JPH10295087A - Inverter equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent failures or misoperation by forming a slope in a passage so as to narrow the passage as cooling wind moves from a cooling fan to a cooling fin thereby efficiently cooling the main circuit portion and logic portion of an inverter, and protecting the logic portion from the heat generated from a main circuit portion. SOLUTION: Almost one-half or more of heat generated at the main circuit portion 4 is discharged to the outside by a cooling fin 3 and a cooling fan 6 in a case 1, but the remainder is discharged to the inside of the case 1 and raises the air temperature inside the inverter. A logic portion 5 rises above the self-heated temperature due to the heat discharged from the main circuit portion 4 to the case 1. However, by providing an air-duct type shield plate 7 between the main circuit portion 4 and the logic portion 5, spaces in the main circuit portion 4 and the logic portion 5 are completely separated, and further heat interruption is given by an insulating member 9 at the side of the main circuit portion 4, so that the heat in the main circuit portion 4 is blocked. Since outer air flows through an air duct 7c inside the air-duct type shield plate 7, an electrically conductive material 8 is cooled and, heat on the side of a logic portion 5 can be discharged also.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device such as an inverter having a low heat resistance component such as a main circuit portion serving as a heat source, a logic portion, a smoothing capacitor and the like in the same housing, and particularly to a closed or full device. The present invention relates to a mounting structure suitable for improving the reliability of a device having a closed structure.

[0002]

2. Description of the Related Art An inverter generally comprises a main circuit section and a logic section. In the conventional inverter, the main circuit portion and the logic portion are simply housed in one housing as disclosed in Japanese Utility Model Application Laid-Open No. 153499/1986. The main circuit generates a large amount of heat and is generally directly mounted on a cooling fan for air cooling. The logic unit generates a small amount of heat but is susceptible to heat, so the ambient air temperature must be lowered. When the logic section and the main circuit section are in the same housing, the air around the logic section is overheated by the main circuit section that generates a large amount of heat, and the temperature of the logic section increases. In order to prevent the temperature from exceeding the allowable temperature of the logic unit, the cooling fan of the main circuit unit is enlarged, or the cooling fan is attached to increase the cooling capacity so that the heat generation of the main circuit unit is reduced. In addition, the main circuit section performs a switching operation and thus becomes a noise source for the logic section. In order to prevent this electromagnetic noise, a space is provided between the main circuit section and the logic section, and an electromagnetic shielding plate is arranged to prevent noise malfunction of the logic section.

[0003] Other related cooling structures are disclosed in Japanese Patent Application Laid-Open Nos. 61-47699 and 61-6799.
No. 4 is mentioned.

[0004]

However, the above prior art has not been considered in that the cooling fins for radiating the heat generated by the inverter efficiently use the cooling air blown by the cooling fan. . For this reason, there was a problem in miniaturization.

An object of the present invention is to provide a main circuit section of an inverter,
Cooling the logic part effectively, protecting the logic part from heat generated from the main circuit part, preventing their failure and malfunction,
An object of the present invention is to provide a highly reliable inverter.

An object of the present invention is to provide a main circuit section of an inverter,
Especially cool the rectifier and switching elements effectively,
An object of the present invention is to provide a highly reliable inverter.

An object of the present invention is to provide a highly reliable inverter that effectively cools a smoothing capacitor, extends the life of the smoothing capacitor, and provides a highly reliable inverter.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an inverter device having a main circuit unit serving as a heat source, a logic unit, and a smoothing capacitor in the same housing. A cooling fin to which a main circuit component is attached; and a cooling fan for sending cooling air to the cooling fin, wherein a slope is formed in the passage so that the passage becomes narrower as the cooling air flows from the cooling fan toward the cooling fin. In an inverter device having a main circuit portion serving as a heat source, a logic portion, and a smoothing capacitor in the same housing, a cooling means for cooling the main circuit portion is formed by aluminum die casting. Cooling fins, and after the gate of the aluminum injection port formed at the time of aluminum die casting to the cooling fins, in the cooling fins adjacent to each other Is achieved by the inverter apparatus characterized by position of There are arranged offset.

[0009] With the above configuration, the cooling air from the cooling fan can effectively cool the elements of the heat-generating component, which are particularly high in temperature, and suppress the temperature rise of the inverter device.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

A first embodiment of the present invention will be described with reference to FIGS.

The inverter is a rectifier 10 as shown in FIG.
6, a main circuit section 4 including a smoothing capacitor 103 and a switching element 104 as a control element, and a logic section 5 for controlling the main circuit section 4 as main components. Rectifier 10
The primary side 6 is connected to an AC power supply 111 (in this embodiment, a three-phase AC power supply), and the secondary side is connected to the primary side of the smoothing capacitor 103 and the switching element 104. In this embodiment, the smoothing capacitor 103 is composed of two capacitors 1
03a and 103b are connected in parallel. The secondary side of the switching element 104 is connected to a load M such as a motor. The logic unit 5 is connected to the main circuit unit 4 via the cable 12, and controls the switching element 104 while detecting the voltage and current on the primary side of the switching element 104.
In addition, a cooling fan is connected to the primary side of the rectifying element 106.

