｄ，変形の棒形
状バンプ部材である突起付き棒形状バンプ部材４５Ｅ，
ストッパー付き棒形状バンプ部材４５Ｆなどの種類があ
るが、図２（ａ）に示すように棒形状バンプ部材４５Ｂ
の一つである単純な形状の円柱形状バンプ部材４５Ｃに
おいて、このバンプ部材の外径ｄ１は凹形状の電極パッ
ド６の内径Ｄより若干小さくし、嵌合時に必要以上の間
隙が生じないようにする。また、両端面のコーナー端部
は位置決め挿入がしやすいように面取り加工をする。あ
るいは、棒形状のバンプ部材４５Ｂを凹形状の電極パッ
ド６へはめ込む作業の効率向上や嵌合状態の安定化を図
るため、棒形状バンプ部材４５Ｂの一つである角柱形状
のバンプ部材４５Ｄを凹形状の電極パッド６の非貫通穴
の内に圧入することができる。このことにより非貫通穴
へ導電性ペースト８や、はんだ付用フラックスを塗布す
る必要がなくなる。例えば、角柱形状のバンプ部材４５
Ｄとしては、図２（ｂ）の正面図、平面図で示してある
ように、角柱形状バンプ部材４５Ｄの多角形の角に接す
る外接径ｄ２を、配線基板１に形成されている凹形状の
電極パッド６の非貫通穴の内径Ｄより若干大きくして、
非貫通穴の内に角柱形状バンプ部材４５Ｄを圧入し、固
定することにより嵌合状態を安定化することができる。
この角柱形状のバンプ部材４５Ｄには、四角柱形状，六
角柱形状，八角柱形状のように線対称となる多角柱形状
のバンプ部材が嵌合状態が安定し良好である。Further, as the rod-shaped bump member 45B according to the present invention, as shown in FIGS. 2 and 3, a columnar bump member 45C, a prismatic bump member 45D, and a rod-shaped bump with projection which is a modified rod-shaped bump member. Member 45E,
There are types such as a rod-shaped bump member 45F with a stopper, and as shown in FIG.
In cylindrical bumps member 45C having a simple shape is one of the outer diameter d 1 of the bump member is slightly smaller than the inner diameter D of the concave of the electrode pads 6, so as not to cause undue clearance during fitting To The corners of both end faces are chamfered to facilitate positioning and insertion. Alternatively, in order to improve the efficiency of fitting the rod-shaped bump member 45B into the concave electrode pad 6 and stabilize the fitting state, the prismatic bump member 45D, which is one of the rod-shaped bump members 45B, is recessed. It can be press-fit into the non-through hole of the shaped electrode pad 6. This eliminates the need to apply the conductive paste 8 or the soldering flux to the non-through holes. For example, a prismatic bump member 45
The D, front view of FIG. 2 (b), as is shown in plan view, shaped concave of the circumscribed diameter d 2 which is in contact with the corners of the polygonal prismatic bumps member 45D, is formed on the wiring board 1 Slightly larger than the inner diameter D of the non-through hole of the electrode pad 6 of
The fitting state can be stabilized by press-fitting and fixing the prismatic bump member 45D into the non-through hole.
Polygonal pillar-shaped bump members such as quadrangular, hexagonal, and octagonal pillars, which are line-symmetric, such as a square pillar, a hexagonal pillar, and an octagonal pillar are stably fitted to the square pillar-shaped bump members 45D.
