JPH10289782A - High-frequency heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adjust energy for heating an object, without the need for moving an adjusting screw for an electrode position by laying a pair of electrodes faced to each other, and an object arrangement and support means for the heating object as well as a dielectric plate between the electrodes as a pair. SOLUTION: An object support means 18 for positioning a heating object 16, and a dielectric plate 20 are laid between electrodes 12 and 14 which are formed as a pair and connected to a high-frequency power supply 22. The dielectric plate 20 is preferably mounted by the use of elastic fasteners fitted to the electrodes 12 and 14. In this case, an effect for reducing an inter-electrode gap occurs, when the dielectric plate 20 acting as an dielectric body together with the air across the electrodes 12 and 14 is inserted. As a result, the heating energy for the object 16 is adjusted. The local change in the thickness of the dielectric plate 20 eliminates the local dispersion of a heating effect, if any, between the electrodes 12 and 14. Also, the dielectric plate 20 has heat resistance and is preferably made of a copolymer of tetrafluoroethylene or the like of good machinability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency heating device for heating an article by disposing an object between a pair of opposed electrodes and applying a high-frequency current to the electrodes.

[0002]

2. Description of the Related Art High frequency heating uses the principle that when an object is placed between a pair of opposed electrodes and a voltage is applied, a dielectric loss occurs to generate heat. Air between the opposing electrodes is used as the dielectric. Such a high-frequency heating device is used in various fields. For example, recently, it is used for preheating of a package resin in a semiconductor manufacturing apparatus.

[0003] The high-frequency heating device includes a pair of opposed electrodes and an object supporting means for disposing an object to be heated between the pair of opposed electrodes. A plurality of objects are placed between opposed electrodes so that these objects can be heated simultaneously. However, the heating temperature may vary among these objects. Therefore, the position of the electrode can be adjusted by an adjusting screw. By adjusting the adjusting screw, the parallelism between the opposing electrodes can be adjusted, or the positional relationship can be slightly shifted, so that there is no variation in heating between the pair of opposing electrodes. Further, by adjusting the adjusting screw, the distance between the opposed electrodes can be changed, and thereby, the heating energy given to the object to be heated can be adjusted. For example, when heating the semiconductor package resin, the heating time can be shortened by reducing the distance between the opposing electrodes.

[0004]

However, in order to adjust the position of the electrode by adjusting the adjusting screw,
It is necessary to put the sample between the electrodes and adjust it while actually heating it, which requires a lot of time and labor. Then, it is difficult to accurately return to the original position when the adjusted position is changed to another position and then returned to the original position, and the reproducibility of the position adjustment is low.

It is an object of the present invention to provide a high-frequency heating device capable of adjusting energy for heating an object without adjusting an adjusting screw.

[0006]

According to the present invention, there is provided a high frequency heating apparatus comprising: a pair of opposed electrodes; an object supporting means for disposing an object to be heated between the pair of opposed electrodes; And a dielectric plate disposed between the opposing electrodes. In this configuration, by inserting a dielectric plate between a pair of opposing electrodes, it is the same as reducing the distance between the opposing electrodes, without adjusting the distance between the opposing electrodes. Even the energy for heating the object can be adjusted. If the heating action varies locally between the facing electrodes, such variation can be eliminated by locally changing the thickness of the dielectric plate.

[0007] Preferably, the dielectric plate is attached to the electrode. Also preferably, the electrodes are provided with elastic fasteners for attaching the dielectric plate.

[0008]

FIG. 1 is a diagram illustrating the principle of the present invention. The high-frequency heating device 10 includes a pair of opposed electrodes 12,
14, an object supporting means 18 for disposing an object 16 to be heated between the pair of opposed electrodes 12, 14, and a dielectric plate disposed between the pair of opposed electrodes 12, 14. 20. The electrodes 12 and 14 are a high-frequency power supply 22
Connected to.

In a high-frequency heating device, air between a pair of opposed electrodes 12 and 14 is usually used as a dielectric. In the present invention, a pair of opposed electrodes 1
The air and dielectric plate 20 between 2 and 14 is used as dielectric. Therefore, a pair of opposing electrodes 12, 14
Even if the distance between the pair of opposing electrodes 1 is
By inserting a dielectric plate 20 between 2 and 14,
The dielectric constant will change. Needless to say, the dielectric plate 20 has a dielectric constant different from that of air.

Therefore, by inserting the dielectric plate 20 between the opposing electrodes 12, 14, the opposing electrodes 12, 1 are inserted.
4 is the same as when the interval between the electrodes 4 is reduced.
The energy for heating the object 16 can be adjusted without adjusting the interval between 2 and 14. In the case where the heating action varies locally between the counter electrodes 12 and 14, such variation can be eliminated by locally changing the thickness of the dielectric plate 20.