In this embodiment, a shielding plate 7 as a shielding member is provided between the main circuit unit 4 and the logic unit 5 so that a gap is minimized so that air does not flow into each other and a heat insulating effect is provided on the shielding plate 7. In order to provide a magnetic shielding effect, the main circuit side is composed of an insulating material 9 and the logic part side is composed of an iron plate 8 or the like, and a refrigerant passage is formed between them as a wind tunnel, and the air is flown to further provide a heat insulating effect. It is a thing. Thus, the main circuit section 4 and the logic section 5 are provided in rooms independent of each other.

The inverter according to this embodiment has a circuit configuration shown in FIG. 9. Specifically, as shown in FIG. 1, a case 1 as a first housing, a cover 2 as a second housing, Cooling fins 3 as means, a main circuit section 4 which is a heating element and also a noise generation source, a logic section 5 which is disposed apart from the main circuit section 4, a cooling fan 6, heat generated by the main circuit section and electromagnetic noise And a wind tunnel-shaped shielding plate 7 for shielding the air. Logical part 5
And the main circuit section 4 are connected by a cable 12. In addition, a refrigerant passage through which air as a refrigerant flows is formed between the cooling fins 3. FIGS. 2 to 4 show the wind tunnel-shaped shielding plate 7 in detail. 1, 7 and 8, the illustration of the smoothing capacitor 103 is omitted. Figure 2
3 and 4 show the plane, side, and AA 'cross section of the wind tunnel type shielding plate 7, respectively. The wind tunnel type shield plate 7 of the present embodiment surrounds a conductive material 8 having a function of shielding electromagnetic noise generated from the main circuit portion 4 with a heat and electricity insulating material 9, and furthermore, has an intake port 7 a on both lower sides and an upper portion. An air vent 7c is provided between the conductive material 8 and the insulating material 9 so that outside air flows inside the shielding plate. In the present embodiment, the wind tunnel type shield plate also functions as a second refrigerant passage. Also, the conductive material 8
Is surrounded by an insulating material 9 so as not to contact the case and prevents electromagnetic noise to the logic section 5 on the front surface of the shielding plate. A terminal 16 for connecting a power supply, a load, and the like is provided near the lower portion of the shielding plate 7. A cable 12 connecting the logic unit 5 and the main circuit unit 4
A cut-out portion 7d for passing through is formed in the wind tunnel-shaped shielding plate 7.

In this embodiment, the heat generated in the main circuit portion 4 leaks from between the notch 7d of the wind tunnel type shield plate 7 and the case 1,
In order to prevent the flow into the logic unit 4, an electric wire holder 11 is provided as closing means, and a cable 12 is inserted between the electric wire holder 11 and the cable holder 11 and is attached to the case 1. As shown in FIG. 5, the wire retainer 11 is provided with a minimum gap necessary for passing the cable 12, so that when the case 1 is attached to the case 1, almost no air passes through the gap and the main circuit portion 4 can be prevented from transferring to the logic unit 5.

When the cable 12 is routed, it is fixed to the case 1 once, and then the wind tunnel-shaped shielding plate 7 is attached to the case 1.
As shown in FIG. 6, the positioning of the cable 12 is facilitated, and the efficiency of the wiring work is improved.

In this embodiment, the logic unit 5 is a printed board 5a.
The printed board 5a is mounted at a predetermined distance from the wind tunnel-shaped shielding plate 7 by a spacer 5b.
Thereby, an air layer is also formed between the shield plate 7 and the logic unit 5, so that the heat insulating effect can be further improved.

The effect of the wind tunnel type shield plate 7 will be described below.
The heat generated in the main circuit 4 is supplied to the cooling fins 3 in the case 1.
Approximately 50 to 60% of the whole is discharged to the outside by the cooling fan 6, but the remaining 50 to 40% is discharged to the inside of the case to raise the air temperature inside the inverter. On the other hand, the logic section 5 inside the same case is heated by the heat (hot air) released from the main circuit section into the case, and rises above the self-heating temperature. However, by providing the wind tunnel type shield plate 7 between the main circuit section 4 and the logic section 5, the space between the main circuit section 4 and the logic circuit section 5 is completely separated, and furthermore, the insulating material on the main circuit section side is provided. 9, the heat of the main circuit section 4 is blocked. In addition, since the outside air flows through the wind tunnel 7c inside the wind tunnel type shield plate 7, the conductive material 8 is cooled by the outside air, and is kept at a low temperature.
Since the heat on the logic unit 5 side can also be radiated through the conductive material 8, the logic unit 5 is cooled, and the temperature rise of the logic unit 5 can be further reduced. Thus, this embodiment has the following effects.

