JPH10300452A - Inspection device and method for semiconductor package measuring system and calibrating jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for inspection of a semiconductor package measuring system, capable of rapidly and efficiently inspecting the measuring system using a stable index of judgment in determining, using a calibrating jig, whether or not the semiconductor package measuring system is normal, and provide the calibrating jig. SOLUTION: A measuring system 12 measures a calibrating jig 11 having three reference balls arranged inside or outside the matrix of each ball, and an imaginary-plane calculating part 13b calculates an imaginary plane on the basis of data about the three reference balls measured by the measuring system 12; a distance calculating part 13c calculates the distance between the imaginary plane and each ball, and on the basis of the distance a measuring-system judging part 13d determines variation of the measuring system 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention measures a calibration jig having a plurality of calibration members of a predetermined size arranged in a member area by a measurement system of a semiconductor package, and based on the measurement result of the measurement system. Inspection apparatus of a semiconductor package measurement system for inspecting whether the measurement system is normal based on the calculated distance between the plane and each calibration member, a measurement method and a calibration jig,
The present invention relates to an inspection apparatus, a method, and a calibration jig for a semiconductor package measurement system capable of quickly and efficiently obtaining a stable determination index.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor package called a BGA (Ball Grid Array) or a CSP (Chip Size Package) (hereinafter collectively referred to as a “BGA package”).
As shown in the front view of FIG. 8A and the side view of FIG. 8B, solder is arranged in a matrix on the package as connection terminals.

Here, since the solder on the BGA package greatly affects the degree of bonding with the substrate mounted on the package, the height of the solder is carefully measured using a measuring system to determine whether the package is proper or not. You will confirm.

However, if the measurement system undergoes aging or the like, it becomes impossible to determine whether the measurement result by the measurement system is a variation of the solder itself or a variation by the measurement system. Therefore, it is necessary to determine whether the measurement system is normal or not. It is necessary to confirm.

For this reason, conventionally, a calibration jig in which steel balls (hereinafter, referred to as "balls") are provided on a flat plate is prepared in advance, and the calibration jig is measured based on a measurement result obtained by a measurement system. In many cases, it is checked whether the measurement system is normal.

More specifically, the height of each ball on the calibration jig is measured by a measuring system, and a virtual plane is calculated based on three balls satisfying a predetermined condition. The validity of the measurement system is determined based on the distance.

Note that this virtual plane is defined as a plane on which all the lowest points of the other terminals exist on the main body side among the geometric planes passing through the lowest points of any three terminals (balls). The condition is that the center of gravity of the position is included inside or on the side of the triangle formed by these three points.

[0008]

However, since the balls arranged on the calibration jig have substantially the same size, the three balls constituting the virtual plane are:
It is not always the same and will be different each time the measurement is performed.

As described above, if the three balls forming the virtual plane calculated at a certain point in time are different from the three balls forming the virtual plane calculated thereafter, naturally, the distance between the virtual plane and each ball is different. Also differ in the distance of
It is not possible to verify the validity of the measurement system by comparing the calculation results in time series.

The three balls forming such a virtual plane are not known until a calibration jig is actually prepared and the height of each ball is measured, and as a result, the three balls are formed. An unstable ball arrangement may occur in which the area of the triangle is small.

From these facts, when confirming whether or not the measurement system is normal using the calibration jig, the flexibility based on factors other than the measurement system is reduced as much as possible, and the stability of the measurement system is reduced. An important issue is how to efficiently obtain judgment indices.

In view of the above, the present invention solves the above-mentioned problems and, when checking whether or not the measurement system of a semiconductor package is normal using a calibration jig, quickly and efficiently uses a stable judgment index. It is an object of the present invention to provide an inspection device, an inspection method, and a calibration jig for a semiconductor package measurement system capable of inspecting a measurement system in a specific manner.

[0013]

In order to achieve the above object, a first aspect of the present invention is a method for measuring a semiconductor package by using a calibration jig having a plurality of calibration members of a predetermined size arranged in a member area. In a semiconductor package measurement system inspection device for measuring whether the measurement system is normal based on the distance between the plane and each calibration member calculated based on the measurement result of the measurement system, A plane calculating means for calculating the plane based on the height of at least three reference members larger than the calibration member disposed inside or outside the member area of the jig; and a plane calculated by the calculating means. The distance calculating means for calculating the distance to the calibration member, and based on the distance calculated by the distance calculating means, and configured to include an inspection means for inspecting whether the measurement system is normal, the following, The effect shown It is obtained.

