JPH10291100A - Pressurizing heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively heat while pressurizing a member (for example, a metal cap) onto a prescribed target (for example, an alumina substrate) without requiring a complicated structure or consuming a large energy. SOLUTION: Each heater tip 11 is energized onto each of plural numbers of metal caps 2 which an energizing means (conductive spring member) 12, by making the heater tip 11 to develop heat while plural numbers of the metal caps 2 are pressed to the substrate (alumina substrate) 1, caused by the direct heat transfer between the heater tip 11 and the metal cap 2, the adhesive 4 is heated and hardened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure heating device for heating a member while applying pressure, and more particularly, to a pressure heating device used for bonding a member such as a metal cap to an object such as a substrate. About.

[0002]

2. Description of the Related Art As shown in FIG. 2, for example, a substrate (alumina substrate or the like) 51 on which a circuit 60 or the like is disposed is mounted on a metal cap 5 as shown in FIG.
When the cap 52 is bonded to the substrate 51 in a process of manufacturing a so-called cap-chip type electronic component having a structure sealed with the cap 2, the conventional method is to bond the cap 52 by a method as shown in FIG. I have.

That is, conventionally, a plurality of caps 52 having an adhesive 54 applied to the lower end thereof are placed at predetermined positions on a substrate (alumina substrate) 51 set on a lower mold 53,
An upper die 56 having a plurality of contacts 55 each having a built-in spring (not shown) is provided on a lower surface side at a position corresponding to each of the plurality of caps 52. In the state pressed to, for example,
The whole is heated to a predetermined temperature in a continuous furnace of a hot air circulation type, whereby the adhesive is cured and the cap 52 is bonded to the substrate 51. FIG. 3 shows one cap 5
2 shows a case where two contacts 55 are configured to contact each other.

However, in the above-mentioned conventional method, the conventional upper and lower dies are large in weight and require a large amount of heat to heat the whole. In addition, the adhesive is heated and cured in a hot air circulation furnace. When hot air is directly applied to the adhesive, the solvent in the adhesive is likely to evaporate, making it difficult to cure the adhesive in a state where sufficient adhesive strength is obtained. And the amount of heat required for heating increases, leading to an increase in cost. In addition, the conventional upper and lower dies are heavy in weight, so that appropriate equipment is required for transport to and removal from the furnace, which leads to an increase in the size of the equipment and complexity of the manufacturing process. There is.

[0005] The present invention solves the above-mentioned problems, and efficiently mounts a member (for example, a metal cap) on a predetermined object without requiring a complicated structure or consuming a large amount of energy. It is an object of the present invention to provide a pressure heating device capable of heating while pressurizing (for example, an alumina substrate).

[0006]

In order to achieve the above object, a pressurizing and heating device according to the present invention (claim 1) is a pressurizing and heating device used for heating a member while pressing it against a predetermined object. A heater chip that contacts and heats the member and a member having a spring property are used, and the member is pressed against a predetermined target by urging the heater chip against the member. And a biasing means. The urging means using a member having a spring property urges the heater chip against the member, urges the member to a predetermined object, and generates heat between the heater chip and the member. It is possible to efficiently heat the member by direct heat transfer between them. Note that, in the present invention, the pressing of the member to the predetermined target and the heating of the heater chip do not necessarily have to be performed at the same time. The heater chip may be heated, or conversely, the heater chip may be heated first and the member may be urged to a predetermined target.

A pressure heating device according to the present invention (claim 2) is a pressure heating device used for heating a plurality of members while pressing the members against a predetermined object. A plurality of heater chips that are disposed so as to be in contact with and heat the plurality of members in contact with the plurality of members, and a member having a spring property are used, and each of the plurality of heater chips is applied to the plurality of members. And a biasing means for biasing the plurality of members against a predetermined object. When each heater chip is urged against a plurality of members by the urging means, and the plurality of members are pressed against a predetermined object, and the heater chips generate heat, the plurality of members may be displaced. Heating can be efficiently performed while applying pressure without causing any heat generation.