The temperature rise of the logic section 5 having an allowable temperature lower than that of the main circuit section 4 is caused only by self-heating and is not affected by the heat generation of the main circuit section 5. Therefore, the cooling fins 3 need only be suitable for the permissible temperature of the main circuit portion 5, and the size of the cooling fins 3 can be reduced. Further, since the conductive material 8 of the wind tunnel type shielding plate 7 can block electromagnetic noise from the main circuit section 4, the distance between the logic section 5 and the main circuit section 4 can be reduced. As described above, it is effective in downsizing the device such as the inverter and improving the noise immunity. Further, it is possible to prevent the failure and malfunction of the logic unit, and to improve the reliability.

The inverter receives a maximum of 0.5 G of vibration from the outside depending on the installation location. There are also components such as a fan and an electromagnetic contactor that generate vibrations inside the inverter. On the other hand, the logic unit 5 composed of a printed circuit board has heavy components such as an electrolytic capacitor and a transformer, and if the vibration is large, it may fall off in the worst case. In order to prevent this, it is ideal that the wind tunnel type shield plate 7 for fixing the printed circuit board 5a of the logic unit 5 is resistant to vibration and has no resonance point.

In this embodiment, the wind tunnel type shield plate 7 is made of a conductive material 8
(Copper plate) and insulating material 9 (Plastic) have a laminated structure composed of two sheets, so they are strong against stress and therefore strong against vibration. As a material for forming the insulating material 9, a polycarbonate resin, a polybutylene resin, or the like is used.

Further, even if noise due to harmonics is generated from the logic section 5 or the main circuit section 4, the shielding plate 7 does not resonate, so that the noise can be reduced.

When the shield plate 7 and the logic unit 5 are attached, the logic unit 5 is covered with the cover 2 and the main circuit unit 4 and the logic unit 5 are isolated from the outside, as shown in FIG. Become.

A control section 2a is provided on the surface of the cover 2, but a portion of the cover 2 for accommodating the control section 2a is a concave portion. In order to make the inverter fully closed, the inside and the outside of the inverter may be separated from each other in this portion.

The inverter is usually used with the case 1 fixed to the equipment mounting plate 15 of the control panel. Usually Figure 8
As shown in (2), the cooling fan 6 is mounted on the equipment mounting plate 15 with the lower side facing down. FIG. 8 schematically shows the flow of wind in the inverter. In this state, a forced airflow from the cooling fan 6 flows through the space between the case 1 and the device mounting plate 15 to cool the cooling fins 3 and the wind tunnel 7 of the wind tunnel type shielding plate 7.
Outside air flows from the intake port 7a to the exhaust port 7b in the area c. Thus, low-temperature air flows in the wind tunnel 7c to prevent heat from being transmitted from the main circuit unit 4 to the logic unit 5, and also to cool the conductive material 8 to radiate heat generated from the logic unit 5.

Next, the cooling structure of the smoothing capacitor in the present embodiment will be described.

As shown in FIG. 10, the inverter of this embodiment includes a cooling fin 3 and a smoothing capacitor 10 in a lower case 1.
3, rectifying element 106, switching element 1 as a heating element
04, the cooling fan 6 is attached, and the smoothing condenser 10
3 is mounted so that a part thereof penetrates through the lower case 1 and protrudes to the side where the cooling fins 3 are located, and is disposed in the refrigerant passage.

In this embodiment, the cooling fins 3 and the lower case 1 are integrally formed by aluminum die-casting,
03, a shielding plate 7 as shielding means is provided above the switching element 104 and the like, and a printed circuit board 5a on which the logic unit 5 is mounted is further provided above the shielding plate 7. The upper case 2 is provided above the printed board 5a. The upper case 2 is provided with an operation panel 2a. In the present embodiment, the interior of the inverter includes a first chamber, a second chamber, a third chamber, and a third chamber.
The first and second chambers are completely closed in order to prevent foreign substances from entering from outside and prevent the human body from touching the charging section. As shown in FIG. 11, the bottom surface 1a of the lower case 1 is provided at a predetermined distance from the lower end of the lower case, and when the inverter is mounted on a control panel (not shown) or the like, the device mounting surface 15 of the control panel and The space between the bottom surface 1a functions as a refrigerant passage. Bottom 1a of lower case
Is formed such that the distance from the lower end of the lower case is different between a position 1aa where the switching element 104 is mounted and a position 1ac where the cooling fan 6 is mounted. An inclined surface 1ab is provided in the middle, and the airflow blown by the cooling fan 6 smoothly flows into the switching element mounting portion 1aa. In the switching element mounting part 1aa, the distance between the lower end surface of the lower case and the bottom surface 1a is reduced to increase the air flow so that a predetermined cooling capacity can be obtained. The bottom surface 1a is provided with a hole 1b for mounting the capacitor 103. In the present embodiment, as shown in FIG. 9, two capacitors 103 are connected in parallel in order to increase the capacity.
Is an "8" shaped hole. Hole 1b and capacitor 1
The gap between the gaskets 03a and 103b is closed with a gasket (not shown) for safety. The cooling fins 3 are provided on the surface of the bottom surface 1a opposite to the surface on which the switching element 104 is mounted, that is, on the surface on the side on which the cooling fan 6 is mounted. In the present embodiment, as shown in FIG. 12, the cooling fins 3 are mainly provided at the portions where elements generating a large amount of heat, such as the switching element 104 and the rectifying element 106, are attached.
The cooling fins 3 provided below the switching element 104 are arranged in the longitudinal direction of the switching element mounting surface 1aa (see FIG. 1).
2 (left-right direction in FIG. 2), and a plurality thereof are provided at predetermined intervals so as to obtain a predetermined cooling area. In the cooling fins 3a closer to the condenser 103, a bent portion 3c is formed so that a part of the wind of the cooling fan 6 as a refrigerant can flow in the direction of the condenser 103.
Note that the bent portion 3c is provided so that most of the bent portion 3c is located upstream of the switching element 104. The cooling fins 3b are also provided below the rectifying element 106. Since the rectifying element 106 generates less heat than the switching element 104, the fin has a shorter length. Further, the cooling fins 3b are provided downstream of the condenser 103 with respect to the airflow blown from the cooling fan 6, so that the heat generated from the cooling fins 3b can prevent the condenser 103 from heating.