1) immobilizing a calibration member forming a plane,
This makes it possible to inspect the measurement system based on the stable determination index.

2) Since the process for specifying the calibration member forming the plane is not required, the inspection process can be performed quickly.

According to a second aspect of the present invention, the inspection means compares the distance calculated by the distance calculation means with a predetermined value held in advance to determine whether the measurement system is normal. Because of this, it is possible to perform absolute evaluation of the measurement system.

In the third invention, the inspection means is configured to compare the plurality of distances calculated by the distance calculation means with each other to check whether or not the measurement system is normal. In addition, it is possible to confirm the degree of variation of the measurement system.

According to a fourth aspect of the present invention, the inspection means compares a plurality of distances calculated at predetermined time intervals by the distance calculation means to inspect whether or not the aging has occurred in the measurement system. With such a configuration, it is possible to confirm the variation of the measurement system viewed in time series.

According to a fifth aspect of the present invention, the plane calculating means is configured such that the plane calculating means is based on heights of three reference members which are larger than the calibration members disposed inside or outside the member area of the calibration jig. Since the virtual plane is calculated, the inspection of the measurement system using the three reference members can be performed.

According to a sixth aspect of the present invention, the plane calculating means is configured to adjust the height of three or more reference members larger than the calibration member disposed inside or outside the member area of the calibration jig. Since the least-squares plane is calculated based on this, it is possible to perform a more stable measurement system inspection using three or more reference members.

According to a seventh aspect of the present invention, a calibration jig in which a plurality of calibration members of a predetermined size are arranged in a member area is measured by a measurement system of a semiconductor package, and based on a measurement result of the measurement system. In a semiconductor package measurement system inspection method for inspecting whether or not the measurement system is normal based on a distance between the calculated plane and each calibration member, the calibration member is provided inside or outside a member area of the calibration jig. Also arranges at least three large reference members, calculates the plane based on the measurement result of the three reference members measured by the measurement system, calculates the distance between the calculated plane and each calibration member, Since it is configured to check whether the measurement system is normal based on the calculated distance, the following effects can be obtained.

1) immobilizing a calibration member forming a plane,
This makes it possible to inspect the measurement system based on the stable determination index.

2) Since the process of specifying the calibration member forming the plane is not required, the inspection process can be performed quickly.

According to an eighth aspect of the present invention, there is provided a calibration jig used for inspecting a semiconductor package measurement system in which a plurality of calibration members having a predetermined size are arranged in a member region, wherein at least a calibration jig larger than the plurality of calibration members is provided. With the configuration having three reference members, it is possible to always keep the calibration member forming the plane constant.

According to a ninth aspect of the present invention, there is provided a calibration jig for inspecting a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member area, wherein the calibration jig is larger than the plurality of calibration members. Since the three reference members are arranged in the member region and at a position where the area of the triangle formed by the three reference members is maximized, the calibration member forming the plane is unstable. Can be avoided.

According to a tenth aspect of the present invention, there is provided a calibration jig used for inspecting a semiconductor package measurement system in which a plurality of calibration members having a predetermined size are arranged in a member area, wherein at least a calibration jig larger than the plurality of calibration members is provided. Since the three reference members are arranged outside the member region, it is possible to evaluate the in-plane distribution of all the calibration members in the member region as measurement targets.

According to an eleventh aspect of the present invention, there is provided a calibration jig used for inspecting a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member area, wherein at least a larger calibration member than the plurality of calibration members is provided. Since the three reference members are arranged on the outer periphery of the member region, it is possible to obtain a stable least square plane.

[0028]

Embodiments of the present invention will be described below with reference to the drawings. Note that the first embodiment shows a case where a measurement system of a semiconductor package (hereinafter simply referred to as a “measurement system”) is inspected using a virtual plane, and the least square plane is used in the second embodiment. 5 shows a case where a measurement system is inspected by using.

FIG. 1 is a diagram showing a configuration of a three-dimensional shape measuring apparatus used in the first embodiment.

The three-dimensional shape measuring device 13 shown in FIG. 1 uses a height jig obtained from the measuring system 12 to generate a calibration jig 11.
Is a device for calculating the distance between each ball and the virtual plane, and the virtual plane is calculated by using three reference balls provided on the surface of the calibration jig 11.

Here, the reference balls are three balls that are higher than the other balls provided on the calibration jig, and the virtual plane is calculated based on the reference balls.