【００１４】この他に、変形の棒形状バンプ部材とし
て、図３（ａ）に示すように突起付き棒形状バンプ部材
４５Ｅがある。これは棒形状のバンプ部材４５Ｂのバン
プ部材本体４１の嵌合部分に複数の突起４２を、この突
起の外径ｄ３が凹形状の電極パッド６の内径Ｄより若干
大きくし、円周上に複数列と、嵌合部の深さ方向にあた
る円周面に複数段の突起４２を設け、この突起付き棒形
状バンプ部材４５Ｅを凹形状の電極パッド６の非貫通穴
へ圧入し、固定する。また、図３（ｂ）に示すような、
ストッパー付き棒形状バンプ部材４５Ｆは複数の突起４
２の他に、棒形状のバンプ部材４５Ｂを凹形状の電極パ
ッド６部にはめ込む際、挿入の深さを一定にするための
ストッパー４３を設けた、ストッパー付き棒形状バンプ
部材４５Ｆを、凹形状の電極パッド６の非貫通穴へ圧入
し、配線基板１のバンプ接続側の表面５Ａから棒形状の
バンプ部材の先端部までの高さＨが均一になるようにす
るストッパー付き棒形状バンプ部材４５Ｆを使用するこ
ともできる。In addition, as a modified rod-shaped bump member, there is a rod-shaped bump member 45E with a projection as shown in FIG. This is because a plurality of projections 42 are formed at the fitting portion of the bump member main body 41 of the rod-shaped bump member 45B, and the outer diameter d3 of the projections is slightly larger than the inner diameter D of the concave electrode pad 6, and a plurality of projections 42 are formed on the circumference. A plurality of projections 42 are provided on the circumferential surface in the depth direction of the row and the fitting portion, and the bar-shaped bump members 45E with the projections are pressed into the non-through holes of the concave electrode pads 6 and fixed. Also, as shown in FIG.
The bar-shaped bump member 45F with the stopper has a plurality of protrusions 4
In addition to the above, when the rod-shaped bump member 45B is fitted into the concave electrode pad 6, the stopper-provided rod-shaped bump member 45F provided with the stopper 43 for keeping the insertion depth constant is replaced with the concave-shaped bump member 45F. Is inserted into the non-through hole of the electrode pad 6 so that the height H from the surface 5A on the bump connection side of the wiring board 1 to the tip of the rod-shaped bump member becomes uniform. Can also be used.
【００１５】[0015]
【実施例】本発明における実施例として、配線基板１は
板厚０．５ｍｍのＢＴレジン基材を使用し、端子ピッチ
０．６５ｍｍで２次元のマトリクス状に配列できる凹形
状の電極パッド６の非貫通穴の穴径０．３５ｍｍを短パ
ルスＣＯ２ガスレーザーで穿孔し、銅めっきを施こし、
仕上がり径０．２８〜０．３１ｍｍの非貫通スルーホー
ル穴とした。上記の非貫通穴の深さは、電子部品搭載面
の表面外層導体３に達するまで穿孔し、非貫通導通スル
ーホール穴とした。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the present invention, a wiring board 1 is made of a BT resin base material having a thickness of 0.5 mm, and has a terminal pitch of 0.65 mm. The hole diameter of the non-through hole 0.35 mm is pierced with a short pulse CO 2 gas laser, and copper plating is applied.
A non-through through hole having a finished diameter of 0.28 to 0.31 mm was formed. The depth of the non-through hole was set to reach the outer layer conductor 3 on the electronic component mounting surface to form a non-through conductive through-hole.
【００１６】[0016]
【実施例１】円柱形状バンプ部材４５Ｃ。 材質＝はんだ，Ｌ＝０．８０ｍｍ，ｄ１＝０．２５ｍ
ｍ。Embodiment 1 A columnar bump member 45C. Material = solder, L = 0.80mm, d 1 = 0.25m
m.
【００１７】[0017]
【実施例２】角柱形状バンプ部材４５Ｄで六角柱形状と
する。材質＝黄銅にスズめっき１０μｍ，Ｌ＝０．８０
ｍｍ，ｄ２＝０．３２ｍｍ。[Embodiment 2] A hexagonal prism-shaped bump member 45D is used. Material = Tin plating on brass 10μm, L = 0.80
mm, d 2 = 0.32 mm.