In the present embodiment, when the cooling fins are formed by die-casting with aluminum, traces of the gate provided as an aluminum inlet remain with a width slightly larger than the thickness of each fin of the cooling fins 3. However, the gate 3d is arranged in a zigzag position by shifting the position of the fins adjacent to each other in the left-right direction shown in FIG. 12 so as not to obstruct the ventilation between the fins. The heat generated by the switching element 104 is reduced by 50% of the amount of heat generated by cooling the cooling fins 3 in the case 1 by the cooling fan 6.
About 60% is released to the outside, but the remaining 50 to 40% is released to the inside of the case to raise the air temperature inside the apparatus. Therefore, if the temperature is in the same case, the temperature of the smoothing capacitor 103 is increased by the heat released from the main circuit unit 4 into the case and rises to the self-heating temperature or more. However, since the smoothing capacitor 103 is partially mounted so as to penetrate the lower case 1 and be provided in the cooling duct, the influence of heat of the main circuit portion can be reduced, and the temperature rise can be reduced. .

In this embodiment, the capacitor 103 is shown in FIG.
As shown in FIG. 14, the capacitor 103a and the capacitor 1
03b are connected in parallel, and the circuit diagram is as shown in FIG.
In FIG. 9, reference numeral 111 denotes a three-phase AC power supply, and M denotes a load. The two capacitors 103a and 103b are in band 1
13 and terminals 103c of the same polarity are connected by a connection bar 115 to be integrated. The band 113 is provided with four legs 113b having mounting holes 113a, and is fastened by screws 113c and nuts 113d so as to be in close contact with the capacitors 103a and 103b. Thus, heat generated by the capacitors 103a and 103b can be transmitted to the bottom surface 1a of the lower case 1 via the legs 113b of the band 113. Further, since the capacitor is divided into two, the surface area can be increased as compared with the case where one capacitor has the same capacity, and the cooling efficiency can be increased.

In this embodiment, the temperature rise of the smoothing capacitors 103a and 103b having a lower allowable temperature than the switching element 104 is caused only by self-heating, and is hardly affected by the switching element 104. Further, the cooling fan 6 can simultaneously cool the smoothing capacitors 103a and 103b, so that the temperature rise can be further reduced. Therefore, it is not necessary to provide any special means for cooling the smoothing capacitor 103. In addition, since it is not necessary to increase the capacity of the smoothing capacitor 103 to reduce heat generation, a device suitable for the current value of the device can be used, and the device can be downsized. Further, since the temperature rise can be reduced, deterioration of the dielectric material of the smoothing capacitor can be suppressed. In the present embodiment, the capacitors 103a and 103b are aluminum electrolytic capacitors, and a terminal 103c is provided on a sealing member 103d provided at an opening of a case 103e of the capacitor. Generally, this type of electrolytic capacitor is provided with an explosion-proof valve in a sealing member for explosion-proof, to prevent explosion at the time of overcurrent. Capacitor 103 in this embodiment
Explosion-proof valves (not shown) are provided in the sealing member 103d also in the a and 103b. In this embodiment, the capacitor 1
03 is provided between the sealing member 103d provided with the terminal 103c and the printed circuit board 5a provided with the logic unit 5.
Is provided, even if the explosion-proof valve operates, damage to the printed circuit board 5a and the logic unit 5 can be prevented. Further, since the shielding plate 7 is made of the insulating material 9 on the main circuit side, that is, the side facing the terminal 103c of the capacitor 103, even if the explosion-proof valve operates, the terminal 10
The charged portion such as the connection bar 115 connected to 3c can be prevented from coming into contact with the iron plate 8, and safety can be improved.

Various embodiments of the structure of the shielding plate and the cooling structure of the smoothing capacitor will be described below.

A second embodiment of the present invention will be described with reference to FIGS.

In this embodiment, as shown in FIG. 15, there is used a wind tunnel type shield plate 27 which is also configured to flow a forced airflow from the cooling fan 6 into the wind tunnel.