In the pressure heating apparatus according to the present invention (claim 3), the member is a metal cap, the predetermined object is a substrate, and the metal cap is attached to the substrate using a thermosetting adhesive. It is characterized by being a pressurizing and heating device used for sealing the substrate surface by bonding. By the urging means, each heater chip is urged against each of the plurality of metal caps, and the plurality of metal caps are pressed against the substrate, and the plurality of metal caps are pressed against the substrate by causing the heater chips to generate heat. While
The direct heat transfer between the heater chip and the metal cap allows the adhesive to be heated and cured efficiently, thereby sealing the substrate surface. Also, since only the metal cap can be heated by the heater chip, it is not necessary to put the whole in a circulating hot stove or the like,
Running costs can be reduced.

Further, in the pressure heating apparatus according to the present invention (claim 4), the substrate is placed on a lower mold having an uneven surface so that a contact area with the substrate is reduced, and the heater is provided. It is characterized in that the chip is heated while pressing the metal cap against the substrate by urging the chip against the metal cap. When using a lower mold with unevenness on the surface as the lower mold on which the substrate is mounted, the contact area with the substrate becomes smaller, and the heat from the heater chip escapes to the lower mold via the substrate. Prevention, it is possible to improve the thermal efficiency. There are no particular restrictions on the specific shape of the unevenness formed on the surface of the lower mold, and a zigzag shape in which peaks and valleys are alternately formed, a large number of concave portions or convex portions, or the like. Various shapes such as a shape provided with

In the pressure heating device of the present invention (claim 5), the heater chip uses a heater chip which generates heat when energized, and a conductive member which constitutes the urging means. The heater chip is heated by using a member having conductivity (conductive spring member) and supplying electricity to the heater chip via the conductive spring member. When a conductive spring member is used as the urging means and the heater chip is energized through the conductive spring member, an electric path for separately energizing the heater is not required, and the configuration is simplified, and the cost is reduced. Reduction can be achieved.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and the features thereof will be described in more detail. FIG. 1 is a sectional view of a main part of a pressurizing and heating device according to an embodiment of the present invention.

In this pressurizing and heating apparatus, a plurality of metal caps 2 are heated while being pressed against a substrate (for example, an alumina substrate having a size of 70 mm × 64 mm × 0.5 mm (thickness)) to cure the adhesive 4. Thereby, a plurality of metal caps (for example, made of nickel-white having a thickness of 0.15 mm and measuring 6.7 mm × 2.2 mm × 1.0 mm (height)) are provided at predetermined positions on the substrate 1.
Is a pressurizing and heating device used when the surface of the substrate 1 facing the metal cap 2 is sealed.

That is, the pressurizing and heating device is disposed so as to contact each of the plurality of metal caps 2.
For example, by using a plurality of heater chips 11 made of a nickel chromium band or an iron chrome band for electric heating and a member having a spring property, the plurality of heater chips 11 are urged against a plurality of metal caps 2. Presses the metal cap 2 against the substrate 1 set on the lower mold 14, for example, S
An urging means (conductive spring member) 12 made of US631, SUS304, or the like is provided.

Each of the heater chips 11 is placed in a hollow portion 13a of an upper mold 13 made of an insulating material having heat resistance (for example, machinable ceramics (for example, Macor), super engineer plastic (for example, PPS, PAI)) or the like. It is attached to the upper die 13 by holding the retaining portion 11a. The heater chip 11 is held so as to be able to move up and down while being urged downward by an urging means (conductive spring member) 12. The biasing means 12 is a plate-like member made of a material having a spring property and having a plurality of curved convex portions 12a abutting on the respective upper surfaces of the heater chips 11, and is disposed in the hollow portion 13a. Therefore, in this pressurizing and heating apparatus, when the upper die 13 is moved in the direction of the lower die 14 and the heater chip 11 is brought into contact with the upper surface of the metal cap 2, the urging means (conductive spring member) bends. The metal cap 2 is urged (pressed) toward the substrate 1 by an amount corresponding to the spring constant. In addition, each heater chip 11
The upper mold 13 and the lower mold 14 are arranged at positions where they come into contact with the upper surface of the metal cap 2 when the upper mold 13 and the lower mold 14 are combined.