That is, since these three reference balls always satisfy the condition of the ball forming the virtual plane, the virtual plane is formed based on the three reference balls even if the virtual plane is calculated at different times. For this reason, it is possible to prevent variations in the judgment index when inspecting the measurement system 12.

Further, by arranging the three reference balls so that the triangles formed are as large as possible, it is possible to prevent the three balls forming the virtual plane from having an unstable ball arrangement.

As shown in FIG. 1, the three-dimensional shape measuring device 13 includes an interface unit 13a, a virtual plane calculating unit 13b, a distance calculating unit 13c, and a measuring system determining unit 13d.
Consists of

The interface unit 13a is connected to the measurement system 12
And outputs data relating to the three reference balls to the virtual plane calculating unit 13b, and outputs data relating to the other balls to the distance calculating unit 13c.

The virtual plane calculation unit 13b is a processing unit that calculates a virtual plane from measurement data relating to the heights of three reference balls, and outputs data indicating the calculated virtual plane to the distance calculation unit 13c.

The distance calculating unit 13c is a virtual plane calculating unit 13
b and the interface unit 13
This is a processing unit that calculates the distance between each ball and the height received from a and outputs it to the measurement system determination unit 13d.

The measurement system determination unit 13d includes a distance calculation unit 13c
This is a processing unit that determines the variation of the measurement system 12 based on the distance data received from the PC, and specifically has three determination functions.

That is, the first function is an absolute determination function for comparing a predetermined value stored in advance with data received from the distance calculator 13c to make an absolute determination of the measurement system. The eye function is a relative determination function of comparing data repeatedly output at the same time from the distance calculation unit 13c to determine a variation in the measurement system.
The third function is a time series determination function for determining a measurement system in a time series based on data output from the distance calculation unit 13c at predetermined time intervals.

When using the absolute judgment function, it is necessary to previously store data to be compared in the measurement system judgment unit 13d. When using the relative judgment function, the same calibration judge is required. A mechanism for measuring the jig 11 a plurality of times is required, and a mechanism for measuring the calibration jig 11 at predetermined time intervals is required when the time series determination function is used.

As described above, the three-dimensional measuring device 13 is configured so that three reference balls are arranged at predetermined positions in advance and the virtual plane is calculated based on the height of the reference balls. The measurement system 12 is based on a stable judgment index always based on the ball forming the virtual plane.
Can be inspected quickly and efficiently.

Next, the three-dimensional shape measuring device 13 shown in FIG.
Will be described.

FIG. 2 shows a three-dimensional shape measuring apparatus 1 shown in FIG.
13 is a flowchart illustrating a processing procedure of No. 3;

As shown in the figure, when the three-dimensional shape measuring device 13 acquires the position and height of each ball measured by the measuring system 12 (step 201), the virtual plane calculating unit 1
3b calculates a virtual plane from the heights of the three reference balls (step 202), and outputs the calculation result to the distance calculation unit 13c.

Next, the distance calculation unit 13c determines the distance between the data on the virtual plane and the height of each ball (step 203), and the measurement system determination unit 13d determines the degree of variation of the measurement system 12 based on this distance. Judgment (Step 20)
4) Output the determination result (step 205).

Next, the arrangement of the reference balls of the calibration jig 11 shown in FIG. 1 will be specifically described.

FIG. 3 is a view showing an example of the arrangement of reference balls of the calibration jig 11 shown in FIG.

As shown in the figure, the reference ball 31 is arranged in the second column on the upper side, the reference ball 32 is arranged in the third column on the lower side, and the reference ball 33 is arranged in the third row on the right side. doing.

That is, the triangle formed by the reference balls 31, 32 and 33 is maximized within the range of a matrix of balls (hereinafter simply referred to as "matrix") arranged on the calibration jig 11. Set the reference ball. However, in this example, three reference balls 31,
Of the reference balls 32 and 33, none of the reference balls is arranged so as to be present on the same side as the other reference balls.

As described above, by making the triangle formed by the three reference balls as large as possible within the range of the matrix of the calibration jig 11, the virtual plane formed by the three reference balls can be stabilized. .

FIG. 4 is a diagram showing another example of the arrangement of the reference balls.

As shown in the figure, here, the reference balls 41, 42 and 43 are arranged outside the range of the matrix of the calibration jig, and the triangle formed by the three reference balls is increased. .

As described above, by setting the three reference balls outside the range of the matrix of the calibration jig, the triangle formed by the three reference balls can be made larger than in the case shown in FIG. As a result, the variation in the inclination of the virtual plane can be reduced, and the in-plane distribution of all the balls in the matrix can be evaluated.