As shown in FIG. 16, the wind tunnel shield plate 27 of this embodiment has an intake port 27a on the lower side, an exhaust port 27b on the upper side, and an intake port 27e communicating with the cooling fan 6 on the lower side. Having. A cutout 27d for passing the cable 12 is provided on the side. Thereby, not only natural convection but also the flow of wind by the cooling fan 6 can be taken into the wind tunnel 27c, and the logic unit 5 on the conductive material 8 side can be cooled more powerfully. The other configuration is the same as that of the first embodiment.

A third embodiment of the present invention will be described with reference to FIGS.

In this embodiment, as shown in FIG. 19, a wind tunnel type shield plate 37 utilizing the Venturi effect by the high wind speed of the cooling fan 6 is used.

In this embodiment, the exhaust port 37 of the wind tunnel type shielding plate 37 is used.
b and the space between the cooling fins 3 flowing at a high speed of the cooling fan 6 (the inside 3 of the wind tunnel-shaped shielding plate 37 due to the high wind speed).
7c) is connected by a bypass 37f, so that the air inside the wind tunnel-shaped shielding plate 37 can be bypassed.
The cooling fin 3 is forcibly pulled out from the opening 37e of the 7f to the exhaust side (Venturi effect) to improve the flow of air. As a result, the outside air is
Therefore, the logic unit 5 on the conductive material 8 side can be more strongly cooled.

FIG. 20 shows a side view of the wind tunnel type shield plate 37.
A notch 37d for passing the cable 12 is provided as shown in FIG.

The other structure is the same as that of the first embodiment.

A fourth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, as shown in FIGS. 23 and 26, a shielding plate in which a chamber 47c in which no outside air flows but air is inserted and a heat insulating material 49 are stacked to form a laminated structure, and a conductive material 8 is laminated. 47 is used to perform thermal insulation with a heat insulating material and air bound by the heat insulating material. In this embodiment, since the shielding plate 47 does not need to take in the outside air, the structure of the case 1 for storing the outside air can be simplified.

In this embodiment, as shown in FIG. 24, a notch 47d is formed in the shielding plate 47 for passing a cable.

The other structure is the same as that of the first embodiment.

A fifth embodiment of the present invention will be described with reference to FIGS. This embodiment is a further simplification of the fourth embodiment.

The shielding plate 57 of this embodiment is composed of only the heat insulating material 59 and the conductive material 8 as shown in FIG. 30, and can be used as shown in FIG. 27 when the amount of heat generated in the main circuit portion is small. . Since the shielding plate is thin, the size of the inverter can be further reduced.

In the above embodiment, the provision of the shielding plate makes the logic portion less susceptible to both heat and electromagnetic noise, eliminates wasted space, and allows the main circuit cooling fan to operate independently of the logic portion temperature. It is only necessary to perform cooling necessary for itself, and it is possible to greatly reduce the size. Further, the logic section is less susceptible to an increase in air temperature due to the main circuit element, and the temperature rise of the logic circuit element can be reduced.

A sixth embodiment of the present invention will be described with reference to FIG. Although the first to fifth embodiments have described the examples in which the gap between the main circuit unit and the logic unit is completely covered with a shielding plate, the present embodiment is different from FIG.
As shown in the figure, the bottom side of the inverter uses the main circuit part and the logic circuit part without being completely covered by the shielding plate 67. This is because the air heated in the main circuit flows upward, so that the air temperature at the upper part (exhaust port 67b side) of the inverter becomes higher, but becomes lower as it approaches the bottom face (the intake port 67a side), so that the gap as a communication part is formed. This is because hot air rarely flows into the logic unit even if is on the bottom.
Further, since the air on the logic section 5 side flows into the main circuit section 4 from the gap 61, low-temperature air is supplied to the main circuit section 4 side, and the cooling efficiency of the main circuit section 4 can be improved.
The other configuration is the same as that of the first embodiment.

In the above embodiment, the cooling fins 3 are forcibly cooled. However, the present invention can be similarly applied to a small inverter having a small heat generation amount in the main circuit portion and a naturally cooled cooling fan. . Further, in the above embodiment, in order to sufficiently obtain the cooling effect by the ventilation in the shielding plate, it is desirable that the inverter is installed so that the shielding plate is substantially vertical. Further, the present invention may be applied not only to a fully closed type or closed type inverter but also to an open type inverter.

Various embodiments of the cooling structure of the smoothing capacitor will be described below.

A seventh embodiment of the present invention will be described with reference to FIGS.

In this embodiment, as shown in FIG. 34, the smoothing capacitors are combined into one, and the smoothing capacitor 103 is mounted laterally with respect to the lower case 121, and the same as in the first embodiment, the cooling capacitor is placed in the cooling air passage. A part is exposed.
Also in this embodiment, the cooling effect of the capacitor 103 can be improved.