An upper surface 14a of the lower die 14 which is in contact with the lower surface of the substrate 1 is formed with irregularities.
It is configured such that heat from the substrate 1 does not easily escape to the lower mold 14 via the substrate 1. Further, the lower die 14 is provided with a hitch (not shown) for positioning the substrate 1.
3 so that the relative position with respect to 3 can be obtained.

The upper die 13 and the lower die 14 are linked together by an interlocking mechanism such as a linear shaft, so that the metal cap 2 is not displaced (ie, is not displaced in a plane direction). It is configured to be able to move.

Next, the operation in the case where the metal cap 2 is bonded to the substrate 1 using the pressurizing and heating device configured as described above will be described.

First, after setting the upper mold 13 and the lower mold 14 so as to maintain a predetermined relative position, a metal cap 2 coated with a thermosetting adhesive (curing temperature 150 to 180 °) 4 at the lower end thereof. Is placed at a predetermined position on the lower mold 14. Then, the upper die 13 is moved (down) in the direction of the lower die 14, the heater chip 11 is brought into contact with the metal cap 2, and further moved (cured) by a certain amount. Thereby, the urging means (conductive spring member) 1 made of a plate-like member having spring properties.
The metal cap 2 has a load (eg,
50 ± 30 g / metal cap) and is pressed against the substrate 1. Then, in the above-mentioned state, the heater chip 11 is heated by energizing the heater chip 11 via the urging means (conductive spring member) 12. Thereby, the heat of the heater chip 11 is transmitted to the adhesive 4 via the metal cap 2,
The adhesive 4 is cured by being heated to, for example, 150 to 180 ° (for example, the heating is performed for 30 minutes including the temperature raising time). The surface of the substrate 1 is sealed by bonding and fixing the metal cap 2 to the substrate 1 in this manner. Then, the upper die 13 is raised, and the substrate 1 whose surface is sealed by the metal cap 2 is taken out.

As described above, in the pressurizing and heating apparatus according to the present embodiment, the urging means 12 urges each heater chip 11 against each of the plurality of metal caps 2, and applies the plurality of metal caps 2 to the substrate. When the heater chip 11 is pressed, the heater chip 11 is energized to generate heat.
The direct heat transfer between 1 and the metal cap 2 allows the adhesive 4 to be efficiently heated and cured.

That is, by using the pressurizing and heating device of this embodiment, it becomes possible to heat only the metal cap 2 by the heater chip 11, and it is not necessary to put the whole in a circulating hot air stove or the like. The adhesive 4 can be efficiently cured with a small amount of heat.

In the above embodiment, the case where the lower mold having the unevenness on the upper surface is used has been described.
By forming irregularities on the upper surface of the upper mold and using a plurality of the irregularities, it is not necessary to use the lower mold outside the lowermost stage, and it is possible to reduce the size of the entire apparatus.

In the above embodiment, the case where a plurality of metal caps are simultaneously bonded to the substrate has been described.
It goes without saying that the present invention can be applied to a case where a single metal cap is bonded to a substrate.

Further, in the above-described embodiment, the description has been given by taking as an example the pressurizing and heating device for bonding the metal cap to the substrate. However, the present invention can be applied to the case where other members are bonded to a predetermined object. It is possible, and in this case, the same effect as in the case of the above embodiment can be obtained.

Further, in the above-described embodiment, a case has been described in which a conductive spring member is used as the biasing means, and the heater chip 11 is energized via the conductive spring member. It is also possible to constitute the urging means by using a member and to use another member for energization.