In the above series of explanations, balls are arranged at all grid points on the matrix. However, each ball can be arranged in other shapes. For example, as shown in FIG. 5, each ball may be arranged in the shape of a "field", or may be arranged only around the matrix. In this case, the three reference balls are arranged inside and outside the matrix as in the case shown in FIGS.

As described above, in the first embodiment, three reference balls are arranged inside or outside the matrix of the calibration jig 11, and the height of the three reference balls measured by the measurement system 12 is determined. Since the virtual plane is calculated based on the measurement data and the variation of the measurement system 12 is determined based on the distance between the virtual plane and each ball, the following effects can be obtained.

1) At any point in time of measurement, the three balls forming the virtual plane are fixed, and the measurement system 12 can be inspected based on a stable judgment index.

2) Since a process for specifying a combination of three balls forming a virtual plane is not required, the process can be performed quickly.

3) By arranging the triangle formed by the three reference balls so as to be as large as possible, it is possible to prevent the three balls constituting the virtual plane from having an unstable ball arrangement.

The first embodiment has been described above.

Next, a second embodiment using a least squares plane will be described.

FIG. 6 is a diagram showing a configuration of a three-dimensional shape measuring apparatus used in the second embodiment.

The three-dimensional shape measuring device 62 shown in FIG. 6 is a device for calculating the distance between each ball of the calibration jig 11 and the least square plane using the data acquired from the measuring system 12. The square plane is calculated using a plurality of reference balls provided on the surface of the calibration jig 61.

That is, in the three-dimensional shape measuring apparatus 62, a plurality of reference balls having a height higher than that of the other balls are previously arranged at predetermined positions of the calibration jig 61, and the minimum number of the reference balls is determined by using these reference balls. Identify the square plane.

For this reason, similarly to the first embodiment using the virtual plane, the balls forming the least square plane are always the same, and the dispersion of the measurement system 12 is quickly and efficiently determined using a stable judgment index. Can be determined.

As shown in FIG. 6, the three-dimensional shape measuring apparatus 62 has a configuration in which a least square plane calculating section 63 is provided in place of the virtual plane calculating section 13b of the three-dimensional shape measuring apparatus 13 shown in FIG. Becomes The units other than the least-squares plane calculating unit 63 have the same functions as the respective units shown in FIG. 1, and thus detailed descriptions thereof will be omitted.

The least-squares plane calculator 63 calculates the calibration jig 11
Minimum height of two or more reference balls arranged in advance
The processing unit calculates the reference plane by applying the multiplication method, and outputs data indicating the calculated reference plane, that is, the least-squares plane, to the distance calculation unit 13c. However, in order to obtain the least-squares plane, there is a condition that there are three or more reference balls that do not exist on the same straight line.

That is, in this embodiment, instead of creating a least-squares plane from uncertain factors having different heights each time, a plurality of reference balls of a known size arranged in advance at predetermined positions are used. Is used to create a least-squares plane.

As described above, the three-dimensional measuring device 62 is configured such that three or more reference balls are disposed at predetermined positions in advance, and the least square plane is calculated based on the height of the reference balls. ing.

Next, the arrangement of the reference balls of the calibration jig 61 shown in FIG. 6 will be specifically described.

FIG. 7 is a view showing an example of the arrangement of the reference balls of the calibration jig 61 shown in FIG.

FIG. 7A shows a case where reference balls are arranged at the periphery of the matrix, and FIG. 7B shows a case where reference balls and other balls are alternately arranged every other ball. This shows a case where they are arranged.

As described above, when such a least-squares plane is obtained, the number of reference balls is not limited, so that a desired number of reference balls can be arranged at desired positions.

Since the least-squares plane becomes more stable as the number of reference balls increases, it is possible to determine the variation of the measurement system 12 in detail. It doesn't matter if you place them.

As described above, in the second embodiment, three or more reference balls are arranged inside or outside the matrix of the calibration jig 61, and the data relating to each reference ball measured by the measurement system 12 is obtained. A least squares plane is calculated based on the least squares plane, and the measurement system 12
Is determined and the distance between the least-squares plane and each ball is calculated, so that the following effects can be obtained.

1) A plurality of balls forming the least-squares plane can be fixed at any measurement point, so that a stable judgment index can be provided.

2) Since the process for specifying the ball forming the least square plane is not required, the process can be performed quickly.