In this embodiment, the bottom surface 121 of the lower case 121
a, the mounting surface 121aa of the switching element 4 is provided at a predetermined distance from the lower end of the lower case 121 similarly to the first embodiment, and the switching element mounting surface 121aa is provided.
Cooling fins 3a having a length substantially equal to the length direction of aa (left-right direction in FIG. 33) are provided, have a slope 121ab with the cooling fan mounting surface 121ac, and are blown by the cooling fan 6. It is formed so that air flows smoothly. A bent portion 3c is formed on the cooling fin close to the condenser 103 so that the airflow is reduced.
It is configured to lead to. The mounting portion 121b of the capacitor 103 has a predetermined distance from the lower end of the lower case 121 equal to the cooling fan mounting surface 121ac.
After extending in parallel with the lower end of the lower case 21, it extends vertically toward the lower end of the lower case, reaches the lower end of the lower case, and extends a predetermined distance along the lower end of the lower case. Part (wall) 121 extending vertically toward the lower end of the lower case
ba is attached so as to penetrate the attachment hole of the capacitor. The capacitor 103 is provided with the head of the case 103e (the side opposite to the terminal 103c) facing the cooling fan 6,
The portion having the terminal 103c is a vertically extending portion 121b.
a and a portion 121bb extending a predetermined distance along the lower end. As a result, the condenser 103 can be cooled, the exposure of the charged portion can be prevented, and the safety can be improved. A shielding plate 7 is provided above the capacitor 103, the switching element 104, and the rectifying element 106, and a printed board 5a on which the logic unit 5 is mounted is provided above the shielding plate 7. In this embodiment, the sealing member 103d of the capacitor 103 is oriented in a different direction from the printed circuit board 5a, and even if the explosion-proof valve (not shown) of the sealing member 103d is activated, the electrolyte may not adhere to the printed circuit board 5a. Damage to the printed circuit board 5a can be effectively prevented. Further, even when the height of the capacitor (the dimension from the case head to the terminal hole) is larger than the height of the lower case 121, the overall height of the device can be kept low.

An eighth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, the smoothing capacitor 103 is shielded by the rising portion 130a provided on the shielding plate 130, so that the device can be downsized.

In this embodiment, the bottom surface 131a of the lower case 131 is composed of a switching element mounting surface 131aa, a cooling fan mounting surface 131ac, and a slope 131ab formed therebetween. Cooling fins 3 are provided on the switching element mounting surface.
Are composed of cooling fins 3a for cooling the switching element 104 and cooling fins 3b for cooling the rectifying element 106. As shown in FIG. 37, the cooling fin 3b is formed to be shorter than the cooling fin 3a. A mounting hole 131b for the condenser 103 is provided on the bottom surface 131a downstream (upward in FIG. 37) of the cooling fin 3b. Bottom 131
The switching element 104 and the rectifying element 106 are mounted on the surface on the back side of the surface on which the cooling fins 3 are provided. Above the switching element 104 and the rectifying element 106 (left side in FIG. 36), a shield plate 130 and a printed circuit board 138 on which the logic unit 5 is mounted are provided. In this embodiment, the printed circuit board 138 and the shielding plate 130 are formed in an “L” shape, and a rising portion (partition wall) 130 a is formed inside the “L” of the shielding plate 130. The capacitor 103 is provided such that the head of the case (the side opposite to the sealing member 103d) penetrates the mounting hole 131b and is located on the cooling fan side, and the terminal 103c is located inside the “L” shape of the shielding plate 130. It is provided as follows. In the present embodiment, the rising portion 130a is provided between the sealing member 103d having the terminal 103c and the printed circuit board 138 to separate them. As a result, even if an explosion-proof valve (not shown) of the capacitor 103 is activated,
8 can be prevented. In the present embodiment, the shielding plate 130 is constituted by an insulating material 130c on the main circuit side and an iron plate 130b on the logic part side. According to the present embodiment, even if the height of the capacitor 103 is large, the height of the inverter can be kept low. In this embodiment, as in the seventh embodiment, the smoothing capacitors 103 are combined into one.

A ninth embodiment of the present invention will be described with reference to FIGS. This embodiment is a first modification of the first embodiment, in which portions of the capacitors 103a and 103b protruding into the cooling air passage are covered with a side surface of a capacitor cover 142 made of a material having good heat conductivity. The capacitor can be protected simultaneously with the cooling effect. Capacitor cover 14
2 may be formed of a metal having good heat conductivity such as aluminum,
Alternatively, it may be formed of a resin in which a filler such as silica is added to an epoxy resin. When aluminum is used for the capacitor cover 142, an extruded material having a cross section as shown in FIG. 39 may be used, and according to this, the capacitor cover can be easily manufactured. The configuration of other parts of the present embodiment is the same as that of the first embodiment.

A tenth embodiment of the present invention will be described with reference to FIGS. This embodiment is a modification of the ninth embodiment in which a capacitor cover 152 configured to cover both the side surface and the bottom surface is used. In addition to the effect of the ninth embodiment, the effect of protecting the bottom surface of the capacitor is obtained. Can be

The capacitor cover 152 of this embodiment is also made of a material having good heat conductivity. As the material, a metal such as aluminum or a resin having a high thermal conductivity obtained by filling a filler such as silica in an epoxy resin is used. Since the capacitor cover 152 has a bottom surface, when aluminum is used, it is manufactured by drawing an aluminum casting or a thin aluminum plate. Other parts of this embodiment are the same as those of the first embodiment.