The present invention is not limited to the above-described embodiment in other respects. The specific configuration and shape of the heater chip and the urging means, the number of heater chips, and the number of metal caps Various applications and modifications can be made to the shape and material within the scope of the invention.

[0026]

As described above, the pressurizing and heating apparatus according to the present invention (claim 1) urges the heater chip against the member by the urging means using the member having the spring property, and Since the heater chip is caused to generate heat while being pressed against a predetermined target, it is possible to efficiently heat the member while pressing the member by direct heat transfer between the heater chip and the member.

Further, in the pressurizing and heating apparatus according to the present invention (claim 2), the urging means urges each heater chip against a plurality of members, and presses the plurality of members against a predetermined object.
Since the heater chip is caused to generate heat, it is possible to efficiently heat a plurality of members while applying pressure by direct heat transfer between the heater chip and the members without causing displacement or the like. .

Further, in the pressurizing and heating apparatus of the present application (claim 3), the urging means urges each heater chip against each of the plurality of metal caps, and presses the plurality of metal caps against the substrate. By heating the heater chip, a plurality of metal caps are pressed against the substrate,
The direct heat transfer between the heater chip and the metal cap allows the adhesive to be heated and cured efficiently, thereby sealing the substrate surface. Also, since only the metal cap can be heated by the heater chip, it is not necessary to put the whole in a circulating hot stove or the like,
Running costs can be reduced. Therefore, by using the pressurizing and heating device of the present application (claim 3), a plurality of metal caps can be efficiently adhered to a desired position on the substrate without causing displacement or the like, thereby sealing the surface of the substrate. Will be able to

Further, in the pressurizing and heating apparatus according to the present invention (claim 4), as the lower mold on which the substrate is placed, a lower mold having irregularities formed on the surface is used. The contact area is reduced, so that the heat transmitted from the heater chip to the adhesive is prevented from escaping to the lower mold via the substrate, and the thermal efficiency can be improved.

Further, the pressurizing and heating device of the present application (claim 5) uses a conductive spring member, and the heater chip is energized via the conductive spring member. This eliminates the need for the electric circuit, thereby simplifying the configuration and reducing the cost.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a pressurizing and heating device according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating an example of a cap chip type electronic component.

FIG. 3 is a diagram showing a main part of a conventional pressure heating device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate (alumina substrate) 2 Metal cap 4 Adhesive 11 Heater chip 11a Detachable part of heater chip 12 Urging means (conductive spring member) 12a Curved convex part of urging means 13 Upper die 13a Upper hollow part 14 Lower mold 14a Upper surface of lower mold

Claims (5)

[Claims] 1. A pressurizing and heating device used for heating a member while pressing it against a predetermined object, comprising: a heater chip that contacts and heats the member; and a springy member. And a biasing unit for biasing the heater chip against the member to press the member against a predetermined object. 2. A pressurizing and heating device used to heat a plurality of members while pressing them against a predetermined object, wherein the pressing and heating device is arranged so as to contact each of the plurality of members.
A plurality of heater chips that are in contact with and heat the plurality of members; and a member having a spring property is used, and by urging each of the plurality of heater chips against the plurality of members, And a biasing means for pressing the member to a predetermined object. 3. The method according to claim 1, wherein the member is a metal cap, the predetermined object is a substrate, and the metal cap is bonded to the substrate using a thermosetting adhesive to seal the substrate surface. 3. The pressure heating device according to claim 1, wherein the pressure heating device is used. 4. The method according to claim 1, wherein the substrate is placed on a lower mold having an uneven surface so that a contact area with the substrate is reduced.
The pressurizing and heating apparatus according to claim 3, wherein the heater cap is urged against the metal cap to heat the metal cap while pressing the metal cap against the substrate. 5. A heater chip that generates heat when energized is used as said heater chip, and a conductive member (conductive spring member) is used as a spring member constituting said urging means. The pressure heating device according to any one of claims 1 to 4, wherein the heater chip generates heat by energizing the heater chip via the conductive spring member.