FIGS. 2 to 6 show an embodiment of the present invention. 2 and 3, the high-frequency heating device 10 includes:
A pair of opposed electrodes 12, 14, an object supporting means 18 for disposing an object 16 to be heated between the pair of opposed electrodes 12, 14, and a pair of opposed electrodes 12, 1;
4 and a dielectric plate 20 disposed between them. Electrode 1
2 and 14 are connected to a high frequency power supply 22 via a power distribution unit 24.

The electrodes 12, 14 are made of a flat plate having good conductivity such as copper. The dielectric plate 20 is made of a resin resistant to heat and having good workability, for example, a polymer of tetrafluoroethylene (trade name: Teflon). The object 16 to be heated is a columnar resin for producing a semiconductor package, and the object support means 18 is a resin block having a columnar hole for supporting the object 16 to be heated. This resin block also
For example, it is made of a polymer of tetrafluoroethylene (trade name: Teflon).

The electrodes 12 and 14 are the supporting members 2 having an L-shaped cross section.
6 and is attached to an insulator base 28. The support member 26 has a long hole 30, and an adjusting screw 32 is inserted into the long hole 30 and screwed into a screw hole provided in the base 28. The support member 26 has a long hole, and an adjusting screw 34 is inserted into the long hole and screwed into a screw hole provided in the electrodes 12 and 14. Accordingly, the support member 26 and the electrodes 12, 14 are adjustably attached to the base 28 by adjusting screws 32, 34. Further, the object supporting means 18 is formed of an insulating base 2.
8 directly attached.

FIG. 4 is a view showing an example in which a dielectric plate 20 is attached to the electrode 12. An elastic fastener 36 is attached to the top of the electrode 12 by a screw 38. FIG. 4 shows only the top of the electrode 12,
A similar elastic fastener is also attached to the bottom of the. Similar elastic fasteners are also attached to the top and bottom of the other electrode 14.

The fastener 36 comprises a leaf spring, and the root portion 3 extends straight along the top (and bottom) of the electrode 12.
6a and a restraining portion 36b which is bent at an angle of less than 90 degrees from the root portion 36a and engages the surface of the dielectric plate 20. The holding portion 36b has an initial shape that comes closer to the surface of the electrode 12 than the state shown in FIG.
When attaching to the electrode 12, the holding portion 36b is
The dielectric plate 20 is inserted between the electrode 12 and the holding portion 36b while spreading away from the surface of the second. When the holding portion 36b is released, the holding portion 36b elastically engages the dielectric plate 20.

The fastener 36 not only allows the dielectric plate 20 to be easily attached, but the holding portion 36b elastically locks the dielectric plate 20 even when the thickness of the dielectric plate 20 changes. can do. FIG. 4 shows an example in which two dielectric plates 20 a and 20 b are supported by fasteners 36. The thicknesses of the two dielectric plates 20a and 20b are different. The same applies to the other electrode 14. Therefore, depending on the type of the object 16 to be heated, the distance between the counter electrodes 12 and 14 is kept constant, and the dielectric plate 20 having a different thickness, or a plurality of dielectric plates 20a, By attaching 20b to the counter electrodes 12, 14, the heating conditions can be changed. And
A dielectric plate 20, or a plurality of dielectric plates 20a,
By replacing 20b, it is possible to return to the original or another heating state. In this case, the counter electrode 12,
There is no need to adjust the spacing between 14 with elaborate effort.

FIG. 5 is a view showing an example in which the dielectric plate 20 has portions 20c having locally different thicknesses. In the high-frequency heating device, the heating action differs locally between the counter electrodes 12 and 14, and the heating state of the object 16 may vary. In such a case, the dielectric plate 2 having the portions 20c having different thicknesses depending on variations in the heating state.
0 should be used. The portions 20c having different thicknesses are added to the flat dielectric plate 20.

FIG. 6 is a view showing an example in which the dielectric plate 20 has portions 20d having locally different thicknesses. In this example,
The different portions 20d are formed integrally with the flat dielectric plate 20.

[0019]

As described above, in the high-frequency heating device according to the present invention, the energy for heating the object can be adjusted without adjusting the adjusting screw.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating the principle of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is a side sectional view of the high-frequency heating device of FIG. 2;

FIG. 4 is a sectional view showing an example in which a dielectric plate is attached to an electrode.

FIG. 5 is a plan view showing an example in which a dielectric plate has portions having locally different thicknesses.

FIG. 6 is a perspective view showing an example in which portions having locally different thicknesses are integrally formed on a dielectric plate.

[Explanation of symbols]

 12, 14 ... electrode 16 ... object to be heated 18 ... object support means 20 ... dielectric plate 36 ... fastener

Claims (3)

[Claims] An object supporting means for arranging an object to be heated between a pair of opposed electrodes, and a dielectric material arranged between the pair of opposed electrodes. A high-frequency heating device comprising: a plate; 2. The high-frequency heating apparatus according to claim 1, wherein the dielectric plate is attached to the electrode. 3. The high-frequency heating device according to claim 2, wherein the electrode includes an elastic fastener for attaching the dielectric plate.