The eleventh embodiment of the present embodiment is shown in FIGS.
This will be described below. In the present embodiment, the capacitor cover 16 is used.
2 is made of a material whose shape changes with temperature (for example, a shape memory alloy), and when the temperature rises, it comes into close contact with the capacitor to enhance the cooling effect.

This embodiment is a case where the capacitor 103 is a single large-capacity capacitor in the first embodiment. In this embodiment, a round hole-shaped capacitor mounting hole 1b is provided on the bottom surface 1a of the lower case 1, and the head of the capacitor 103 is inserted into the mounting hole 1b. After the capacitor 103 is mounted, a capacitor cover 162 is fitted to the outer periphery on the head side of the capacitor 103 as shown in FIGS. The capacitor cover 162 is made of, for example, a shape memory alloy, and is configured to adhere to the outer periphery of the capacitor 103 when the temperature rises to improve the heat radiation of the capacitor 103. According to the present embodiment, the cooling effect of the capacitor at the time of high temperature can be improved.

The example in which the present invention is applied to the inverter has been described above. However, the present invention is not limited to this, and the present invention may be applied to other electronic devices having the same configuration requirements.

In the seventh, ninth, tenth, and eleventh embodiments, the same shield plate 7 as in the first embodiment is used. However, the present invention is not limited to this. From the second embodiment to the conditions such as the calorific value and the external dimensions of the device.
The shielding plate of the fifth embodiment may be used as appropriate. Further, depending on the conditions, a communication section that connects the main circuit side and the logic section side may be provided on the bottom side of the inverter as in the sixth embodiment.

[0064]

According to the present invention, the capacity of the cooling fan by the cooling air can be increased particularly at the rectifying element and the switching element which are heated by the heat-generating components, and the temperature rise of the inverter device can be effectively reduced. be able to.

Further, since the gate provided for the die-casting of the cooling fins can be prevented from obstructing the flow of the cooling air and the cooling capacity can be increased, the temperature rise of the inverter device can be effectively reduced. be able to.

As a result, the size of the cooling fins and the cooling fan can be reduced, the reliability of the inverter can be improved, and a downsized inverter can be provided.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of an inverter according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a configuration of a shielding plate in the present embodiment;
It is a side view and a side sectional view.

FIG. 3 is a plan view showing a configuration of a shielding plate according to the embodiment.
It is a side view and a side sectional view.

FIG. 4 is a plan view showing a configuration of a shielding plate in the present embodiment;
It is a side view and a side sectional view.

FIG. 5 is a cross-sectional view showing a configuration of a cable passage portion of the shielding plate.

FIG. 6 is an exploded perspective view showing a state where a shielding plate is attached.

FIG. 7 is a side sectional view showing a configuration of the inverter of the present embodiment.

FIG. 8 is a side sectional view showing a flow of wind in the present embodiment.

FIG. 9 is a circuit diagram showing a circuit configuration of the present embodiment.

FIG. 10 is a perspective view, a side sectional view, and a bottom view showing a configuration of the inverter according to the first embodiment of the present invention.

FIG. 11 is a perspective view, a side sectional view, and a bottom view showing the configuration of the inverter according to the first embodiment of the present invention.

FIG. 12 is a perspective view, a side sectional view, and a bottom view showing a configuration of the inverter according to the first embodiment of the present invention.

13A and 13B are a plan view and a side view showing the shape of the capacitor according to the present embodiment.

14A and 14B are a plan view and a side view showing the shape of the capacitor according to the present embodiment.

FIG. 15 is a side sectional view showing a configuration of an inverter according to a second embodiment of the present invention.

FIG. 16 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 17 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 18 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 19 is a side sectional view showing a configuration of an inverter according to a third embodiment of the present invention.

FIG. 20 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 21 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 22 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate in the present embodiment.

FIG. 23 is a side sectional view showing a configuration of an inverter according to a fourth embodiment of the present invention.

FIG. 24 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate of the present example.

FIG. 25 is a plan view, a side view, and a side sectional view showing the configuration of the shielding plate of the present example.

FIG. 26 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate of the present example.

FIG. 27 is a side sectional view showing a configuration of an inverter according to a fifth embodiment of the present invention.

FIG. 28 is a plan view, a side view, and a side sectional view illustrating a configuration of a shielding plate of the present embodiment.

FIG. 29 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate of the present example.

FIG. 30 is a plan view, a side view, and a side sectional view showing a configuration of a shielding plate of the present example.

FIG. 31 is a side sectional view showing a configuration of an inverter according to a sixth embodiment of the present invention.

FIG. 32 is a side sectional view and a bottom view showing a configuration of an inverter according to a seventh embodiment of the present invention.

FIG. 33 is a side sectional view and a bottom view showing a configuration of an inverter according to a seventh embodiment of the present invention.