In the first and second embodiments, the case where each ball and each reference ball are spherical is described. However, the present invention is not limited to this. Alternatively, the present invention can be applied to a case where a mark is placed instead of a ball.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a three-dimensional shape measuring apparatus used in a first embodiment.

FIG. 2 is a flowchart showing a processing procedure of the three-dimensional shape measuring apparatus shown in FIG.

FIG. 3 is a view showing an example of an arrangement of three reference balls of the calibration jig shown in FIG. 1;

FIG. 4 is a view showing another example of the arrangement of the reference balls of the calibration jig shown in FIG. 1;

FIG. 5 is a diagram showing an example in which balls are arranged in a cross on a calibration jig.

FIG. 6 is a diagram showing a configuration of a three-dimensional shape measuring apparatus used in a second embodiment.

FIG. 7 is a view showing an example of the arrangement of reference balls of the calibration jig shown in FIG. 6;

FIG. 8 is a diagram showing an example of a conventional calibration jig.

[Explanation of symbols]

11: calibration jig, 12: measurement system, 13: three-dimensional shape measurement device, 13a: interface unit, 13b: control unit, 13c: virtual plane calculation unit, 13d: distance calculation unit,
13e: Measurement system determination unit, 31, 32, 33, 41, 4
2, 43: Reference ball, 61: Calibration jig, 62: Three-dimensional shape measuring device, 63: Least square plane calculation unit

Claims (11)

[Claims] A calibration jig in which a plurality of calibration members of a predetermined size are arranged in a member area is measured by a measurement system of a semiconductor package, and a plane calculated based on a measurement result of the measurement system and each calibration surface are measured. In a semiconductor package measurement system inspection apparatus for inspecting whether or not the measurement system is normal based on a distance from a member, the inspection device is larger than the calibration member disposed inside or outside a member area of the calibration jig. Plane calculating means for calculating the plane based on the heights of at least three reference members, distance calculating means for calculating the distance between the plane calculated by the calculating means and each calibration member, and distance calculating means An inspection means for inspecting whether or not the measurement system is normal based on the distance. 2. The method according to claim 1, wherein the inspection unit compares the distance calculated by the distance calculation unit with a predetermined value held in advance to check whether the measurement system is normal. The inspection device for a semiconductor package measurement system according to claim 1. 3. The apparatus according to claim 1, wherein the inspection unit compares the plurality of distances calculated by the distance calculation unit with each other to check whether the measurement system is normal. Inspection equipment for semiconductor package measurement system. 4. The apparatus according to claim 1, wherein the inspection unit compares a plurality of distances calculated at predetermined time intervals by the distance calculation unit to check whether the measurement system has changed over time. Item 2. An inspection device for a semiconductor package measurement system according to Item 1. 5. The plane calculating means calculates a virtual plane based on heights of three reference members larger than the calibration member disposed inside or outside a member area of the calibration jig. The inspection apparatus for a semiconductor package measurement system according to claim 1, wherein: 6. The least-squares plane based on the height of three or more reference members larger than the calibration member disposed inside or outside the member area of the calibration jig. 2. The inspection apparatus for a semiconductor package measurement system according to claim 1, wherein: 7. A calibration jig in which a plurality of calibration members of a predetermined size are arranged in a member region is measured by a measurement system of a semiconductor package, and a plane calculated based on a measurement result of the measurement system and each calibration surface are measured. A method of inspecting a semiconductor package measurement system for inspecting whether or not the measurement system is normal based on a distance from a member, wherein at least three standards larger than the calibration member inside or outside a member area of the calibration jig. A member is disposed, the plane is calculated based on the measurement result of the three reference members measured by the measurement system, a distance between the calculated plane and each calibration member is calculated, and the distance is calculated based on the calculated distance. An inspection method for inspecting whether the measurement system is normal or not. 8. A calibration jig for use in inspection of a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member region, comprising at least three reference members larger than the plurality of calibration members. A calibration jig characterized by the above-mentioned. 9. A calibration jig for use in inspection of a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member area, wherein three reference members larger than the plurality of calibration members are provided. A calibration jig disposed in a member region and at a position where the area of a triangle formed by the three reference members is maximized. 10. A calibration jig used for inspection of a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member area, wherein at least three reference members larger than the plurality of calibration members are used. A calibration jig disposed outside a member region. 11. A calibration jig used for inspection of a semiconductor package measurement system in which a plurality of calibration members of a predetermined size are arranged in a member area, wherein at least three reference members larger than the plurality of calibration members are used. A calibration jig arranged on an outer periphery of a member region.