【００１８】[0018]
【実施例３】突起付き棒形状バンプ部材４５Ｅ。 材質＝リン青銅線にはんだめっき１０μｍ，Ｌ＝０．８
０ｍｍ，ｄ１＝０．２５ｍｍ，ｄ３＝０．３２ｍｍ。Embodiment 3 A rod-shaped bump member 45E with a projection. Material = Solder plating on phosphor bronze wire 10μm, L = 0.8
0 mm, d 1 = 0.25 mm, d 3 = 0.32 mm.
【００１９】[0019]
【実施例４】ストッパー付き棒形状バンプ部材４５Ｆ。 材質＝軟銅線にスズめっき７μｍ，Ｌ＝０．８０ｍｍ，
ｄ１＝０．２５ｍｍ，ｄ３＝０．３０ｍｍ，ストッパー
径＝０．４０ｍｍ。Embodiment 4 A rod-shaped bump member 45F with a stopper. Material = Tin plating on soft copper wire, L = 0.80mm,
d 1 = 0.25mm, d 3 = 0.30mm, stopper diameter = 0.40mm.
【００２０】[0020]
【発明の効果】以上説明したように、従来の球形状バン
プ部材４５や半球形状バンプ部材，山型形状バンプ部材
などのバンプを平面的（２次元的）な電極パッド３６に
仮固定した後、次の工程以後の作業中や運搬中に、バン
プ部材が位置ずれしたり、離脱する不良が生じていた
が、本発明の棒形状のバンプ部材４５Ｂである円柱形状
バンプ部材４５Ｃ，角柱形状バンプ部材４５Ｄ，突起付
き棒形状バンプ部材４５Ｅ，ストッパー付き棒形状バン
プ部材４５Ｆなどを立体的（３次元）に形成された凹形
状の電極パッド６の非貫通穴の内に、はめ込み固定した
ことにより、作業中や運搬中のバンプ部材が位置ずれし
たり、離脱する不良が大幅に低減（従来の１／３０以下
に低減）し、バンプを使用する、はんだ接続による品質
が安定化する。As described above, after the bumps such as the conventional spherical bump member 45, the hemispherical bump member, and the mountain-shaped bump member are temporarily fixed to the planar (two-dimensional) electrode pad 36, During the operation after the next step or during transportation, there was a defect that the bump member was displaced or detached. However, the rod-shaped bump member 45B of the present invention is a columnar bump member 45C, a prismatic bump member. 45D, a rod-shaped bump member 45E with a projection, a rod-shaped bump member 45F with a stopper, and the like are fitted into and fixed in the non-through holes of the three-dimensionally (three-dimensionally) concave electrode pad 6. The defect that the bump member is displaced or detached during or during transportation is greatly reduced (reduced to 1/30 or less of the conventional one), and the quality of the solder connection using the bump is stabilized.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明を説明する電子部品搭載状態の配線基板
断面図。FIG. 1 is a cross-sectional view of a wiring board in a state where electronic components are mounted, explaining the present invention.
【図２】本発明による棒形状のバンプ部材の一例を示す
正面図と平面図。FIG. 2 is a front view and a plan view showing an example of a rod-shaped bump member according to the present invention.
【図３】本発明による変形の棒形状バンプ部材の一例を
示す正面図と平面図。FIG. 3 is a front view and a plan view showing an example of a modified rod-shaped bump member according to the present invention.
【図４】従来の電子部品搭載用の配線基板断面図。FIG. 4 is a sectional view of a conventional wiring board for mounting electronic components.