FIG. 34 is a block diagram illustrating a circuit configuration of the inverter according to the present embodiment.

FIG. 35 is a plan view, a side sectional view, and a bottom view of an inverter according to an eighth embodiment of the present invention.

FIG. 36 is a plan view, a side sectional view, and a bottom view of an inverter according to an eighth embodiment of the present invention.

FIG. 37 is a plan view, a side sectional view, and a bottom view of an inverter according to an eighth embodiment of the present invention.

FIG. 38 is a front view and a bottom view in which a part of an inverter according to a ninth embodiment of the present invention is sectioned.

FIG. 39 is a front view and a bottom view in which a part of an inverter according to a ninth embodiment of the present invention is sectioned.

FIG. 40 is a front view and a bottom view in which a part of each of the inverters according to the tenth embodiment of the present invention is sectioned.

FIGS. 41A and 41B are a front view and a bottom view, respectively, showing a part of a cross section of an inverter according to a tenth embodiment of the present invention.

FIGS. 42A and 42B are a front view and a bottom view, respectively, showing a part of an inverter according to an eleventh embodiment of the present invention;

FIG. 43 is a front view and a bottom view in which a part of each of the inverters according to the eleventh embodiment of the present invention is sectioned.

[Explanation of symbols]

1: case, 3: cooling means, 4: main circuit section, 5: logic section, 7: shielding member, 103: smoothing capacitor, 104:
Switching element, 106: rectifying element

Continued on the front page (72) Inventor Kengo Hasegawa 7-1-1, Higashi-Narashino, Narashino-shi, Chiba In-house Narashino Plant in Hitachi, Ltd. (72) Inventor Kenji Nanto 7-1-1, Higashi-Narashino, Narashino-shi, Chiba Stock (72) Inventor Takehiko Yanagita 502-Jindachi-cho, Tsuchiura-shi, Ibaraki Pref. Machinery Research Laboratories, Inc. (72) Naoto Suzuki 7-11-1, Higashi-Narashino, Narashino-shi, Chiba Co., Ltd. (72) Inventor Shigeyuki Baba 7-1-1, Higashi Narashino, Narashino City, Chiba Prefecture

Claims (7)

[Claims] 1. An inverter device having a main circuit section serving as a heat source, a logic section, and a smoothing capacitor in the same housing, wherein cooling means for cooling the main circuit section includes a cooling means to which the main circuit components are attached. An inverter device, comprising: a fin; and a cooling fan that sends cooling air to the cooling fin, wherein a slope is formed in the passage so that the passage becomes narrower as the cooling air flows from the cooling fan toward the cooling fin. 2. The semiconductor device according to claim 1, wherein said main circuit portion includes a switching element and a rectifying element, and said cooling fins are provided mainly in a portion where said switching element and said rectifying element are mounted. 2. The inverter device according to 1. 3. The cooling fin provided on the smoothing condenser has a bent portion for allowing a part of the wind of the cooling fan to flow toward the smoothing condenser. 2. The inverter device according to 1. 4. The inverter device according to claim 1, wherein said cooling fin is provided downstream or laterally of said smoothing condenser with respect to an airflow blown from said cooling fan. 5. An inverter main circuit section including a rectifying element for converting received AC power to DC power and a switching element for converting the DC power to AC power of an arbitrary frequency, and a logic section for controlling the switching element. In the inverter device housing the main circuit and the logic unit in a housing, the housing has a case in which the rectifying element and the switching element are mounted inside and cooling fins are mounted outside, and the case includes: The case is integrally formed with a cover for accommodating the inverter main circuit and the logic part, and the case is integrally formed with the cooling fin provided between the lower end and an aluminum die-cast. A cooling fan that is provided at a predetermined interval and sends cooling air to the cooling fins; An inclined surface is provided in the middle so that the distance from the lower end decreases from the mounting position to the switching element mounting position, and the air flow blown by the cooling fan smoothly flows into the mounting part of the switching element, and the switching mounting part has An inverter device configured to increase air blowing. 6. In an inverter device having a main circuit portion serving as a heat source, a logic portion, and a smoothing capacitor in the same housing, the cooling means for cooling the main circuit portion includes a cooling fin formed by aluminum die casting. An inverter device comprising a cooling fin and a cooling fin adjacent to each other, which are offset from each other after a gate of an aluminum injection port formed at the time of aluminum die casting. 7. An inverter main circuit section including a rectifying element for converting received AC power to DC power and a switching element for converting the DC power to AC power of an arbitrary frequency, and a logic section for controlling the switching element. In the inverter device housing the main circuit and the logic unit in a housing, the housing has a case in which the rectifying element and the switching element are mounted inside and cooling fins are mounted outside, and the case includes: The case is formed integrally with the inverter main circuit and a cover that houses the logic unit, and the case is formed by aluminum die casting integrally with the cooling fin provided between the lower end and the aluminum die casting. The position of the cooling fins adjacent to each other after the gate provided as an aluminum injection port is Inverter and wherein disposed Jo position by being configured so as not to interfere with the airflow between the fins.