【符号の説明】 １…配線基板 ３…電子部品搭載面の表面外層導体 ４…非貫通穴内のスルーホールめっき層 ５…バンプ接
続側の表面外層導体 ５Ａ…バンプ接続側の表面 ６…凹形状の電極パッド
７…ソルダーレジスト ８…導電性ペースト Ｒ…バンプの先端面の高さの差 ３１…配線基板 ３３…上面外層導体 ３５…下面外層
導体 ３６…電極パッド ４０…電子部品 ４１…バンプ部材
本体 ４２…突起 ４３…ストッパー ４５…球形状部材バンプ ４５Ｂ…棒形状のバンプ部材 ４５Ｃ…円柱形状バンプ
部材 ４５Ｄ…角柱形状バンプ部材 ４５Ｅ…突起付き棒形状
バンプ部材 ４５Ｆ…ストッパー付き棒形状バンプ部材 Ｓ…バンプ接続側の表面から凹設穴底面までの深さ Ｈ…バンプ接続側の表面からバンプ部材の先端部までの
高さ[Description of Signs] 1 ... Wiring board 3 ... Outer surface layer conductor on electronic component mounting surface 4 ... Through hole plating layer in non-through hole 5 ... Surface outer layer conductor on bump connection side 5A ... Bump connection side surface 6 ... Concave shape Electrode pad
7: Solder resist 8: Conductive paste R: Difference in height of tip surface of bump 31: Wiring board 33: Upper outer conductor 35: Lower outer conductor 36: Electrode pad 40: Electronic component 41: Bump member body 42: Projection 43 ... Stopper 45 ... Spherical member bump 45B ... Bar-shaped bump member 45C ... Cylindrical bump member 45D ... Square column-shaped bump member 45E ... Bar-shaped bump member with a projection 45F ... Bar-shaped bump member with a stopper S ... Bump connection side Depth from the surface to the bottom of the concave hole H: Height from the surface on the bump connection side to the tip of the bump member
Claims (4)
る、はんだ接続用のバンプにおいて、棒形状であること
を特徴とする配線基板用のバンプ。1. A bump for a wiring board, which is used in a wiring board on which an electronic component is mounted and has a rod shape.
形状，角柱形状であり、特に角柱形状バンプ（４５Ｄ）
は挿入穴の内部に圧入して、はめ込むことを特徴とする
配線基板用のバンプ。2. The bump according to claim 1, wherein the bump has a columnar shape or a prismatic shape.
Is a bump for a wiring board, which is press-fitted into an insertion hole and fitted.
状のバンプ本体（４１）に突起（４２）やストッパー
（４３）を有するバンプで、挿入穴の内部に圧入して、
はめ込むことを特徴とする配線基板用のバンプ。3. The bump shape according to claim 1, wherein the rod-shaped bump body (41) has a projection (42) and a stopper (43) and is press-fitted into the insertion hole.
A bump for a wiring board, which is to be fitted.
質がはんだの他に、銅，黄銅，軟銅，リン青銅，鋼材あ
るいは前記材質に金属めっきをしたものや樹脂に金属め
っきをしたものである配線基板用のバンプ。4. The bump according to claim 1, wherein the material of the bump is copper, brass, soft copper, phosphor bronze, steel, a metal plated on said material, or a metal plated resin, in addition to solder. Bump for wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9117425A JPH10303359A (en) | 1997-04-22 | 1997-04-22 | Bump member for wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9117425A JPH10303359A (en) | 1997-04-22 | 1997-04-22 | Bump member for wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10303359A true JPH10303359A (en) | 1998-11-13 |
Family
ID=14711334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9117425A Pending JPH10303359A (en) | 1997-04-22 | 1997-04-22 | Bump member for wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10303359A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286677A (en) * | 2005-03-31 | 2006-10-19 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
| CN117107648A (en) * | 2023-08-22 | 2023-11-24 | 哈尔滨工业大学 | Closure auxiliary device for steel tube concrete arch bridge structure |
-
1997
- 1997-04-22 JP JP9117425A patent/JPH10303359A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286677A (en) * | 2005-03-31 | 2006-10-19 | Renesas Technology Corp | Semiconductor device and its manufacturing method |
| JP4551255B2 (en) * | 2005-03-31 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| CN117107648A (en) * | 2023-08-22 | 2023-11-24 | 哈尔滨工业大学 | Closure auxiliary device for steel tube concrete arch bridge structure |
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